Ultrasonic transducer applied to gas medium
By employing a damping backing structure in the ultrasonic transducer, and utilizing a combination of flexible and rigid damping layers and a cavity design, the balance between sensitivity and parasitic vibration is solved, thereby improving the detection effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 中山市高灵科技有限公司
- Filing Date
- 2025-05-07
- Publication Date
- 2026-04-17
AI Technical Summary
Ultrasonic transducers struggle to balance sensitivity and parasitic vibrations in gaseous media, which affects detection results.
The structure employs a damping backing structure, comprising a first flexible damping layer and a second rigid damping layer. The second damping layer has a cavity to allow some areas to remain undamped. Combined with a sound-permeable layer and a protective outer shell, a balance between sensitivity and parasitic vibration is achieved.
While maintaining sensitivity, it effectively suppresses parasitic vibrations, thus improving the detection performance of the ultrasonic transducer.
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Figure CN224127750U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of ultrasonic transducer technology, and in particular to an ultrasonic transducer used in gaseous media. Background Technology
[0002] Ultrasonic transducers can be used in air or other gaseous media to transmit and receive ultrasonic waves. Distance can be detected by the time difference between transmission and reception, and the surface material of a reflective object can be determined by the intensity of transmission and reception.
[0003] For this type of transducer, the two most critical indicators are the sensitivity of the transmitting and receiving signals and the intensity of parasitic vibrations. Higher sensitivity and weaker parasitic vibrations are more conducive to applications in air or other gases. However, achieving these two key indicators is often contradictory.
[0004] To improve the sensitivity of an ultrasonic transducer, the rigid backing material needs to be replaced with a soft backing material or even air can be used directly as the backing. However, this would make it impossible to control the parasitic vibrations generated by the piezoelectric ceramics in the ultrasonic transducer, resulting in an imbalance between the sensitivity of the piezoelectric ceramics and the parasitic vibrations, which would affect the operation of the ultrasonic transducer.
[0005] If you want to reduce the intensity of parasitic vibration, you need to increase the stiffness or weight of the ultrasonic transducer backing to increase the restraint on the ultrasonic transducer; however, it is difficult to ensure the sensitivity of the ultrasonic transducer, so it is difficult to achieve a balance between sensitivity and parasitic vibration. Utility Model Content
[0006] This invention aims to solve the problem of the inability to achieve a balance between the sensitivity and parasitic vibration of ultrasonic transducers, and provides an ultrasonic transducer for use in gaseous media.
[0007] To achieve the above objectives, the present invention provides the following technical solution: an ultrasonic transducer for use in a gaseous medium, comprising a piezoelectric component, wherein a damping backing is provided on the piezoelectric component, the damping backing comprising a first damping layer located above the piezoelectric component for initially suppressing parasitic vibrations of the piezoelectric component and a second damping layer located above the first damping layer for further suppressing parasitic vibrations of the piezoelectric component, wherein the second damping layer has a cavity inside, the cavity preventing a portion of the first damping layer from being suppressed by the second damping layer.
[0008] As a further embodiment of this utility model: the first damping layer is a flexible damping layer.
[0009] As a further embodiment of this invention: the second damping layer is a hard damping layer.
[0010] As a further embodiment of this utility model: the piezoelectric component includes a piezoelectric ceramic located below the first damping layer and a sound-permeable layer located below the piezoelectric ceramic.
[0011] As a further embodiment of this utility model: a placement groove is provided above the second damping layer, and an adapter plate is provided in the placement groove. The adapter plate is electrically connected to the piezoelectric component, and an external adapter wire is electrically connected to the adapter plate.
[0012] As a further embodiment of this utility model: a third damping layer is provided above the second damping layer for suppressing parasitic vibrations of the piezoelectric component.
[0013] As a further embodiment of this utility model: the piezoelectric ceramic is provided with an inner connecting line, and the piezoelectric ceramic is provided with a solder point for forming an electrical connection with the inner connecting line. The two ends of the inner connecting line extend from the outer side of the first damping layer and form an electrical connection with the adapter plate.
[0014] As a further embodiment of this utility model: the damping backing is provided with an outer shell, and both the piezoelectric component and the damping backing are located in the outer shell.
[0015] Compared with the prior art, the beneficial effects of this technical solution are as follows: the cavity is opened in the second damping layer so that the piezoelectric component will not have its sensitivity reduced due to the presence of the second damping layer when it is working. At the same time, since the cavity only prevents the local area of the piezoelectric component from being interfered with by the second damping layer, the parasitic vibration generated by the piezoelectric component will still be suppressed by the second damping layer, thereby achieving a balance between sensitivity and parasitic vibration.
[0016] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 This is a schematic cross-sectional view of the overall structure of Example 1;
[0019] Figure 2 This is a schematic cross-sectional view of the damping backing structure in Example 1;
[0020] Figure 3This is a schematic diagram of the arc-shaped end face of the first damping layer in Example 1;
[0021] Figure 4 This is a schematic cross-sectional view of the piezoelectric component structure in Example 1;
[0022] Figure 5 This is a schematic cross-sectional view of the overall structure of Example 2;
[0023] Figure 6 This is a schematic cross-sectional view of the overall structure of Example 3;
[0024] The corresponding labels in the attached diagram are explained as follows:
[0025] 1. Piezoelectric component; 11. Piezoelectric ceramic; 111. Internal connecting wire; 112. Solder point; 12. Sound-permeable layer; 2. Damping backing; 21. First damping layer; 22. Second damping layer; 221. Placement slot; 222. Adapter plate; 223. External adapter wire; 23. Cavity; 24. Third damping layer; 3. Outer shell. Detailed Implementation
[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0027] Example 1
[0028] like Figures 1 to 4 As shown, an ultrasonic transducer for air detection includes a piezoelectric component 1. The piezoelectric component 1 is provided with a damping backing 2. The damping backing 2 includes a first damping layer 21 located above the piezoelectric component 1 for initially suppressing parasitic vibrations of the piezoelectric component 1, and a second damping layer 22 located above the first damping layer 21 for further controlling parasitic vibrations of the piezoelectric component 1. The second damping layer 22 has a cavity 23 inside. The cavity 23 prevents a part of the first damping layer 21 from being compressed by the second damping layer 22. The cavity in the second damping layer prevents the piezoelectric component from experiencing a decrease in sensitivity due to the presence of the second damping layer during operation. At the same time, because the cavity only prevents a local area of the piezoelectric component from being interfered with by the second damping layer, the parasitic vibrations generated by the piezoelectric component are still suppressed by the second damping layer, thereby achieving a balance between sensitivity and parasitic vibration.
[0029] Furthermore, the first damping layer 21 is a flexible damping layer. The flexibility of the first damping layer 21 can initially control parasitic vibrations while also ensuring the sensitivity of the piezoelectric component 1 under certain conditions. In addition, the material hardness of the first damping layer 21 is Shore hardness 1-70A. As further explanation and not limitation, the top end face of the first damping layer 21 can be arc-shaped or parallel.
[0030] Furthermore, the second damping layer 22 is a hard damping layer with a Shore hardness of 20-90A. This makes the second damping layer 22 harder than the first damping layer 21, allowing the second damping layer 22 to better suppress the parasitic vibration of the piezoelectric component 1.
[0031] Furthermore, the piezoelectric component 1 includes a piezoelectric ceramic 11 located below the first damping layer 21 and an acoustically transparent layer 12 located below the piezoelectric ceramic 11. When the piezoelectric ceramic 11 is energized, it emits ultrasonic waves, and the acoustically transparent layer 12 can focus the ultrasonic wave signal, enhance the directionality of the ultrasonic wave during propagation, and improve the sensitivity of the probe. The acoustically transparent layer 12 can also serve as an acoustic impedance matching layer, reducing the reflection loss of sound waves at the interface and increasing the transmittance of sound waves. At the same time, the acoustically transparent layer 12 can protect the piezoelectric ceramic 11, reducing the wear and damage of the piezoelectric ceramic 11.
[0032] Furthermore, a placement groove 221 is provided above the second damping layer 22, and a converter plate 222 is provided in the placement groove 221. The converter plate 222 is electrically connected to the piezoelectric component 1. An external adapter wire 223 is electrically connected to the converter plate 222. After receiving the ultrasonic signal, the piezoelectric ceramic 11 will start to vibrate, converting mechanical energy into electrical energy, and then transmitting it to the converter plate 222. The external adapter wire 223 can supply power to the converter plate 222 and the piezoelectric component 1. At the same time, it can also transmit the electrical signal received by the converter plate 222 to the main end.
[0033] Furthermore: The piezoelectric ceramic 11 is provided with an internal connecting line 111, and the piezoelectric ceramic 11 is provided with solder points 112 for forming an electrical connection with the internal connecting line 111. The two ends of the internal connecting line 111 extend from the first damping layer 21 to the outside of the first damping layer 21 and form an electrical connection with the adapter plate 222. The damping backing 2 is provided with a housing 3. The piezoelectric component 1 and the damping backing 2 are both located in the housing 3. The solder points 112 and the internal connecting line 111 form an electrical connection, allowing the piezoelectric ceramic 11 to work normally and the electrical signal to be transmitted to the adapter plate 222 through the internal connecting line 111. The housing 3 protects the piezoelectric component 1 and the damping backing 2, and also facilitates installation, allowing the piezoelectric component 1 to work.
[0034] Example 2
[0035] like Figure 5As shown, the difference between this embodiment and Embodiment 1 is that a third damping layer 24 for suppressing parasitic vibrations of the piezoelectric component 1 is provided above the second damping layer 22. The material hardness of the third damping layer 24 is Shore hardness 50A-90D. The third damping layer 24 can further suppress the parasitic vibrations of the piezoelectric component 1 on the basis of the second damping layer 22.
[0036] Example 3
[0037] like Figure 6 As shown, the difference between this embodiment and Embodiments 1 and 2 is that the first damping layer 21 is not exposed in the cavity 23, so that the first damping layer 21 can ensure the sensitivity of the piezoelectric component 1, and can also rely on the hardness of the second damping layer 22 to suppress the parasitic vibration of the piezoelectric component 1, thus achieving a better balance.
[0038] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.
Claims
1. An ultrasonic transducer for use in a gaseous medium, characterized in that, The device includes a piezoelectric component (1) and a damping backing (2) on the piezoelectric component (1). The damping backing (2) includes a first damping layer (21) located above the piezoelectric component (1) for initially suppressing the parasitic vibration of the piezoelectric component (1) and a second damping layer (22) located above the first damping layer (21) for further suppressing the parasitic vibration of the piezoelectric component (1). The second damping layer (22) has a cavity (23) inside, and the cavity (23) prevents a portion of the first damping layer (21) from being suppressed by the second damping layer (22).
2. The ultrasonic transducer for use in a gaseous medium according to claim 1, characterized in that, The first damping layer (21) is a flexible damping layer.
3. The ultrasonic transducer for use in a gaseous medium according to claim 1, characterized in that, The second damping layer (22) is a hard damping layer.
4. The ultrasonic transducer for use in a gaseous medium according to claim 1, characterized in that, The piezoelectric component (1) includes a piezoelectric ceramic (11) located below a first damping layer (21) and a sound-permeable layer (12) located below the piezoelectric ceramic (11).
5. The ultrasonic transducer for use in a gaseous medium according to claim 4, characterized in that, A placement groove (221) is provided above the second damping layer (22), and a transition plate (222) is provided in the placement groove (221). The transition plate (222) is electrically connected to the piezoelectric component (1), and an external adapter wire (223) is electrically connected to the transition plate (222).
6. The ultrasonic transducer for use in a gaseous medium according to claim 5, characterized in that, A third damping layer (24) is provided above the second damping layer (22) to suppress parasitic vibrations of the piezoelectric component (1).
7. The ultrasonic transducer for use in a gaseous medium according to claim 5, characterized in that, The piezoelectric ceramic (11) is provided with an inner connecting line (111), and the piezoelectric ceramic (11) is provided with a solder point (112) for forming an electrical connection with the inner connecting line (111). The two ends of the inner connecting line (111) extend from the first damping layer (21) to the outside of the first damping layer (21) and form an electrical connection with the adapter plate (222).
8. The ultrasonic transducer for use in a gaseous medium according to claim 1, characterized in that, The damping backing (2) is provided with an outer shell (3), and both the piezoelectric component (1) and the damping backing (2) are located in the outer shell (3).