Circuit board galvanization equipment with uniform galvanization layer

Abstract

The utility model discloses circuit board galvanization equipment with a uniform galvanization layer, which comprises a galvanization equipment main body and further comprises a top seat, the top seat is arranged at the top end in the galvanization equipment main body, a screw rod is arranged at the central position in the top seat, a driving block is sleeved on the screw rod, and a movable plate is arranged at the bottom end of the driving block; the first driving motor is arranged at one end of the top seat; the circuit board main body is arranged below the movable plate, and two sides of the bottom of the movable plate are respectively connected with the circuit board main body through clamps; and the spraying pipes are arranged on the two sides of the interior of the galvanizing equipment body, and sprayers are evenly distributed on the sides, close to the circuit board body, of the spraying pipes. According to the utility model, the galvanizing equipment main body, the circuit board main body, the top seat, the screw rod, the driving block, the first driving motor, the clamp, the spraying pipe and the spraying head are arranged, so that a uniform electroplated layer can be formed.

Description

Technical Field

[0001] This utility model relates to the technical field of circuit board galvanizing equipment, specifically to a circuit board galvanizing equipment with a uniform zinc coating. Background Technology

[0002] A circuit board is an electronic component consisting of an insulating substrate, conductive patterns, and holes. It is an indispensable basic component in the field of electronic technology. Due to the complex and diverse working environment of circuit boards, galvanizing the circuit board can form a protective barrier on its surface, effectively resisting the corrosion of moisture, acids, alkalis, and other corrosive substances, extending the service life of the circuit board, and ensuring the stability and reliability of electronic equipment.

[0003] When galvanizing a typical circuit board, it is necessary to clamp the circuit board and immerse it in the electroplating solution. Due to the complex shape of the circuit board, the electric field distribution may be uneven. Moreover, after electroplating, the circuit board needs to be removed vertically from the electroplating solution. When removing the circuit board, the electroplating solution will flow downwards, which can easily cause uneven distribution of the electroplating solution on the circuit board. Utility Model Content

[0004] The purpose of this invention is to provide a circuit board galvanizing equipment with a uniform zinc coating, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a galvanizing equipment for circuit boards with a uniform zinc coating, comprising: a galvanizing equipment body, characterized in that it further comprises...

[0006] The top seat is located at the top of the body of the galvanizing equipment, and a lead screw is provided at the center of the top seat. A drive block is sleeved on the lead screw, and a movable plate is provided at the bottom of the drive block.

[0007] A first drive motor is disposed at one end of the top seat, and the output end of the first drive motor is connected to the lead screw;

[0008] The circuit board body is located below the movable plate, and the two sides of the bottom of the movable plate are respectively connected to the circuit board body by clamps.

[0009] Spray pipes are installed on both sides inside the main body of the galvanizing equipment, and spray nozzles are evenly distributed on the side of the spray pipes closest to the main body of the circuit board.

[0010] Preferably, a collection tank is provided at the bottom of the main body of the galvanizing equipment, and a filter screen is provided at the top of the collection tank. Two sets of pumps are provided at the bottom of the collection tank, and the output ends of the pumps are connected to the spray pipes through liquid guide pipes.

[0011] Preferably, the galvanizing equipment has supports on both sides inside the main body, and each support has a rotating shaft on the side near the spray pipe. The rotating shaft is connected to the spray pipe via a connector on the side near the spray pipe.

[0012] Preferably, both ends of the rotating shaft are fitted with swinging components, and the swinging components on one side of the rotating shaft are connected by a fixed shaft. A movable sleeve is fitted on the fixed shaft, and a fixed rod is provided at one end of each movable sleeve.

[0013] Preferably, a second drive motor is fixed on both sides of the galvanizing equipment body, and the output end of the second drive motor is provided with a transmission component through a roller, one end of which is sleeved with a fixed rod.

[0014] Preferably, a buffer pad is provided on the side of the fixture closest to the circuit board body, and the buffer pad is made of rubber.

[0015] Preferably, a screw passes through one side of each clamp, and a pressure block is provided at the end of each screw near the circuit board body.

[0016] Compared with the prior art, the beneficial effects of this utility model are as follows: This circuit board galvanizing equipment with uniform galvanized layer consists of a galvanizing equipment body, a circuit board body, a top seat, a lead screw, a drive block, a first drive motor, a movable plate, a clamp, spray pipes, and nozzles. The top of the circuit board body to be galvanized is inserted into the clamp and fixed below the movable plate by the clamp. Then, the first drive motor drives the lead screw to rotate, causing the drive block to move along the lead screw, thereby driving the circuit board body to pass through the space between two sets of spray pipes at a relatively stable speed. The nozzles on the spray pipes spray electroplating onto both sides of the circuit board body. This stable movement method avoids inconsistent amounts of plating solution received in certain areas due to sudden changes in the speed of the circuit board. During the electroplating process, the nozzle continuously and evenly supplies plating solution to the surface of the circuit board. The spraying force can, to some extent, counteract the influence of gravity on the plating solution, reducing unevenness caused by the natural flow of plating solution. At the same time, continuous spraying can replenish the consumed zinc ions in a timely manner, avoiding uneven zinc plating caused by local differences in ion concentration. This ensures that zinc ions are evenly deposited on the entire surface of the circuit board, which helps to form a uniform electroplating layer. Attached Figure Description

[0017] Figure 1 This is a front view structural diagram of the present utility model;

[0018] Figure 2 This is a top view of the support structure of this utility model;

[0019] Figure 3 This is a front view schematic diagram of the bracket structure of this utility model;

[0020] Figure 4 This is a side sectional view of the top seat structure of this utility model;

[0021] Figure 5 For the present utility model Figure 1 Enlarged structural diagram at point A in the middle.

[0022] In the diagram: 1. Main body of galvanizing equipment; 2. Main body of circuit board; 3. Top seat; 4. Spray pipe; 5. Collection tank; 6. Filter screen; 7. Pump body; 8. Support; 9. Second drive motor; 10. Liquid guide pipe; 11. Swinging component; 12. Transmission component; 13. Fixed shaft; 14. Rotating shaft; 15. Movable sleeve; 16. Fixed rod; 17. Nozzle; 18. Lead screw; 19. Drive block; 20. Movable plate; 21. Clamp; 22. First drive motor; 23. Screw; 24. Pressure block; 25. Buffer pad. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0024] Please see Figure 1-5 The present invention provides an embodiment of a circuit board galvanizing equipment for producing a uniform zinc coating, comprising: a galvanizing equipment body 1, and further comprising...

[0025] Top seat 3 is located at the top of the body 1 of the galvanizing equipment, and a lead screw 18 is provided at the center of the top seat 3. A drive block 19 is sleeved on the lead screw 18, and a movable plate 20 is provided at the bottom of the drive block 19.

[0026] The circuit board body 2 is located below the movable plate 20, and the two sides of the bottom of the movable plate 20 are connected to the circuit board body 2 via clamps 21.

[0027] The clamp 21 has a buffer pad 25 on the side of the circuit board body 2 inside, and the buffer pad 25 is made of rubber.

[0028] One side of the clamp 21 is through which screws 23 pass, and each end of the screw 23 near the circuit board body 2 is provided with a pressure block 24;

[0029] The top of the circuit board body 2 to be galvanized is inserted into the clamps 21 on both sides below the movable plate 20. The screw 23 is rotated to make the pressure block 24 press the circuit board body 2 tightly. The buffer pad 25 is used to fix the circuit board body 2 to ensure its stable position during the galvanizing process.

[0030] A collection tank 5 is provided at the bottom of the main body 1 of the galvanizing equipment. Sufficient electroplating solution is added to the collection tank 5. Two sets of pump bodies 7 are provided at the bottom of the collection tank 5, and the output ends of the pump bodies 7 are connected to the spray pipe 4 through the liquid guide pipe 10 respectively.

[0031] The first drive motor 22 is located at one end of the top seat 3, and the output end of the first drive motor 22 is connected to the lead screw 18.

[0032] Spray pipe 4 is located on both sides inside the main body 1 of the galvanizing equipment, and spray nozzles 17 are evenly distributed on the side of the spray pipe 4 closest to the main body 2 of the circuit board.

[0033] Start the first drive motor 22, and the lead screw 18 rotates to drive the drive block 19, the movable plate 20 and the circuit board body 2 to move smoothly, so that the circuit board body 2 passes through the two sets of spray pipes 4 at a stable speed.

[0034] The nozzle 17 continuously sprays electroplating solution onto both sides of the circuit board body 2 to perform zinc plating. This ensures that the time and conditions for each part of the circuit board body 2 to receive the electroplating solution are consistent. The spraying force can, to some extent, counteract the influence of gravity on the plating solution, reducing the unevenness caused by the natural flow of the plating solution. At the same time, continuous spraying can replenish the consumed zinc ions in a timely manner, avoiding uneven zinc plating caused by local ion concentration differences. This allows zinc ions to be uniformly deposited on the entire surface of the circuit board body 2, which helps to form a uniform electroplating layer.

[0035] Both sides of the main body 1 of the galvanizing equipment are equipped with brackets 8, and the side of the bracket 8 closest to the spray pipe 4 is equipped with a rotating shaft 14. The side of the rotating shaft 14 closest to the spray pipe 4 is connected to the spray pipe 4 through a connector.

[0036] Both ends of the rotating shaft 14 are fitted with swinging parts 11, and a fixed shaft 13 is connected between the swinging parts 11 on one side of the rotating shaft 14. A movable sleeve 15 is fitted on the fixed shaft 13, and a fixed rod 16 is provided at one end of each movable sleeve 15.

[0037] The main body 1 of the galvanizing equipment is fixed with a second drive motor 9 on both sides, and the output end of the second drive motor 9 is provided with a transmission component 12 through a roller. One end of the transmission component 12 is sleeved with the fixed rod 16.

[0038] After the second drive motor 9 starts, it drives the transmission component 12 to rotate through the roller. The rotation of the transmission component 12 will push the movable sleeve 15 to slide back and forth on the fixed shaft 13.

[0039] The reciprocating sliding of the movable sleeve 15 causes the swinging component 11 to swing up and down inside the bracket 8. The swinging component 11 is fixedly connected to the rotating shaft 14. Therefore, the movement of the swinging component 11 will be directly converted into the reciprocating rotation of the rotating shaft 14, which in turn drives the spray pipe 4 to swing around its axis, thereby changing the tilt angle of the nozzle 17 fixed on the spray pipe 4, so that the electroplating liquid can be covered at multiple angles and reduce dead corners.

[0040] Furthermore, a filter screen 6 is installed at the top of the collection tank 5. Excess electroplating solution enters the collection tank 5, is filtered by the filter screen 6, and then re-enters the spray pipe 4, thus realizing the recycling of the electroplating solution.

[0041] The specific models and specifications of the first drive motor 22, the second drive motor 9, and the pump body 7 need to be determined based on the specifications and parameters of the device. The selection and calculation method is existing technology, so it will not be described in detail here.

[0042] Working Principle: In this embodiment, sufficient electroplating solution is added to the collection tank 5. Then, the top of the circuit board body 2 to be galvanized is inserted into the clamps 21 on both sides below the movable plate 20. The screw 23 is rotated to press the pressure block 24 against the circuit board body 2. The buffer pad 25 is used to fix the circuit board body 2, ensuring its stable position during the galvanizing process. The first drive motor 22 is started, and the lead screw 18 rotates, driving the drive block 19, movable plate 20, and circuit board body 2 to move smoothly. This allows the circuit board body 2 to pass between the two sets of spray pipes 4 at a stable speed. The nozzles 17 continuously spray electroplating solution onto both sides of the circuit board body 2 for galvanizing. This ensures that the time and conditions for each part of the circuit board body 2 to receive the electroplating solution are consistent, and the spraying force can, to a certain extent, counteract the influence of gravity on the plating solution, reducing... The unevenness caused by the natural flow of less plating solution is mitigated by continuous spraying, which replenishes the consumed zinc ions in a timely manner and avoids uneven zinc plating caused by local ion concentration differences. This ensures that zinc ions are evenly deposited on the entire surface of the circuit board body 2, which helps to form a uniform electroplating layer. At the same time, during spraying, the second drive motor 9 starts and drives the transmission component 12 to rotate via the roller. When the transmission component 12 rotates, it causes the movable sleeve 15 to slide back and forth on the fixed shaft 13, which in turn causes the swinging component 11 at both ends of the fixed shaft 13 to swing inside the bracket 8. This causes the rotating shaft 14 to rotate back and forth, thereby driving the spray pipe 4 to swing and adjust the tilt angle of the nozzle 17 to expand the spray coverage area. Excess electroplating solution enters the collection tank 5, is filtered by the filter screen 6, and then re-enters the spray pipe 4, realizing the recycling of electroplating solution.

[0043] Obviously, the embodiments described above are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.

[0044] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0045] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in sequences other than those illustrated or described herein.

[0046] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A galvanization apparatus for a circuit board having a uniform zinc layer, comprising: The main body of the galvanizing equipment (1) is characterized in that it further includes... Top seat (3), the top seat (3) is located at the top of the body (1) of the galvanizing equipment, and a screw rod (18) is provided at the center of the top seat (3), a drive block (19) is sleeved on the screw rod (18), and a movable plate (20) is provided at the bottom of the drive block (19). The first drive motor (22) is located at one end of the top seat (3), and the output end of the first drive motor (22) is connected to the lead screw (18); The circuit board body (2) is located below the movable plate (20), and the two sides of the bottom of the movable plate (20) are connected to the circuit board body (2) by clamps (21); Spray pipe (4) is located on both sides inside the galvanizing equipment body (1), and spray nozzles (17) are evenly distributed on the side of the spray pipe (4) near the circuit board body (2).

2. The galvanization equipment for a circuit board according to claim 1, wherein: The bottom of the galvanizing equipment body (1) is provided with a collection tank (5), and the top of the collection tank (5) is provided with a filter screen (6). The bottom of the collection tank (5) is provided with two sets of pump bodies (7), and the output ends of the pump bodies (7) are connected to the spray pipe (4) through the liquid guide pipe (10).

3. The galvanizing equipment for a circuit board according to claim 1, wherein: The main body (1) of the galvanizing equipment is equipped with brackets (8) on both sides, and the brackets (8) are equipped with rotating shafts (14) on the side of the side near the spray pipe (4). The rotating shafts (14) are connected to the spray pipe (4) on the side near the spray pipe (4) through connectors.

4. The galvanizing layer uniform line board galvanizing equipment according to claim 3, characterized in that: Both ends of the rotating shaft (14) are fitted with swinging parts (11), and a fixed shaft (13) is connected between the swinging parts (11) on one side of the rotating shaft (14). A movable sleeve (15) is fitted on the fixed shaft (13), and a fixed rod (16) is provided at one end of the movable sleeve (15).

5. The apparatus for galvanizing a circuit board according to claim 4, wherein: The galvanizing equipment body (1) is fixed with a second drive motor (9) on both sides, and the output end of the second drive motor (9) is provided with a transmission component (12) through a roller. One end of the transmission component (12) is sleeved with a fixed rod (16).

6. The galvanization layer uniform line board galvanization equipment according to claim 1, characterized in that: The clamp (21) has a buffer pad (25) on the side of the circuit board body (2) inside, and the buffer pad (25) is made of rubber.

7. The apparatus for galvanizing a circuit board according to claim 1, wherein: Each of the clamps (21) has a screw (23) passing through one side, and each of the screws (23) has a pressure block (24) at the end near the circuit board body (2).

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