Bypass diode junction box

Abstract

The utility model discloses a bypass diode junction box, which relates to the technical field of photovoltaic modules, and specifically structurally comprises a frame assembly, the box body wraps the frame assembly; the frame assembly comprises two metal sheets which are arranged in a spaced mode, and the opposite ends of the two metal sheets are in an L shape. The crystal grain is arranged at the L-shaped end of one metal sheet; and one end of the jumper wire is installed on the crystal grain, and the other end is installed at the L-shaped end of the remaining metal sheet. According to the utility model, the technical problems of high cost and insufficient heat dissipation performance of the junction box are solved.

Description

Technical Field

[0001] This utility model relates to the field of photovoltaic module technology, and in particular to a bypass diode junction box. Background Technology

[0002] A bypass diode is a diode connected in reverse parallel across the two ends of a solar silicon cell array in a solar module. It effectively prevents the silicon cells from burning out due to hot spot effects and is an important component of photovoltaic solar modules. Bypass diodes are used to prevent some solar cells from becoming overheated and damaged due to shading under strong sunlight, causing them to become a load. They are commonly used in bypass diodes of monocrystalline and polycrystalline silicon photovoltaic (PV) panels to protect overheated photovoltaic cells when low shunt current and high shunt impedance occur.

[0003] The existing bypass diodes typically use the frame structure with authorization notice number CN213878107U. The upper and lower surfaces of the frame are uneven, which is not conducive to subsequent mating with the junction box. Moreover, the heat dissipation performance of the frame itself is insufficient, which has a certain impact on the performance of the bypass diode. At the same time, the existing junction boxes are usually secondary encapsulations, which cannot guarantee the quality of the product. Utility Model Content

[0004] The purpose of this invention is to provide a bypass diode junction box, which solves the technical problems of high cost and insufficient heat dissipation performance of existing junction boxes.

[0005] This application discloses a bypass diode junction box, including:

[0006] Framework components;

[0007] The box encloses the frame components;

[0008] The framework components include:

[0009] Two metal sheets are spaced apart, and the opposite ends of the two metal sheets are L-shaped; the metal sheets are copper sheets.

[0010] The grain is installed at the L-shaped end of one of the metal sheets;

[0011] A jumper wire is attached to the die at one end and to the L-shaped end of the remaining metal sheet at the other end.

[0012] This application designs a frame assembly in which the opposite ends of the metal sheets are L-shaped, which facilitates the subsequent installation of the chips and also improves the heat dissipation performance of the product.

[0013] Based on the above technical solution, the embodiments of this application can be further improved as follows:

[0014] Furthermore, the upper surfaces and lower surfaces of the two metal sheets are on the same horizontal plane. The advantage of this step is that it facilitates subsequent installation.

[0015] Furthermore, the two ends of the box are fitted with buckles, which facilitates the subsequent filling of materials.

[0016] Furthermore, the box body is a one-piece epoxy resin molded part. The advantage of this step is that it uses a single encapsulation, which can better reduce the height of the product and thus improve the product's heat dissipation performance.

[0017] Furthermore, the housing includes:

[0018] The transition section is wrapped around the opposite ends of the two metal sheets;

[0019] At least four connecting segments are provided, with each connecting segment arranged in pairs on both sides of the connecting segment. The connecting segments are L-shaped, and gaps are left between the horizontal portions of the connecting segments in the same group to form the hollowed-out area. The vertical portions of the connecting segments in the same group are opposite each other, and gaps are left between the vertical portions of the connecting segments in the same group. The beneficial effect of this step is that the corresponding hollowed-out area helps to improve the heat dissipation performance of the product.

[0020] Further, the metal sheet comprises:

[0021] A substrate segment on which a die is mounted;

[0022] The pin segment is located at the end of the substrate segment furthest from the die;

[0023] A heat dissipation section is disposed at one end of the substrate section. The beneficial effect of this step is that heat dissipation is carried out through the heat dissipation section, thereby ensuring the heat dissipation performance of the entire product.

[0024] Furthermore, the heat dissipation sections of the two metal plates are rotationally symmetrical about the center of the housing, and the beneficial effect of this step is to ensure the heat dissipation effect of the product.

[0025] Furthermore, a groove is provided on the outer side of the substrate segment. The advantage of this step is that it facilitates better filling of the sealant later.

[0026] Furthermore, no positioning holes are provided on the substrate segment. The advantage of this step is that it can better ensure heat dissipation.

[0027] Furthermore, the width of the substrate segment is greater than the width of the pin segment;

[0028] A gap is left between the end of the substrate segment and the inner wall of the vertical portion of the connecting segment.

[0029] One or more technical solutions provided in the embodiments of this application have at least the following technical effects or advantages:

[0030] 1. This application designs a frame component, and through a flat design, it is easy to ensure the electrical performance of the frame component, thereby improving the quality of the product.

[0031] 2. The metal sheet in this application is designed with an L-shaped end, which facilitates the subsequent assembly of larger-sized grains and thus improves heat dissipation performance.

[0032] 3. This application designs the box body and uses epoxy resin for encapsulation, which can reduce the product height and volume, and reduce costs. Attached Figure Description

[0033] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0034] Figure 1 This is a structural schematic diagram of a bypass diode junction box (without clips) according to a specific embodiment of the present utility model;

[0035] Figure 2 for Figure 1 Structural diagram of the middle frame component (without ribs cut);

[0036] Figure 3 This is a schematic diagram of the structure of a bypass diode junction box according to a specific embodiment of the present utility model;

[0037] Figure 4 This is another structural schematic diagram of a bypass diode junction box (without clips) according to a specific embodiment of the present utility model;

[0038] Figure 5 for Figure 4 Structural diagram of the middle frame component (without ribs cut);

[0039] Figure 6 This is a schematic diagram of the structure of a bypass diode junction box according to a specific embodiment of the present utility model;

[0040] Figure label:

[0041] 1-Frame component; 2-Box body; 3-Hollowed-out area; 4-Snap fastener;

[0042] 101-Metal sheet; 102-Die; 103-Jumper wire; 104-Substrate segment; 105-Pin segment; 106-Heat dissipation segment; 107-Connecting rib; 108-Groove; 109-Through hole;

[0043] 201 - Transition section; 202 - Connecting section. Detailed Implementation

[0044] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings. These embodiments are merely illustrative of the present invention and should not be construed as limiting the scope of protection of the present invention.

[0045] It should be noted that, unless otherwise stated, the technical or scientific terms used in this application shall have the ordinary meaning as understood by one of ordinary skill in the art to which this utility model pertains.

[0046] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0047] To better understand the above technical solutions, the following will provide a detailed description of the technical solutions in conjunction with the accompanying drawings and specific embodiments.

[0048] Example:

[0049] like Figure 1-6 As shown in the figure, this application discloses a bypass diode junction box. Compared with existing bypass diode junction boxes, the structure is simplified and the thickness is reduced. This application adopts the form of epoxy resin wrapping the frame assembly, which can reduce the overall thickness to less than 13mm, or even directly to 6mm. This can reduce the overall size and make it easier for users to control the weight. At the same time, the frame assembly is in direct contact with the epoxy resin, which can increase the size of the frame assembly under the same size conditions, thereby increasing the heat dissipation area and further improving the heat dissipation effect.

[0050] The specific structure of this application includes:

[0051] Frame component 1: This application designs frame component 1 as a plane, which facilitates the reduction of shear force and thus improves product quality.

[0052] The box body 2 encloses the frame component 1, and the box body 2 has a hollow area 3. The box body 2 is made of epoxy resin. Compared with the existing structure of sealing with epoxy resin and then connecting the box body, this application directly uses epoxy resin as the box body, which simplifies the structure and reduces the overall height of the product. At the same time, the hollow area 3 facilitates the subsequent installation of the busbar.

[0053] The structure of this application is that the frame component 1 is directly combined with the housing 2 to form a component. Compared with the existing frame component, which first encapsulates the diode and then combines it with the housing 2 to form a component, the heat dissipation effect is better because the frame component 1 is in direct contact with the housing 2, resulting in better heat dissipation. Moreover, this application has one less encapsulation layer, which can increase the overall size of the frame component 1 under the same size conditions. This not only allows for the assembly of larger chips, but also increases the heat dissipation area.

[0054] To improve product quality, the framework component 1 in this application includes:

[0055] Two metal sheets 101 are spaced apart, and the opposite ends of the two metal sheets 101 are L-shaped; the metal sheets 101 are copper sheets.

[0056] A die 102 is installed on the L-shaped end of one of the metal sheets 101. The die 102 cooperates with the L-shaped part of the metal sheet to increase the heat dissipation area.

[0057] Jumper 103 is mounted on the die 102 at one end and on the L-shaped end of the remaining metal sheet 101 at the other end.

[0058] To further explain this part, compared with the existing framework, this application designs the opposite ends of the two metal plates 101 into an L-shape for mounting the chips. For example, when there are two chips, the two chips 102 are staggered, that is, they are respectively set at the two ends of the L-shape. Compared with the existing side-by-side arrangement, it can better avoid heat accumulation and improve the heat dissipation effect.

[0059] During installation, the installation method is similar to the existing ones, which are connected by jumpers. One end of the jumper is connected to the chip, and the other end is connected to the metal plate 101 where no chip is installed.

[0060] Compared to existing uneven frame components, the upper surfaces and lower surfaces of the two metal sheets 101 in this application are on the same horizontal plane, which improves flatness and reduces the shear force that occurs after multiple frames are combined, thus reducing the problem of poor material electrical properties. Because the existing unevenness is not conducive to mass production and will have large stress.

[0061] This application requires subsequent connection with wires. To better ensure the stability of the connection, the two ends of the housing 2 described in this application are equipped with clips 4. These clips 4 ensure the stability of the wire connection and prevent subsequent filler overflow. The clips 4 in this application can be manufactured separately and then installed at both ends of the housing 2 before the wires are installed; alternatively, they can be formed with the wires and then installed at both ends of the housing 2.

[0062] As stated in the introduction, in order to reduce the overall height, simplify the structure, and improve the heat dissipation effect, the box body 2 in this application is an integrally molded epoxy resin part. In terms of thermal conductivity W / (m·K), nylon is 0.25-0.3, PPE is 0.22, PS is 0.1-0.13, silicone rubber is 0.26, while epoxy resin reaches 1.0-2.5. In addition, since the epoxy resin is in direct contact with the frame components, one less layer of contact material is required, which can better ensure the heat dissipation effect.

[0063] Similarly, the specific shape of the box has also been designed to ensure electrical performance and facilitate subsequent installation; wherein, the box 2 includes:

[0064] The transition section 201 is wrapped around the opposite ends of the two metal sheets 101;

[0065] At least four connecting segments 202 are provided, arranged in pairs on both sides of each other. The connecting segments 202 are L-shaped, with gaps between the horizontal portions of the connecting segments 202 within the same group forming the hollowed-out area 3. The vertical portions of the connecting segments 202 within the same group are opposite each other, with gaps between the vertical portions. This hollowed-out area 3 facilitates the subsequent assembly of other materials, such as busbars; simultaneously, the connecting segments 202 enclose subsequent heat dissipation segments, thereby further improving heat dissipation performance. The gaps facilitate subsequent production.

[0066] Furthermore, to ensure product quality, this application also designs the metal sheet 101, specifically, the metal sheet 101 includes:

[0067] The substrate segment 104 has an L-shaped end;

[0068] Pin segment 105 is located at the end of substrate segment 104 away from the die 102;

[0069] A heat dissipation section 106 is disposed on one side of the substrate section 104. This application designs a separate heat dissipation section 106 for the metal sheet 101 to improve heat dissipation performance. The heat dissipation section 106 is strip-shaped and is located inside the housing 2, which facilitates heat dissipation.

[0070] In this application, during processing, the original frame component 1 also includes a connecting rib 107, which is disposed between the heat dissipation section 106 and the substrate section 104. When the final product is formed, the connecting rib 107 is cut off.

[0071] This application designs the metal sheet 101 to better connect with the grains while ensuring heat dissipation; furthermore, the heat dissipation sections 106 of the two metal sheets 101 are rotationally symmetrical about the center of the housing 2, which can form a heat dissipation channel and improve the heat dissipation effect.

[0072] The structure in this application has various forms, one of which is as follows: Figure 1 , 2 The structure shown is another one, as shown in the image. Figure 3 , 4 The structure shown.

[0073] like Figure 1-3 As shown, further explanation is given regarding the heat dissipation section 106. The heat dissipation sections of the two metal plates 101 are rotationally symmetrical about the center of the housing, thereby improving heat dissipation performance. Specifically, as shown... Figure 2 As shown, one heat dissipation section 106 is located on the upper side of the metal sheet 101, with a gap between it and the substrate section 104 of the other metal sheet 101. The left end of the heat dissipation section 106 is on the same vertical plane as the left end of the other metal sheet 101. Similarly, the other heat dissipation section 106 is located on the lower side of the metal sheet 101, with a gap between it and the substrate section 104 of the other metal sheet 101. The left end of the heat dissipation section 106 is on the same vertical plane as the left end of the other metal sheet 101. This ensures the length of the heat dissipation section, thereby improving the heat dissipation performance.

[0074] At this time, a groove 108 is provided on the outer side of the substrate segment 104 (specifically, a groove 108 is provided at the location corresponding to the connecting rib 107). The groove 108 is located on the inner side of the heat dissipation segment. The groove 108 facilitates subsequent filling with filler and further ensures the quality of the product.

[0075] The substrate segment 104 does not have positioning holes because it does not need to be packaged into a diode and is directly connected to the housing. This eliminates the need for positioning and ensures sufficient heat dissipation area.

[0076] In this embodiment, the two metal sheets 101 are integrally formed, that is, the two and the connecting rib are integral. Specifically, a connecting rib 107 is provided between the heat dissipation section 106 of one of the metal sheets 101 and the other metal sheet 101. This connecting rib is removed during subsequent processing to achieve the diode characteristics.

[0077] like Figure 4-6As shown, another structure is described, with further explanation regarding the heat dissipation section 106. The heat dissipation sections of the two metal plates 101 are rotationally symmetrical about the center of the housing, thereby improving heat dissipation performance. Specifically, as shown... Figure 2 As shown, one heat dissipation section 106 is located on the upper side of the metal sheet 101, with a gap between it and the substrate section 104 of the other metal sheet 101; similarly, the other heat dissipation section 106 is located on the lower side of the metal sheet 101, with a gap between it and the substrate section 104 of the other metal sheet 101. In this structure, the length of the heat dissipation section 106 is also relatively long, exceeding the end of the substrate section, thereby improving the heat dissipation effect.

[0078] The two metal sheets 101 in this application are integrally formed, that is, the two and the connecting rib are integral. Specifically, a connecting rib 107 is provided between the heat dissipation section 106 of one of the metal sheets 101 and the other metal sheet 101. This connecting rib is removed during subsequent processing in order to achieve the diode characteristics.

[0079] The width of the substrate segment 104 is greater than the width of the pin segment 105; a gap is left between the end of the substrate segment 104 and the inner wall of the vertical portion of the connecting segment 202 to facilitate the passage of filler material, thereby ensuring the quality of the product.

[0080] Further explanation is provided regarding this application:

[0081] The improvements in this application are mainly divided into two parts: the frame components and the box body.

[0082] Regarding the framework components:

[0083] The metal sheet 101 in this application is an integrated design, and the upper and lower surfaces of the metal sheet 101 are on the same plane. This can improve flatness, reduce the shear force that occurs after the multiple frames are combined, avoid material electrical problems, and thus ensure product quality. Moreover, the high flatness also facilitates production operations and integrated installation, which is conducive to ensuring efficient production of the product.

[0084] During the die assembly process, the metal sheet 101 in this application has an L-shaped end, which helps to improve heat dissipation performance. The housing in this application is a one-piece molded package, which eliminates the space occupied by the secondary mounting and positioning of traditional diodes inside the box. This increases the area of ​​the metal sheet, i.e., the area of ​​the copper sheet, and the corresponding die size also increases. For example, the die welding size can be increased to 230mil*2, which is 28% larger than the traditional 180mil. Moreover, when placing the die, this application can adopt a staggered design, which provides a wider heat dissipation channel compared with the traditional side-by-side method, effectively improving the product's overcurrent capability.

[0085] The metal sheet 101 in this application is also provided with a heat dissipation section 106, which is used for heat dissipation on both sides. The end of the heat dissipation section corresponds to the end of another metal sheet, thereby increasing the length of the heat dissipation section and ensuring the uniformity of heat. At the same time, the subsequent structure of the metal sheet and epoxy resin in this application is a direct structure, which reduces the heat conduction path and improves the uniformity and efficiency of heat dissipation.

[0086] This application features a groove 108, which allows for more efficient filling of sealant.

[0087] Regarding the box body:

[0088] The housing in this application is an integrated package, which can improve quality and efficiency, shorten the production process, reduce the processing risks caused by diodes in the wire box processing and installation process, and the overall airtightness of the integrated package material is better.

[0089] This application features a hollowed-out area, providing a wide heat dissipation channel and increasing the material's heat capacity. Furthermore, this application uses epoxy resin encapsulation, which has a higher thermal conductivity than traditional PPE, nylon, and PS, thereby improving heat dissipation.

[0090] This application designs the dimensions of the box to reduce its thickness, specifically from 13-18mm to 6mm. This reduces the volume, achieves weight reduction, and lowers the overall material usage. Furthermore, the integrated packaging avoids the risks associated with secondary packaging.

[0091] When testing the temperature rise capability under energizing conditions, this application showed a 10°C decrease in temperature under the same current, effectively improving the overcurrent capability per unit area of ​​the grain.

[0092] Attached test data:

[0093] The testing was conducted in accordance with the IEC 61215 MQT 18 standard. Two chip suppliers of the same size were selected, and two sets of tests were performed on each supplier for comparison.

[0094]

[0095] From the table above, it can be seen that the values ​​of 75T=1H for products 3, 4, 7, and 8 in this embodiment are relatively large, which indicates that the product in this embodiment has better heat dissipation.

[0096] Numerous specific details are set forth in this specification. However, it will be understood that embodiments of this invention may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0097] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0098] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model, and they should all be covered within the scope of the claims and specification of this utility model.

Claims

1. A bypass diode junction box characterized by, include: Framework component (1); Box (2), which encloses the frame component (1); The framework component (1) includes: Two metal sheets (101) are spaced apart, and the opposite ends of the two metal sheets (101) are L-shaped; the metal sheets (101) are copper sheets; A grain (102) is mounted on the L-shaped end of one of the metal sheets (101); A jumper (103) is mounted on the die (102) at one end and on the L-shaped end of the remaining metal sheet (101) at the other end.

2. The bypass diode junction box of claim 1, wherein, The upper surfaces of the two metal sheets (101) are on the same horizontal plane, and the lower surfaces are on the same horizontal plane.

3. The bypass diode junction box of claim 1, wherein, The box body (2) is an epoxy resin integral molded part.

4. The bypass diode junction box of claim 3, wherein, The box body (2) includes: The transition section (201) is wrapped around the opposite ends of the two metal sheets (101); At least four connecting segments (202) are provided, with each connecting segment (202) in pairs and located on both sides of the connecting segment (202). The connecting segments (202) are L-shaped. The horizontal portions of the connecting segments (202) in the same group are separated by gaps to form a hollow area (3). The vertical portions of the connecting segments (202) in the same group are opposite to each other, and there are gaps between the vertical portions of the connecting segments (202) in the same group.

5. The bypass diode junction box of claim 4, wherein, The metal sheet (101) comprises: A substrate segment (104) on which a die is mounted; The pin segment (105) is located at the end of the substrate segment (104) away from the die (102); A heat dissipation section (106) is disposed at one end of the substrate section (104).

6. The bypass diode junction box of claim 5, wherein, The heat dissipation sections (106) of the two metal plates (101) are rotationally symmetrical about the center of the box (2).

7. The bypass diode junction box of claim 5, wherein, A groove (108) is provided on the outer side of the substrate segment (104).

8. The bypass diode junction box of claim 7, wherein, No positioning holes are provided on the substrate segment (104).

9. The bypass diode junction box of claim 5, wherein, The width of the substrate segment (104) is greater than the width of the pin segment (105); A gap is left between the end of the substrate segment (104) and the inner wall of the vertical portion of the connecting segment (202).

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