Wafer cleaning spray pipe

Abstract

The utility model provides a wafer cleaning spray pipe. The wafer cleaning spray pipe comprises a liquid conveying pipe, one end of the liquid conveying pipe is provided with a liquid outlet, the liquid conveying pipe is used for conveying cleaning liquid to the liquid outlet and spraying the cleaning liquid to the edge of a wafer for cleaning through the liquid outlet, at least one groove is formed in the outer side of the pipe wall of the liquid conveying pipe, and the liquid outlet is communicated with the groove. The groove extends in the direction in which the liquid conveying pipe conveys the cleaning liquid and extends to the position below the liquid outlet; the at least one liquid suction pipe is arranged in the groove, one end of the liquid suction pipe extends to the position below the liquid outlet, and the liquid suction pipe is used for sucking liquid drops formed by the cleaning liquid below the liquid outlet. According to the technical scheme, the groove is formed in the outer wall of the liquid conveying pipe, and the liquid suction pipe capable of absorbing liquid is arranged in the groove, so that liquid drops are absorbed in time when the liquid drops are formed at the liquid outlet, the problems of wafer edge deviation and excessive edge washing caused by the fact that the liquid drops drop to the surface of the wafer are avoided, a chip on the surface of the wafer is prevented from being damaged, and the cleaning quality is improved.

Description

Technical Field

[0001] This utility model relates to the semiconductor field, and in particular to a wafer cleaning nozzle. Background Technology

[0002] In semiconductor manufacturing, the growth of the copper seed layer via physical vapor deposition (PVD) is crucial. However, in actual production, the copper seed layer exhibits strong diffusion during growth, extending not only to the edges of the silicon wafer but also to the back side. This phenomenon causes severe metal contamination of subsequent process equipment, significantly impacting its normal operation and lifespan. Simultaneously, the uneven copper seed layer at the wafer edges presents adhesion problems with the subsequently deposited thin film: poor adhesion can lead to detachment of the copper seed layer from the deposited film. These detached film fragments or portions of the copper seed layer become particles, scattered on the chip surface or in the manufacturing environment, becoming a significant source of particle defects and severely affecting the quality and performance of semiconductor products.

[0003] In existing technologies, an edge-washing (EBR) process following chemical electroplating is particularly necessary. Typically, such as... Figure 1 As shown, the electroplated wafer 11 is placed in the slot and fixed in position by clips (not shown). During high-speed rotation, a cleaning solution is sprayed onto the edge of the wafer 11 using a nozzle 12 to remove copper from the edge. However, during the spraying process, cleaning solution accumulates at the outlet 120 of the nozzle 12, forming larger droplets 13. These droplets 13 then drip from the outlet 120 onto the high-speed rotating wafer 11 (i.e., dripping phenomenon), causing a noticeable edge misalignment on the wafer 11. Figure 2 As shown, during the edge washing process, the droplets 13 may come into contact with areas of the wafer 11 that originally did not require copper removal, resulting in excessive edge washing (as indicated by arrow 21). This edge deviation can affect the chips on the surface of the wafer 11.

[0004] Therefore, how to avoid wafer edge deviation and excessive edge washing caused by dripping is a problem that needs to be solved. Summary of the Invention

[0005] The technical problem to be solved by this invention is how to avoid wafer edge deviation and excessive edge washing caused by dripping, and provides a wafer cleaning nozzle.

[0006] To address the aforementioned problems, this utility model provides a wafer cleaning nozzle, comprising: a delivery tube having an outlet at one end, the delivery tube being used to transport cleaning fluid to the outlet and spray the cleaning fluid onto the wafer edge for cleaning via the outlet; at least one groove being formed on the outer side of the delivery tube wall, the groove extending along the direction of the delivery tube transporting the cleaning fluid and extending below the outlet; and at least one suction tube disposed within the groove, one end extending below the outlet, for absorbing droplets of the cleaning fluid formed below the outlet.

[0007] The above technical solution involves setting a groove on the outer wall of the infusion tube and placing a liquid-absorbing tube inside the groove. When liquid droplets are formed at the outlet, the droplets are absorbed in time, preventing them from falling onto the wafer surface and causing wafer edge deviation and over-washing. This avoids damage to the chips on the wafer surface and improves the cleaning quality.

[0008] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit the present invention. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. Attached Figure Description

[0009] To more clearly illustrate the technical solutions in the specific embodiments of this utility model, the accompanying drawings used in the description of the specific embodiments will be briefly introduced below. Obviously, the drawings described below are only some specific embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0010] Figure 1 This is a schematic diagram of a wafer structure with clear edges in the prior art.

[0011] Figure 2 This is a schematic diagram of the wafer over-washing structure in the existing technology.

[0012] Figure 3 This is a schematic diagram of the structure of the first embodiment of the wafer cleaning nozzle of this utility model.

[0013] Figure 4 This is a top view of the first embodiment of the wafer cleaning nozzle of this utility model.

[0014] Figure 5 This is a cross-sectional view of the first embodiment of the wafer cleaning nozzle of this utility model.

[0015] Figure 6This is a cross-sectional view of a second embodiment of the wafer cleaning nozzle of this utility model.

[0016] Figure 7 This is a cross-sectional view of the third embodiment of the wafer cleaning nozzle of this utility model.

[0017] Figure 8 This is a cross-sectional view of the fourth embodiment of the wafer cleaning nozzle of this utility model.

[0018] Explanation of reference numerals in the attached figures

[0019] 11 wafers

[0020] 12 nozzles

[0021] 13 Droplets

[0022] 21. Excessive edge washing

[0023] 30 wafers

[0024] 31. Infusion tubing

[0025] 310 liquid outlet

[0026] 312 The wall of the infusion tubing

[0027] 313 Groove

[0028] 32. Suction tube

[0029] 320 suction pump

[0030] 32. Pipeline of the suction tube

[0031] 33 Droplets

[0032] 34 Detachable fasteners Detailed Implementation

[0033] The technical solutions in the embodiments of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0034] Please see Figures 3-5 ,in, Figure 3 This is a schematic diagram of the structure of the first embodiment of the wafer cleaning nozzle of this utility model; Figure 4 This is a top view of the first embodiment of the wafer cleaning nozzle of this utility model;

[0035] Figure 5This is a cross-sectional view of the first embodiment of the wafer cleaning nozzle of this utility model; wherein, Figure 5 For along Figure 3 The cross-sectional view along the AA' direction is shown, with the invisible parts drawn using dashed lines.

[0036] like Figures 3-5 As shown, the wafer cleaning nozzle includes: a delivery tube 31 and at least one suction tube 32. One end of the delivery tube 31 has an outlet 310. The delivery tube 31 is used to transport cleaning fluid to the outlet 310 and spray the cleaning fluid onto the edge of the wafer 30 for cleaning via the outlet 310. At least one groove 313 is formed on the outer side of the tube wall 312 of the delivery tube 31. The groove 313 extends along the direction of the delivery tube 31 in transporting the cleaning fluid and extends below the outlet 310. The suction tube 32 is disposed within the groove 313, with one end extending below the outlet 310, and is used to absorb droplets 33 formed by the cleaning fluid below the outlet 310.

[0037] The above technical solution involves setting a groove on the outer wall of the infusion tube and placing a liquid-absorbing tube inside the groove. This allows for the timely absorption of liquid droplets formed at the outlet, preventing them from falling onto the wafer surface and causing issues such as wafer edge misalignment and over-washing. This avoids damage to the chips on the wafer surface and improves cleaning quality. Furthermore, since the wafer cleaning nozzle is very close to the wafer during cleaning, placing the liquid-absorbing tube inside the groove avoids increasing the volume of the wafer cleaning nozzle and prevents any additional impact on the wafer cleaning process.

[0038] like Figure 5 As shown, in some embodiments, the wall 312 of the infusion tube 31 has a thickness T1, and the thickness of the groove 313 is less than the thickness of the wall 312 of the infusion tube 31. That is, the groove 313 is formed on the wall 312 using the thickness of the wall 312 itself to accommodate the suction tube 32. Figure 5 The filled portion of the diagram of the suction tube 32 shown represents the tube wall of the suction tube 32, while the blank portion represents the pipe 321 of the suction tube 32.

[0039] In some embodiments, the groove 313 has a rectangular cross-section; the width of the groove 313 ranges from 0.5mm to 2mm, and the depth of the groove 313 ranges from 0.5mm to 2mm. In this embodiment, the width of the groove 313 is 1mm; the depth of the groove 313 is 1mm. In other embodiments, the width of the groove 313 may also be 0.5mm, 1.5mm, or 2mm; the depth of the groove 313 may also be 0.5mm, 1.5mm, or 2mm.

[0040] In some embodiments, the shape of the suction tube 32 is adapted to the shape of the groove 313 to enhance the stability of the suction tube 32 when it is disposed within the groove 313 and reduce the possibility of it falling off. Furthermore, the inner wall of the groove 313 can be made with a frosted surface to increase the friction between the suction tube 32 and the groove 313, further enhancing the stability of the suction tube 32 when disposed within the groove 313.

[0041] In some embodiments, the suction tube 32 is a flexible tube that is detachably fixed within the groove 313. The suction tube 32 may be made of fluororubber material with high flexibility, chemical corrosion resistance and smooth inner wall, which improves the service life of the suction tube 32 and reduces the resistance of the droplets 33 flowing within the suction tube 32, ensuring the smoothness of the back suction process.

[0042] Furthermore, using a flexible tube as the suction tube 32 facilitates disassembly and replacement. For example... Figure 4 As shown, the suction tube 32 is placed in the groove 313, and the tubing is securely fixed in the groove 313 using a detachable fastener 34. This ensures that the suction tube 32 fits tightly against the groove 313 without affecting the normal spraying function of the infusion tube 31. Simultaneously, it ensures that the suction tube 32 is unobstructed, without bending or blockage. In this embodiment, the detachable fastener 34 can be a snap-fit ​​or a clamp. Using a snap-fit ​​or clamp to detachably fix the suction tube 32 in the groove 313 facilitates timely replacement in case of malfunction or damage, improving maintenance efficiency and reducing maintenance costs.

[0043] In some other embodiments, the suction tube 32 may not use a flexible tube, but the shape of the suction tube 32 needs to be adapted to the shape of the groove 313 to ensure that the suction tube 32 can be fixedly installed in the groove 313.

[0044] In some embodiments, the wafer cleaning nozzle further includes a suction pump 320 connected to the other end of the suction pipe 32 for providing suction to the suction pipe 32.

[0045] In addition, a liquid collector (not shown) can be provided on the side of the suction pump 320 away from the suction tube 32 to collect the liquid sucked out by the suction tube 32.

[0046] In some embodiments, a controller (not shown) may be provided at the suction pump 320 to adjust the power of the suction pump 320, thereby adjusting the suction force of the suction tube 32 to adsorb the droplets 33. When the amount of droplets 33 is large, the power of the suction pump 320 is increased to improve the back suction speed and ensure that the droplets 33 can be removed in time; when the amount of droplets 33 is small, the power of the suction pump 320 is reduced to avoid affecting the internal structure of the infusion tube 31 or normal liquid spraying due to excessive suction, while also reducing energy consumption and achieving a balance between energy saving and high efficiency.

[0047] In some embodiments, the direction in which the cleaning fluid is ejected from the infusion tube 31 forms an angle with the surface of the wafer 30. This allows the cleaning fluid to impact the surface of the wafer 30 edge at a specific angle. Compared to vertical spraying, this method more effectively utilizes the kinetic energy of the cleaning fluid, enhancing the scouring effect on surface impurities at the edge of the wafer 30. Furthermore, the angle alters the flow path of the cleaning fluid on the surface of the wafer 30 edge, preventing excessive accumulation of the cleaning fluid in certain areas and allowing for more uniform coverage of the wafer 30 surface. This improves cleaning uniformity and ensures that the entire edge of the wafer 30 is effectively cleaned. Simultaneously, this design reduces splashing of the cleaning fluid on the wafer 30 surface, minimizing environmental pollution.

[0048] In some embodiments, the distance between the liquid outlet 310 and the wafer 30 is less than or equal to 0.5 mm. In this embodiment, the distance between the liquid outlet 310 and the wafer 30 is 0.5 mm. In other embodiments, the distance between the liquid outlet 310 and the wafer 30 can also be 0.1 mm, 0.2 mm, 0.3 mm, or 0.4 mm. When the distance between the liquid outlet 310 and the wafer 30 is small, the cleaning fluid sprayed from the liquid outlet 310 can act more concentratedly on the edge of the wafer 30, reducing the dispersion and loss of the cleaning fluid during transmission. The energy of the cleaning fluid can be more effectively transferred to the parts of the wafer 30 edge that need cleaning, enhancing the ability to remove impurities such as edge copper film. At the same time, the smaller distance helps to improve the cleaning accuracy, enabling more accurate control of the cleaning area, avoiding the cleaning fluid from splashing onto other parts of the wafer 30 that do not need cleaning, preventing unnecessary damage or contamination to the wafer 30, and ensuring the accuracy and stability of key processes in semiconductor manufacturing.

[0049] However, it is precisely because of the limited distance between the outlet 310 and the wafer 30 that it is difficult for technicians to set up additional structures between the outlet 310 and the wafer 30 to avoid dripping. The wafer 30 cleaning nozzle provided by this invention, by providing a groove 313 extending along the infusion tube 31 to the outlet 310 on the outer wall 312 of the infusion tube 31, and placing the suction tube 32 within the groove 313, can absorb the droplets 33 formed at the outlet 310 without increasing the volume of the wafer 30 cleaning nozzle, thus avoiding additional impact on the cleaning of the wafer 30.

[0050] In some embodiments, the velocity range of the cleaning fluid ejected from the infusion tube 31 is 0.1 ml / s to 0.5 ml / s. In this embodiment, the velocity of the cleaning fluid ejected from the infusion tube 31 is 0.2 ml / s. In other embodiments, the velocity of the cleaning fluid ejected from the infusion tube 31 can also be 0.1 ml / s, 0.3 ml / s, 0.4 ml / s, or 0.5 ml / s. Setting an appropriate range of cleaning fluid ejection velocity can maintain the stability and reliability of the process while ensuring the cleaning effect. If the cleaning fluid ejection velocity is too low, the amount of cleaning fluid reaching the edge of the wafer 30 per unit time is too small, which cannot provide sufficient chemical action and mechanical scouring force to effectively remove impurities at the edge, such as copper film. This will lead to incomplete cleaning, and residual impurities may affect subsequent processes and reduce product quality. Conversely, if the cleaning fluid is sprayed at too high a speed, it may generate a large impact force on the surface of the wafer 30, causing the cleaning fluid to splash. This not only wastes the cleaning fluid but may also contaminate surrounding equipment and the environment; it may even damage the wafer 30, affecting its physical structure and performance. Excessive speed may also result in uneven distribution of the cleaning fluid at the edges of the wafer 30, similarly affecting the consistency of the cleaning effect. A suitable speed allows the cleaning fluid to evenly cover the edges of the wafer 30, fully utilizing the reaction between the chemicals in the cleaning fluid and impurities, as well as the flushing effect of the cleaning fluid, ensuring that impurities are effectively removed. At the same time, this speed range facilitates equipment control and operation, which is beneficial for achieving large-scale, high-efficiency production.

[0051] In some embodiments, the cleaning solution is a mixture of hydrogen peroxide and sulfuric acid. In some embodiments, the infusion tube 31 is made of a special material that is corrosion-resistant, wear-resistant, and has a smooth surface, such as a ceramic matrix composite material, to reduce the adhesion and residue of the cleaning solution on the surface of the infusion tube 31 and reduce the possibility of droplet formation.

[0052] Please see Figure 6 This is a cross-sectional view of a second embodiment of the wafer cleaning nozzle of this utility model, wherein... Figure 6 Also for along Figure 3 A cross-sectional view along the AA' direction. Figure 6 The illustrated embodiments and Figure 5 The embodiment shown differs in that the groove 313 has a semi-circular cross-section to accommodate the circular cross-section of the suction tube 32. The suction tube 32 is disposed in the groove 313 and fixed within the groove 313 by a fastener (not shown). Figure 6 The filled portion of the diagram of the suction tube 32 shown represents the tube wall of the suction tube 32, while the blank portion represents the pipe 321 of the suction tube 32.

[0053] Furthermore, the cross-sectional shape of the groove 313 is not limited to a rectangle or a semi-circle. It can also be set to a shape that is compatible with the suction tube 32 according to the needs of different scenarios, or other shapes can be set according to different needs.

[0054] Please see Figure 7 This is a cross-sectional view of the third embodiment of the wafer cleaning nozzle of this utility model, wherein... Figure 7 Also for along Figure 3 A cross-sectional view along the AA' direction. Figure 7 The illustrated embodiments and Figure 5 Unlike the illustrated embodiment, in this embodiment, a controller is not set to adjust the power of the suction pump. Instead, multiple grooves 313 of different sizes and suction pipes 32 of corresponding diameters are set, and suction pipes 32 of different diameters are used to absorb the droplets below the outlet according to different rate requirements. Figure 7 The filled portion of the diagram of the suction tube 32 shown represents the tube wall of the suction tube 32, while the blank portion represents the pipe 321 of the suction tube 32.

[0055] Different cleaning solutions may produce different amounts of droplets. Based on the droplet formation rate and flow rate differences, suction tubes of different diameters are used for targeted back suction. For cases with a large droplet flow rate, a suction tube with a slightly larger diameter can be used to improve back suction efficiency; for cases with a small droplet flow rate, a suction tube with a smaller diameter is used to ensure that the droplets are removed promptly and efficiently, avoiding empty suction caused by an excessively large suction tube diameter, and also reducing energy consumption.

[0056] Please see Figure 8 This is a cross-sectional view of the fourth embodiment of the wafer cleaning nozzle of this utility model, wherein... Figure 8 Also for along Figure 3 A cross-sectional view along the AA' direction. Figure 8 The illustrated embodiments and Figure 5Unlike the illustrated embodiment, in this embodiment, the wall 312 of the infusion tube 31 is bent inward to form the groove 313. That is, the groove 313 is formed by changing the shape of the wall 312 of the infusion tube 31, which is suitable for scenarios where the wall 312 is relatively thin, avoiding excessive use of the internal space of the infusion tube 31 by an overly thick wall 312. (The image shows a thinner wall.) Figure 8 The walls 312 of the infusion tube 31 and the walls of the suction tube 32 are both drawn with lines. In the drawing, the blank part inside the wall 312 of the infusion tube 31 is the pipe of the infusion tube 31, and the blank part inside the wall of the suction tube 32 is the pipe of the suction tube 32.

[0057] In this embodiment, the cross-section of the groove 313 is rectangular, and the cross-section of the suction tube 32 is circular. The cross-section of the groove 313 and the cross-section of the suction tube 32 do not need to be exactly the same, as long as they can stably position the suction tube 32 within the groove 313.

[0058] The wafer cleaning nozzle of this invention can also be adapted to clean silicon wafers and other workpieces of different sizes through adaptive improvements. By adjusting the size and position of the infusion tube 31 and the layout of the suction tube 32, it is ensured that the liquid droplets 33 can be effectively removed when cleaning workpieces of different sizes, thereby improving the versatility and application range of the device.

[0059] Furthermore, the design concept and technical solution of the wafer 30 cleaning nozzle described in this utility model can be extended to cleaning processes in other semiconductor manufacturing or related fields, such as photoresist cleaning and chip surface cleaning. Similar liquid leakage problems may also exist in these processes. By appropriately adjusting and optimizing the infusion tube 31 and the suction tube 32, they can be applied to new scenarios to solve the impact of droplet phenomena on product quality.

[0060] It should be noted that references to "an embodiment," "an embodiment," "an exemplary embodiment," "some embodiments," etc., in the specification indicate that the described embodiments may include specific features, structures, or characteristics, but each embodiment may not necessarily include that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. In addition, when a specific feature, structure, or characteristic is described in connection with an embodiment, whether explicitly described or not, implementing such a feature, structure, or characteristic in conjunction with other embodiments is within the knowledge of those skilled in the art.

[0061] Generally, terms can be understood at least partially from their usage in context. For example, the term "one or more," as used herein, depends at least partially on the context and can be used to describe any feature, structure, or characteristic in a singular sense, or in a plural sense, to describe a combination of features, structures, or characteristics. Similarly, terms such as "a," "a," or "the" can also be understood, at least partially on the context, to express either a singular or plural usage. Furthermore, the term "based on" can be understood not necessarily to express an exclusive set of factors, but rather, alternatively, also at least partially on the context, to allow for the presence of other factors that are not necessarily explicitly described. It should also be noted in this specification that "connection / coupling" refers not only to a direct coupling of one component to another, but also to an indirect coupling of one component to another via an intermediate component.

[0062] It should be noted that the terms "comprising" and "having," and their variations, used in this utility model document are intended to cover non-exclusive inclusion. The terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence, unless explicitly indicated by the context. It should be understood that such data used interchangeably where appropriate. Furthermore, embodiments and features within embodiments of this utility model can be combined with each other without conflict. In addition, descriptions of well-known components and technologies have been omitted in the above description to avoid unnecessarily obscuring the concepts of this utility model. In the various embodiments described above, each embodiment focuses on its differences from other embodiments; similar / identical parts between embodiments can be referred to mutually.

[0063] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A wafer cleaning nozzle, characterized in that, include: An infusion tube has an outlet at one end. The infusion tube is used to transport cleaning fluid to the outlet and spray the cleaning fluid onto the edge of the wafer for cleaning through the outlet. At least one groove is formed on the outer side of the tube wall. The groove extends along the direction of transporting the cleaning fluid through the infusion tube and extends below the outlet. At least one suction tube is disposed in the groove, with one end extending below the liquid outlet, for absorbing the droplets formed by the cleaning fluid below the liquid outlet.

2. The wafer cleaning nozzle of claim 1, wherein, The wall of the infusion tube has a thickness, and the thickness of the groove is less than the thickness of the wall of the infusion tube.

3. The wafer cleaning nozzle of claim 1, wherein, The infusion tube wall is bent inward to form the groove.

4. The wafer cleaning nozzle of claim 1, wherein, The suction tube is a flexible tube that is detachably fixed in the groove.

5. The wafer cleaning nozzle of claim 1, wherein, The shape of the suction tube is adapted to the shape of the groove.

6. The wafer cleaning nozzle according to claim 1, characterized in that, The groove has a rectangular cross-section; the width of the groove ranges from 0.5mm to 2mm; and the depth of the groove ranges from 0.5mm to 2mm.

7. The wafer cleaning nozzle of claim 1, wherein, It also includes a suction pump, connected to the other end of the suction tube, for providing suction to the suction tube.

8. The wafer cleaning nozzle of claim 1, wherein, The direction in which the cleaning fluid is sprayed from the infusion tube forms an angle with the surface of the wafer.

9. The wafer cleaning nozzle of claim 1, wherein, The distance between the liquid outlet and the wafer is less than or equal to 0.5 mm.

10. The wafer cleaning nozzle of claim 1, wherein, The speed at which the cleaning fluid is ejected from the infusion tube ranges from 0.1 ml / s to 0.5 ml / s.

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