Ultrasonic cleaning device

Abstract

The utility model relates to an ultrasonic cleaning device, and relates to the field of appliance cleaning equipment, the ultrasonic cleaning device comprises a machine body, a storage rack is detachably mounted on the machine body, a plurality of water passing holes for water to flow out are formed in the storage rack, the storage rack is erected in a cleaning groove in the machine body, and a connecting structure is arranged between the storage rack and the machine body; the sensing unit is arranged on the machine body and is used for outputting a high-level signal when the storage rack is arranged on the machine body; the signal input end of the single-chip microcomputer is in signal connection with the signal output end of the sensing unit, the signal output end of the single-chip microcomputer is in signal connection with an ultrasonic vibration module in the machine body, and the single-chip microcomputer is used for receiving the high-level signals and controlling the ultrasonic vibration module to operate. According to the ultrasonic cleaning device, the cleaning convenience of the ultrasonic cleaning device on the detection tool can be improved.

Description

Technical Field

[0001] This application relates to the field of appliance cleaning equipment, and more particularly to an ultrasonic cleaning device. Background Technology

[0002] Ultrasonic cleaners utilize high-frequency oscillation signals emitted by an ultrasonic generator to induce cavitation in liquids, producing powerful shock waves that peel away dirt layers. The advantages of ultrasonic cleaners are excellent cleaning results and ease of operation. When testing skincare products, the testing equipment needs to be cleaned to avoid interference from external factors.

[0003] In existing technologies, common ultrasonic cleaning devices for cleaning skincare product testing equipment mainly consist of a main body. The main body has a cleaning tank for holding water and placing the skincare products. An ultrasonic vibration module is installed inside the main body, and a control button is installed on the outer wall of the main body to control the start and stop of the ultrasonic vibration module. When the operator uses the ultrasonic cleaning device to clean the testing equipment, cleaning water is placed in the cleaning tank, and the testing equipment is placed inside. The ultrasonic vibration module is activated by pressing the start button, causing the water in the cleaning tank to vibrate at high frequency, thus rinsing the testing equipment and removing dirt from its surface, achieving the technical effect of cleaning the surface of the testing equipment.

[0004] However, most ultrasonic cleaning machines still require manual retrieval using other tools after cleaning, resulting in low work efficiency and room for improvement. Utility Model Content

[0005] To improve the convenience for operators in cleaning testing equipment using ultrasonic cleaning devices, this application provides an ultrasonic cleaning device.

[0006] The ultrasonic cleaning device provided in this application adopts the following technical solution:

[0007] An ultrasonic cleaning device mainly includes a body, on which a shelf is detachably mounted. The shelf has several water outlet holes for water flow. The shelf is placed in a cleaning tank within the body, and a connecting structure is provided between the shelf and the body.

[0008] A sensing unit is installed on the body and is used to output a high-level signal when the shelf is installed on the body;

[0009] The microcontroller has its signal input terminal connected to the signal output terminal of the sensing unit, and its signal output terminal connected to the ultrasonic vibration module inside the machine body. It is used to receive the high-level signal and control the operation of the ultrasonic vibration module.

[0010] By adopting the above technical solution, when operators need to use the ultrasonic cleaning device to clean the testing equipment, they can place the testing equipment in the rack and install the rack in the cleaning tank through the connecting structure. After the sensing unit detects that the rack is installed in the cleaning tank, it outputs a high-level signal. After the microcontroller recognizes the high-level signal, it controls the ultrasonic vibration module to operate, and the water in the rack enters through the water passage on the rack to clean the testing equipment. When cleaning is complete, the operator removes the rack from the cleaning tank, the sensing unit stops outputting the high-level signal, and the microcontroller controls the ultrasonic vibration module to stop operating. The rack design allows operators to easily retrieve the testing equipment after cleaning, eliminating the need to use tools to take it out again, thus significantly improving the ease of use of the ultrasonic cleaning device. When used with a sensing unit and microcontroller, the ultrasonic vibration module can be automatically activated after the operator places the rack and automatically deactivated after the operator removes the rack. This achieves automatic sensing and activation / deactivation of the ultrasonic cleaning device, further enhancing its usability.

[0011] Preferably, two positioning plates are fixedly installed on the shelf, and the bottom of each of the two positioning plates is fixedly connected to a plug;

[0012] The connection structure includes two sockets fixedly installed on the body, and each of the two sockets has a slot adapted to the plug.

[0013] By adopting the above technical solution, when it is necessary to use an ultrasonic cleaning device to clean the testing equipment, the operator can put the testing equipment to be cleaned into the shelf and insert the plug on the shelf into the two sockets on the machine body to install the shelf on the machine body.

[0014] Preferably, one of the sockets is fixedly mounted with a mounting base, the mounting base has a mounting hole, a cylindrical sensing block is slidably mounted in the mounting hole, the socket has a through hole coaxial with the mounting hole, the end of the sensing block extends into the through hole, and the end of the sensing block is dome-shaped, and the through hole is recessed at the port away from the mounting base.

[0015] A sensing plate is installed inside the mounting base, and a spring is fixedly connected between the sensing plate and the sensing block. The sensing unit includes a thin-film pressure sensor, which is fixedly installed on the side wall of the sensing plate. A sealing plate is fixedly installed on the mounting base, and the thin-film pressure sensor abuts against the sealing plate and the sensing plate.

[0016] The signal output terminal of the thin-film pressure sensor is connected to a comparator chip, and the signal output terminal of the comparator chip is connected to the signal input terminal of the microcontroller.

[0017] By adopting the above technical solution, when the operator inserts the two plugs on the shelf into the slots of the two sockets, the plugs can cause the sensing block to move towards the sensing block. During this process, the thin-film pressure sensor detects the contact pressure between the sensing plate and the sealing plate in real time. The spring is compressed, which increases the contact pressure between the sensing plate and the sealing plate. After comparison by the comparator chip, the comparator chip can output a high-level signal when the contact pressure reaches or exceeds the set value. The microcontroller recognizes the high-level signal and can determine that the plugs on the shelf are inserted into the socket slots. The microcontroller controls the ultrasonic vibration module to start. When the operator removes the shelf from the cleaning tank, the sensing block resets, and the contact pressure value measured by the thin-film pressure sensor is less than the set value. The comparator chip outputs a low-level signal, and the microcontroller recognizes the low-level signal and controls the ultrasonic vibration module to stop running. This can realize automatic sensing of the installation status of the shelf and automatic control of the ultrasonic vibration module to start or stop according to the installation status of the shelf.

[0018] Preferably, a first limiting post is fixedly installed on the sensing plate, and a second limiting post is fixedly installed on the sensing block. The first limiting post and the second limiting post are arranged opposite to each other, and the two ends of the spring are respectively sleeved on the outside of the first limiting post and the second limiting post.

[0019] By adopting the above technical solution, the first limiting post and the second limiting post can limit the deformation of the spring, reduce the occurrence of irreversible deformation of the spring, and extend the service life of the spring.

[0020] Preferably, the bottom corners of both inserts are rounded.

[0021] By adopting the above technical solution, the rounded corners at the bottom of the plug can reduce the occurrence of collisions between the plug and the corners of the socket during the installation of the shelf by the operator.

[0022] Preferably, a handle is fixedly installed on the shelf, and the two ends of the handle are respectively fixedly connected to the two positioning plates.

[0023] By adopting the above technical solution, the handle makes it easier for operators to pick up and place the shelf, which further improves the ease of use of the ultrasonic cleaning device.

[0024] In summary, the ultrasonic cleaning device of this application has at least the following beneficial technical effects:

[0025] 1. The rack design allows operators to easily retrieve the testing equipment after cleaning, eliminating the need to use tools to retrieve the equipment again, thus effectively improving the convenience of using the ultrasonic cleaning device.

[0026] 2. When the operator inserts the two insert blocks on the shelf into the slots of the two sockets, the insert blocks cause the sensing block to move towards the sensing block. During this process, the thin-film pressure sensor detects the contact pressure between the sensing plate and the sealing plate in real time. The spring is compressed, causing the contact pressure between the sensing plate and the sealing plate to increase. After comparison by the comparator chip, the comparator chip can output a high-level signal when the contact pressure reaches or exceeds the set value. The microcontroller recognizes the high-level signal and determines that the insert blocks on the shelf are inserted into the socket slots. The microcontroller controls the ultrasonic vibration module to start. When the operator removes the shelf from the cleaning tank, the sensing block resets, and the contact pressure value measured by the thin-film pressure sensor is less than the set value. The comparator chip outputs a low-level signal, and the microcontroller recognizes the low-level signal and controls the ultrasonic vibration module to stop running. This can realize automatic sensing of the installation status of the shelf and automatic control of the ultrasonic vibration module to start or stop according to the installation status of the shelf. Attached Figure Description

[0027] Figure 1 This is a schematic diagram illustrating the overall structure of the ultrasonic cleaning device in an embodiment of this application.

[0028] Figure 2 This is a schematic diagram illustrating the mounting structure of the sensing unit in an embodiment of this application.

[0029] Explanation of reference numerals in the attached drawings: 1. Body; 11. Cleaning tank; 12. Handle; 2. Shelf; 21. Water passage hole; 22. Positioning plate; 23. Insert block; 3. Socket; 31. Slot; 32. Through hole; 4. Mounting base; 41. Mounting hole; 42. Sensing block; 43. Sensing plate; 44. Spring; 45. First limit post; 46. Second limit post; 47. Sealing plate; 5. Thin-film pressure sensor. Detailed Implementation

[0030] The following is in conjunction with the appendix Figure 1-2 This application will be described in further detail.

[0031] Example

[0032] This application discloses an ultrasonic cleaning device. (Refer to...) Figure 1 and Figure 2It mainly includes a body 1, on which a shelf 2 is detachably installed. The shelf 2 has several water outlet holes 21 for water to flow out. The shelf 2 is installed in a cleaning tank 11 inside the body 1, and a connecting structure is provided between the shelf 2 and the body 1; and a sensing unit, which is installed on the body 1 and is used to output a high-level signal when the shelf 2 is installed on the body 1; and a microcontroller, whose signal input terminal is connected to the signal output terminal of the sensing unit, and whose signal output terminal is connected to the ultrasonic vibration module inside the body 1, for receiving high-level signals and controlling the operation of the ultrasonic vibration module.

[0033] When the operator needs to use the ultrasonic cleaning device to clean the testing equipment, the operator can place the testing equipment in the rack 2 and install the rack 2 in the cleaning tank 11 through the connecting structure. After the sensing unit detects that the rack 2 is installed in the cleaning tank 11, it outputs a high-level signal. After the microcontroller recognizes the high-level signal, it controls the ultrasonic vibration module to run, and the water in the rack 2 enters through the water hole 21 on the rack 2 to clean the testing equipment. When the cleaning is completed, the operator removes the rack 2 from the cleaning tank 11, the sensing unit stops outputting the high-level signal, and the microcontroller controls the ultrasonic vibration module to stop running.

[0034] The rack 2 allows operators to easily retrieve the testing equipment after cleaning, eliminating the need to use tools to remove it again, thus significantly improving the ease of use of the ultrasonic cleaning device. When used with a sensing unit and microcontroller, the ultrasonic vibration module can be automatically activated after the operator places the rack 2, and automatically deactivated after the operator removes the rack 2, achieving automatic sensing and activation or deactivation of the ultrasonic cleaning device, further enhancing the convenience of using the ultrasonic cleaning device.

[0035] Reference Figure 1 and Figure 2 Two positioning plates 22 are fixedly installed on the shelf 2, and the bottom of the two positioning plates 22 are respectively fixedly connected to the plug 23; the connection structure includes two sockets 3 fixedly installed on the body 1, and the two sockets 3 are respectively provided with slots 31 that are compatible with the plug 23.

[0036] When it is necessary to use an ultrasonic cleaning device to clean the testing equipment, the operator can place the testing equipment to be cleaned into the rack 2 and insert the plug 23 on the rack 2 into the two sockets 3 on the body 1 to install the rack 2 on the body 1.

[0037] Reference Figure 2One of the sockets 3 is fixedly installed with a mounting base 4. The mounting base 4 has a mounting hole 41. A cylindrical sensing block 42 is slidably installed in the mounting hole 41. The socket 3 has a through hole 32 coaxial with the mounting hole 41. The end of the sensing block 42 extends into the through hole 32, and the end of the sensing block 42 is dome-shaped. The through hole 32 is recessed at the port away from the mounting base 4.

[0038] A sensing plate 43 is installed inside the mounting base 4. A spring 44 is fixedly connected between the sensing plate 43 and the sensing block 42. The sensing unit includes a thin-film pressure sensor 5, which is fixedly installed on the side wall of the sensing plate 43. A sealing plate 47 is fixedly installed on the mounting base 4. The thin-film pressure sensor 5 is pressed against the sealing plate 47 and the sensing plate 43. The signal output terminal of the thin-film pressure sensor 5 is connected to a comparator chip, and the signal output terminal of the comparator chip is connected to the signal input terminal of the microcontroller.

[0039] When the operator inserts the two plugs 23 on the shelf 2 into the slots 31 of the two sockets 3, the plugs 23 cause the sensing block 42 to move towards the sensing block 42. During this process, the thin-film pressure sensor 5 detects the contact pressure between the sensing plate 43 and the sealing plate 47 in real time. The spring 44 is compressed, which increases the contact pressure between the sensing plate 43 and the sealing plate 47. After comparison by the comparator chip, the comparator chip can output a high-level signal when the contact pressure reaches or exceeds the set value. The microcontroller recognizes the high-level signal and determines that the plugs 23 on the shelf 2 are inserted into the slots 31 of the sockets 3. The microcontroller controls the ultrasonic vibration module to start. When the operator removes the shelf 2 from the cleaning tank 11, the sensing block 42 resets. The contact pressure value measured by the thin-film pressure sensor 5 is less than the set value. The comparator chip outputs a low-level signal. The microcontroller recognizes the low-level signal and controls the ultrasonic vibration module to stop running. This can realize automatic sensing of the installation status of the shelf 2 and automatic control of the ultrasonic vibration module to start or stop according to the installation status of the shelf 2.

[0040] Reference Figure 2 A first limiting post 45 is fixedly installed on the sensing plate 43, and a second limiting post 46 is fixedly installed on the sensing block 42. The first limiting post 45 and the second limiting post 46 are arranged opposite to each other, and the two ends of the spring 44 are respectively sleeved on the outside of the first limiting post 45 and the second limiting post 46.

[0041] The first limiting post 45 and the second limiting post 46 can limit the deformation of the spring 44, reduce the occurrence of irreversible deformation of the spring 44, and extend the service life of the spring 44.

[0042] It should be noted that in this embodiment, the bottom corners of both plugs 23 are rounded. The rounded bottom corners of the plugs 23 can reduce the possibility of collisions between the plugs 23 and the corners of the socket 3 during the installation of the shelf 2 by the operator.

[0043] Reference Figure 1 A handle 12 is fixedly installed on the shelf 2, and both ends of the handle 12 are fixedly connected to two positioning plates respectively. The handle makes it easy for operators to pick up and put down the shelf 2, which further improves the ease of use of the ultrasonic cleaning device.

[0044] The implementation principle of the ultrasonic cleaning device in this application embodiment is as follows: The rack 2 allows operators to easily retrieve the testing equipment after cleaning, eliminating the need to retrieve it again with tools, thus effectively improving the convenience of using the ultrasonic cleaning device. When the operator inserts the two inserts 23 on the rack 2 into the slots 31 of the two sockets 3, the inserts 23 cause the sensing block 42 to move towards the sensing block 42. During this process, the thin-film pressure sensor 5 detects the contact pressure between the sensing plate 43 and the sealing plate 47 in real time. The spring 44 is compressed, causing the contact pressure between the sensing plate 43 and the sealing plate 47 to increase. The comparator chip performs a comparison and outputs a high-level signal when the contact pressure reaches or exceeds the set value. The microcontroller recognizes the high-level signal and determines that the insert 23 on the shelf 2 is inserted into the slot 31 of the socket 3. The microcontroller then controls the ultrasonic vibration module to start. When the operator removes the shelf 2 from the cleaning tank 11, the sensing block 42 resets, and the contact pressure value measured by the thin-film pressure sensor 5 is less than the set value. The comparator chip outputs a low-level signal, and the microcontroller recognizes the low-level signal and controls the ultrasonic vibration module to stop running. This enables automatic sensing of the installation status of the shelf 2 and automatic control of the ultrasonic vibration module to start or stop based on the installation status of the shelf 2.

[0045] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. An ultrasonic cleaning apparatus, characterized by comprising: Includes a body (1), on which a shelf (2) is detachably mounted, the shelf (2) having several water outlet holes (21) for water supply, the shelf (2) being mounted in a cleaning tank (11) inside the body (1), and a connecting structure between the shelf (2) and the body (1); and: The sensing unit is installed on the body (1) and is used to output a high-level signal when the shelf (2) is installed on the body (1); The microcontroller has its signal input terminal connected to the signal output terminal of the sensing unit, and its signal output terminal connected to the ultrasonic vibration module inside the body (1). It is used to receive the high-level signal and control the operation of the ultrasonic vibration module.

2. The ultrasonic cleaning apparatus according to claim 1, wherein Two positioning plates (22) are fixedly installed on the shelf (2), and the bottom of the two positioning plates (22) are respectively fixedly connected to the inserts (23); The connection structure includes two sockets (3) fixedly installed on the body (1), and each of the two sockets (3) has a slot (31) adapted to the plug (23).

3. The ultrasonic cleaning apparatus of claim 2, wherein One of the sockets (3) is fixedly mounted with a mounting base (4), and a mounting hole (41) is provided in the mounting base (4). A cylindrical sensing block (42) is slidably mounted in the mounting hole (41). A through hole (32) coaxial with the mounting hole (41) is provided on the socket (3). The end of the sensing block (42) extends into the through hole (32), and the end of the sensing block (42) is dome-shaped. The through hole (32) is recessed at the port away from the mounting base (4). A sensing plate (43) is installed inside the mounting base (4). A spring (44) is fixedly connected between the sensing plate (43) and the sensing block (42). The sensing unit includes a thin film pressure sensor (5). The thin film pressure sensor (5) is fixedly installed on the side wall of the sensing plate (43). A sealing plate (47) is fixedly installed on the mounting base (4). The thin film pressure sensor (5) is pressed against the sealing plate (47) and the sensing plate (43). The signal output terminal of the thin-film pressure sensor (5) is connected to a comparator chip, and the signal output terminal of the comparator chip is connected to the signal input terminal of the microcontroller.

4. The ultrasonic cleaning apparatus of claim 3, wherein A first limiting post (45) is fixedly installed on the sensing plate (43), and a second limiting post (46) is fixedly installed on the sensing block (42). The first limiting post (45) and the second limiting post (46) are arranged opposite to each other, and the two ends of the spring (44) are respectively sleeved on the outside of the first limiting post (45) and the second limiting post (46).

5. The ultrasonic cleaning apparatus of claim 4, wherein The bottom corners of both inserts (23) are rounded.

6. An ultrasonic cleaning apparatus according to claim 5, wherein A handle (12) is fixedly installed on the shelf (2), and the two ends of the handle (12) are respectively fixedly connected to the two positioning plates.

Images