Microphone structure and electronic equipment

Abstract

The utility model provides a microphone structure and electronic equipment, and relates to the technical field of electronic equipment. The microphone structure comprises a circuit board which is provided with a sound receiving hole penetrating through the circuit board; the shell is connected with the circuit board to define an accommodating cavity, and the sound receiving hole is communicated with the accommodating cavity; and the silicon net layer is connected with the circuit board and covers the sound receiving hole, the silicon net layer is provided with a plurality of air holes, and the air holes and the sound receiving hole are correspondingly arranged so that sound can be conducted.

Description

Technical Field

[0001] This application relates to the field of electronic device technology, and in particular to a microphone structure and electronic device. Background Technology

[0002] As a critical audio input component of electronic devices, the performance and stability of microphones directly affect the user experience and market competitiveness of products. However, in the manufacturing process of electronic devices, water ingress into microphones affects their performance and accuracy, and reduces the product yield. Utility Model Content

[0003] The purpose of this application is to provide a microphone structure and electronic device, mainly providing the following technical solutions:

[0004] The first aspect of this application provides a microphone structure, which includes: a circuit board having a sound receiving hole penetrating the circuit board;

[0005] The housing is connected to the circuit board to form a receiving cavity, and the sound receiving hole communicates with the receiving cavity;

[0006] A silicon mesh layer is connected to the circuit board and covers the sound-receiving hole. The silicon mesh layer has a plurality of vent holes, which are arranged corresponding to the sound-receiving hole to enable sound conduction.

[0007] In some modified embodiments of the first aspect of this application

[0008] The silicon mesh layer is disposed on the first side of the circuit board; and / or,

[0009] The silicon mesh layer is disposed on the second side of the circuit board opposite to the first side.

[0010] In some modified embodiments of the first aspect of this application, the silicon mesh layer is disposed within the microphone hole of the circuit board.

[0011] In some modified embodiments of the first aspect of this application, the silicon mesh layer is fixedly connected to the circuit board by a sealant.

[0012] In some modified embodiments of the first aspect of this application

[0013] Also includes:

[0014] A diaphragm is located within the receiving cavity, and a sound receiving cavity is formed between the diaphragm and the circuit board. The sound receiving hole is connected to the sound receiving cavity through a silicon mesh layer.

[0015] In some modified embodiments of the first aspect of this application, the pore size of the vent is 50-60 micrometers.

[0016] In some modified embodiments of the first aspect of this application, the spacing between any two adjacent vent holes is 150-200 micrometers.

[0017] In some modified embodiments of the first aspect of this application, the first region of the silicon mesh layer is provided with the plurality of vent holes, and the area of ​​the first region is not less than the area of ​​the region where the sound-receiving hole is located.

[0018] A second aspect of this application provides an electronic device, the electronic device comprising: a body having a first hole;

[0019] A microphone structure is disposed within the body corresponding to the first hole, the microphone structure comprising:

[0020] A circuit board is disposed inside the housing, and the circuit board is provided with a sound receiving hole that penetrates the circuit board, and the position of the sound receiving hole corresponds to that of the hole portion;

[0021] The housing is connected to the circuit board to form a receiving cavity, and the sound receiving hole communicates with the receiving cavity;

[0022] A silicon mesh layer is connected to the circuit board and covers the sound-receiving hole. The silicon mesh layer has a plurality of vent holes, which are arranged corresponding to the sound-receiving hole to enable sound conduction.

[0023] Some modified embodiments of the second aspect of this application also include:

[0024] The camera module is mounted on the circuit board;

[0025] The main body is provided with a second hole located on the side of the first hole, and the camera module is provided correspondingly to the second hole. Attached Figure Description

[0026] The above and other objects, features, and advantages of exemplary embodiments of this application will become readily understood by reading the following detailed description with reference to the accompanying drawings. In the drawings, several embodiments of this application are illustrated by way of example and not limitation, with the same or corresponding reference numerals denoteing the same or corresponding parts, wherein:

[0027] Figure 1 A schematic diagram of the microphone structure provided in an embodiment of this application is shown.

[0028] Figure 2 A schematic diagram of another microphone structure provided in an embodiment of this application is shown.

[0029] Figure 3 A schematic diagram of another microphone structure provided in an embodiment of this application is shown.

[0030] Figure 4 A schematic diagram of another microphone structure provided in an embodiment of this application is shown.

[0031] Figure 5 A schematic diagram of another microphone structure provided in an embodiment of this application is shown.

[0032] Figure 6 A schematic diagram of the silicon mesh layer of the microphone structure provided in the embodiments of this application is shown.

[0033] Figure 7 A partial structural diagram of the electronic device provided in an embodiment of this application is shown schematically;

[0034] Figure 8 A partial structural diagram of another electronic device provided in an embodiment of this application is shown schematically;

[0035] Explanation of icon numbers:

[0036] 1. Circuit board; 101. Microphone hole; 2. Housing; 3. Silicon mesh layer; 301. Vent hole; 31. First area; 32. Second area; 4. Sealant; 5. Diaphragm; 6. Camera module. Detailed Implementation

[0037] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0038] It should be noted that, unless otherwise stated, the technical or scientific terms used in this application shall have the ordinary meaning as understood by one of ordinary skill in the art to which this application pertains.

[0039] Example 1

[0040] Reference Appendix Figure 1 - Appendix Figure 6 Embodiment 1 of this application proposes a microphone structure, which includes: a circuit board 1 having a sound receiving hole 101 penetrating the circuit board 1; a housing 2 connected to the circuit board 1 and enclosing it to form a receiving cavity, wherein the sound receiving hole 101 communicates with the receiving cavity; and a silicon mesh layer 3 connected to the circuit board 1 and covering the sound receiving hole 101, wherein the silicon mesh layer 3 has a plurality of vent holes 301, the vent holes 301 being correspondingly arranged with respect to the sound receiving hole 101 to enable sound conduction.

[0041] Specifically, this embodiment provides a microphone structure that achieves good waterproof performance. The structure includes a circuit board 1, a housing 2, and a silicon mesh layer 3. The circuit board 1 has a through-hole 101 for receiving sound. The housing 2 is disposed on the circuit board 1, with its opening facing the circuit board 1, and forms a cavity with the circuit board 1. The sound hole 101 on the circuit board 1 is located within and communicates with the cavity. The cavity design provides physical protection for the internal components of the microphone and prevents dust, moisture, and other debris from entering the microphone. To prevent moisture from entering the cavity through the sound hole 101, this application employs a silicon mesh layer 3 at the sound hole 101. The silicon mesh layer 3 can be made of hydrophobic silicone material and covers the entire sound hole 101. The silicon mesh layer 3 has several vent holes 301, which correspond to and are connected to the sound receiving hole 101. Since the wavelength of sound waves is relatively long, they can easily pass through the vent holes 301 of the silicon mesh layer 3, thus ensuring that the sound can be transmitted smoothly. The vent holes 301 of the silicon mesh layer 3 are tiny holes with a diameter much smaller than that of a water droplet. Therefore, when a water droplet passes through the silicon mesh layer 3, it will be restricted by capillary force and cannot pass through the tiny vent holes 301 smoothly. When water encounters the silicon mesh layer 3, due to the surface tension between water molecules, the water droplet will tend to maintain its spherical shape rather than disperse into smaller droplets to pass through the vent holes 301. Thus, the silicon mesh layer 3 can achieve the effect of water resistance and sound transmission. Even if the microphone structure works in a humid environment, water will not enter the cavity, ensuring the stability of its performance.

[0042] Among them, reference appendix Figure 2 Multiple vent holes 301 can be arranged at intervals on the silicon mesh layer 3. The cross-sectional shape of the vent holes 301 can be circular, elliptical, rectangular or regular polygonal, etc., without specific limitations.

[0043] Based on the relationship between liquid surface tension and liquid pressure in capillary action, when the surface tension effect generated by the tortuous liquid surface formed on the inner wall of the capillary is balanced with the pressure difference between the liquid inside and outside the capillary, we can derive: 2πrσcosθ=πr 2 (P0-P), thus obtaining r=2σcosθ / P0-P (Formula 1), where 2πrσcosθ represents the integral of the liquid surface along the circumference of the capillary, which represents the upward pulling force generated by the surface tension at the contact surface between the liquid and the capillary, and πr 2(P0-P) represents the pressure generated by the pressure difference between the liquid inside and outside the capillary. Under steady-state conditions of capillary action, these two forces are in equilibrium. r is the radius of the capillary, σ is the surface tension coefficient of the liquid (the surface tension coefficient of water is 0.073 N / m), θ is the contact angle between the liquid and the capillary material (the contact angle between water and hydrophobic silica gel is 167.3°), P0 is the pressure of the liquid outside the capillary (usually atmospheric pressure), and P is the pressure of the liquid inside the capillary. The results are calculated according to Formula 1 and are shown in Table 1 below. Table 1 lists the correspondence between pore size and dustproof and waterproof rating requirements.

[0044] Table 1: Correspondence between pore size and dustproof / waterproof rating

[0045] <![CDATA[r=2σcosθ / P0-P]]> Aperture size Waterproof rating 0.0014162 1400 micrometers Water pressure above 0.01m 0.0001416 140 micrometers Water pressure above 0.1m 0.0000566 56 micrometers Water pressure above 1.25m 0.0000142 14 micrometers Water pressure above 2.25m 0.0000071 7 micrometers Water pressure above 3.25m 0.0000014 1.4 micrometers Water pressure above 10.25m

[0046] According to Table 1, based on the IP67 dustproof and waterproof rating requirements, the optimal dustproof and waterproof effect is achieved when the pore size of the vent 301 is 56 micrometers. Therefore, the pore size of the vent 301 in the silicon mesh layer 3 can be set to 50-60 micrometers. Within this range, setting the pore size of the vent 301 to 50 micrometers provides better water and water resistance, while setting it to 60 micrometers provides better sound conduction. The tiny vent 301 effectively prevents moisture from entering the cavity, preventing internal components from being damaged by moisture, while also ensuring sound conduction and air circulation, maintaining pressure balance inside and outside the sound chamber, and avoiding performance degradation or structural damage due to pressure differences. At the same time, this pore size range can also effectively block the intrusion of dust and other tiny contaminants, thereby greatly improving the durability and stability of the equipment while ensuring sound reception.

[0047] Specifically, the multiple vent holes 301 on the silicon mesh layer 3 can be configured with equal or unequal diameters. For example, the first region 31 of the silicon mesh layer 3 with vent holes 301 can be further divided into a concentric central circular region, an intermediate annular region, and an outer annular region. The diameter of the vent holes 301 in the central circular region can be set to 50 micrometers, the diameter of the vent holes 301 in the outer annular region can be set to 60 micrometers, and the diameter of the vent holes 301 in the intermediate annular region can be set with vent holes 301 with diameters of 52 micrometers, 54 micrometers, 56 micrometers, and 58 micrometers from the inside out, to achieve the desired effect. To achieve better sound conduction at the center and better waterproofing at the periphery, the following methods can be used: The central circular area's vent hole 301 can be set to a diameter of 60 micrometers, the outer ring area's vent hole 301 can be set to a diameter of 50 micrometers, and the central ring area can have vent holes 301 with diameters of 59 micrometers, 57 micrometers, 55 micrometers, and 53 micrometers arranged from the inside out, thus achieving better sound conduction at the center and better waterproofing at the periphery. Using multiple vent holes 301 with unequal diameters, not limited to the above two methods, can also achieve a better balance between sound conduction and waterproofing performance. The vent holes 301 with different diameters in the central ring area can be randomly mixed or arranged in a ring array, such as vent holes 301 with diameters of 52 micrometers, 54 micrometers, 56 micrometers, and 58 micrometers arranged in at least one ring, but not limited to these methods.

[0048] Furthermore, when arranging multiple vent holes 301, the spacing between any two adjacent vent holes 301 can be 150-200 micrometers. Within this range, setting the spacing of the vent holes 301 to 150 micrometers allows for the arrangement of a larger number of vent holes 301, resulting in better sound conduction of the silicon mesh layer 3. Setting the spacing of the vent holes 301 to 200 micrometers provides better water and water resistance for the silicon mesh layer 3. The preferred spacing of the vent holes 301 is 180 millimeters. This spacing range ensures effective gas exchange and flow between the vent holes 301, preventing obstruction of gas flow and impact on sound conduction. It also prevents problems such as reduced structural strength, impaired sound conduction, or easy clogging caused by excessively dense vent holes 301. At the same time, a reasonable spacing can also improve the durability of the silicon mesh layer 3 to a certain extent, providing better water and sound transmission performance and a longer service life for the equipment.

[0049] Further, see attached document. Figure 1 The silicon mesh layer 3 can be configured as a flat mesh structure, which simplifies the manufacturing process of the silicon mesh layer 3 and facilitates the arrangement and processing of the vent holes 301; or refer to the appendix. Figure 2 The silicon mesh layer 3 can also be configured as an arc-shaped mesh structure with at least its central portion bulging towards the cavity side. This helps guide water droplets that cannot pass through the silicon mesh layer 3 towards the edge, causing them to fall and move away from the cavity; or refer to the appendix. Figure 3 The silicon mesh layer 3 can also be configured as an arc-shaped mesh structure that protrudes at least in the middle towards the side away from the receiving cavity. This allows water droplets outside the silicon mesh layer 3 to be further away from the receiving cavity, and can guide water droplets that cannot pass through the silicon mesh layer 3 to the center of the silicon mesh layer 3, causing them to gather and fall quickly, further away from the receiving cavity, thus improving the waterproof effect.

[0050] Furthermore, in specific implementations, to achieve the fixation of the silicon mesh layer 3 on the circuit board 1 and the coverage of the sound receiving hole 101, the position of the silicon mesh layer 3 can be set in various ways. The following are examples illustrating three possible positions of the silicon mesh layer 3:

[0051] The first setting location is: (See attached document) Figure 4 The silicon mesh layer 3 can be disposed on the first side of the circuit board 1, which can refer to the side of the circuit board 1 facing away from the housing 2. The silicon mesh layer 3 can cover the entire sound receiving hole 101 from the first side of the circuit board 1. This can firstly prevent water from entering the sound receiving hole 101 and prevent water vapor from hindering the sound transmission of the sound receiving hole 101. It also further improves the waterproof effect of the housing cavity. In addition, the silicon mesh layer 3 can fully contact the circuit board 1 to improve the reliability of the connection between the two.

[0052] The second setting location is: see attached document. Figure 1 The silicon mesh layer 3 can be disposed on the second side of the circuit board 1 opposite to the first side. This second side can be the side of the circuit board 1 facing the housing 2. This placement position allows the silicon mesh layer 3 to be located inside the receiving cavity, which is beneficial for the protection of the silicon mesh layer 3. In addition, the silicon mesh layer 3 can make full contact with the circuit board 1, thereby improving the reliability of the connection between the two.

[0053] To further improve the water-proofing effect, two silicon mesh layers 3 can be used, and the setting position adopts a combination of the first setting position and the second setting position. That is, one silicon mesh layer 3 is set on the first side of the circuit board 1, and the other silicon mesh layer 3 is set on the second side of the circuit board 1. The positions of the two silicon mesh layers 3 correspond and cover the sound receiving hole 101 at the same time.

[0054] The third setting location is: see attached document. Figure 5 The silicon mesh layer 3 is disposed inside the sound receiving hole 101 of the circuit board 1, which does not affect the external structure of the circuit board 1, and is conducive to reducing the arrangement area of ​​the silicon mesh layer 3, saving materials, and helping to reduce costs. Furthermore, the solution of disposing the silicon mesh layer 3 inside the sound receiving hole 101 can improve the protection of the silicon mesh layer 3.

[0055] Specifically, in order to achieve a reliable connection between the silicon mesh layer 3 and the circuit board 1, the technical solution adopted in this application, when the silicon mesh layer 3 is arranged in any of the three positions mentioned above, refers to the appendix. Figure 1 - Appendix Figure 5The silicon mesh layer 3 can be fixed to the circuit board 1 by using sealant 4. For example, when the silicon mesh layer 3 is disposed on the first and / or second side of the circuit board 1, sealant 4 is disposed on the area of ​​the silicon mesh layer 3 facing the surface of the circuit board 1 and not corresponding to the sound hole 101, so as to achieve bonding and fixation with the circuit board 1; or when the silicon mesh layer 3 is disposed in the sound hole 101, sealant 4 can be disposed on the outer peripheral surface of the silicon mesh layer 3 to achieve bonding and fixation with the circuit board 1.

[0056] Reference Appendix Figure 6 When the silicon mesh layer 3 is arranged in the first and second settings, it can be divided into a first region 31 and a second region 32 surrounding the first region 31. The first region 31 of the silicon mesh layer 3 is provided with a number of vent holes 301, and the area of ​​the first region 31 is not less than the area of ​​the sound receiving hole 101. This can ensure the water-proof performance of the silicon mesh layer 3 while further improving the air permeability and sound reception clarity of the silicon mesh layer 3, and reduce the influence of the silicon mesh layer 3 on sound transmission. The second region 32 can be provided with sealant 4 to achieve bonding with the circuit board 1.

[0057] Further, see attached document. Figure 1 - Appendix Figure 5 In a specific implementation, the microphone structure provided in this embodiment further includes: a diaphragm 5 located in the receiving cavity, and a sound receiving cavity is formed between the diaphragm 5 and the circuit board 1, and the sound receiving hole 101 is connected to the sound receiving cavity through the silicon mesh layer 3.

[0058] Specifically, in the technical solution adopted in this application, a diaphragm 5 is also provided inside the receiving cavity for receiving sound wave vibrations. When sound waves pass through the sound receiving hole 101 and enter the receiving cavity, they will cause the diaphragm 5 to vibrate. This vibration will be converted into an electrical signal to achieve sound capture and transmission. A sound receiving cavity is formed between the diaphragm 5 and the circuit board 1, and the sound receiving hole 101 is connected to the sound receiving cavity through the silicon mesh layer 3, which can effectively improve the sound reception effect and protect the internal structure, enabling efficient and stable audio acquisition. (See attached document) Figure 1 When the silicon mesh layer 3 is disposed on the second side of the circuit board 1 opposite to the first side, that is, on the side of the circuit board 1 facing the housing 2, the distance between the silicon mesh layer 3 and the diaphragm 5 is related to the position of the diaphragm 5 and the thickness of the silicon mesh layer 3, etc., and can be set to 300-350 micrometers, but is not limited to this. The specific distance can be set according to the actual arrangement.

[0059] Example 2

[0060] Reference Appendix Figure 1 - Appendix Figure 8Embodiment 2 of this application proposes a microphone structure, which includes: a body having a first hole; and a microphone structure disposed within the body corresponding to the first hole. The microphone structure includes: a circuit board 1 disposed within a housing 2, the circuit board 1 having a sound receiving hole 101 penetrating the circuit board 1, the sound receiving hole 101 corresponding to the position of the first hole; a housing 2 connected to the circuit board 1 to form a receiving cavity, the sound receiving hole 101 communicating with the receiving cavity; and a silicon mesh layer 3 connected to the circuit board 1 and covering the sound receiving hole 101, the silicon mesh layer 3 having a plurality of vent holes 301, the vent holes 301 corresponding to the sound receiving hole 101 to allow sound conduction.

[0061] Specifically, the electronic device provided in this embodiment can be, but is not limited to, a laptop computer, a smart conferencing device, a smart home device, or an in-vehicle device. The main body can be the display part of a laptop computer. A first hole is opened on the main body, allowing the microphone to be placed inside the main body at a position corresponding to the first hole, so that the microphone's sound receiving hole 101 and the first hole are connected to achieve sound acquisition. By adopting the above-described microphone structure, a silicon mesh layer 3 covering the sound receiving hole 101 is provided on the circuit board 1 of the microphone structure. The vent hole 301 on the silicon mesh layer 3 has a sufficiently small aperture, much smaller than the diameter of a water droplet. When a water droplet passes through the silicon mesh layer 3, it will be restricted by capillary force and cannot pass smoothly through the tiny vent hole 301. When water encounters the silicon mesh layer 3, due to the surface tension between water molecules, the water droplet tends to maintain its spherical shape rather than disperse into smaller droplets to pass through the vent hole 301. Thus, the silicon mesh layer 3 can achieve the effect of water resistance and sound transmission. Even if the microphone structure works in a humid environment, water will not enter the cavity, ensuring the stability of its performance.

[0062] Further, see attached document. Figure 1 Appendix Figure 7 and attached Figure 8 In a specific implementation, the electronic device provided in this embodiment further includes: a camera module 6 disposed on the circuit board 1; the main body is provided with a second hole located on the side of the first hole, and the camera module 6 is disposed corresponding to the second hole.

[0063] Specifically, the electronic device has a second hole located on the side of the first hole, which can be used for the camera module 6 inside the circuit body to realize the camera light function of the electronic device. To increase the compactness of the structural layout and save space, the technical solution adopted in this application allows the camera module 6 and the microphone structure to share the same circuit board 1, as shown in the attached diagram. Figure 7Taking a laptop computer as an example, the circuit board 1 can be a long strip structure, and two microphone structures can be set on the circuit board 1, respectively located on both sides of the camera module 6, or refer to the attached diagram. Figure 8 Taking smart home devices, such as smart speakers, as an example, the circuit board 1 can be a rectangular structure, and the microphone structure and camera module 6 can be arranged vertically at intervals. Since the camera module 6 has high cleanliness requirements, it needs to be washed multiple times during the process. Since the microphone structure is waterproof, even if it is washed, it will not affect the function of the microphone structure. It also does not require a film to be applied to the microphone structure, which saves the film removal operation after washing, reduces the number of process steps, and reduces the defect rate of the microphone structure.

[0064] It should be noted that in the description of this specification, the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application; the terms "connection," "installation," "fixing," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0065] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0066] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A microphone structure, characterized in that, include: A circuit board having a sound-receiving hole penetrating the circuit board; The housing is connected to the circuit board to form a receiving cavity, and the sound receiving hole communicates with the receiving cavity; A silicon mesh layer is connected to the circuit board and covers the microphone hole. The silicon mesh layer has a plurality of vent holes, which are arranged corresponding to the microphone hole to enable sound conduction. The silicon mesh layer includes a concentric central circular region, an intermediate annular region, and an outer annular region. The diameter of the vent holes in the intermediate annular region is larger than that in the central circular region and smaller than that in the outer annular region. The diameter of the vent holes in the intermediate annular region is 52-58 micrometers.

2. The microphone structure according to claim 1, characterized in that, The silicon mesh layer is disposed on the first side of the circuit board; and / or, The silicon mesh layer is disposed on the second side of the circuit board opposite to the first side.

3. The microphone structure according to claim 1, characterized in that, The silicon mesh layer is disposed within the microphone hole of the circuit board.

4. The microphone structure according to claim 2 or 3, characterized in that, The silicon mesh layer is fixedly connected to the circuit board by sealant.

5. The microphone structure according to claim 1, characterized in that, Also includes: A diaphragm is located within the receiving cavity, and a sound receiving cavity is formed between the diaphragm and the circuit board. The sound receiving hole is connected to the sound receiving cavity through a silicon mesh layer.

6. The microphone structure according to claim 1, characterized in that, The pore size of the vent is 50-60 micrometers.

7. The microphone structure according to claim 1 or 6, characterized in that, The spacing between any two adjacent air vents is 150-200 micrometers.

8. The microphone structure according to claim 1, characterized in that, The first region of the silicon mesh layer is provided with the plurality of vent holes, and the area of ​​the first region is not less than the area of ​​the region where the sound hole is located.

9. An electronic device, characterized in that, include: The body has a first hole. A microphone structure is disposed within the body corresponding to the first hole, the microphone structure comprising: A circuit board is disposed inside a housing, and the circuit board is provided with a sound receiving hole that penetrates the circuit board, and the position of the sound receiving hole corresponds to that of the hole portion; The housing is connected to the circuit board to form a receiving cavity, and the sound receiving hole communicates with the receiving cavity; A silicon mesh layer is connected to the circuit board and covers the microphone hole. The silicon mesh layer has a plurality of vent holes, which are arranged corresponding to the microphone hole to enable sound conduction. The silicon mesh layer includes a concentric central circular region, an intermediate annular region, and an outer annular region. The diameter of the vent holes in the intermediate annular region is larger than that in the central circular region and smaller than that in the outer annular region. The diameter of the vent holes in the intermediate annular region is 52-58 micrometers.

10. The electronic device according to claim 9, characterized in that, Also includes: The camera module is mounted on the circuit board; The main body is provided with a second hole located on the side of the first hole, and the camera module is provided correspondingly to the second hole.

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