Matcher with high matching degree

Abstract

The utility model aims to provide a high-matching-degree matcher which comprises a shell, a partition plate used for dividing the shell into two spaces is arranged in the shell, the shell is divided into a low-voltage space and a radio-frequency space by the partition plate, the radio-frequency space comprises an input end arranged on the shell, the input end is electrically connected with at least one capacitor, and the capacitor is electrically connected with the low-voltage space and the radio-frequency space. The end, away from the input end, of the capacitor is electrically connected with an inductor. The end, away from the capacitor, of the inductor is electrically connected with an output end. A radio frequency fan is arranged on the side wall, corresponding to the radio frequency space, of the shell, first heat dissipation holes are formed in the side wall, opposite to the radio frequency fan, of the shell, and the first heat dissipation holes are arranged in an array mode; a plurality of second heat dissipation holes are formed in the surface, corresponding to the top of the radio frequency space, of the shell, and the second heat dissipation holes are arranged in an array; the upper edge of the first heat dissipation hole array is slightly lower than the upper edge of the radio frequency fan, and by means of the scheme, the number of the fans can be reduced, the occupied area is reduced, meanwhile, the equivalent matching capacity and the heat dissipation level are guaranteed, and therefore the compatibility of the matcher arranged by the array is improved.

Description

Technical Field

[0001] This application relates to a plasma power supply device, and more particularly to a high-matching-degree matcher. Background Technology

[0002] A power matchbox, also known as an RF load matchbox or RF matching network, is a device used to match the impedance between an RF power supply and a load. Its main function is to ensure that the RF power supply can efficiently transfer energy to the load, providing maximum power delivery and system efficiency.

[0003] RF power matching circuits adjust the impedance matching between the power supply and the load by modifying their internal electrical components, such as inductors, capacitors, and transformers, to achieve optimal power transfer. Their operation is based on the concept of impedance matching, adjusting the parameters of the matching network according to the impedance characteristics of the power supply and the load to achieve optimal power transfer and reflection loss.

[0004] With the development of industrialization, radio frequency power supplies and their matching devices are now mostly used in high-tech fields such as photovoltaics and semiconductors. In order to cope with increasingly integrated and arrayed settings, current applications have put forward higher requirements for the quality of the matching devices themselves, especially in terms of balancing heat dissipation performance and power performance. Summary of the Invention

[0005] The purpose of this application is to provide a high-matching-degree matcher that can reduce the number of fans and the footprint while ensuring equivalent matching capability and heat dissipation level, thereby improving the compatibility of the matcher with array configuration.

[0006] The matching device disclosed in this application includes a housing, inside which a partition is provided to divide the housing into two spaces. The housing is divided into a low-voltage space and a radio frequency (RF) space by the partition. The RF space includes an input terminal disposed on the housing, the input terminal being electrically connected to at least one capacitor, the end of the capacitor away from the input terminal being electrically connected to an inductor, and the end of the inductor away from the capacitor being electrically connected to an output terminal. An RF fan is disposed on one side wall of the housing corresponding to the RF space. A plurality of first heat dissipation holes are formed on the side wall of the housing opposite to the RF fan, and the first heat dissipation holes are arranged in an array. A plurality of second heat dissipation holes are formed on the top surface of the housing corresponding to the RF space, and the second heat dissipation holes are arranged in an array. The upper edge of the array of first heat dissipation holes is slightly lower than the upper edge of the RF fan.

[0007] The above technical solution enables the formation of multiple airflow channels within the radio frequency (RF) space, from the RF fan to the first heat dissipation hole, using only a single fan. This allows for the separate cooling of the capacitors and inductors that generate the most heat. Furthermore, by positioning the first heat dissipation hole lower than the fan and providing a second heat dissipation hole on its top surface, the airflow from the top of the fan can exit directly through the second heat dissipation hole, preventing the formation of eddies within the casing that could lead to heat accumulation.

[0008] Furthermore, the input terminal is electrically connected to a first capacitor and a second capacitor, with the end of the first capacitor furthest from the input terminal grounded.

[0009] The end of the second capacitor furthest from the input terminal is electrically connected to the inductor; the inductor is an inductor coil with its central axis perpendicular to the bottom surface of the matching circuit.

[0010] By employing the aforementioned technical solution, the inductor is vertically positioned as a coil. This reduces the space occupied and creates a new airflow channel within the casing, allowing airflow to pass through the coil and dissipate heat from the coil body. Simultaneously, because the RF fan is positioned relatively high, the vertically positioned coil guides more airflow towards the bottom of the device, improving the overall heat dissipation efficiency within the housing.

[0011] Furthermore, the end of the second capacitor furthest from the input terminal is electrically connected to an insulator, which is irregularly shaped with a diameter in the middle larger than the diameters at both ends.

[0012] Through the above technical solution, the insulator can assist the second capacitor in sharing stress and withstanding voltage. Using an irregularly shaped insulator with a central diameter larger than the diameters at both ends, compared to ordinary columnar insulators, the insulator height can be reduced while maintaining similar performance, thereby further reducing the need for matching devices and improving the adaptability of their array configuration.

[0013] Furthermore, the end of the first capacitor furthest from the input terminal is electrically connected to a grounding inductor, and the end of the grounding inductor furthest from the first capacitor is grounded through the casing.

[0014] Furthermore, at least three air ducts are formed between the RF fan and the first heat dissipation hole array. The first air duct flows through the first capacitor and the second capacitor in sequence at least sequentially; the second air duct flows through the first capacitor and the inductor in sequence at least sequentially; and the third air duct flows through the end of the inductor away from the second capacitor in sequence at least sequentially.

[0015] By setting up multiple air ducts, each component, especially high-heat-generating components such as the first capacitor, the second capacitor, and the inductor, can be placed on the airflow path of at least one air duct, which can effectively disperse the hot airflow inside the casing and improve the cooling effect.

[0016] Furthermore, a fourth air duct is formed between the radio frequency fan and the second heat dissipation hole.

[0017] Through the above-mentioned design, the fourth air duct allows the airflow at the top of the fan to flow directly out from the second heat dissipation hole, avoiding the formation of vortices inside the casing that would cause heat accumulation.

[0018] Furthermore, a fourth air duct is formed between the radio frequency fan and the first heat dissipation hole array, which flows through the insulator.

[0019] The technical effects of this application are as follows:

[0020] By designing the layout of electronic components, four airflow paths are constructed in the radio frequency (RF) space of the housing, thereby effectively improving the heat dissipation efficiency of the RF space and reducing the required volume of the RF space.

[0021] By using irregularly shaped insulators, the volume required for radio frequency space is reduced, thereby reducing the size of the matching unit to match more application scenarios. Detailed Implementation

[0022] The following description of preferred embodiments is intended to explain the invention in more detail in conjunction with the accompanying drawings. Individual features of these embodiments may also be used to further develop the previously described methods or apparatus independently of other features of the various embodiments. Attached image description:

[0023] Figure 1 This is a schematic diagram of the overall matcher in this application;

[0024] Figure 2 This is a structural diagram of the matching unit's radio frequency space in this application;

[0025] Figure 3 This is a structural diagram of the matching unit in the radio frequency space from another angle.

[0026] Figure 4 This is a schematic diagram of the air duct of the matcher in this application;

[0027] Figure 5 Thermal simulation results for specific embodiments of this application;

[0028] Figure 6 The thermal simulation results are for Comparative Example 2 of this application.

[0029] Reference Symbol List

[0030] 100. Housing; 110. Partition; 111. RF space; 112. Low-voltage space; 120. Input terminal; 121. First capacitor; 122. Second capacitor; 123. Grounding inductor; 124. Inductor; 125. Output terminal; 126. Insulator; 130. RF fan; 131. First heat dissipation hole; 132. First air duct; 133. Second air duct; 134. Third air duct; 135. Second heat dissipation hole; 140. Bias rod; 141. Grounding capacitor.

[0031] In any embodiment, such as Figure 1 and Figure 2 As shown, this application discloses a matching device, which includes a housing 100. A partition 110 is disposed inside the housing perpendicular to the bottom surface, dividing the housing 100 into two spaces: a radio frequency (RF) space 111 and a low-voltage space 112. The RF space 111 is used to house all RF-related high-voltage, high-power components, while the low-voltage space 112 is used to accommodate low-voltage circuit boards, components, and other elements. By separating the high and low voltage spaces, mutual electromagnetic interference can be effectively avoided, and the operational stability and safety of the device can be improved.

[0032] In any embodiment, such as Figure 2 and Figure 3 As shown, an input terminal 120 is provided on one side wall of the housing 100 corresponding to the high-voltage space 111. The input terminal 120 is used to input electrical energy to the matching unit. The input terminal 120 is electrically connected to a first capacitor 121 and a second capacitor 122 disposed inside the radio frequency space 111. The input terminal is independently connected to the first capacitor 121 and the second capacitor 122, and the electrical connection can be achieved through copper busbars, wires, etc. The central axes of the first capacitor 121 and the second capacitor 122 are horizontally arranged and are both located in a horizontal plane parallel to the bottom surface of the matching unit. The central axes of the first capacitor 121 and the second capacitor 122 are both perpendicular to the partition 110, and the driving ends of the first capacitor and the second capacitor pass through the partition and are connected to their corresponding driving motors.

[0033] The end of the first capacitor 121 furthest from the input terminal 120 is electrically connected to a grounding inductor 123. The end of the grounding inductor 123 furthest from the first capacitor 121 is electrically connected to the bottom surface of the matching unit housing 100 for grounding purposes.

[0034] The end of the second capacitor 122 furthest from the input terminal 120 is electrically connected to an inductor 124, which is coil-shaped. The end of the inductor 124 furthest from the second capacitor is electrically connected to the output terminal 125 for final power output from the matching unit. The spiral axis of the inductor 123 is perpendicular to the bottom surface of the housing 100, and the inductor 124 is positioned between the first capacitor 121 and the second capacitor 122.

[0035] The end of the second capacitor 122 furthest from the input terminal 120 is also electrically connected to an insulator 126, and the other end of the insulator 126 is connected to the bottom surface of the housing 100 for grounding. The insulator has an irregular shape with a diameter larger in the middle than at both ends. This irregular insulator allows for a further reduction in the size of the matching device while achieving equivalent functionality.

[0036] By setting up the above electronic components, a complete matching circuit can be formed within the matching unit, thereby realizing the function of the RF matching unit.

[0037] In any embodiment, such as Figure 2 and Figure 3 As shown, an RF fan 130 is positioned on the outer side of the housing 100 near the first capacitor. The RF fan draws airflow into the RF space 111 inside the housing 100 or draws airflow out of the RF space 111. An array of first heat dissipation holes 131 is formed on the sidewall of the housing 100 opposite to the RF fan 130. These holes are arranged in a square array, with the top of the array of first heat dissipation holes 131 lower than the top of the RF fan 130. Through the arrangement of the RF fan 130, the array of first heat dissipation holes 131, and the placement of the first capacitor 121, the second capacitor 122, and the inductor 124, multiple airflow channels are created within the RF space 111 for component heat dissipation. Wherein:

[0038] The first air duct 132 flows sequentially from the RF fan 130 through the top of the first capacitor 121 and the top of the second capacitor 122 to the first heat dissipation hole 131.

[0039] The second air duct 133 flows sequentially from the RF fan 130 through the bottom of the first capacitor 121, the inside of the inductor coil, to the bottom of the second capacitor 122 and the position of the insulator 126, and then to the first heat dissipation hole 131.

[0040] The third air duct 134 flows sequentially from the RF fan 130 through the bottom of the first capacitor 121 and the bottom of the second capacitor 122 to the first heat dissipation hole 131.

[0041] With the above layout, the airflow is directed to three air ducts, which can effectively cool down the main heat-generating components such as the first capacitor 121, the second capacitor 122 and the inductor 124, and effectively avoid the problem of heat accumulation caused by a single air duct and poor heat dissipation of downstream components.

[0042] In any embodiment, such as Figure 3 and Figure 4 As shown, the device also includes a second heat dissipation hole 135 disposed on the top of the RF space 111 corresponding to the housing 100, and the second heat dissipation holes 135 are arranged in an array. A third air duct 136 is formed between the second heat dissipation holes 135 and the RF fan. Because the height of the array of first heat dissipation holes 131 is slightly lower than that of the RF fan 130, the overall air duct is inclined downward. In this case, the airflow at the top of the RF space 111 is prone to forming vortices at the top of the space, resulting in heat accumulation and difficulty in heat dissipation. By setting the array of second heat dissipation holes 135, the airflow at the top can be guided to flow directly out from the second heat dissipation holes 135, further reducing the possibility of heat accumulation and improving the heat dissipation effect.

[0043] In the laboratory, by comparing the above technical solutions with several comparative examples, the following thermal simulation results can be obtained:

[0044]

[0045] The thermal simulation results show that the technical solution disclosed in this application achieves an 18% improvement in heat dissipation effect compared to other single-fan RF space by changing the air duct setting and component layout, and can present a similar or even better heat dissipation effect as the dual RF fan setting.

[0046] In any embodiment, such as Figure 3 As shown, a bias bar 140 is provided at the position inside the RF space 111 corresponding to the housing 100. The bias bar 140 is used to adjust the bias voltage of the matching device.

[0047] In any embodiment, such as Figure 3 As shown, the output terminal 125 is electrically connected to a grounding capacitor 141, which is used to control the path of the radio frequency current through the grounding topology.

Claims

1. A high-matching-degree matcher, comprising a housing, wherein a partition is disposed inside the housing to divide the housing into two spaces, characterized in that: The housing is divided into a low-pressure space and a radio frequency space by the partition. The radio frequency space includes an input terminal disposed on the housing, the input terminal being electrically connected to at least one capacitor, an inductor being electrically connected to the end of the capacitor away from the input terminal, and an output terminal being electrically connected to the end of the inductor away from the capacitor. An RF fan is provided on one side wall of the housing corresponding to the RF space. A plurality of first heat dissipation holes are provided on the side wall of the housing opposite to the RF fan. The first heat dissipation holes are arranged in an array. The housing has a plurality of second heat dissipation holes on the surface corresponding to the top of the radio frequency space, and the second heat dissipation holes are arranged in an array. The upper edge of the first heat dissipation hole array is slightly lower than the upper edge of the radio frequency fan.

2. The high-matching-degree matcher as described in claim 1, characterized in that: The input terminal is electrically connected to a first capacitor and a second capacitor, and the end of the first capacitor away from the input terminal is grounded. The end of the second capacitor furthest from the input terminal is electrically connected to the inductor; The inductor is an inductor coil, and the central axis of the inductor coil is arranged perpendicular to the bottom surface of the high-matching-degree matching device.

3. The high-matching-degree matcher according to claim 2, characterized in that: The end of the second capacitor furthest from the input terminal is also electrically connected to an insulator, which is irregularly shaped with a diameter in the middle larger than the diameters at both ends.

4. The high-matching-degree matcher according to claim 2, characterized in that: The end of the first capacitor away from the input terminal is electrically connected to a grounding inductor, and the end of the grounding inductor away from the first capacitor is grounded through the housing.

5. The high-matching-degree matcher as described in any one of claims 2-4, characterized in that: At least three air ducts are formed between the radio frequency fan and the first heat dissipation hole array. The first air duct flows through the first capacitor and the second capacitor in sequence at least; The second air duct flows through the first capacitor and the inductor in sequence at least; The third air duct flows sequentially through at least one end of the inductor furthest from the second capacitor.

6. The high-matching-degree matcher as described in any one of claims 2-4, characterized in that: At least three air ducts are formed between the radio frequency fan and the first heat dissipation hole array. The first air duct flows through the top of the first capacitor and the top of the second capacitor at least sequentially; The second air duct flows sequentially through the bottom of the first capacitor and the inductor; The third air duct flows sequentially through the bottom of the inductor at least once.

7. The high-matching-degree matcher according to claim 5, characterized in that: A fourth air duct is formed between the radio frequency fan and the second heat dissipation hole.

8. The high-matching-degree matcher according to any one of claims 1-4, characterized in that, The output terminal is electrically connected to a grounding capacitor.

9. The high-matching-degree matcher according to any one of claims 1-4, characterized in that, A bias rod is electrically connected to the side wall of the housing corresponding to the inside of the radio frequency space.

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