Sorting device and chip production line

Abstract

The utility model belongs to the technical field of semiconductor detection, and discloses a sorting device and a chip production line. The sorting device comprises a transfer platform, a rotating mechanism and a blowing mechanism. The transfer platform is used for bearing an IC chip; the rotating mechanism is in transmission connection with the transfer platform and is used for driving the transfer platform to rotate; the blowing mechanism is arranged on the transfer platform and is used for separating the IC chip from the transfer platform under the action of airflow; when an IC chip is placed on the transfer platform, the rotating mechanism can drive the transfer platform to rotate to a preset angle from an initial state, and when the IC chip is unqualified, the blowing mechanism enables the IC chip to be separated from the transfer platform; and when the IC chip is qualified, the rotating mechanism can drive the transfer platform to reset to an initial state. According to the utility model, artificial participation in the material throwing process can be avoided, and the problems that unqualified IC chips are not actually removed or isolated due to negligence of personnel, the unqualified IC chips and subsequent qualified IC chips are stacked, and physical crushing is caused are solved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a sorting device and a chip production line. Background Technology

[0002] In the automated production process of semiconductor packaging, IC chips (Integrated Circuit Chips) need to undergo multiple quality inspections and calibrations.

[0003] In the existing technology, when a faulty IC chip is transported to the transfer platform, the equipment will prompt the operator to intervene through the alarm system. This process is called the "IC rejection" process.

[0004] However, this process has a significant flaw: if operators only deactivate the alarm signal without actually removing or isolating defective products, the equipment control system will incorrectly determine that the anomaly has been handled and resume the workflow. This logical flaw results in unprocessed calibration IC chips remaining on the transfer platform, stacking with subsequent normal chips and causing physical damage. Damaged chips exhibit direct defects such as bright lines and functional failures in subsequent processes, and further, due to internal structural damage, they create potential reliability risks, severely reducing finished product yield and increasing quality control risks. Utility Model Content

[0005] The purpose of this invention is to provide a sorting device and a chip production line to solve the problem that when operators only clear the alarm signal without actually removing or isolating defective products, unprocessed calibration IC chips remain on the transfer platform, forming a stack with subsequent normal chips and causing physical damage.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] The sorting device includes:

[0008] The transit platform is used to carry IC chips;

[0009] A rotating mechanism is connected to the transfer platform via a transmission mechanism, and the rotating mechanism is used to drive the transfer platform to rotate;

[0010] A blowing mechanism, located on the transfer platform, is used to separate the IC chip from the transfer platform by airflow.

[0011] When the IC chip is placed on the transfer platform, the rotating mechanism can drive the transfer platform to rotate from the initial state to a preset angle. When the IC chip is unqualified, the blowing mechanism separates the IC chip from the transfer platform. When the IC chip is qualified, the rotating mechanism can drive the transfer platform to reset to the initial state.

[0012] As an alternative to the sorting device, the sorting device further includes a transfer mechanism for placing the IC chip on the transfer platform or removing the IC chip from the transfer platform.

[0013] As an alternative to the sorting device, the transfer mechanism includes a vacuum pump and a suction nozzle, wherein the vacuum pump is used to draw the IC chip by creating a vacuum.

[0014] As an alternative to the sorting device, the transfer mechanism further includes a robotic arm, with the suction nozzle located at the end of the robotic arm.

[0015] As an optional solution for the sorting device, the sorting device also includes an alarm mechanism that emits an alarm signal when the IC chip is defective.

[0016] As an alternative to the sorting device, the rotating mechanism includes a driving member and a drive shaft that is pulverizedly connected to the driving member. The driving member is used to drive the drive shaft to rotate, and the transfer platform is fixed on the drive shaft.

[0017] As an alternative to the sorting device, the drive unit and the drive shaft are connected by a belt drive.

[0018] As an alternative to the sorting device, the drive unit and the transmission shaft are connected by gear transmission.

[0019] As an alternative to the sorting device, the sorting device further includes a sensor and a controller disposed on the transfer platform. The controller is signal-connected to the drive component and the sensor. The sensor is used to monitor the rotation angle of the transfer platform, and the controller is used to receive the signal from the sensor to adjust the rotation angle of the drive component.

[0020] A chip production line includes a stacking device and a sorting device as described in any of the above schemes. The stacking device is located downstream of the sorting device, and qualified IC chips from the sorting device are transported to the stacking device.

[0021] Beneficial effects:

[0022] In the first aspect of this invention, after an IC chip is placed on a transfer platform, a rotating mechanism drives the transfer platform to rotate from its initial state. After rotating to a preset angle, the IC chip on the transfer platform is identified. When a defective chip is identified, a blowing mechanism is activated, separating the IC chip from the transfer platform, completing the "discarding". When a qualified chip is identified, the rotating mechanism rotates in the opposite direction, resetting the transfer platform to its initial state. This sorting device avoids manual intervention in the "discarding" process, preventing the failure to remove or isolate defective IC chips due to human negligence. This avoids the problem of unprocessed corrected IC chips remaining on the transfer platform, stacking with qualified IC chips and causing physical damage.

[0023] In a second aspect of this invention, a chip production line equipped with this sorting device reduces manual labor, improves production efficiency, increases yield, and saves costs. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the sorting device provided in an embodiment of the present invention.

[0025] In the picture:

[0026] 1. IC chip; 2. Transfer platform; 3. Rotating mechanism; 31. Drive component; 32. Drive shaft; 33. Conveyor belt; 4. Blowing mechanism; 5. Transmission mechanism; 51. Vacuum pump; 52. Suction nozzle; 6. Frame. Detailed Implementation

[0027] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0028] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0029] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0030] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0031] Please see the appendix Figure 1 The first aspect of this embodiment relates to a sorting device, which includes a transfer platform 2, a rotating mechanism 3, and a blowing mechanism 4. The transfer platform 2 carries an IC chip 1; the rotating mechanism 3 is connected to the transfer platform 2 and drives the transfer platform 2 to rotate; the blowing mechanism 4 is located on the transfer platform 2 and is used to separate the IC chip 1 from the transfer platform 2 by airflow. When an IC chip 1 is placed on the transfer platform 2, the rotating mechanism 3 can drive the transfer platform 2 to rotate from its initial state to a preset angle; when the IC chip 1 is defective, the blowing mechanism 4 separates the IC chip 1 from the transfer platform 2; when the IC chip 1 is qualified, the rotating mechanism 3 can drive the transfer platform 2 to return to its initial state.

[0032] Specifically, the rotating mechanism 3 is mounted on the frame 6, and the transfer platform 2 is used to position and support the IC chip 1. The transfer platform 2 is a plate-shaped or block-shaped part with a bearing surface. The upper surface of the transfer platform 2 is provided with a limiting feature for positioning the IC chip 1. The limiting feature can be a limiting groove or a limiting block, etc.

[0033] In this embodiment, after the IC chip 1 is placed on the transfer platform 2, the rotating mechanism 3 drives the transfer platform 2 to rotate from the initial state (in the initial state, the transfer platform 2 is horizontal). After rotating to a preset angle, the IC chip 1 on the transfer platform 2 is identified. When it is identified as a defective product, the blowing mechanism 4 is activated and the IC chip 1 is separated from the transfer platform 2, completing the "discarding" process. When it is identified as a qualified product, the rotating mechanism 3 rotates in the opposite direction to drive the transfer platform 2 back to the horizontal state.

[0034] In this embodiment, the preset angle can be 90° or 180°, or it can be adjusted according to the working position and angle of the blowing mechanism 4.

[0035] This sorting device avoids the manual "discarding" process, and prevents unqualified IC chips 1 from being left unremoved or isolated due to human negligence, which would result in unprocessed corrected IC chips 1 remaining on the transfer platform 2 and stacking with qualified IC chips 1, causing physical damage.

[0036] Optionally, the sorting device further includes a transmission mechanism 5, which is used to place the IC chip 1 on the transfer platform 2 or remove the IC chip 1 from the transfer platform 2.

[0037] Specifically, the transfer mechanism 5 can employ a conventional robotic arm to transfer the IC chip 1 from different workstations. In this embodiment, the transfer mechanism 5 further includes a vacuum pump 51 and a suction nozzle 52. The vacuum pump 51 is used to create a vacuum, causing the suction nozzle 52 to pick up the IC chip 1. The suction nozzle 52 is located at the end of the robotic arm. By fixing the IC chip 1 with the suction nozzle 52, damage or scratches to the IC chip 1 can be avoided during the movement of the IC chip 1, thus ensuring the performance of the IC chip 1.

[0038] When the transmission mechanism 5 is working, the vacuum pump 51 is started and a vacuum environment is created in the pipeline. The IC chip 1 is stably picked up by the suction nozzle 52 and then the work position is changed by the robotic arm.

[0039] In this embodiment, the transmission mechanism 5 is used to further ensure the stability and accuracy of the IC chip 1 flowing from different workstations, improve transportation efficiency, and reduce manual intervention.

[0040] Optionally, the sorting device also includes an alarm mechanism that emits an alarm signal when IC chip 1 is defective.

[0041] In this embodiment, the alarm mechanism includes, but is not limited to, using sound signal prompts, light signal prompts, or a combination of sound and light signal prompts to help staff know the status of IC chip 1 as soon as possible, thereby helping staff to check for unqualified IC chips 1 in a timely manner and change strategies to handle batch problems.

[0042] Optionally, the rotating mechanism 3 includes a driving member 31 and a transmission shaft 32 that is connected to the driving member 31. The driving member 31 is used to drive the transmission shaft 32 to rotate, and the transfer platform 2 is fixed on the transmission shaft 32.

[0043] In this embodiment, the drive unit 31 is a rotary servo motor, and the output shaft of the drive unit 31 can be directly connected to the transmission shaft 32, thereby further driving the transfer platform 2 to rotate to a preset angle.

[0044] The use of direct drive ensures the overall compactness of the sorting device and reduces its size.

[0045] In one implementation of this embodiment, the driving component 31 and the transmission shaft 32 are connected by belt drive.

[0046] Of course, the drive unit 31 and the drive shaft 32 can also be connected by a conveyor belt 33 to optimize the layout between the drive unit 31 and the drive shaft 32.

[0047] In another implementation of this embodiment, the driving component 31 and the transmission shaft 32 are connected by gear transmission.

[0048] The transmission between the drive unit 31 and the transmission shaft 32 via gear transmission can improve transmission accuracy and ensure the precision of the rotation angle of the transfer platform 2.

[0049] Furthermore, the sorting device also includes a sensor and a controller located on the transfer platform 2. The controller is connected to the drive unit 31 and the sensor via signal. The sensor is used to monitor the rotation angle of the transfer platform 2, and the controller is used to receive the sensor signal to adjust the rotation angle of the drive unit 31.

[0050] Specifically, the sensor can be a photoelectric sensor to monitor whether the rotation angle of the transfer platform 2 is in place. The sensor can transmit the data collected to the controller in the form of an electrical signal, thereby completing the angle adjustment of the drive component 31. This gives the sorting device a feedback effect, improves the stability of the long-term rotation operation of the transfer platform 2, and ensures the continuous operation of the sorting device.

[0051] The second aspect of this embodiment also relates to a chip production line, which includes a stacking device and a sorting device. The stacking device is located downstream of the sorting device, and qualified IC chips 1 from the sorting device are conveyed to the stacking device. The existing structure of the stacking device for performing the stacking process on the IC chips 1 will not be described in detail in this embodiment.

[0052] In this embodiment, the chip production line equipped with this sorting device can avoid manual intervention, improve the level of automation and production efficiency, increase the yield rate, and save costs.

[0053] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A sorting device, characterized in that, include: The transit platform (2) is used to carry the IC chip (1); A rotating mechanism (3) is connected to the transfer platform (2) via a transmission connection. The rotating mechanism (3) is used to drive the transfer platform (2) to rotate. A blowing mechanism (4) is provided on the transfer platform (2) for separating the IC chip (1) from the transfer platform (2) by means of airflow; When the IC chip (1) is placed on the transfer platform (2), the rotating mechanism (3) can drive the transfer platform (2) to rotate from the initial state to a preset angle. When the IC chip (1) is unqualified, the blowing mechanism (4) separates the IC chip (1) from the transfer platform (2). When the IC chip (1) is qualified, the rotating mechanism (3) can drive the transfer platform (2) to reset to the initial state.

2. The sorting device according to claim 1, characterized in that, The sorting device further includes a transmission mechanism (5), which is used to place the IC chip (1) on the transfer platform (2) or remove the IC chip (1) from the transfer platform (2).

3. The sorting device according to claim 2, characterized in that, The transmission mechanism (5) includes a vacuum pump (51) and a suction nozzle (52). The vacuum pump (51) is used to draw the IC chip (1) by the suction nozzle (52) through a vacuuming action.

4. The sorting device according to claim 3, characterized in that, The transmission mechanism (5) also includes a robotic arm, and the suction nozzle (52) is located at the end of the robotic arm.

5. The sorting device according to claim 1, characterized in that, The sorting device also includes an alarm mechanism, which emits an alarm signal when the IC chip (1) is defective.

6. The sorting device according to claim 1, characterized in that, The rotating mechanism (3) includes a driving member (31) and a transmission shaft (32) that is connected to the driving member (31). The driving member (31) is used to drive the transmission shaft (32) to rotate. The transfer platform (2) is fixed on the transmission shaft (32).

7. The sorting device according to claim 6, characterized in that, The drive unit (31) and the transmission shaft (32) are connected by a belt drive.

8. The sorting device according to claim 6, characterized in that, The drive unit (31) and the transmission shaft (32) are connected by gear transmission.

9. The sorting device according to claim 6, characterized in that, The sorting device also includes a sensor and a controller located on the transfer platform (2). The controller is connected to the drive unit (31) and the sensor. The sensor is used to monitor the rotation angle of the transfer platform (2), and the controller is used to receive the signal from the sensor to adjust the rotation angle of the drive unit (31).

10. A chip production line, characterized in that, It includes a stacking device and a sorting device as described in any one of claims 1-9, wherein the stacking device is located downstream of the sorting device, and qualified IC chips (1) from the sorting device are used to deliver to the stacking device.

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