Server mainboard radiator

The design of the mounting plate and mounting mechanism solves the problem of inconvenient operation when applying thermal paste to heat sinks in the existing technology, and achieves convenient installation and grease application.

CN224122956UActive Publication Date: 2026-04-14SIHUI HONGYI ELECTRONICS TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-04-17
Publication Date
2026-04-14

AI Technical Summary

Technical Problem

Applying thermal paste to existing server heat sinks requires removing the entire heat sink and realigning it with the mounting holes, which is inconvenient.

Method used

The system employs a mounting plate and mounting mechanism, including a main base, a secondary base, a connecting seat, a round rod, a plug, and fasteners. Through the cooperation of torsion bars and threaded rods, it enables convenient installation and grease application of the radiator.

Benefits of technology

This facilitates the installation and grease application of the radiator, eliminating the need for disassembly and realignment, and improving operational convenience and stability.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model belongs to the field of computers, particularly relates to a server mainboard radiator, and aims to solve the problems that the whole radiator needs to be dismounted for operation when re-coating is needed in the later stage, and the corresponding mounting holes need to be aligned again for mounting when the radiator is re-mounted, so that the operation is very inconvenient. Comprising a radiator body and a mounting plate arranged at the bottom of the radiator body, the mounting plate comprises a main base and two auxiliary bases, the radiator body is mounted at the top of the main base, and the two auxiliary bases are located at one ends of the two sides of the main base respectively. The radiator can be conveniently installed on the server mainboard, corresponding operation can be completed without overall disassembly for subsequent greasing, the alignment step is omitted, and the radiator is higher in practicability and better meets the actual requirement.
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Description

Technical Field

[0001] This utility model relates to the field of computer technology, and in particular to a server motherboard heat sink. Background Technology

[0002] In server heat dissipation, air cooling is one of the most mainstream methods. When the processor on the server motherboard generates heat, this heat is transferred to the heat sink body through heat conduction. The heat sink body is usually made of high thermal conductivity materials, such as copper or aluminum, which can quickly absorb heat and disperse it throughout the heat sink. At the same time, the fan on the heat sink generates airflow, which carries away the heat on the heat sink through convection and exhausts it to the outside of the server chassis, so that the heat on the server motherboard can be effectively dissipated, thereby ensuring the stable operation of the server.

[0003] In practical use, thermal paste is applied between the heatsink and the CPU. Its main function is to fill the tiny gaps between the CPU and the heatsink, expel air, and improve heat conduction efficiency, thereby aiding in heat dissipation. However, most existing heatsinks are installed with screws, requiring the entire heatsink to be removed before reapplying thermal paste. Furthermore, reinstallation necessitates realigning the mounting holes, which is inconvenient. Therefore, a heatsink that is securely installed and easy to apply thermal paste to is needed. Utility Model Content

[0004] The purpose of this utility model is to solve the problem that in the existing technology, when re-coating is required, the entire heat sink needs to be removed and operated, and when reinstalling, the corresponding mounting holes need to be aligned again, which is very inconvenient. Therefore, a server motherboard heat sink is proposed.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A server motherboard heat sink includes a heat sink body and a mounting plate disposed at the bottom of the heat sink body. The mounting plate includes a main base and two secondary bases. The heat sink body is mounted on the top of the main base. The two secondary bases are respectively located at one end of each side of the main base. A connecting seat is fixedly disposed on one side of the top of each secondary base. A round rod is fixedly disposed on both sides of the top of the main base, and one end of the round rod is located inside the connecting seat.

[0007] The mounting mechanism is used to mount the main base and the sub-base onto the motherboard. The mounting mechanism is respectively located on the top of the main base and the sub-base. The mounting mechanism includes two No. 1 fixing components, which are respectively located on the top of the two sub-bases. Each No. 1 fixing component includes a No. 1 torsion bar and a No. 1 threaded rod fixedly located at the bottom end of the No. 1 torsion bar. The No. 1 threaded rod is threaded through the sub-base.

[0008] In one possible design, the mounting mechanism further includes two inserts. A fixing seat is fixedly mounted on the top of the main base. Both sides of the fixing seat have internal cavities. The two inserts are slidably mounted inside the two internal cavities. One end of the insert slides through the fixing seat, the round rod, and the connecting seat. Both sides of the top of the fixing seat have sliding openings, and the two sliding openings are respectively connected to the two internal cavities. The other end of the insert extends to the outside of the fixing seat through the sliding opening.

[0009] In one possible design, the outer wall of the first torsion bar has an annular groove, and one end of the insert extends into the interior of the annular groove.

[0010] In one possible design, a limiting rod is fixedly installed inside the cavity, a connecting plate is fixedly installed at the bottom of the insert, and the connecting plate is slidably sleeved on the outer wall of the limiting rod. A compression spring is sleeved on the outer wall of the limiting rod, and the two ends of the compression spring are respectively fixedly installed on one side of the inner wall of the cavity and one side of the connecting plate.

[0011] In one possible design, the mounting mechanism further includes two secondary fasteners, which are located on opposite sides of the top of the main base and at an end away from the sub-base.

[0012] In one possible design, the second fixing component includes a second torsion bar and a second threaded rod fixedly disposed at the bottom end of the second torsion bar. The second threaded rod is threaded through the main base. Rotary rings are rotatably disposed on both sides of the top of the main base, and the two rotating rings are respectively sleeved on the outer walls of the two second threaded rods. A tension spring is sleeved on the outer wall of the second torsion bar, and the two ends of the tension spring are respectively fixedly disposed on the outer wall of the second torsion bar and the top of the rotating ring.

[0013] In one possible design, the bottom of the main base has an opening, and the contact surface of the radiator body mates with the opening.

[0014] In this application, during actual use, after applying the thermal paste, place it on the motherboard and rotate the second torsion bar. The second torsion bar rotates the second threaded rod, screwing it into the threaded groove on the motherboard. Then, rotate the first torsion bar and repeat the same operation. After the fixing component is installed, the insert will be moved by the force of the compression spring, locking it into the inner part of the annular groove. At this time, the first torsion bar will not be able to rotate, and the insert will also connect the connector and the round rod, thus connecting the main base and the secondary base, completing the installation of the heatsink. When it is necessary to reapply thermal paste, first rotate the second torsion bar to disengage the second threaded rod from the motherboard, and... When rotating the second torsion bar, the swivel and tension spring will also rotate together, and the tension spring will be stretched to provide tension during reset, thereby increasing the stability of the second threaded rod. Then, move the two inserts to disengage them from the connector. At this point, the round rod will be released from the connector and can move freely inside the connector, thus releasing the fixation between the main base and the secondary base. This allows the main base and the heat sink body to rotate and move upwards. At this point, thermal grease can be reapplied. Then, during reinstallation, the operation can be reversed. This operation is more convenient and avoids the problem of needing to realign during installation.

[0015] In this utility model, the server motherboard heat sink, through the mounting plate, can achieve the installation of the heat sink body at the same time, and when applying grease later, it is not necessary to disassemble the entire heat sink. This not only saves the corresponding operation, but also avoids the problem of the mounting holes being difficult to align.

[0016] In this utility model, the server motherboard heat sink, through the installation mechanism, can fix the mounting plate to the server motherboard. It is not only simple in structure and operation, but also can realize the connection and fixation between the main base and the sub-base in the mounting plate, thereby ensuring the overall stability.

[0017] In this invention, by using the mounting plate and fasteners, the heat sink can be conveniently installed onto the server motherboard. Furthermore, subsequent grease application can be completed without complete disassembly, saving the alignment steps and making it more practical and better suited to actual needs. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the main structure of a server motherboard heat sink proposed in this utility model;

[0019] Figure 2 This utility model Figure 1 Enlarged view of the structure of section A;

[0020] Figure 3 This is a rear view structural diagram of a server motherboard heat sink proposed in this utility model;

[0021] Figure 4 This is a rear cross-sectional view of a server motherboard heatsink proposed in this utility model.

[0022] Figure 5 This utility model Figure 4 Enlarged view of the structure of section B;

[0023] Figure 6 This utility model Figure 4 Enlarged view of the structure of section C;

[0024] Figure 7 This is a bottom view of the structure of a server motherboard heatsink proposed in this utility model.

[0025] In the diagram: 1. Main base; 2. Radiator body; 3. Sub-base; 4. Torsion bar No. 2; 5. Tension spring; 6. Rotary ring; 7. Threaded rod No. 2; 8. Fixing seat; 9. Insert; 10. Connecting seat; 11. Limiting rod; 12. Inner cavity; 13. Connecting plate; 14. Compression spring; 15. Sliding mouth; 16. Round rod; 17. Threaded rod No. 1; 18. Circular groove; 19. Torsion bar No. 1. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Example

[0027] Reference Figure 1 , Figure 3 A radiator includes a radiator body 2 and a mounting plate disposed at the bottom of the radiator body 2. The mounting plate consists of a main base 1 and two auxiliary bases 3. The radiator body 2 is mounted on top of the main base 1, and the two auxiliary bases 3 are respectively located at one end of each side of the main base 1. A connecting seat 10 is fixedly disposed on one side of the top of the auxiliary base 3, and round rods 16 are fixedly disposed on both sides of the top of the main base 1, with one end of the round rods 16 located inside the connecting seat 10.

[0028] To mount the main base 1 and the sub-base 3 onto the motherboard, a mounting mechanism is provided. The mounting mechanism is located on the top of both the main base 1 and the sub-base 3, and specifically includes two fixing components, each located on top of one of the sub-bases 3. Each fixing component consists of a torsion bar 19 and a threaded rod 17 fixed to the bottom end of the torsion bar 19. The threaded rod 17 is threaded through the sub-base 3. By rotating the torsion bar 19, the extension length of the threaded rod 17 can be adjusted, thereby aligning it with the threaded groove on the motherboard for installation.

[0029] Reference Figure 2 The mounting mechanism also includes two secondary fixing components, located on opposite sides of the top of the main base 1, away from the sub-base 3. Each secondary fixing component consists of a secondary torsion bar 4 and a secondary threaded rod 7 fixed to the bottom of the secondary torsion bar 4, with the threaded rod 7 threaded through the main base 1. Rotary rings 6 are rotatably mounted on both sides of the top of the main base 1, each ring fitting around the outer wall of one of the secondary threaded rods 7. A tension spring 5 is fitted onto the outer wall of the secondary torsion bar 4, with its two ends fixed to the outer wall of the secondary torsion bar 4 and the top of the rotating rings 6, respectively. Similarly, by rotating the secondary torsion bar 4, the secondary threaded rod 7 at its bottom is screwed onto the main plate for installation. The tension spring 5 applies a downward force to the torsion bar, thereby increasing stability.

[0030] Reference Figure 7 The bottom of the main base 1 has an opening, which allows the heat sink body 2 to fit snugly against the motherboard.

[0031] This application can be used in the field of computers, or in other fields applicable to this application. Example

[0032] refer to Figure 4-5 An improvement upon Embodiment 1: A server motherboard heatsink, applied in the computer field, includes two inserts 9 in its mounting mechanism. A fixing seat 8 is fixedly mounted on the top of the main base 1. Both sides of the fixing seat 8 have internal cavities 12, and the two inserts 9 are slidably disposed within the two internal cavities 12. One end of the insert 9 slides through the fixing seat 8, the round rod 16, and the connecting seat 10, while the other end extends to the outside of the fixing seat 8 through a sliding opening 15. A circular groove 18 is formed on the outer wall of the first torsion rod 19, and one end of the insert 9 extends into the interior of the circular groove 18.

[0033] To ensure more stable sliding of the insert 9 within the inner cavity 12, a limiting rod 11 is fixedly installed inside the inner cavity 12, and a connecting plate 13 is fixedly installed at the bottom of the insert 9. The connecting plate 13 is slidably sleeved on the outer wall of the limiting rod 11. A compression spring 14 is sleeved on the outer wall of the limiting rod 11, with both ends of the compression spring 14 fixedly installed on one side of the inner wall of the inner cavity 12 and one side of the connecting plate 13, respectively, so that the insert 9 can automatically return to its original position after movement.

[0034] Specifically, after applying the thermal paste, place it on the motherboard and rotate the second torsion bar 4. The second torsion bar 4 drives the second threaded rod 7 to rotate, screwing it into the threaded groove on the motherboard itself. Then, rotate the first torsion bar 19 and perform the same operation. After the fastener is installed, the insert 9 will be moved by the force of the compression spring 14, causing it to lock into the inside of the annular groove 18. At this time, the first torsion bar 19 will not be able to rotate. At the same time, the insert 9 will also connect the connector 10 and the round rod 16, thereby connecting the main base 1 and the secondary base 3. This completes the installation of the heatsink. When the processor on the server motherboard generates heat, it will be transferred to the heatsink body through heat conduction. Then, the fan on the heatsink will generate airflow, which will carry away the heat from the heatsink through convection and exhaust it to the outside of the server chassis to achieve heat dissipation.

[0035] When reapplying thermal paste, first rotate the second torsion bar 4 to disengage the second threaded rod 7 from the motherboard. As the second torsion bar 4 rotates, the rotating ring 6 and tension spring 5 will also rotate, stretching the tension spring 5 to provide tension during resetting, thus increasing the stability of the second threaded rod 7. Then, move the two inserts 9 to disengage them from the connector 10. At this point, the round rod 16 will be released from the connector 10, allowing it to move freely within the connector 10. This releases the fixation between the main base 1 and the secondary base 3, giving the main base 1 and the heatsink body 2 room to rotate and move upwards. Thermal paste can then be reapplied. Reinstallation is then performed in reverse order, making the process more convenient and avoiding the need for realignment during installation.

[0036] However, as is well known to those skilled in the art, the working principle and wiring method of the radiator body 2 are commonplace and are all conventional methods or common knowledge. They will not be described in detail here. Those skilled in the art can make any selections according to their needs or convenience.

[0037] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A server motherboard heatsink, characterized in that, include: The radiator body (2) and the mounting plate set at the bottom of the radiator body (2) include a main base (1) and two auxiliary bases (3). The radiator body (2) is installed on the top of the main base (1). The two auxiliary bases (3) are respectively located at one end of the two sides of the main base (1). A connecting seat (10) is fixedly provided on one side of the top of the auxiliary base (3). A round rod (16) is fixedly provided on both sides of the top of the main base (1), and one end of the round rod (16) is located inside the connecting seat (10). The mounting mechanism is used to mount the main base (1) and the sub-base (3) onto the motherboard. The mounting mechanism is respectively set on the top of the main base (1) and the sub-base (3). The mounting mechanism includes two first fixing parts, which are respectively set on the top of the two sub-bases (3). The first fixing part includes a first torsion bar (19) and a first threaded bar (17) fixed at the bottom end of the first torsion bar (19). The first threaded bar (17) is threaded through the sub-base (3).

2. A server motherboard heatsink according to claim 1, characterized in that, The installation mechanism also includes two inserts (9). A fixed seat (8) is fixedly installed on the top of the main base (1). An inner cavity (12) is opened on both sides of the fixed seat (8). The two inserts (9) are slidably installed inside the two inner cavities (12). One end of the insert (9) slides through the fixed seat (8), the round rod (16) and the connecting seat (10). A sliding opening (15) is opened on both sides of the top of the fixed seat (8), and the two sliding openings (15) are connected to the two inner cavities (12) respectively. The other end of the insert (9) extends to the outside of the fixed seat (8) through the sliding opening (15).

3. A server motherboard heatsink according to claim 2, characterized in that, The outer wall of the first torsion bar (19) is provided with an annular groove (18), and one end of the insert (9) extends into the interior of the annular groove (18).

4. A server motherboard heatsink according to claim 3, characterized in that, A limiting rod (11) is fixedly installed inside the inner cavity (12). A connecting plate (13) is fixedly installed at the bottom of the insert (9). The connecting plate (13) is slidably sleeved on the outer wall of the limiting rod (11). A compression spring (14) is sleeved on the outer wall of the limiting rod (11). The two ends of the compression spring (14) are respectively fixedly installed on one side of the inner wall of the inner cavity (12) and one side of the connecting plate (13).

5. A server motherboard heatsink according to claim 1, characterized in that, The installation mechanism also includes two secondary fasteners, which are located on the top sides of the main base (1) and at one end away from the sub-base (3).

6. A server motherboard heatsink according to claim 5, characterized in that, The second fixing component includes a second torsion bar (4) and a second threaded bar (7) fixedly disposed at the bottom end of the second torsion bar (4). The second threaded bar (7) is threaded through the main base (1). Rotary rings (6) are rotatably disposed on both sides of the top of the main base (1), and the two rotating rings (6) are respectively sleeved on the outer walls of the two second threaded bars (7). A tension spring (5) is sleeved on the outer wall of the second torsion bar (4), and the two ends of the tension spring (5) are respectively fixedly disposed on the outer wall of the second torsion bar (4) and the top of the rotating ring (6).

7. A server motherboard heatsink according to claim 1, characterized in that, The bottom of the main base (1) has an opening, and the contact surface of the radiator body (2) matches the opening.