Heat dissipation structure of battery equalization module

Abstract

The utility model discloses a heat dissipation structure of a battery equalization module, which relates to the field of battery equalization module shells, and comprises an upper cover, a lower cover, a left end cover and a right end cover which are detachably connected, and the upper cover, the lower cover, the left end cover and the right end cover are connected through clamping, screws or the combination thereof; according to the battery equalization module heat dissipation structure, through unique heat dissipation structure arrangement, the upper space and the lower space of the circuit board are communicated through the through groove, the air inlet is formed in the middle of the side, away from the through groove, of the lower cover, and the exhaust fan is installed on the right end cover, so that airflow can penetrate through the lower portion and the upper portion of the circuit board; the two sides of the circuit board can be effectively cooled, especially in the narrow space between the bottom face of the circuit board and the inner wall of the lower cover body, heat dissipation dead angles are avoided.

Description

Technical Field

[0001] This utility model relates to the field of battery equalization module housing, and in particular to a heat dissipation structure for a battery equalization module. Background Technology

[0002] The battery balancing module employs an internally integrated circuit board design, whose high-power components generate significant heat accumulation during operation. Traditional heat dissipation solutions typically place an air intake on the left side of the casing and an axial-flow cooling fan on the right, using forced convection to achieve internal airflow circulation and heat dissipation. However, the existing structure has significant thermal management deficiencies: the heat dissipation components are located above the circuit board, while there is only a narrow gap between the bottom surface of the circuit board and the lower casing. This restricts the heat conduction path and reduces air convection efficiency in this area, leading to heat accumulation at the bottom. Under prolonged high-temperature operation, the solder joints and substrate of the circuit board are prone to thermal stress damage, severely affecting the module's reliability and lifespan. Utility Model Content

[0003] To overcome the shortcomings of existing technologies, the purpose of this utility model is to provide a heat dissipation structure for a battery balancing module, which solves the problem in the prior art of lacking heat dissipation in the narrow gap between the circuit board and the inner wall of the battery balancing module housing, which leads to thermal stress damage to the bottom solder joints and substrate of the circuit board.

[0004] To address the problems in the existing technology, the technical solution of this utility model is as follows:

[0005] A battery equalization module heat dissipation structure includes a detachably connected upper cover, lower cover, left end cover and right end cover. A circuit board is inserted into the inner side of the lower cover. The circuit board divides the inner space of the lower cover into upper and lower parts. The right side of the circuit board abuts against the inner side of the right end cover. A through groove for airflow is formed between the left side of the circuit board and the left end cover. The through groove connects the upper space of the circuit board with the lower space.

[0006] An air inlet is provided in the middle of the side of the lower cover away from the through slot. An airflow guiding device is provided on the right end cover. The airflow guiding device drives outside air to enter the lower space of the circuit board through the air inlet, and then enters the upper space of the circuit board through the through slot, and is discharged from the right end cover.

[0007] Optionally, the lower ends of the two side plates of the lower cover are provided with slots on opposite sides, and the length direction of the slots is the same as the length direction of the lower cover. The circuit board is interference-fitted into the two slots.

[0008] Optionally, a plurality of air inlets are provided at equal intervals, and the plurality of air inlets are arranged on the lower cover along the width direction of the lower cover. A plurality of reinforcing grooves are provided at equal intervals on the bottom surface of the lower cover. The length direction of the reinforcing grooves is the same as the length direction of the lower cover. Each air inlet is connected to a reinforcing groove, and the two ends of the reinforcing grooves pass through the left end cover and the right end cover, respectively.

[0009] Optionally, the airflow guiding device includes air outlets symmetrically opened on both sides of the right end cover, an exhaust fan fixed on the inner side of the right end cover opposite the air outlet, a baffle fixed on the outer side of the right end cover opposite the air outlet, and a dustproof net fixed on the inner wall of the lower cover. The dustproof net covers all air inlets to prevent dust from entering the entire housing.

[0010] Compared with the prior art, the advantages of this utility model are as follows:

[0011] 1. This utility model uses a unique heat dissipation structure arrangement to connect the upper and lower spaces of the circuit board through a through slot. The air inlet is set in the middle of the side of the lower cover away from the through slot, and the exhaust fan is installed on the right end cover. This allows airflow to pass through the lower and upper parts of the circuit board, ensuring that both sides of the circuit board can be effectively cooled. In particular, the narrow space between the bottom surface of the circuit board and the inner wall of the lower cover avoids the occurrence of heat dissipation dead corners.

[0012] 2. This utility model increases the overall strength and resistance to deformation of the lower cover by setting a reinforcing groove on the bottom surface of the lower cover. The two ends of the reinforcing groove penetrate the end caps at both ends, so that even if the bottom surface of the lower cover is covered, cold air from the outside can still enter the air inlet from the two ends of the reinforcing groove to achieve heat dissipation. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0014] Figure 2 This is a schematic diagram of the barrier structure of this utility model.

[0015] Figure 3 This is a schematic diagram of the card slot structure of this utility model.

[0016] Figure 4 This is a schematic diagram of the dustproof net structure of this utility model.

[0017] Figure 5 This is a schematic diagram of the air inlet structure of this utility model.

[0018] Figure 6 This is a schematic diagram of the air inlet position of this utility model.

[0019] Reference numerals: 1. Top cover; 2. Bottom cover; 3. Left end cover; 4. Right end cover; 5. Slot; 6. Circuit board; 7. Through slot; 8. Air inlet; 9. Dustproof net; 10. Reinforcing slot; 11. Air outlet; 12. Exhaust fan; 13. Barrier net. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0021] Please see Figures 1 to 6 This embodiment provides a battery equalization module heat dissipation structure, including a detachably connected upper cover 1, lower cover 2, left end cover 3 and right end cover 4. The upper cover 1, lower cover 2, left end cover 3 and right end cover 4 are connected by snap-fit, screws or a combination thereof, all of which are existing mature technologies and will not be described in detail.

[0022] The two side plates of the lower cover 2 are provided with slots 5 at the lower ends of opposite sides. The length direction of the slots 5 is the same as the length direction of the lower cover 2. Circuit boards 6 are inserted into the inner side of the two slots 5. Circuit boards 6 divide the inner space of the lower cover 2 into upper and lower parts. The right side of circuit boards 6 abuts against the inner side of the right end cover 4. A through groove 7 for airflow is formed between the left side of circuit boards 6 and the left end cover 3. The through groove 7 connects the upper space of circuit boards 6 with the lower space.

[0023] The lower cover 2 has several air inlets 8 evenly spaced on the side opposite to the through slot 7. A dustproof net 9 is fixed to the inner wall of the lower cover 2, covering all the air inlets 8. Cold air from the outside enters the inner side of the housing through the air inlets 8, while the dustproof net 9 prevents dust from entering and protects the components on the circuit board 6. The air inlets 8 are arranged along the width of the lower cover 2. The top surface of the upper cover 1 and the bottom surface of the lower cover 2 have several reinforcing grooves 10 evenly spaced. The length direction of the reinforcing grooves 10 is the same as that of the lower cover 2. Each air inlet 8 is connected to a reinforcing groove 10 on the lower cover 2. The two ends of the reinforcing grooves 10 on the lower cover 2 pass through the left end cover 3 and the right end cover 4, respectively. The reinforcing grooves 10 can improve the deformation resistance of the lower cover 2 and ensure that even after the bottom surface of the lower cover 2 is covered, outside air can still enter the air inlets 8 normally from the two ends of the reinforcing grooves 10, reducing the probability of the heat dissipation channel being blocked.

[0024] It should be emphasized that the wiring port on the circuit board 6 passes through the through hole on the right end cover 4 and is fixed to the inner wall of the through hole. The through hole is sealed by the wiring port to prevent air leakage from the through hole.

[0025] The right end cover 4 has symmetrical air vents 11 on both sides. An exhaust fan 12 is fixed on the inner side of the right end cover 4, directly opposite the air vent 11. A baffle 13 is fixed on the outer side of the right end cover 4, directly opposite the air vent 11. The baffle 13 can play a protective role. When heat dissipation is performed, the exhaust fan 12 is activated, drawing in outside air through the reinforcing groove 10 into the air inlet 8. Then, it passes through the lower space of the circuit board 6 and through the through groove 7 to reach the upper space of the circuit board 6. The air flows in opposite directions in the upper and lower parts of the circuit board 6. This reverse design allows both the upper and lower parts of the circuit board 6 to be fully cooled. Then, the hot air is discharged from the air vent 11 from the entire shell, achieving a high-efficiency heat dissipation effect. This ensures that all parts inside the shell can be effectively cooled, avoiding the occurrence of heat dissipation dead corners. In particular, the lower space of the bottom surface of the circuit board 6 can also be effectively cooled.

[0026] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A battery equalization module heat dissipation structure, comprising a detachably connected upper cover (1), a lower cover (2), a left end cover (3), and a right end cover (4), characterized in that, A circuit board (6) is inserted into the inner side of the lower cover (2). The circuit board (6) divides the inner space of the lower cover (2) into upper and lower parts. The right side of the circuit board (6) abuts against the inner side of the right end cover (4). A through groove (7) for airflow is formed between the left side of the circuit board (6) and the left end cover (3). The through groove (7) makes the upper space of the circuit board (6) and the lower space connected. The lower cover (2) has an air inlet (8) in the middle of the side away from the through groove (7). The right end cover (4) is provided with an airflow guiding device. The airflow guiding device drives the outside air to enter the lower space of the circuit board (6) through the air inlet (8), and then enters the upper space of the circuit board (6) through the through groove (7) and is discharged from the right end cover (4).

2. The battery balancing module heat dissipation structure according to claim 1, characterized in that, The two side plates of the lower cover (2) are provided with slots (5) at the lower ends of opposite sides. The length direction of the slots (5) is the same as that of the lower cover (2). The circuit board (6) is interference-fitted into the two slots (5).

3. The battery balancing module heat dissipation structure according to claim 1, characterized in that, The air inlets (8) are arranged at equal intervals, and the air inlets (8) are arranged on the lower cover (2) along the width direction of the lower cover (2).

4. The battery balancing module heat dissipation structure according to claim 3, characterized in that, The bottom surface of the lower cover (2) is provided with a number of reinforcing grooves (10) at equal intervals. The length direction of the reinforcing grooves (10) is the same as the length direction of the lower cover (2). Each air inlet (8) is connected to a reinforcing groove (10). The two ends of the reinforcing grooves (10) pass through the left end cover (3) and the right end cover (4) respectively.

5. The battery balancing module heat dissipation structure according to claim 4, characterized in that, The airflow guiding device includes air outlets (11) symmetrically opened on both sides of the right end cover (4), and an exhaust fan (12) is fixed on the inner side of the right end cover (4) directly opposite the air outlets (11).

6. The battery equalization module heat dissipation structure according to claim 5, characterized in that, A screen (13) is fixed on the outside of the right end cover (4) directly opposite the air outlet (11).

7. The battery balancing module heat dissipation structure according to claim 3, characterized in that, The inner wall of the lower cover (2) is fixed with a dustproof net (9), which covers all the air inlets (8).

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