Ultrathin wafer carrying clean box

Abstract

The utility model discloses an ultrathin wafer carrying clean box which comprises an upper shell, a wafer basket and a lower shell, the upper shell and the lower shell are detachably connected, and the wafer basket is arranged between the upper shell and the lower shell and used for placing wafers. The upper shell is provided with a first support and a separation sheet, and the separation sheet bump is used for separating the wafer; the lower shell is provided with a corresponding second support, and wafer grooves are arranged in the lower shell and the second support. The bottom of the wafer flower basket groove is designed to be arc-shaped and is used for placing wafers with the diameter smaller than 300 micrometers. According to the carrying clean box, wafer pouring stress is reduced through the arc design of the groove bottom of the middle frame, and the sheet fragmentation risk is reduced; the upper cover separation sheet structure separates the poured wafer and ensures that the wafer is centered during introduction, and the bearing structure wraps the wafer in a high-elasticity manner after introduction; the lower portion of the wafer is guided into the center through the middle frame, and the lower shell bearing structure wraps and prepresses for protection. And the packaging, protecting and transporting problems of material sheets with the thickness being 300 microns or below can be effectively solved, and the practical value is remarkable.

Description

Technical Field

[0001] This utility model belongs to the field of wafer clean boxes, and particularly relates to an ultra-thin wafer transport clean box. Background Technology

[0002] In semiconductor manufacturing and related fields, the packaging, protection, and transportation of materials thinner than 300µm (such as common wafers) has always been a challenge. Traditional carrier boxes have numerous design shortcomings, making it difficult to meet the special needs of these ultra-thin wafers. On the one hand, the bottom of ordinary carrier boxes is usually flat, and when the wafer is poured in, it is subjected to a large impact force, making the thin wafers extremely prone to fragmentation, seriously affecting product quality and production efficiency. On the other hand, during the wafer loading process, the lack of effective separation and centering protection structures causes the wafers to easily shift and fail to be accurately placed in the intended position, affecting not only the compactness of the packaging but also potentially causing damage due to collisions during transportation. Moreover, existing carrier boxes do not provide adequate protection for the bottom of the wafer, failing to provide stable pre-pressure protection during transportation, increasing the risk of wafer damage. These problems limit the smooth operation of ultra-thin wafers in production and transportation, urgently requiring a new type of clean carrier box to solve the problem. Utility Model Content

[0003] The purpose of this utility model is to provide an ultra-thin wafer transport cleanroom box, aiming to solve the problems existing in the background art. To achieve this purpose, the technical solution adopted by this utility model is:

[0004] An ultra-thin wafer transport clean box includes an upper shell, a wafer basket, and a lower shell. The upper shell and the lower shell are detachably connected. The wafer basket is disposed between the upper shell and the lower shell and is used to place wafers. The upper shell includes an upper shell body. The top interior of the upper shell body has two vertical rows of first supports. The interior of the first supports has multiple partitions. The front and rear sides of the partitions are provided with integrally formed protrusions for separating two wafers at a time.

[0005] Preferably, the lower shell includes a lower shell body, and the interior of the lower shell body is provided with a second support corresponding to the first support.

[0006] Preferably, the first support and the second support are provided with wafer slots inside.

[0007] Preferably, the wafer basket is used to place wafers smaller than 300µm.

[0008] Preferably, the bottom of the wafer basket groove is designed with a rounded arc.

[0009] The beneficial effects of this utility model are:

[0010] Reduced fragmentation risk: The bottom of the groove in the middle frame of this ultra-thin wafer transport clean box features a rounded design, which greatly reduces the impact force on the wafer during placement. In actual operation, when the wafer is placed into the transport box, the rounded bottom can distribute the force and avoid stress concentration, thereby effectively reducing the risk of wafer fragmentation and improving product yield.

[0011] Precise positioning and protection: The separator structure on the top cover separates the poured wafer before the pre-pressurized support contacts, ensuring the wafer is centered during insertion. After insertion, the support structure, with its high elasticity, better wraps the wafer, providing stable protection and preventing displacement and collisions during transportation.

[0012] All-round protection: The lower part of the wafer is guided and centered through the middle frame, while the supporting structure of the lower shell wraps and pre-compresses the wafer for protection, providing stable support and protection for the wafer from all directions, further improving the safety of the wafer during transportation.

[0013] Wide range of applications: Through the above-mentioned optimized design, this cleanroom transport box can well meet the packaging and protection transportation needs of materials with a thickness of less than 300um (such as common wafers), and has a wide range of application prospects, providing a reliable packaging and transportation solution for semiconductor manufacturing and related industries. Attached Figure Description

[0014] Figure 1 This is an overall schematic diagram of an embodiment of the present utility model;

[0015] Figure 2 This is a schematic diagram of the exploded structure provided for an embodiment of the present utility model;

[0016] Figure 3 A schematic diagram of the upper shell structure provided for an embodiment of this utility model;

[0017] Figure 4 This is a schematic diagram of the lower shell structure of an embodiment of the present utility model.

[0018] The following are the labeling elements in the figure:

[0019] 1. Upper shell; 11. Upper shell body; 12. First support; 13. Separator; 14. Bump; 2. Wafer basket; 3. Lower shell; 31. Lower shell body; 32. Second support; 4. Wafer slot. Detailed Implementation

[0020] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. The drawings illustrate preferred embodiments of this utility model. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this utility model.

[0021] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intermediate element present. Conversely, when an element is referred to as being "directly on" another element, there is no intermediate element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementations. The terms "upper end," "lower end," "left side," "right side," "front end," "rear end," and similar expressions used herein refer to the positional relationship with reference to the accompanying drawings.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0023] The technical solution of this patent will be further described in detail below with reference to specific embodiments.

[0024] like Figures 1-4 As shown, this utility model embodiment provides an ultra-thin wafer transport clean box, including an upper shell 1, a wafer basket 2, and a lower shell 3. The upper shell 1 and the lower shell 3 are detachably connected. The wafer basket 2 is disposed between the upper shell 1 and the lower shell 3. The wafer basket 2 is used to place wafers. The upper shell 1 includes an upper shell body 11. The top interior of the upper shell body 11 is provided with two vertical rows of first supports 12. The interior of the first supports 12 is provided with multiple partitions 13. The front and rear sides of the partitions 13 are provided with integrally formed protrusions 14. The protrusions 14 are used to separate two wafers.

[0025] In this embodiment, the lower shell 3 includes a lower shell body 31, and the interior of the lower shell body 31 is provided with a second support 32 corresponding to the first support 12.

[0026] In the embodiment, wafer slots 4 are provided inside the first support 12 and the second support 32.

[0027] In this embodiment, the wafer basket 2 is used to place wafers smaller than 300µm.

[0028] In this embodiment, the bottom of the wafer basket 2 slot is designed with an arc.

[0029] The above embodiments are only used to illustrate the present utility model and are not intended to limit the present utility model. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present utility model. Therefore, all equivalent technical solutions also fall within the scope of the present utility model. The patent protection scope of the present utility model should be defined by the claims.

Claims

1. A clean box for transporting ultrathin wafers, characterized in that: The device includes an upper shell, a wafer basket, and a lower shell. The upper shell and the lower shell are detachably connected. The wafer basket is disposed between the upper shell and the lower shell and is used to place wafers. The upper shell includes an upper shell body. The top interior of the upper shell body has two vertical rows of first supports. The interior of the first supports has multiple partitions. The front and rear sides of the partitions are provided with integrally formed protrusions. The protrusions are used to separate two wafers at a time.

2. The ultra-thin wafer carrier clean box according to claim 1, wherein: The lower shell includes a lower shell body, and the interior of the lower shell body is provided with a second support corresponding to the first support.

3. The ultra-thin wafer carrier clean box according to claim 2, wherein: The first support and the second support are provided with wafer slots inside.

4. The ultra-thin wafer carrier clean box according to claim 3, wherein: The wafer basket is used to place wafers smaller than 300µm.

5. The ultra-thin wafer carrier clean box according to claim 4, wherein: The bottom of the wafer basket groove is designed with an arc.

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