Chip test pin cleaning device

Abstract

The utility model relates to the technical field of chip production, and discloses a chip test pin cleaning device which comprises a working panel and supporting legs fixedly installed at the lower end of the working panel, a connecting plate is fixedly installed at the upper end of the working panel, when a chip is detected, the chip to be detected can be firstly placed on a fixing plate, and then the supporting legs are fixedly installed on the working panel. Then an electric push rod is started, a movable rod at the telescopic end of the electric push rod extends downwards when the electric push rod is started, the movable rod drives a test needle at the lower end to move simultaneously when moving, and the test needle makes contact with a cleaning cotton block arranged on the side face when moving, so that the surface of the test needle can be wiped and cleaned; when a chip at the lower end is tested and pulled back to the original position by the electric push rod, the surface of the testing needle can be wiped and cleaned in the moving process, when the chip testing needle cleaning device is used, the surface of a needle body of the testing needle can be wiped and cleaned before and after the chip is tested, testing work can be conveniently carried out, and the working efficiency is improved. And the test result is more accurate.

Description

Technical Field

[0001] This utility model relates to the field of chip manufacturing technology, specifically to a chip test probe cleaning device. Background Technology

[0002] Chip test probes are key components in semiconductor testing, primarily used in chip design verification, wafer testing, and final product testing. They connect the chip / wafer to the testing equipment to transmit signals, playing a crucial role in quality control of semiconductor products. Chip test probes come in various types, including cantilever probes and vertical probes. Cantilever probes are known for their classic design and stability, suitable for testing most conventional chips; while vertical probes are specifically designed for high-density chips, offering higher testing accuracy and a smaller contact area, making them particularly suitable for scenarios requiring high-precision electrical testing. Chip test probes are widely used in chip design verification, wafer testing, and final product testing. In wafer testing, probe stations support thousands of exposed chip pins. Connecting to the testing equipment via probes, they perform electrical performance measurements, ensuring chip performance and defect detection, and improving testing accuracy and efficiency.

[0003] When using chip testers to test chips, multiple tests are usually performed in sequence. During the testing process, dust and other debris may adhere to the chip surface and the test probes. If debris adheres to the surface of the test probes, it may cause poor contact, resulting in inaccurate test results. Therefore, this is somewhat inconvenient in actual use. Utility Model Content

[0004] The purpose of this invention is to provide a chip test probe cleaning device to solve the problem mentioned in the background art, which is that when using chip test probes to test chips, multiple tests are generally performed in sequence. During the testing process, dust and other debris may adhere to the test probes on the chip surface and during the test. If debris adheres to the surface of the test probes, it may cause poor contact, resulting in inaccurate test results. Therefore, it is inconvenient in actual use.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a chip test probe cleaning device, comprising a working panel and a support leg fixedly installed at the lower end of the working panel, a connecting plate fixedly installed at the upper end of the working panel, an electric push rod fixedly installed on the connecting plate, a movable rod fixedly installed at the output end of the electric push rod, a test probe fixedly installed at one end of the movable rod, a fixing rod fixedly installed on the side wall of the connecting plate, and cleaning cotton blocks fixedly installed on both sides of one end of the fixing rod, the test probe contacting the cleaning cotton blocks when moving, a fixing post fixedly installed at the upper end of the working panel, and a fixing plate fixedly installed on the fixing post.

[0006] Preferably, the fixed plate has sliding grooves on both sides, and movable rings are slidably installed in the sliding grooves. Inclined blocks are fixedly installed on both sides of the movable rings.

[0007] Preferably, connecting blocks are fixedly installed at both ends of the fixed plate, and a spring is fixedly installed between the side wall of the connecting block and the side wall of the movable ring.

[0008] Preferably, one end of the movable rod is provided with a movable component, the movable component including a cross plate fixedly installed at one end of the movable rod.

[0009] Preferably, a telescopic rod is fixedly installed at each of the four lower corners of the horizontal plate, and a spring is fixedly installed inside the telescopic rod.

[0010] Preferably, the lower end of the telescopic rod is provided with an inclined groove, and the inclined block is slidably connected in the inclined groove.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] 1. When testing a chip, first place the chip to be tested on the fixed plate, then start the electric push rod. When the electric push rod is started, the movable rod at its telescopic end extends downward. When the movable rod moves, it drives the test probe at the lower end to move simultaneously. When the test probe moves, it comes into contact with the cleaning cotton block set on the side, which can wipe and clean its surface. When the test probe finishes testing the chip at the lower end and is pulled back to its original position by the electric push rod, the surface of the test probe will also be wiped and cleaned during the movement. When using this chip test probe cleaning device, the surface of the test probe can be wiped and cleaned before and after chip testing, which facilitates the testing work and makes the test results more accurate.

[0013] 2. With the cooperation of the slide groove, movable ring, connecting block, spring one, inclined block, movable component, horizontal plate, telescopic rod, spring two, and inclined groove, this device allows the chip to be tested to be placed on the fixed plate during use. Then, the electric push rod is activated to move the test probe downwards to test the chip. As the movable rod moves the test probe downwards, it simultaneously moves the horizontal plate downwards as well. During this downward movement, the telescopic rods at the four corners at the bottom retract downwards, compressing spring two inside the telescopic rods. After compression to a certain extent, the inclined block in the inclined groove at the bottom is pushed towards the center by the telescopic rod. At this time, the inclined blocks on both sides move the movable ring towards the center simultaneously, clamping and fixing the chip placed on the fixed plate. This device automatically clamps and fixes the chip during chip testing, facilitating chip testing and preventing slippage. After testing, it automatically releases the chip, facilitating its removal after subsequent testing. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall three-dimensional structure of this utility model;

[0015] Figure 2 This is a three-dimensional structural diagram of the present invention;

[0016] Figure 3 This is a three-dimensional structural diagram of the present invention;

[0017] Figure 4 This is a three-dimensional structural diagram of the present invention.

[0018] In the diagram: 1. Working panel; 2. Support leg; 3. Connecting plate; 31. Fixed rod; 32. Cleaning cotton pad; 4. Electric actuator; 41. Movable rod; 42. Test probe; 5. Fixed column; 51. Fixed plate; 52. Slide groove; 53. Movable ring; 54. Connecting block; 55. Spring 1; 56. Inclined block; 6. Movable component; 61. Horizontal plate; 62. Telescopic rod; 63. Spring 2; 64. Inclined groove. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Example 1: Please refer to Figure 1 - Figure 3A chip test probe cleaning device includes a working panel 1 and a support leg 2 fixedly installed at the lower end of the working panel 1. A connecting plate 3 is fixedly installed at the upper end of the working panel 1. An electric push rod 4 is fixedly installed on the connecting plate 3. A movable rod 41 is fixedly installed at the output end of the electric push rod 4. A test probe 42 is fixedly installed at one end of the movable rod 41. A fixing rod 31 is fixedly installed on the side wall of the connecting plate 3. Cleaning cotton blocks 32 are fixedly installed on both sides of one end of the fixing rod 31. When the test probe 42 moves, it contacts the cleaning cotton blocks 32. A fixing post 5 is fixedly installed at the upper end of the working panel 1. A fixing plate 51 is fixedly installed on the fixing post 5.

[0021] In this embodiment: When using the device to test the chip, the chip to be tested can be placed on the fixed plate 51 first, and then the electric push rod 4 can be started. When the electric push rod 4 is started, the movable rod 41 at its telescopic end extends downward. When the movable rod 41 moves, it drives the test needle 42 at the lower end to move at the same time. When the test needle 42 moves, it comes into contact with the cleaning cotton block 32 set on the side, and its surface can be wiped and cleaned. When the test needle 42 finishes testing the chip at the lower end and is pulled back to its original position by the electric push rod 4, the surface of the test needle 42 will also be wiped and cleaned during the movement. When using this chip test needle cleaning device, the surface of the test needle 42 can be wiped and cleaned before and after chip testing, which facilitates the testing work and makes the test results more accurate.

[0022] Example 2: This example is an improvement on Example 1. For details, please refer to [link / reference]. Figure 2 - Figure 4 The fixed plate 51 has a sliding groove 52 on both sides, and a movable ring 53 is slidably installed in the sliding groove 52. An inclined block 56 is fixedly installed on both sides of the movable ring 53. The movable ring 53 on both sides can clamp and fix the chip placed on the fixed plate 51.

[0023] Both ends of the fixed plate 51 are fixedly installed with connecting blocks 54. A spring 55 is fixedly installed between the side wall of the connecting block 54 and the side wall of the movable ring 53. The spring 55 can pull the movable ring 53 back to its original position after it moves.

[0024] One end of the movable rod 41 is provided with a movable component 6, which includes a horizontal plate 61 fixedly installed at one end of the movable rod 41. When the movable rod 41 moves downward, it can simultaneously drive the horizontal plate 61 to move.

[0025] Telescopic rods 62 are fixedly installed at the four corners of the lower end of the horizontal plate 61. Springs 63 are fixedly installed inside the telescopic rods 62. Springs 63 keep the telescopic rods 62 in an extended state without being subjected to external force.

[0026] The lower end of the telescopic rod 62 is provided with a groove 64, and the inclined block 56 is slidably connected in the groove 64. When the horizontal plate 61 moves downward, it can drive the telescopic rod 62 to move downward, and make the groove 64 at its lower end slide against the surface of the inclined block 56, pushing the inclined block 56 in the direction of force.

[0027] In this embodiment: When using the device, the chip to be tested can be placed on the fixed plate 51 first, and then the electric push rod 4 is activated to move the test probe 42 downward to test the chip. During the downward movement of the movable rod 41 and the test probe 42, the horizontal plate 61 will also move downward at the same time. When moving downward, the telescopic rods 62 at the four corners of the lower end will move downward and retract. First, the springs 63 inside the telescopic rods 62 are compressed. After being compressed to a certain extent, the inclined blocks 56 in the inclined grooves 64 at the lower end will be pushed by the telescopic rods 62 to move to the middle position. At this time, the inclined blocks 56 on both sides will drive the movable rings 53 to move to the middle at the same time, clamping and fixing the chip placed on the fixed plate 51. When using the device, it can automatically clamp and fix the chip during the chip testing process using the test probe 42, which is convenient for chip testing and prevents the chip from slipping during chip testing. After the test is completed, it will automatically release the chip, which is convenient for subsequent chip removal after the test is completed.

[0028] The contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0029] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A chip testing needle cleaning device comprising a working panel (1) and a supporting leg (2) fixedly installed at the lower end of the working panel (1), characterized in that: A connecting plate (3) is fixedly installed on the upper end of the working panel (1). An electric push rod (4) is fixedly installed on the connecting plate (3). A movable rod (41) is fixedly installed at the output end of the electric push rod (4). A test needle (42) is fixedly installed at one end of the movable rod (41). A fixing rod (31) is fixedly installed on the side wall of the connecting plate (3). A cleaning cotton block (32) is fixedly installed on both sides of one end of the fixing rod (31). When the test needle (42) moves, it contacts the cleaning cotton block (32). A fixing column (5) is fixedly installed on the upper end of the working panel (1). A fixing plate (51) is fixedly installed on the fixing column (5).

2. A chip test pin cleaning device according to claim 1, characterized in that: The fixed plate (51) has grooves (52) on both sides, and movable rings (53) are slidably installed in the grooves (52). Inclined blocks (56) are fixedly installed on both sides of the movable rings (53).

3. A chip test pin cleaning device according to claim 2, characterized in that: Both ends of the fixed plate (51) are fixedly installed with connecting blocks (54), and a spring (55) is fixedly installed between the side wall of the connecting block (54) and the side wall of the movable ring (53).

4. A chip test needle cleaning device according to claim 3, characterized in that: One end of the movable rod (41) is provided with a movable component (6), the movable component (6) including a horizontal plate (61) fixedly installed at one end of the movable rod (41).

5. A chip test needle cleaning device according to claim 4, wherein: Telescopic rods (62) are fixedly installed at the four corners of the lower end of the horizontal plate (61), and springs (63) are fixedly installed inside the telescopic rods (62).

6. A chip test needle cleaning device according to claim 5, wherein: The lower end of the telescopic rod (62) is provided with a groove (64), and the inclined block (56) is slidably connected in the groove (64).

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