Semiconductor equipment sampling device

Abstract

The utility model discloses a semiconductor equipment sampling device, which relates to the technical field of semiconductor processing, and comprises a driving mechanism, a buffer mechanism and at least two suction heads, the buffer mechanism comprises at least two elastic expansion pieces; the elastic expansion pieces are connected with the suction heads in a one-to-one correspondence manner, so that the suction heads can elastically move; the driving mechanism is connected with the elastic expansion pieces and used for driving the elastic expansion pieces to move close to each other or away from each other. According to the design, by optimizing the buffering effect and the adsorption stability, the sample rejection rate is reduced, and the semiconductor manufacturing yield is increased; and the continuity and the efficiency of the production process can be improved by adopting the universal design and reducing the remodeling operation.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing technology, and in particular to semiconductor equipment sampling devices. Background Technology

[0002] In semiconductor manufacturing, the transfer of samples such as wafers and substrates is a crucial step in ensuring smooth production processes and product quality. Currently, the main methods for transferring such samples include gripper-based transfer and suction cup-based transfer. As shown in the semiconductor bonding-assisted operation robot and equipment disclosed in Chinese Patent No. CN119910630B, the industry typically selects the appropriate transfer method based on the specific characteristics of the sample. For example, gripper-based transfer is often used for samples of moderate size and with sufficient structural strength; while suction cup-based transfer is commonly used for samples that are larger, structurally fragile, or whose edges are unsuitable for gripping, to reduce the risk of physical damage to the sample.

[0003] However, existing chuck-based transfer technologies generally lack a specially designed contact buffer function. Current buffering effectiveness primarily relies on the elastic deformation of the flexible nozzle material within the chuck itself. This buffering capacity, provided solely by the flexible nozzle, is often quite limited and insufficient to handle various non-ideal contact situations that may occur during sample transfer, such as alignment deviations and improper descent speed control. Therefore, in practice, significant contact and collisions can still occur between the sample and the chuck nozzle, leading to surface scratches, internal structural damage, and even sample rejection, severely impacting semiconductor manufacturing yield and production efficiency. In light of this, developing a chuck-based transfer solution that provides superior contact buffering to effectively prevent sample damage due to contact and collision has become a pressing technical problem in the semiconductor manufacturing field. Utility Model Content

[0004] In view of this, the purpose of this application is to provide a semiconductor equipment sampling device with better contact buffering effect to effectively avoid damage to the sample due to contact collision.

[0005] To achieve the above-mentioned technical objectives, this application provides a semiconductor equipment sampling device, including a driving mechanism, a buffer mechanism, and at least two suction heads;

[0006] The buffer mechanism includes at least two elastic expanders;

[0007] Each of the aforementioned elastic telescopic members is connected to the suction head in a one-to-one correspondence, so that the suction head can move elastically;

[0008] The drive mechanism is connected to each of the elastic expansion joints and is used to drive each of the elastic expansion joints to move closer to or further away from each other.

[0009] Furthermore, the elastic telescoping device includes a connecting block and an elastic element;

[0010] The connecting block is connected to the driving end of the driving mechanism;

[0011] The elastic element is connected between the connecting block and the suction head.

[0012] Furthermore, the elastic telescoping device also includes a guide rod;

[0013] The guide rod moves through the connecting block and the suction head, and one end is provided with a first stop that can contact and abut against the connecting block, and the other end is provided with a second stop that can contact and abut against the connecting block.

[0014] Furthermore, there are multiple guide rods arranged in a spaced array.

[0015] Furthermore, the connecting block is provided with a first receiving groove into which one end of the elastic element extends;

[0016] The suction head is provided with a second receiving groove into which the other end of the elastic element extends.

[0017] Furthermore, there are multiple elastic elements, arranged in a spaced array.

[0018] Furthermore, the elastic element is a compression spring.

[0019] Furthermore, the connecting block has a countersunk hole that penetrates itself on the side facing the suction head;

[0020] The drive end of the drive mechanism is provided with a threaded hole that is connected to the countersunk hole.

[0021] A threaded fastener capable of connecting to the threaded hole is installed in the countersunk hole.

[0022] Furthermore, there are two suction heads and two elastic telescopic devices;

[0023] The driving mechanism is a finger cylinder, with its two driving ends connected to the two elastic telescopic elements respectively.

[0024] Furthermore, the suction head has a suction port at its bottom;

[0025] A flexible suction cup is installed on the suction port;

[0026] The suction head has an air inlet on its side that connects to the suction port;

[0027] The drive mechanism is equipped with a quick-change connector.

[0028] As can be seen from the above technical solutions, the semiconductor equipment sampling device designed in this application has the following beneficial effects:

[0029] 1. Optimized buffering effect: By connecting the elastic telescoping device to each pipette tip in a one-to-one correspondence, each pipette tip has independent elastic movement capability. Compared with the existing buffering method that only relies on the deformation of the flexible nozzle material, it can provide more sufficient buffering capacity, effectively absorb the impact force under non-ideal contact conditions such as alignment deviation and improper control of descent speed, avoid violent collision between sample and pipette tip, and reduce problems such as surface scratches and internal structural damage.

[0030] 2. Enhanced versatility: The drive mechanism can move the elastic telescopic members closer or further apart to adjust the distance between the suction heads, which can adapt to the suction needs of samples of different sizes (such as wafers and substrates of different specifications) without the need to replace the suction cup assembly, thus improving the adaptability of the device and saving changeover time.

[0031] 3. Improved adsorption stability: The distributed adsorption design with at least two adsorption tips allows for more uniform force on the sample, reducing local pressure concentration. This is especially suitable for samples that are large in size or have a fragile structure, avoiding damage caused by excessive force at a single point, and reducing the risk of sample detachment during transport.

[0032] In summary, by optimizing buffering effect and adsorption stability, sample scrap rate can be reduced and semiconductor manufacturing yield can be improved; universal design and reduced changeover operations can improve the continuity and efficiency of the production process. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 A perspective view of the semiconductor equipment sampling device provided in this application;

[0035] Figure 2 This is a schematic diagram of the cooperation structure between the elastic telescoping device and the suction head of the semiconductor equipment sampling device provided in this application;

[0036] Figure 3 A perspective view of the suction head of the semiconductor equipment sampling device provided in this application;

[0037] In the diagram: 1. Drive mechanism; 2. Suction head; 21. Suction port; 22. Air inlet; 23. Flexible suction cup; 24. Air connector; 25. Second receiving groove; 3. Elastic expansion joint; 31. Connecting block; 311. First receiving groove; 312. Countersunk hole; 32. Elastic element; 33. Guide rod; 331. First stop; 332. Second stop; 4. Quick-change connector. Detailed Implementation

[0038] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the embodiments of this application.

[0039] In the description of the embodiments of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0040] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a replaceable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application based on the specific circumstances.

[0041] This application discloses a semiconductor equipment sampling device.

[0042] Please see Figure 1 One embodiment of the semiconductor equipment sampling device provided in this application includes:

[0043] The drive mechanism 1, the buffer mechanism, and at least two suction heads 2.

[0044] The buffer mechanism includes at least two elastic expansion joints 3; each elastic expansion joint 3 is connected to the suction head 2 in a one-to-one correspondence, allowing the suction head 2 to move elastically. The direction of elastic movement is vertical. When the suction head 2 comes into contact with the surface of the object to be sampled during sampling, if it is subjected to vertical pressure, the elastic expansion joint 3 will contract accordingly, thereby buffering the suction head 2 and preventing it from being damaged by a rigid collision with the object surface. At the same time, this elastic movement also allows the suction head 2 to better adapt to sampling surfaces of different heights or uneven surfaces, ensuring that the suction port 21 can fit tightly, improving the stability and accuracy of sampling.

[0045] The drive mechanism 1 is connected to each elastic telescopic member 3 and is used to drive each elastic telescopic member 3 to move closer or further away from each other, thereby driving each suction head 2 to move closer or further away from each other.

[0046] The semiconductor equipment sampling device designed in this application has the following beneficial effects:

[0047] 1. Optimized buffering effect: The elastic telescoping device 3 is connected to the suction head 2 in a one-to-one correspondence, so that each suction head 2 has independent elastic movement capability. Compared with the existing buffering method that only relies on the deformation of the flexible nozzle material, it can provide more sufficient buffering capacity, effectively absorb the impact force under non-ideal contact conditions such as alignment deviation and improper control of descent speed, avoid violent collision between sample and suction head 2, and reduce problems such as surface scratches and internal structural damage.

[0048] 2. Enhanced versatility: The drive mechanism 1 can move the elastic telescopic members 3 closer or further apart to adjust the spacing of the suction heads 2, which can adapt to the suction needs of samples of different sizes (such as wafers and substrates of different specifications) without the need to replace the suction cup assembly, thus improving the adaptability of the device and saving changeover time.

[0049] 3. Improved adsorption stability: The distributed adsorption design with at least two adsorption tips 2 can make the sample more uniformly stressed and reduce local pressure concentration. It is especially suitable for samples with larger size or fragile structure, avoiding damage caused by excessive stress at a single point, and reducing the risk of sample falling off during the transfer process.

[0050] In summary, by optimizing buffering effect and adsorption stability, sample scrap rate can be reduced and semiconductor manufacturing yield can be improved; universal design and reduced changeover operations can improve the continuity and efficiency of the production process.

[0051] The above is Embodiment 1 of the semiconductor equipment sampling device provided in this application. The following is Embodiment 2 of the semiconductor equipment sampling device provided in this application. Please refer to the following for details. Figures 1 to 3 .

[0052] Based on the solution of Embodiment 1 above:

[0053] Furthermore, such as Figure 2 As shown, the elastic telescopic device 3 includes a connecting block 31 and an elastic element 32; the connecting block 31 is connected to the driving end of the driving mechanism 1; the elastic element 32 is connected between the connecting block 31 and the suction head 2.

[0054] The connecting block 31 serves as the connecting carrier between the elastic expansion joint 3 and the drive mechanism 1, and its structural design directly affects the overall stability and ease of assembly. The elastic element 32, as the core component enabling the elastic movement of the suction head 2, absorbs the impact force generated when the suction head 2 contacts the object to be sampled through its own elastic deformation. When the suction head 2 is subjected to downward pressure, the elastic element 32 is compressed, and the suction head 2 moves downward relative to the connecting block 31, thus achieving buffering; when the pressure is removed, the elastic element 32 returns to its original shape, causing the suction head 2 to reset. This structure is simple and reliable, and can stably provide the required elastic buffering force for the suction head 2.

[0055] Furthermore, such as Figure 2 as well as Figure 3 As shown, the elastic telescopic device 3 also includes a guide rod 33; the guide rod 33 moves through the connecting block 31 and the suction head 2, and one end is provided with a first stop part 331 that can contact and abut against the connecting block 31, and the other end is provided with a second stop part 332 that can contact and abut against the connecting block 31.

[0056] The guide rod 33 is designed to guide and limit the elastic movement of the suction head 2, ensuring that the suction head 2 can only move smoothly in a preset vertical direction, preventing lateral deviation or wobbling during the buffering process, thus ensuring accurate alignment between the suction port 21 and the surface of the object to be sampled. When the suction head 2 is subjected to pressure and moves downward, the guide rod 33 moves downward with the suction head 2, at which time the connecting block 31 and the second stop 332 on the guide rod 33 gradually approach each other; when the suction head 2 returns to its original position, the guide rod 33 moves upward with the suction head 2, and the connecting block 31 gradually approaches the first stop 331. The first stop 331 and the second stop 332 prevent the guide rod 33 from disengaging from the connecting block 31 and the suction head 2, ensuring the operational stability of the elastic expansion joint 3.

[0057] Furthermore, the guide rods 33 are multiple (e.g., two), arranged in an interval array.

[0058] The spaced array arrangement of multiple guide rods 33 can guide the movement of the suction head 2 from multiple points, further improving the smoothness and coaxiality of the elastic movement of the suction head 2, and effectively preventing the suction head 2 from tilting or getting stuck during movement. For example, when there are two guide rods 33 and they are symmetrically arranged on both sides of the elastic member 32, a stable two-point support guide structure can be formed, so that the suction head 2 can still maintain the preset trajectory movement when subjected to lateral forces in different directions, ensuring the smoothness of the buffering process and the accuracy of the adsorption operation.

[0059] Furthermore, such as Figure 2 As shown, the connecting block 31 is provided with a first receiving groove 311 into which one end of the elastic member 32 extends; as Figure 3 As shown, the suction head 2 is provided with a second receiving groove 25 into which the other end of the elastic member 32 extends.

[0060] The first receiving groove 311 and the second receiving groove 25 effectively position and fix both ends of the elastic element 32, preventing lateral displacement or detachment of the elastic element 32 during compression or extension. When the elastic element 32 is a compression spring, one end of the spring is embedded in the first receiving groove 311 and the other end is embedded in the second receiving groove 25. The inner wall of the receiving groove can constrain the radial movement of the spring, ensuring that the spring always stretches and contracts axially, thereby ensuring the stability of the elastic movement of the suction head 2 and the consistency of the buffering effect. This design also facilitates the installation and replacement of the elastic element 32. During assembly, simply place both ends of the elastic element 32 into the corresponding receiving grooves, improving assembly efficiency.

[0061] Furthermore, such as Figure 2 As shown, the connecting block 31 has a countersunk hole 312 through itself on the side facing the suction head 2; the driving end of the driving mechanism 1 has a threaded hole that is connected to the countersunk hole 312; and a threaded fastener that can be connected to the threaded hole is installed in the countersunk hole 312.

[0062] By engaging the countersunk hole 312 with the threaded hole, the connecting block 31 can be securely fixed to the drive end of the drive mechanism 1 using threaded fasteners (such as hex socket screws). The countersunk hole 312 design allows the head of the threaded fastener to be embedded inside the connecting block 31, preventing the head from protruding from the surface of the connecting block 31 and interfering with other components. It also ensures the flatness of the connection surface between the connecting block 31 and the drive end, improving the overall compactness and aesthetics of the structure. This detachable threaded connection method also facilitates the installation, disassembly, and subsequent maintenance or replacement of the connecting block 31. When the elastic expansion joint 3 needs repair or component replacement, simply unscrew the threaded fastener to remove the connecting block 31 from the drive end, making the operation convenient and efficient.

[0063] Furthermore, there are two suction heads 2 and two elastic telescopic devices 3; the drive mechanism 1 is a finger cylinder, and its two drive ends are respectively connected to two elastic telescopic devices 3.

[0064] As a compact and highly sensitive driving element, the finger cylinder can control two driving ends to achieve synchronous and opposite linear motion via an air source, thereby precisely driving the two elastic telescopic elements 3 and their connected suction heads 2 to move closer or further apart. When small samples need to be aspirated, the finger cylinder drives the two driving ends closer together, reducing the distance between the two suction heads 2; when dealing with larger samples, it drives the two driving ends further apart, increasing the distance between the suction heads 2, to adapt to different sample aspiration needs. The selection of the finger cylinder not only simplifies the overall structure of the driving mechanism 1 and reduces the installation space requirements of the device, but also provides stable driving force and precise displacement control, ensuring the accuracy and reliability of the suction head 2 distance adjustment, and meeting the high-precision sampling operation requirements of semiconductor equipment.

[0065] Furthermore, such as Figure 2 As shown, the bottom of the suction head 2 is provided with a suction port 21; a flexible suction cup 23 is installed on the suction port 21; the side of the suction head 2 is provided with a gas inlet 22 that connects to the suction port 21; the gas inlet 22 is equipped with a gas connector 24 for connecting to an external vacuum generator or gas source pipeline. When it is necessary to suction a sample, the vacuum generator evacuates the suction port 21 through the gas inlet 22, creating a negative pressure inside the flexible suction cup 23, thereby adsorbing the sample onto the suction cup; when it is necessary to release the sample, gas can be introduced into the suction port 21 through the gas inlet 22 to break the negative pressure state, allowing the sample to be smoothly released from the suction cup. The flexible suction cup 23 is made of a highly elastic material (such as silicone, fluororubber, etc.), and its soft properties can better conform to the sample surface. Even if there are slight unevenness or curvature on the sample surface, it can achieve close contact through its own deformation, effectively preventing air leakage and ensuring the firmness of the adsorption. Meanwhile, flexible materials can also protect the sample surface during the adsorption process, avoiding scratches or indentations that may be caused by hard contact, and are especially suitable for semiconductor samples with fragile surfaces.

[0066] like Figure 1 As shown, a quick-connect coupling 4 is installed on the drive mechanism 1. The quick-connect coupling 4 is used to quickly connect to the matching coupling at the end of the robot arm, so that it can be quickly plugged in and unplugged when the sampling device needs to be changed, which helps to improve the overall production efficiency. The quick-connect coupling 4 is an existing design and will not be described in detail.

[0067] In this application, the main structure of the suction head 2 can be a T-shaped block structure, and the structure of the connecting block 31 can also be a T-shaped block structure; there are no specific limitations.

[0068] The semiconductor equipment sampling device provided in this application has been described in detail above. For those skilled in the art, there will be changes in the specific implementation and application scope based on the ideas of the embodiments of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A semiconductor equipment sampling device, characterized in that, It includes a drive mechanism (1), a buffer mechanism, and at least two suction heads (2); The buffer mechanism includes at least two elastic expanders (3); Each of the elastic telescopic elements (3) is connected to the suction head (2) in a one-to-one correspondence, so that the suction head (2) can move elastically; The drive mechanism (1) is connected to each of the elastic telescopic elements (3) and is used to drive each of the elastic telescopic elements (3) to move closer to or further away from each other.

2. The semiconductor equipment sampling device according to claim 1, characterized in that, The elastic expansion joint (3) includes a connecting block (31) and an elastic element (32); The connecting block (31) is connected to the driving end of the driving mechanism (1); The elastic element (32) is connected between the connecting block (31) and the suction head (2).

3. The semiconductor equipment sampling device according to claim 2, characterized in that, The elastic expansion joint (3) also includes a guide rod (33); The guide rod (33) moves through the connecting block (31) and the suction head (2), and one end is provided with a first stop (331) that can contact and abut against the connecting block (31), and the other end is provided with a second stop (332) that can contact and abut against the connecting block (31).

4. The semiconductor equipment sampling device according to claim 3, characterized in that, The guide rods (33) are multiple and arranged in an array at intervals.

5. The semiconductor equipment sampling device according to claim 2, characterized in that, The connecting block (31) is provided with a first receiving groove (311) into which one end of the elastic member (32) extends; The suction head (2) is provided with a second receiving groove (25) into which the other end of the elastic member (32) extends.

6. The semiconductor equipment sampling device according to claim 2, characterized in that, The elastic element (32) is multiple and arranged in an array at intervals.

7. The semiconductor equipment sampling device according to claim 2, characterized in that, The elastic element (32) is a compression spring.

8. The semiconductor equipment sampling device according to claim 2, characterized in that, The connecting block (31) has a countersunk hole (312) that passes through it on the side facing the suction head (2). The drive end of the drive mechanism (1) is provided with a threaded hole that is connected to the countersunk hole (312); A threaded fastener capable of connecting with the threaded hole is installed in the countersunk hole (312).

9. The semiconductor equipment sampling device according to claim 1, characterized in that, There are two suction heads (2) and two elastic telescopic devices (3); The driving mechanism (1) is a finger cylinder, and its two driving ends are respectively connected to the two elastic telescopic elements (3).

10. The semiconductor equipment sampling device according to claim 1, characterized in that, The suction head (2) has a suction port (21) at its bottom. A flexible suction cup (23) is installed on the suction port (21); The suction head (2) has an air inlet (22) on its side that connects to the suction port (21). The drive mechanism (1) is equipped with a quick-change connector (4).

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