Novel semiconductor electrostatic chuck

By designing a motor-driven cleaning component and a combination of dry and wet cloths on the electrostatic chuck, the problem of inconsistent surface cleaning of the electrostatic chuck is solved, ensuring the normal operation and extended service life of the electrostatic chuck.

CN224129523UActive Publication Date: 2026-04-17WUXI HUCHUANGXIN MICRO SEMICON TECH CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
WUXI HUCHUANGXIN MICRO SEMICON TECH CO LTD
Filing Date
2024-12-19
Publication Date
2026-04-17

AI Technical Summary

Technical Problem

The surface cleaning of existing electrostatic chucks is difficult to ensure consistently, which affects their normal operation and service life.

Method used

A novel semiconductor electrostatic chuck has been designed, equipped with a motor-driven shaft and cleaning components, including a dry cloth and a wet cloth. The surface of the electrostatic chuck is automatically cleaned by the forward and reverse rotation of the motor, ensuring consistent cleanliness.

Benefits of technology

It achieves consistent drying and cleaning of the electrostatic chuck surface, maintains adsorption performance, extends service life, and improves work efficiency.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224129523U_ABST
    Figure CN224129523U_ABST
Patent Text Reader

Abstract

The utility model relates to a novel semiconductor electrostatic chuck which comprises an electrostatic chuck body, a first cleaning assembly and a rectangular-ambulatory-plane frame, and a supporting block is connected between the rectangular-ambulatory-plane frame and the electrostatic chuck body. A motor is mounted on the concentric-square-shaped frame, a rotating shaft is arranged at the output end of the motor, the rotating shaft extends out of a first cleaning assembly of the concentric-square-shaped frame, and the first cleaning assembly is driven by the motor forwards and backwards to clean the surface of the electrostatic chuck body, so that the cleanliness of surface cleaning is consistent; the electrostatic chuck is driven to rotate through positive and negative operation of the motor, so that the first supporting plate swings, the dry cloth swings, the surface of the electrostatic chuck body is cleaned, and the consistent cleaning standard can be achieved in each time of cleaning.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This utility model belongs to the field of electrostatic chuck technology and relates to a novel semiconductor electrostatic chuck. Background Technology

[0002] An electrostatic chuck is a general term for an ultra-clean sheet carrier and gripping and handling device suitable for atmospheric or vacuum environments. When using an electrostatic chuck, the surface of the chuck must be kept dry and clean to ensure proper distribution of static charge. Current technology requires users to clean the surface of the electrostatic chuck with a cloth, making it difficult to guarantee a completely consistent cleanliness standard each time. Utility Model Content

[0003] The purpose of this invention is to provide a novel semiconductor electrostatic chuck that can solve the problems mentioned in the background art.

[0004] According to the technical solution provided by this utility model: a novel semiconductor electrostatic chuck includes an electrostatic chuck body, a first cleaning component, and a U-shaped frame. A support block is connected between the U-shaped frame and the electrostatic chuck body. A motor is installed on the U-shaped frame, and a rotating shaft is provided at the output end of the motor. The rotating shaft extends out of the first cleaning component of the U-shaped frame. Under the forward and reverse drive of the motor, the first cleaning component can clean the surface of the electrostatic chuck body, so that the cleanliness of the surface is consistent.

[0005] Preferably, the first cleaning component includes a first support plate, a first groove, a dry cloth, and a first bolt; the first support plate is provided on the U-shaped frame, the first support plate is connected to the extension end of the rotating shaft, the first groove is provided on the first support plate, and the dry cloth is provided between the first support plate and the U-shaped frame; the two ends of the dry cloth are bent to form a U-shape; one end of the dry cloth extends out of the first groove, and the two ends are respectively connected to the first support plate by the first bolt.

[0006] Preferably, the first support plate is provided with a second cleaning component via a connecting plate.

[0007] Preferably, the second cleaning component includes a second support plate, a second slot, a wet cloth, and a second bolt; the second support plate is provided on the U-shaped frame, the second slot is provided on the second support plate, and the wet cloth is provided between the second support plate and the U-shaped frame; the two ends of the wet cloth are bent to form a U-shape; one end of the wet cloth extends out of the second slot, and the two ends are respectively connected to the second support plate by the second bolt.

[0008] Preferably, there is a distance between the second support plate and the loop frame.

[0009] Preferably, the connecting plate is provided with two third bolts, one of which is screwed to the first support plate and the other is screwed to the second support plate.

[0010] This utility model provides a novel semiconductor electrostatic chuck, which has the following advantages:

[0011] 1. The forward and reverse operation of the motor drives the rotation, which in turn causes the first support plate to swing, and the dry cloth to swing, cleaning the surface of the electrostatic chuck body. This ensures that each cleaning achieves a consistent cleaning standard. The dry cloth cleaning of the electrostatic chuck body surface ensures dryness and cleanliness, ensuring its normal operation. It also removes surface contaminants, keeps the chuck's adsorption performance at its best, helps extend the service life of the electrostatic chuck body, and improves its working efficiency. Attached Figure Description

[0012] Figure 1 This is a perspective view of the present invention.

[0013] Figure 2 This is a screenshot of the present invention.

[0014] In the figure: 1. Electrostatic chuck body; 2. Support block; 21. U-shaped frame; 3. First support plate; 31. First groove; 32. Dry cloth; 33. First bolt; 4. Motor; 41. Rotating shaft; 5. Second support plate; 51. Second slot; 52. Wet cloth; 53. Second bolt; 6. Connecting plate; 61. Detailed Implementation

[0015] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0016] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0017] like Figure 1-2As shown, this utility model is a novel semiconductor electrostatic chuck, including an electrostatic chuck body 1, a first cleaning component, and a loop frame 21. A support block 2 is connected between the loop frame 21 and the electrostatic chuck body 1. A motor 4 is installed on the loop frame 21, and a rotating shaft 41 is provided at the output end of the motor 4. The rotating shaft 41 extends out of the loop frame 21 to form the first cleaning component. Under the forward and reverse drive of the motor 4, the first cleaning component cleans the surface of the electrostatic chuck body 1, so that the cleanliness of the surface is consistent.

[0018] Preferably, the first cleaning component includes a first support plate 3, a first groove 31, a dry cloth 32, and a first bolt 33; the first support plate 3 is provided on the U-shaped frame 21, the first support plate 3 is connected to the extension end of the rotating shaft 41, the first support plate 3 has a first groove 31, and the dry cloth 32 is provided between the first support plate 3 and the U-shaped frame 21; the two ends of the dry cloth 32 are bent to form a U-shape, so as to fix the dry cloth 32 to the first support plate 3; one end of the dry cloth 32 extends out of the first groove 31, and the two ends are respectively connected to the first support plate 3 by the first bolt 33, and the dry cloth 32 can be replaced by rotating the first bolt 33.

[0019] The forward and reverse operation of motor 4 drives 41 to rotate, which in turn causes the first support plate 3 to swing, and the dry cloth 32 to swing, cleaning the surface of the electrostatic suction cup body 1. This ensures that each cleaning achieves a consistent cleaning standard. The dry cloth 32 cleans the surface of the electrostatic suction cup body 1, keeping it dry and clean, ensuring its normal operation. It also removes surface contaminants, keeps the suction cup's adsorption performance at its best, and helps extend the service life of the electrostatic suction cup body 1 and improve its working efficiency.

[0020] In this embodiment, a second cleaning component is provided via a first support plate 3 and a connecting plate 6.

[0021] The connecting plate 6 is provided with two third bolts 61 and has two through holes. One third bolt 61 is screwed to the first support plate 3, and the other third bolt 61 is screwed to the second support plate 5. When the surface of the electrostatic suction cup body 1 needs to be cleaned with a wet cloth 52, first, the two third bolts are passed through the through holes on the connecting plate 6, and then the third bolts are screwed to the first support plate 3 and the second support plate 5 in sequence. This forms a whole with the first support plate 3. Driven by the motor 4, the second support plate 5 and the first support plate 3 swing synchronously, thereby causing the wet cloth 52 to swing and clean the surface of the electrostatic suction cup body 1. This helps to dissolve and disperse stains and improves cleaning efficiency. At the same time, the electrostatic suction cup body 1 is prone to accumulating static electricity during operation, and the moisture in the wet cloth 52 can conduct electricity, which helps to neutralize and dissipate this static electricity. After the wet cloth 52 is cleaned, the surface of the electrostatic suction cup body 1 is wiped with a dry cloth 32 to ensure that the surface is dry.

[0022] There is a distance between the second support plate 5 and the loop frame 21; so as to accommodate the rotation of the second support plate 5.

[0023] The second cleaning assembly includes a second support plate 5, a second slot 51, a wet cloth 52, and a second bolt 53. The second support plate 5 is provided on the U-shaped frame 21, and the second slot 51 is provided on the second support plate 5. The wet cloth 52 is provided between the second support plate 5 and the U-shaped frame 21. The two ends of the wet cloth 52 are bent to form a U-shape so as to fix the wet cloth 52 to the second support plate 5. One end of the wet cloth 52 extends out of the second slot 51, and the two ends are respectively connected to the second support plate 5 by the second bolt 53. By rotating the second bolt 53, the wet cloth 52 can be replaced.

[0024] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of this utility model, and the utility model is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of this utility model, and these modifications and improvements are also considered to be within the protection scope of this utility model.

Claims

1. A novel semiconductor electrostatic chuck, characterized by, The device includes an electrostatic chuck body (1) and a U-shaped frame (21). A support block (2) is connected between the U-shaped frame (21) and the electrostatic chuck body (1). A motor (4) is installed on the U-shaped frame (21). The output end of the motor (4) is provided with a rotating shaft (41). The rotating shaft (41) extends out of the U-shaped frame (21) and is provided with a first cleaning component. The first cleaning component is driven by the motor (4) in both forward and reverse directions to achieve surface cleaning of the electrostatic chuck body (1) so that the surface cleaning cleanliness is consistent.

2. A novel semiconductor electrostatic chuck as claimed in claim 1, wherein: The first cleaning component includes a first support plate (3), a first groove (31), a dry cloth (32), and a first bolt (33); the first support plate (3) is provided on the U-shaped frame (21), the first support plate (3) is connected to the extension end of the rotating shaft (41), the first groove (31) is provided on the first support plate (3), and the dry cloth (32) is provided between the first support plate (3) and the U-shaped frame (21); the two ends of the dry cloth (32) are bent to form a U-shape; one end of the dry cloth (32) extends out of the first groove (31), and the two ends are respectively connected to the first support plate (3) by the first bolt (33).

3. The novel semiconductor electrostatic chuck as described in claim 2, characterized in that: The first support plate (3) is provided with a second cleaning component via a connecting plate (6).

4. A novel semiconductor electrostatic chuck as claimed in claim 3, wherein: The second cleaning component includes a second support plate (5), a second slot (51), a wet cloth (52), and a second bolt (53); the second support plate (5) is provided on the U-shaped frame (21), the second slot (51) is provided on the second support plate (5), and the wet cloth (52) is provided between the second support plate (5) and the U-shaped frame (21); the two ends of the wet cloth (52) are bent to form a U-shape; one end of the wet cloth (52) extends out of the second slot (51), and the two ends are respectively connected to the second support plate (5) by the second bolt (53).

5. A novel semiconductor electrostatic chuck as claimed in claim 4, wherein: There is a distance between the second support plate (5) and the loop frame (21).

6. A novel semiconductor electrostatic chuck as described in claim 3, wherein: The connecting plate (6) is provided with two third bolts (61), one of which is screwed to the first support plate (3), and the other is screwed to the second support plate (5).