Auxiliary heat dissipation device based on Peltier effect
By using a Peltier effect-assisted heat dissipation device, the problem of insufficient heat dissipation performance of the electric motor and electronic control cooling system of pure electric buses in high-temperature environments and performance degradation in low-temperature environments has been solved, realizing improved heat dissipation performance and heating function under different climatic conditions.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZONSON SMART AUTO CORP
- Filing Date
- 2025-03-27
- Publication Date
- 2026-04-17
AI Technical Summary
The existing electric motor and electronic control cooling system of pure electric buses has low heat dissipation performance in high-temperature environments and its performance deteriorates in low-temperature environments, failing to meet the heat dissipation requirements under different climatic conditions.
An auxiliary heat dissipation device based on the Peltier effect is adopted. Through the Peltier effect device and the flip-plate control mechanism, the direct-flow circuit and the cooling circuit are adjusted to help improve the heat dissipation performance of the traditional liquid cooling system and provide heating function in low-temperature environments.
It improves heat dissipation performance in high-temperature environments to prevent the motor and electronic control performance from deteriorating, while providing heating function in low-temperature environments to ensure that the motor and electronic control system can work normally under different climatic conditions.
Smart Images
Figure CN224139315U_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the technical field of vehicle structure, and in particular to an auxiliary heat dissipation device based on the Peltier effect. Background Technology
[0002] The motors and electronic control components of pure electric buses generate heat during operation. To ensure their proper functioning, a cooling system is designed on board. Currently, most pure electric buses in China use liquid cooling. The working principle is that when the vehicle is running, an electro-hydraulic pump in the liquid cooling system operates. Coolant from the radiator assembly is pressurized by the electro-hydraulic pump and flows into the motor controller and motor. The cooler coolant absorbs heat and its temperature rises as it flows through the motor controller and motor. The warmer coolant then flows into the radiator, where the cooling fan operates, forcing air from outside the vehicle to flow through the heat exchange fins on the radiator. The heat in the coolant is transferred to the flowing air through the heat exchange fins, and the flowing air carries away the heat, lowering the temperature of the coolant inside the radiator, ultimately cooling the motor and electronic control components.
[0003] Current traditional pure electric bus motor and electronic control cooling systems generally use liquid cooling. This cooling method relies on the temperature difference between the coolant flowing through the radiator and the ambient temperature; the greater the temperature difference, the better the heat dissipation performance. For example, the engine cooling system of a traditional fuel vehicle uses liquid cooling. The internal operating temperature of the engine generally exceeds 100°C, and the coolant temperature at the inlet of its cooling system is basically maintained at around 90°C. This means that the temperature of the coolant flowing through the radiator can generally reach between 90 and 100°C. This temperature is much higher than the ambient temperature. Even in southern my country during summer, when the ambient temperature is generally around 28-30°C, the temperature difference between the coolant flowing through the radiator and the ambient temperature can reach about 60°C.
[0004] For the cooling system of the motor and electronic control unit in pure electric buses, since this system mainly dissipates heat from the stator coils inside the motor and the IGBT modules inside the electronic control unit, these components can adapt to relatively low ambient temperatures, but are quite sensitive to ambient temperature. Generally, the inlet coolant temperature is required not to exceed 65℃. In southern my country, where summer ambient temperatures are generally around 28-30℃, the maximum temperature difference between the coolant flowing through the radiator and the ambient temperature is only about 35℃. Therefore, the heat dissipation performance of the liquid cooling system used in the motor and electronic control unit of pure electric buses is relatively low. Especially in some regions of the Middle East, where summer ambient temperatures can reach 40℃, the heat dissipation performance of traditional liquid cooling systems for motors and electronic control units will obviously decrease significantly, thus reducing the performance of the motor and electronic control unit. Furthermore, in cold regions such as Europe, the relatively low winter ambient temperatures will reduce the performance output of the electronic equipment inside the motor and electronic control unit.
[0005] Therefore, it is necessary to provide an auxiliary heat dissipation device based on the Peltier effect. Based on the Peltier effect device, it can help improve the heat dissipation performance of traditional heat dissipation systems in high-temperature environments and enable heating functions in low-temperature environments. Utility Model Content
[0006] The technical problem to be solved by this utility model is to overcome the shortcomings of the prior art and provide an auxiliary heat dissipation device based on the Peltier effect. Based on the Peltier effect device, it helps to improve the heat dissipation performance of traditional heat dissipation systems in high-temperature environments and can also realize the heating function in low-temperature environments.
[0007] The technical solution adopted by this utility model is as follows: This utility model includes a radiator and an electro-hydraulic pump. An auxiliary heat dissipation device is connected between the radiator and the electro-hydraulic pump. The auxiliary heat dissipation device includes a liquid-cooled plate main board. A liquid-cooled plate cover is provided in the cavity of the liquid-cooled plate main board. A plurality of cooling fins are provided at the bottom of the liquid-cooled plate cover. The cooling fins divide the cavity of the liquid-cooled plate main board into a through circuit and a cooling circuit. The liquid-cooled plate cover is provided with a flip-plate control mechanism, an adjustable flip plate, and two sets of cooling water pipe joints. The flip-plate control mechanism opens or closes the through circuit by adjusting the flip plate. The two sets of cooling water pipe joints are respectively connected to the radiator and the electro-hydraulic pump. A Peltier effect device is provided on the top of the liquid-cooled plate cover. A heat sink and a cooling fan are sequentially provided on the top of the Peltier effect device.
[0008] As can be seen from the above scheme, the auxiliary heat dissipation device is connected in series between the radiator and the electro-hydraulic pump of the traditional liquid cooling system. The auxiliary heat dissipation device's participation in heat dissipation can be controlled by adjusting a flap, utilizing a Peltier effect device. When the direct-through circuit is open, the auxiliary heat dissipation device does not participate in heat dissipation. Closing the direct-through circuit indirectly opens the cooling circuit, and by controlling the operation of the Peltier effect device and related components, the auxiliary heat dissipation device participates in heat dissipation, which helps improve the heat dissipation performance of the liquid cooling system assembly, especially in high-temperature environments, where the improvement is significant. When a pure electric bus is first powered on in extremely cold regions, the motor and electronic control components are in a cold start state. The auxiliary heat dissipation device can adjust the direction of the operating current of the Peltier effect device to interchange the heat absorption and heat dissipation surfaces, thus reversing the flow of coolant to heat it. This avoids the problem of decreased cold start performance of the motor and electronic control components, helps improve the heat dissipation performance of the traditional cooling system in high-temperature environments, and can also achieve heating functionality in low-temperature environments.
[0009] In a preferred embodiment, the heat sink is an aluminum alloy structure, with several heat sink fins in the middle of the heat sink and a base plate at the bottom of the heat sink fins. The base plate has several heat sink mounting holes, and the heat sink mounting holes are used to mount the heat sink to the upper end of the liquid cooling plate cover by bolts and heat insulation washers.
[0010] In a preferred embodiment, the Peltier effect device includes a heat-absorbing surface and a heat-dissipating surface, wherein the heat-dissipating surface is in close contact with the bottom surface of the heat sink, and the heat-absorbing surface is in close contact with the top surface of the liquid cooling plate cover.
[0011] In a preferred embodiment, a cooling fan bracket is provided between the heat sink and the cooling fan. The cooling fan bracket has several bracket mounting holes and several cooling fan connection holes. The bracket mounting holes are bolted to the upper end of the heat sink, and the cooling fan is bolted to the cooling fan through the several cooling fan connection holes. A blocking plate is provided on one side of the cooling fan bracket.
[0012] In a preferred embodiment, the two sets of cooling water pipe connectors include an inlet connector and an outlet connector. The inlet connector is connected to the outlet of the radiator via a cooling water pipe, and the outlet connector is connected to the inlet of the electro-hydraulic pump via a cooling water pipe.
[0013] A preferred embodiment is that the liquid cooling plate main board has a rectangular box structure, the middle of the liquid cooling plate main board is a liquid cooling cavity, the liquid cooling plate main board has a liquid cooling plate cover plate connection hole, the liquid cooling plate cover plate connection hole is connected to the liquid cooling plate cover plate by bolts, and a plurality of liquid cooling plate main board mounting holes are provided on both sides of the liquid cooling plate main board, the liquid cooling plate main board mounting holes are installed to the vehicle body by bolts.
[0014] In a preferred embodiment, the flap control mechanism is communicatively connected to the vehicle controller, and the flap control mechanism receives instructions from the vehicle controller to control the adjustment flap to open or close the through circuit. Attached Figure Description
[0015] Figure 1 This is a connection diagram of this utility model;
[0016] Figure 2 This is a three-dimensional structural schematic diagram of the present invention;
[0017] Figure 3 This is an exploded three-dimensional structural diagram of the present invention;
[0018] Figure 4 This is a schematic diagram of the structure of the through circuit and the cooling circuit;
[0019] Figure 5 This is a three-dimensional structural diagram of the heat sink.
[0020] Figure 6 This is a three-dimensional structural schematic diagram of the Peltier effect device.
[0021] Figure 7 This is a schematic diagram of the structure of the cooling fan bracket;
[0022] Figure 8 This is a three-dimensional structural schematic diagram of the liquid cooling plate cover.
[0023] Figure 9 This is a three-dimensional structural diagram of the liquid cooling plate motherboard.
[0024] Figure 10 This is a flow field and temperature field analysis diagram of the present invention under heat dissipation working condition. Detailed Implementation
[0025] like Figures 1 to 4 As shown, in this embodiment, the present invention includes a radiator 1 and an electro-hydraulic pump 2. An auxiliary heat dissipation device 3 is connected between the radiator 1 and the electro-hydraulic pump 2. The auxiliary heat dissipation device 3 includes a liquid-cooled plate main board 4. A liquid-cooled plate cover 5 is provided in the cavity of the liquid-cooled plate main board 4. A plurality of cooling fins 6 are provided at the bottom of the liquid-cooled plate cover 5. The cooling fins 6 divide the cavity of the liquid-cooled plate main board 4 into a through circuit 7 and a cooling circuit 8. The liquid-cooled plate cover 5 is provided with a flip-plate control mechanism 9, an adjusting flip-plate 10, and two sets of cooling water pipe joints 11. The flip-plate control mechanism 9 opens or closes the through circuit 7 through the adjusting flip-plate 10. The two sets of cooling water pipe joints 11 are respectively connected to the radiator 1 and the electro-hydraulic pump 2. A Peltier effect device 12 is provided on the top of the liquid-cooled plate cover 5. A heat dissipation plate 13 and a cooling fan 14 are sequentially provided on the top of the Peltier effect device 12.
[0026] The cooling fan 14 is a low-pressure axial flow fan. The suction side of the cooling fan 14 is bolted to the upper end of the heat sink 13 and is controlled by the vehicle's overall controller. When the auxiliary cooling device 3 is working, the cooling fan 14 operates, forcibly removing heat from the heat sink 13.
[0027] The liquid-cooled plate cover 5 is made of aluminum alloy, which has high thermal conductivity. Two upward-protruding cooling water pipe joints 11 are provided on the upper surface of the liquid-cooled plate cover 5. The electric motor cooling system of the pure electric bus, equipped with the auxiliary heat dissipation device 3, incorporates the auxiliary heat dissipation device 3 in series before the radiator 1 and the electro-hydraulic pump 2, compared to traditional structures. A large number of cooling fins 6 are provided at the bottom of the liquid-cooled plate cover 5. These cooling fins 6 separate the liquid-cooled cavity of the main liquid-cooled plate 4 into the through circuit 7 and the cooling circuit 8. The cooling fins 6 are mainly distributed in the cooling circuit 8, and their thin-plate structure greatly increases the contact area with the coolant, thereby effectively improving the heat exchange efficiency of the liquid-cooled plate cover 5.
[0028] The adjusting flap 10 is controlled by the flap control mechanism 9. By rotating its central pivot, the position of the rectangular baffle is adjusted to open or close the direct circuit of the auxiliary heat dissipation device 3.
[0029] like Figures 1 to 6 As shown, the heat sink 13 is an aluminum alloy structure. A number of heat sink fins 15 are provided in the middle of the heat sink 13. A base plate 16 is provided at the bottom of the heat sink fins 15. A number of heat sink mounting holes 17 are provided in the base plate 16. The heat sink mounting holes 17 are installed to the upper end of the liquid cooling plate cover 5 by bolts and heat insulation washers.
[0030] The heat sink 13 is made of aluminum alloy, which has high thermal conductivity. The heat sink 15 has a sheet-like structure, which mainly conducts heat from the base plate 16 upwards, and finally the heat is carried away by the air flowing over its surface.
[0031] like Figure 6 As shown, the Peltier effect device 12 includes a heat-absorbing surface 18 and a heat-releasing surface 19. The heat-releasing surface 19 is in close contact with the bottom surface of the heat sink 15, and the heat-absorbing surface 18 is in close contact with the top surface of the liquid cooling plate cover 5.
[0032] The Peltier effect device 12 generates the Peltier effect, meaning that when current flows through a circuit composed of different conductors, heat absorption and release phenomena occur at the junctions of the different conductors depending on the direction of the current. This phenomenon can be controlled by changing the direction of the current, thus changing the junctions for heat release and absorption. The Peltier effect device 12 concentrates its internal heat-absorbing junctions on the heat-absorbing surface 18, and similarly concentrates its heat-releasing junctions on the heat-releasing surface 19. The Peltier effect occurs when the power supply is connected as required. The heat-releasing surface 19 is in close contact with the bottom surface of the heat sink 15, and the heat-absorbing surface 18 is in close contact with the top surface of the liquid cooling plate cover 5. During operation, it absorbs heat through the heat-absorbing surface 18 and simultaneously releases or dissipates heat through the heat-releasing surface 19.
[0033] like Figures 1 to 7 As shown, a cooling fan bracket 20 is provided between the heat sink 13 and the cooling fan 14. The cooling fan bracket 20 has several bracket mounting holes 21 and several cooling fan connection holes 22. The bracket mounting holes 21 are bolted to the upper end of the heat sink 13, and the cooling fan 14 is bolted to the several cooling fan connection holes 22. A blocking plate 23 is provided on one side of the cooling fan bracket 20. When the cooling fan 14 is working, air can only flow in from the air inlet side of the heat sink 13, preventing air backflow from the air outlet side.
[0034] like Figures 1 to 6As shown, the two sets of cooling water pipe connectors 11 include an inlet connector and an outlet connector. The inlet connector is connected to the outlet of the radiator 1 through a cooling water pipe, and the outlet connector is connected to the inlet of the electro-hydraulic pump 2 through a cooling water pipe.
[0035] like Figures 1 to 10 As shown, the liquid cooling plate main board 4 has a rectangular box structure. The middle part of the liquid cooling plate main board 4 is a liquid cooling cavity 24. The liquid cooling plate main board 4 has a liquid cooling plate cover plate connection hole 25. The liquid cooling plate cover plate connection hole 25 is connected to the liquid cooling plate cover plate 5 by bolts. Several liquid cooling plate main board mounting holes 26 are provided on both sides of the liquid cooling plate main board 4. The liquid cooling plate main board mounting holes 26 are installed to the vehicle body by bolts.
[0036] like Figures 1 to 3 As shown, the flap control mechanism 9 is communicatively connected to the vehicle controller. The flap control mechanism 9 receives instructions from the vehicle controller and controls the adjusting flap 10 to open or close the through circuit 7.
Claims
1. An auxiliary heat dissipation device based on the Peltier effect, comprising a heat sink (1) and an electronic hydraulic pump (2), characterized in that: An auxiliary heat dissipation device (3) is connected between the radiator (1) and the electro-hydraulic pump (2). The auxiliary heat dissipation device (3) includes a liquid-cooled plate main board (4). The cavity of the liquid-cooled plate main board (4) is provided with a liquid-cooled plate cover (5). Several cooling plates (6) are provided at the bottom of the liquid-cooled plate cover (5). The cooling plates (6) divide the cavity of the liquid-cooled plate main board (4) into a through circuit (7) and a cooling circuit (8). The liquid-cooled plate cover (5) is provided with a flip-up control mechanism (9). The adjustment flap (10) and two sets of cooling water pipe joints (11) are provided. The flap control mechanism (9) opens or closes the direct circuit (7) through the adjustment flap (10). The two sets of cooling water pipe joints (11) are respectively connected to the radiator (1) and the electro-hydraulic pump (2). The top of the liquid cooling plate cover (5) is provided with a Peltier effect device (12). The top of the Peltier effect device (12) is provided with a heat sink (13) and a cooling fan (14).
2. A Peltier-effect-based auxiliary heat dissipation device according to claim 1, characterized in that: The heat sink (13) is an aluminum alloy structure. Several heat sinks (15) are provided in the middle of the heat sink (13). A base plate (16) is provided at the bottom of the heat sinks (15). Several heat sink mounting holes (17) are provided in the base plate (16). The heat sink mounting holes (17) are installed to the upper end of the liquid cooling plate cover (5) by bolts and heat insulation washers.
3. A Peltier-effect based heat-assisted device according to claim 2, characterized in that: The Peltier effect device (12) includes a heat-absorbing surface (18) and a heat-releasing surface (19). The heat-releasing surface (19) is in close contact with the bottom surface of the heat sink (15), and the heat-absorbing surface (18) is in close contact with the top surface of the liquid cooling plate cover (5).
4. The Peltier-effect-based heat-assistance dissipating device according to claim 1, characterized in that: A cooling fan bracket (20) is provided between the heat sink (13) and the cooling fan (14). The cooling fan bracket (20) has several bracket mounting holes (21) and several cooling fan connection holes (22). The bracket mounting holes (21) are bolted to the upper end of the heat sink (13), and the cooling fan (14) is bolted to the several cooling fan connection holes (22). A blocking plate (23) is provided on one side of the cooling fan bracket (20).
5. The auxiliary heat dissipation device based on the Peltier effect according to claim 1, characterized in that: The two sets of cooling water pipe joints (11) include an inlet joint and an outlet joint. The inlet joint is connected to the outlet of the radiator (1) through a cooling water pipe, and the outlet joint is connected to the inlet of the electro-hydraulic pump (2) through a cooling water pipe.
6. The Peltier-effect-based heat-assistance dissipating device according to claim 1, characterized in that: The liquid cooling plate main board (4) has a rectangular box structure. The middle part of the liquid cooling plate main board (4) is a liquid cooling cavity (24). The liquid cooling plate main board (4) has a liquid cooling plate cover plate connection hole (25). The liquid cooling plate cover plate connection hole (25) is connected to the liquid cooling plate cover plate (5) by bolts. Several liquid cooling plate main board mounting holes (26) are provided on both sides of the liquid cooling plate main board (4). The liquid cooling plate main board mounting holes (26) are installed to the vehicle body by bolts.
7. The Peltier-effect-based heat-assistance dissipating device according to claim 1, characterized in that: The flap control mechanism (9) is in communication connection with the vehicle controller, the flap control mechanism (9) receives the instruction of the vehicle controller, and controls the adjusting flap (10) to open or close the straight-through loop (7).