Copper plating device for producing thermoelectric separation copper substrate

Abstract

The utility model discloses a copper plating device for producing a thermoelectric separation copper substrate, which comprises an electroplating tank, a cleaning tank, a first drying tank, an electroplating tank and a second drying tank are sequentially arranged in the electroplating tank, the first drying tank and the second drying tank are identical in structure, and a pair of water pumps is fixedly connected to two sides of the outside of the cleaning tank. Hot air blowers are fixedly connected to the two sides of the exterior of the first drying groove, driving motors are fixedly connected to one side of the top of the cleaning groove and one side of the top of the first drying groove, and wiping mechanisms are arranged over the cleaning groove and over the first drying groove. The device can clean and dry the copper substrate, and can wipe the copper substrate with attachments.

Description

Technical Field

[0001] This utility model relates to the field of copper substrate production technology, and more specifically, to a copper plating apparatus for producing thermoelectric separation copper substrates. Background Technology

[0002] Thermoelectric separation copper substrate is a type of copper substrate that improves heat dissipation efficiency and reduces thermal interference by physically isolating the conductive layer and the thermally conductive layer. It has advantages such as high thermal conductivity, efficient heat dissipation, and extended lifespan. In the production process of copper substrate, a thin layer needs to be plated on the surface of the copper substrate using an electroplating device based on the principle of electrolysis. This prevents metal oxidation and improves wear resistance, conductivity, reflectivity, corrosion resistance, and aesthetics.

[0003] Existing copper plating equipment does not handle the copper substrates meticulously enough during electroplating. For example, placing uncleaned copper substrates directly into the electroplating tank can easily cause contamination, or failing to dry the cleaned copper substrates can lead to water stains. Therefore, this paper studies and improves the existing structure to provide a copper plating apparatus for the production of thermoelectrically separated copper substrates, aiming to achieve greater practical value. Utility Model Content

[0004] In view of the problems existing in the prior art, the purpose of this utility model is to provide a copper plating device for the production of thermoelectric separation copper substrate, which can clean and dry the copper substrate and wipe the copper substrate with attached substances.

[0005] To solve the above problems, the present invention adopts the following technical solution:

[0006] A copper plating apparatus for producing a thermoelectric separation copper substrate includes an electroplating tank. Inside the electroplating tank, a cleaning tank, a first drying tank, an electroplating tank, and a second drying tank are sequentially arranged. The first drying tank and the second drying tank have the same structure. A pair of water pumps are fixedly connected to both sides of the exterior of the cleaning tank. A spray pipe is fixedly connected to the output end of each water pump and is fixedly connected to the upper part of the interior of the cleaning tank. Hot air blowers are fixedly connected to both sides of the exterior of the first drying tank. A drying pipe is fixedly connected to the output end of each hot air blower and is fixedly connected to the upper part of the interior of the first drying tank. A drive motor is fixedly connected to one side of the top of both the cleaning tank and the first drying tank. A wiping mechanism is provided directly above both the cleaning tank and the first drying tank.

[0007] Furthermore, the wiping mechanism includes two pairs of support rods, each pair of support rods being located at opposite front and rear positions. The two support rods located at the same front and rear positions are movably connected to a wiping roller at their opposite faces in the center. Limiting rings are fixedly connected to both sides of the middle of each support rod. A bidirectional lead screw is provided on the lower side of the opposite faces of the two support rods on the same side of the two pairs of support rods. A pair of ball sliders are sleeved on the outer side of the bidirectional lead screw.

[0008] Furthermore, an extension rod is movably connected to the top of the ball slider, and the top end of the extension rod is slidably connected to the bottom end of the adjacent support rod.

[0009] Furthermore, the support rod is movably connected to the top surface of the electroplating tank with the limiting ring as the pivot, and the output end of the drive motor is fixedly connected to the bidirectional lead screw.

[0010] Furthermore, a filter screen is fixedly connected to the center of the cleaning tank, and the electroplating tank is filled with electroplating solution.

[0011] Compared with the prior art, the advantages of this utility model are as follows: This solution, by setting up a cleaning component and a drying component, can clean and dry the copper substrate to ensure the meticulous processing of the copper substrate electroplating process, reduce pollution problems, and improve the electroplating effect; at the same time, this solution, by setting up a wiping mechanism, can wipe the copper substrate with attached substances, thereby improving the processing effect of the copper substrate. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the overall structure of a preferred embodiment of the present invention;

[0013] Figure 2 for Figure 1 Schematic diagram of the structure of the central spray pipe;

[0014] Figure 3 for Figure 1 Schematic diagram of the structure of the central drying tube;

[0015] Figure 4 for Figure 1 A schematic diagram of the wiping mechanism;

[0016] Figure 5 for Figure 4 A structural breakdown diagram of the extension rod and the ball slider.

[0017] The following are the labels in the diagram: 1. Electroplating tank; 2. Cleaning tank; 3. First drying tank; 4. Electroplating tank; 5. Second drying tank; 6. Water pump; 7. Hot air blower; 8. Drive motor; 9. Wiping mechanism; 10. Spray pipe; 11. Drying pipe; 12. Extension rod; 13. Support rod; 14. Wiping roller; 15. Limiting ring; 16. Bidirectional lead screw; 17. Ball bearing slider. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0019] Please see Figure 1-5 A copper plating apparatus for producing a thermoelectrically separated copper substrate includes an electroplating tank 1. Inside the electroplating tank 1, a cleaning tank 2, a first drying tank 3, an electroplating tank 4, and a second drying tank 5 are sequentially arranged. The first drying tank 3 and the second drying tank 5 have the same structure. A pair of water pumps 6 are fixedly connected to both sides of the outside of the cleaning tank 2, and hot air blowers 7 are fixedly connected to both sides of the outside of the first drying tank 3.

[0020] A drive motor 8 is fixedly connected to the top side of the cleaning tank 2 and the top side of the first drying tank 3. The copper substrate is placed inside the cleaning tank 2 for cleaning.

[0021] In order to wipe the copper substrate before or after processing as needed and improve the subsequent processing effect of the copper substrate, wiping mechanisms 9 are provided directly above the cleaning tank 2 and the first drying tank 3.

[0022] Please see Figure 4 The wiping mechanism 9 includes two pairs of support rods 13. Each pair of support rods (13) is located in a relatively front-to-back position. The two support rods 13 located in the same front-to-back position are movably connected to a wiping roller 14 at the center of their opposite surfaces. Limiting rings 15 are fixedly connected to the middle of each support rod 13 on both sides. A bidirectional lead screw 16 is provided on the lower side of the opposite surfaces of the two support rods 13 located on the same side. A pair of ball bearing sliders 17 are sleeved on the outer side of the bidirectional lead screw 16.

[0023] Please see Figure 1 A filter screen is fixedly connected in the center of the cleaning tank 2, and the electroplating tank 4 is filled with electroplating solution. The filter screen filters out impurities that fall off the surface of the copper substrate.

[0024] Please see Figure 2 and Figure 3 The output end of the water pump 6 is fixedly connected to the spray pipe 10, and the spray pipe 10 is fixedly connected to the upper part of the interior of the cleaning tank 2. When the water pump 6 is started, it works with the spray pipe 10 to rinse the copper substrate. The output end of the hot air blower 7 is fixedly connected to the drying pipe 11, and the drying pipe 11 is fixedly connected to the upper part of the interior of the first drying tank 3.

[0025] Please see Figure 4 The support rod 13 is movably connected to the top surface of the electroplating tank 1 with the limiting ring 15 as the pivot. The output end of the drive motor 8 is fixedly connected to the bidirectional lead screw 16. The rotational stability of the support rod 13 is ensured by the limiting ring 15.

[0026] Please see Figure 5 An extension rod 12 is movably connected to the top of the ball slider 17, and the top end of the extension rod 12 is slidably connected to the bottom end of the adjacent support rod 13. When the drive motor 8 is started, the bidirectional lead screw 16 is driven to rotate. The bidirectional lead screw 16, in conjunction with the two ball sliders 17, drives the extension rod 12 and the support rod 13 to rotate, thereby adjusting the position of the wiping roller 14.

[0027] In use: The copper substrate is placed inside the cleaning tank 2. The drive motor 8 is started, driving the bidirectional lead screw 16 to rotate. The bidirectional lead screw 16, in conjunction with two ball bearing sliders 17, drives the extension rod 12 and the support rod 13 to rotate. The rotational stability of the support rod 13 is ensured by the limiting ring 15, thereby adjusting the position of the wiping rollers 14 so that the two wiping rollers 14 above the cleaning tank 2 cooperate to wipe the copper substrate. Then, the wiping rollers 14 above the cleaning tank 2 are reset, and the water pump 6 is started, in conjunction with the spray pipe 10, to rinse the copper substrate and filter out impurities that have fallen off the surface of the copper substrate. Afterward, the copper substrate is reset and sent into the first drying tank 3. At this time, the two wiping rollers 14 above the first drying tank 3 cooperate to wipe the water stains on the surface of the copper substrate. Then, the hot air blower 7 is started, in conjunction with the drying pipe 11, to heat and dry the copper substrate. Then, the cleaned and dried copper substrate is sent into the electroplating tank 4 for electroplating. Afterward, it is sent into the second drying tank 5 for wiping and drying of the electroplating solution on the surface of the copper substrate. Finally, the copper substrate is removed, and the electroplating process is completed.

[0028] The copper plating device described above uses a water pump (6) on the cleaning tank (2) in conjunction with a spray pipe (10) to rinse the copper substrate. Then, the hot air blower (7) on the first drying tank (3) in conjunction with a drying pipe (11) is used to wipe the copper substrate. After the electroplating process is completed, the copper substrate is dried again in the second drying tank (5) to complete the electroplating process. Compared with the prior art, the device is equipped with a cleaning component and a drying component, which can clean and dry the copper substrate to ensure the fine processing of the copper substrate electroplating process, reduce pollution problems, and improve the electroplating effect.

[0029] In addition, the copper plating device described above uses a wiping mechanism (9) to drive a motor (8) to rotate a bidirectional lead screw (16). The bidirectional lead screw (16) works with two ball bearing sliders (17) to rotate an extension rod (12) and a support rod (13). A limit ring (15) ensures the rotational stability of the support rod (13), thereby adjusting the position of the wiping roller (14) to wipe the copper substrate. Compared with the prior art, the wiping assembly can wipe copper substrates with attached substances, further improving the processing effect of the copper substrate.

[0030] Finally, it should be noted that in the description of this utility model, the terms "upper" and "lower" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0031] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0032] The above description is merely a preferred embodiment of this utility model; however, the protection scope of this utility model is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the technical scope disclosed in this utility model, based on the technical solution and its improved concept, should be included within the protection scope of this utility model.

Claims

1. A copper plating apparatus for producing a thermoelectrically separated copper substrate, comprising an electroplating tank (1), wherein the electroplating tank (1) is provided with a cleaning tank (2), a first drying tank (3), an electroplating tank (4), and a second drying tank (5) sequentially arranged inside the electroplating tank (1), wherein the first drying tank (3) and the second drying tank (5) have the same structure, characterized in that: A pair of water pumps (6) are fixedly connected to the outside of the cleaning tank (2) on both sides. The output end of the water pump (6) is fixedly connected to a spray pipe (10), and the spray pipe (10) is fixedly connected to the upper part of the inside of the cleaning tank (2). A hot air blower (7) is fixedly connected to the outside of the first drying tank (3) on both sides. The output end of the hot air blower (7) is fixedly connected to a drying pipe (11), and the drying pipe (11) is fixedly connected to the upper part of the inside of the first drying tank (3). A drive motor (8) is fixedly connected to the top side of the cleaning tank (2) and the top side of the first drying tank (3). A wiping mechanism (9) is provided directly above the cleaning tank (2) and the first drying tank (3).

2. The copper plating apparatus for producing thermoelectric separation copper substrates according to claim 1, characterized in that: The wiping mechanism (9) includes two pairs of support rods (13). Each pair of support rods (13) is located in a relative front-back position. The two support rods (13) located in the same front-back position are movably connected to the opposite face of the wiping roller (14). The middle part of the support rod (13) is fixedly connected to both sides with limit rings (15). The two support rods (13) located on the same side of the two pairs of support rods (13) are provided with a bidirectional lead screw (16) on the lower side of the opposite face of the bidirectional lead screw (16). A pair of ball sliders (17) are sleeved on the outer side of the bidirectional lead screw (16).

3. The copper plating apparatus for producing thermoelectric separation copper substrates according to claim 2, characterized in that: The top of the ball block slider (17) is movably connected to an extension rod (12), and the top end of the extension rod (12) is slidably connected to the bottom end of the adjacent support rod (13).

4. The copper plating apparatus for producing thermoelectric separation copper substrates according to claim 2, characterized in that: The support rod (13) is movably connected to the top surface of the electroplating tank (1) with the limiting ring (15) as the pivot, and the output end of the drive motor (8) is fixedly connected to the bidirectional lead screw (16).

5. The copper plating apparatus for producing thermoelectric separation copper substrates according to claim 1, characterized in that: A filter screen is fixedly connected in the center of the cleaning tank (2), and the electroplating tank (4) is filled with electroplating solution.

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