Display substrate and display device

Abstract

The utility model provides a display substrate. The display substrate comprises a substrate body; a plurality of pixels including a first pixel, a second pixel, and a third pixel; the flat layer comprises a first groove part, a second groove part and a third groove part, and the first groove part, the second groove part and the third groove part are located in the first pixel, the second pixel and the third pixel respectively; the reflecting layer comprises a first reflecting part, a second reflecting part and a third reflecting part which are respectively positioned on the bottoms and the side walls of the first groove part, the second groove part and the third groove part and comprise bottom parts and side wall parts; the first electrode layer comprises a first sub-electrode, a second sub-electrode and a third sub-electrode which are located on the sides, away from the substrate, of the first reflection part, the second reflection part and the third reflection part respectively; the distances between the surfaces, far away from the substrate, of the bottoms of the first reflection part, the second reflection part and the third reflection part and the surface, close to one side of the reflection layer, of the substrate are not equal; the distances between the surfaces, away from the substrate, of the first sub-electrode, the second sub-electrode and the third sub-electrode and the surface, close to one side of the reflecting layer, of the substrate are equal.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to display substrates and their preparation methods, and display devices. Background Technology

[0002] Organic Light Emitting Diode (OLED) panels possess self-emissive properties, enabling them to achieve infinite contrast and display purer blacks and richer color gradations. White Organic Light-Emitting Diode (WOLED) displays typically employ a series structure of R+G (red-green) units and B (blue) units to emit white light, combined with a color filter to achieve color display. However, due to the different emission efficiencies of red, green, and blue light in the top-emitting device of a WOLED, a single strong emission cannot be achieved simultaneously in this device structure. Consequently, the addition of a color filter significantly reduces the overall light emission efficiency of the device.

[0003] The information disclosed in this section is only for understanding the background of the inventive concept of this disclosure, and therefore may include information that does not constitute prior art. Utility Model Content

[0004] To address at least one aspect of the above-mentioned problems, embodiments of this disclosure provide a display substrate, a method for preparing the same, and a display device.

[0005] One aspect of the embodiments of this disclosure provides a display substrate, comprising:

[0006] Substrate;

[0007] Multiple pixels are located on one side of the substrate, and the multiple pixels are arranged in an array along a first direction and a second direction. The multiple pixels include a first pixel, a second pixel and a third pixel.

[0008] A planarization layer, located on one side of the substrate, includes a first groove, a second groove, and a third groove, which are respectively located in the first pixel, the second pixel, and the third pixel;

[0009] A reflective layer, comprising a first reflective portion, a second reflective portion, and a third reflective portion, respectively located on the bottom and sidewall of the first groove portion, the second groove portion, and the third groove portion, wherein the first reflective portion, the second reflective portion, and the third reflective portion each include a bottom portion and a sidewall portion; and

[0010] The first electrode layer includes a first sub-electrode, a second sub-electrode, and a third sub-electrode, which are respectively located on the side of the first reflective portion, the second reflective portion, and the third reflective portion away from the substrate.

[0011] Wherein, the distances between the bottom surfaces of the first reflective portion, the second reflective portion, and the third reflective portion away from the substrate and the surface of the substrate near the reflective layer are respectively a first distance, a second distance, and a third distance, and the first distance, the second distance, and the third distance are not equal to each other; the distances between the surfaces of the first sub-electrode, the second sub-electrode, and the third sub-electrode away from the substrate and the surface of the substrate near the reflective layer are equal to each other.

[0012] According to some exemplary embodiments, the depth of the first groove is greater than the depth of the second groove, and the depth of the second groove is greater than the depth of the third groove; and

[0013] The first distance is less than the second distance, and the second distance is less than the third distance.

[0014] According to some exemplary embodiments, the display substrate further includes:

[0015] A microcavity modulation layer is located on the side of the reflective layer away from the substrate, and includes a first microcavity portion, a second microcavity portion, and a third microcavity portion, which are respectively located in the first groove portion, the second groove portion, and the third groove portion; the thickness of the first microcavity portion is greater than the thickness of the second microcavity portion, and the thickness of the second microcavity portion is greater than the thickness of the third microcavity portion.

[0016] According to some exemplary embodiments, the first microcavity includes a first sub-microcavity, a second sub-microcavity, and a third sub-microcavity; the second microcavity includes a fourth sub-microcavity and a fifth sub-microcavity; and the third microcavity includes a sixth sub-microcavity. The second sub-microcavity and the fourth sub-microcavity are located on the same layer, and the third sub-microcavity, the fifth sub-microcavity, and the sixth sub-microcavity are located on the same layer.

[0017] The surfaces of the first, second, and third microcavities away from the substrate are equidistant from the surface of the substrate near the reflective layer.

[0018] According to some exemplary embodiments, the first sub-electrode, the second sub-electrode, and the third sub-electrode are respectively connected to the upper edge of the sidewall portion of the first reflective portion, the second reflective portion, and the third reflective portion;

[0019] The orthographic projection of the sidewall portion of the reflective layer onto the substrate surrounds at least a portion of the orthographic projection of the first electrode layer onto the substrate.

[0020] According to some exemplary embodiments, the first sub-electrode, the second sub-electrode, and the third sub-electrode are respectively connected to the sidewall portions of the first reflective portion, the second reflective portion, and the third reflective portion away from the surface of the substrate.

[0021] The orthographic projection of the first electrode layer on the substrate covers the orthographic projection of the sidewall portion of the reflective layer on the substrate.

[0022] According to some exemplary embodiments, the shapes of the orthographic projections of the first sub-electrode, the second sub-electrode, and the third sub-electrode on the substrate are different from the shapes of the orthographic projections of the first reflective portion, the second reflective portion, and the third reflective portion on the substrate.

[0023] According to some exemplary embodiments, the orthographic projections of the first reflective portion, the second reflective portion, and the third reflective portion on the substrate are regular polygons, and the orthographic projections of the first sub-electrode, the second sub-electrode, and the third sub-electrode on the substrate are circles.

[0024] According to some exemplary embodiments, the first sub-electrode, the second sub-electrode, and the third sub-electrode are respectively located in the first groove, the second groove, and the third groove, and the surfaces of the first sub-electrode, the second sub-electrode, and the third sub-electrode away from the substrate are respectively flush with the surface of the planarization layer away from the substrate; or

[0025] The first sub-electrode, the second sub-electrode, and the third sub-electrode are located outside the first groove portion, the second groove portion, and the third groove portion, respectively. The surfaces of the first sub-electrode, the second sub-electrode, and the third sub-electrode near the substrate are respectively flush with the surfaces of the planarization layer away from the substrate.

[0026] According to some exemplary embodiments, the display substrate further includes:

[0027] A pixel defining layer is located on the side of the first electrode layer away from the substrate. The pixel defining layer includes a first pixel opening, a second pixel opening, and a third pixel opening. The orthographic projections of the first pixel opening, the second pixel opening, and the third pixel opening on the substrate are respectively located within the orthographic projections of the first reflective portion, the second reflective portion, and the third reflective portion on the substrate.

[0028] According to some exemplary embodiments, the pixel defining layer includes a first pixel defining portion, a second pixel defining portion, and a third pixel defining portion. The first pixel defining portion is located between a first pixel opening and a second pixel opening. The second pixel defining portion is located between a second pixel opening and a third pixel opening. The third pixel defining portion is located between a third pixel opening and a first pixel opening. The surfaces of the first pixel defining portion, the second pixel defining portion, and the third pixel defining portion that are away from the substrate are equidistant from the surfaces of the substrate that are near the reflective layer.

[0029] According to some exemplary embodiments, the display substrate further includes:

[0030] The second electrode layer includes a main body and an extension. The main body is located on the side of the first electrode layer away from the substrate. The main body includes a first sub-main body, a second sub-main body, and a third sub-main body. The orthographic projections of the first sub-main body, the second sub-main body, and the third sub-main body on the substrate respectively cover the orthographic projections of the first sub-electrode, the second sub-electrode, and the third sub-electrode on the substrate. The surfaces of the first sub-main body, the second sub-main body, and the third sub-main body away from the substrate are equidistant from the surfaces of the substrate near the reflective layer. The extension is connected to the main body, and the orthographic projection of the extension on the substrate surrounds the display area.

[0031] According to some exemplary embodiments, the display substrate further includes:

[0032] A power supply adapter structure is provided, wherein the extension provides power to the main body through the power supply adapter structure. The power supply adapter structure includes a first adapter structure, a second adapter structure, and a third adapter structure. The first adapter structure is located on the same layer as the third reflective part, the second adapter structure is located on the same layer as the third microcavity part, and the third adapter structure is located on the same layer as the third sub-electrode.

[0033] According to some exemplary embodiments, the display substrate further includes:

[0034] A driving circuit layer is located on one side of the substrate.

[0035] The connection layer includes a first connection portion, a second connection portion, and a third connection portion. The first reflective portion, the second reflective portion, and the third reflective portion are electrically connected to the driving circuit layer through the first connection portion, the second connection portion, and the third connection portion, respectively. The height of the first connection portion is less than the height of the second connection portion, and the height of the second connection portion is less than the height of the third connection portion.

[0036] In another aspect of the embodiments of this disclosure, a display device is provided, the display device comprising a display substrate according to any of the preceding claims. Attached Figure Description

[0037] Other objects and advantages of this disclosure will become apparent from the following description of the disclosure with reference to the accompanying drawings, and will help to provide a comprehensive understanding of the disclosure.

[0038] Figure 1A A schematic cross-sectional view of a display substrate in the related art is shown;

[0039] Figure 1BThe schematic diagram shows an electron microscope image of a step in the pixel-defining layer in the related art;

[0040] Figure 2 The schematic diagram illustrates a planar structure of a display substrate according to some exemplary embodiments of the present disclosure;

[0041] Figure 3A A cross-sectional view of a display substrate according to some exemplary embodiments of the present disclosure is schematically shown;

[0042] Figures 3B-3C Schematic illustration Figure 3A Partial cross-sectional view;

[0043] Figures 4A-4C The diagram schematically illustrates cross-sectional and plan views of the relative positions of the reflective layer and the first electrode layer according to some exemplary embodiments of the present disclosure;

[0044] Figure 4D A schematic diagram of pixel openings of different shapes in related technologies is shown.

[0045] Figure 5 A cross-sectional view schematically illustrating the relative positions of a pixel-defining layer and a reflective layer according to some exemplary embodiments of the present disclosure;

[0046] Figure 6 The illustration schematically shows a cross-sectional view of a display substrate including a cathode ring structure according to some exemplary embodiments of the present disclosure;

[0047] Figure 7 A schematic diagram of the structure of a display device provided for an embodiment of this disclosure;

[0048] Figure 8 A flowchart illustrating a method for fabricating a display substrate according to an embodiment of the present disclosure is shown schematically.

[0049] Figures 9A-9B A flowchart illustrating the fabrication process of a display substrate according to an embodiment of the present disclosure is shown schematically.

[0050] Figures 10A-10I A cross-sectional view schematically illustrating a method for fabricating a display substrate according to an embodiment of the present disclosure is shown.

[0051] It should be noted that, for clarity, the dimensions of layers, structures, or regions in the accompanying drawings used to describe embodiments of this disclosure may be enlarged or reduced; that is, these drawings are not drawn to actual scale. Detailed Implementation

[0052] The technical solutions of this disclosure will be further described in detail below through embodiments and in conjunction with the accompanying drawings. In this specification, the same or similar reference numerals indicate the same or similar components. The following description of the embodiments of this disclosure with reference to the accompanying drawings is intended to explain the overall inventive concept of this disclosure and should not be construed as a limitation thereof.

[0053] Furthermore, in the following detailed description, numerous specific details are set forth for ease of explanation to provide a thorough understanding of the embodiments disclosed herein. However, it will be apparent that one or more embodiments may be practiced without these specific details.

[0054] It should be understood that although the terms first, second, etc., may be used herein to describe different elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of the exemplary embodiments, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0055] It should be understood that when an element or layer is referred to as being "formed on" another element or layer, that element or layer may be formed directly or indirectly on the other element or layer. That is, for example, intermediate elements or intermediate layers may exist. Conversely, when an element or layer is referred to as being "directly formed on" another element or layer, there are no intermediate elements or intermediate layers. Other terms used to describe relationships between elements or layers (e.g., "between" and "directly between," "adjacent" and "directly adjacent," etc.) should be interpreted in a similar manner. Furthermore, the X-axis, Y-axis, and Z-axis are not limited to the three axes of a Cartesian coordinate system and can be interpreted in a broader sense. For example, the X-axis, Y-axis, and Z-axis may be perpendicular to each other or may represent different directions that are not perpendicular to each other. For the purposes of this disclosure, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" can be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z such as XYZ, XY, XZ, and YZ.

[0056] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments. As used herein, the singular forms are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will also be understood that when the terms “comprising” and / or “including” are used herein, it indicates the presence of the stated features, integrals, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or combinations thereof.

[0057] In this document, unless otherwise expressly specified and limited, the term “connection” should be interpreted broadly. For example, “connection” can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium.

[0058] It should be noted that in this paper, "same layer" refers to a layer structure formed by using the same film deposition process to form a film layer for a specific pattern, and then using the same mask to pattern that film layer in a single patterning process. Depending on the specific pattern, a single patterning process may include multiple exposure, development, or etching processes, and the specific pattern in the formed layer structure can be continuous or discontinuous. That is, multiple elements, components, structures, and / or portions located in the "same layer" are made of the same or different materials and are formed by the same single patterning process. Typically, multiple elements, components, structures, and / or portions located in the "same layer" have approximately the same thickness.

[0059] Those skilled in the art will understand that, unless otherwise stated herein, the terms “height,” “thickness,” or “depth” refer to the dimensions along the surface of each film layer disposed perpendicular to the display substrate, i.e., the dimensions along the light-emitting direction of the display substrate, or the dimensions along the normal direction of the display device.

[0060] White organic light-emitting diodes (WOLEDs) typically employ a series structure of red-green (R+G) and blue (B) units to emit white light, combined with a color filter to achieve color display. However, due to the different emission efficiencies of red, green, and blue light in WOLED top-emitting devices, a single strong emission cannot be achieved simultaneously in this device structure. This results in a significant decrease in the light emission efficiency of the device after adding a color filter. Related technologies use optical adjustment layers to change the cavity length of each pixel unit to address the low light emission efficiency problem.

[0061] Figure 1A A schematic cross-sectional view of a display substrate in the related art is shown. Figure 1B The diagram illustrates an electron microscope image of a step pattern appearing in the pixel-defining layer in a related art.

[0062] Referring to Figure 1, the display substrate 100 includes a substrate 011, a driving circuit layer 012, a tungsten aperture 013, a reflective metal layer 014, an anode 015, a pixel defining layer 016, a light-emitting layer 017, a cathode 018, a color filter layer 019, and a lens 020. By using isolation layers IL0 of different thicknesses in different pixels, microcavity structures of different cavity lengths can be achieved. The microcavity effect allows for amplification of red, green, and blue light. However, the significant height difference between the electrodes of different pixels can easily lead to breakage of the cathode 018. Simultaneously, the significant height difference between the reflective metal layer 014 and the anode 015 makes it difficult to fabricate the pixel defining layer 016 flat, easily resulting in stepped defects, such as… Figure 1B The area highlighted in the Chinese box is shown. When light passes through the uneven pixel definition layer, diffuse reflection occurs, creating a halo effect and reducing contrast.

[0063] To address at least one of the above problems, embodiments of this disclosure provide a display substrate, a method for preparing the same, and a display device.

[0064] Figure 2 The diagram illustrates a planar structure of a display substrate according to some exemplary embodiments of the present disclosure. Figure 3A A cross-sectional view of a display substrate according to some exemplary embodiments of the present disclosure is schematically shown. Figures 3B-3C Schematic illustration Figure 3A Partial cross-sectional views; for example, Figures 3A-3C It can be along the display substrate Figure 2 The cross-sectional view taken from line AA' in the diagram.

[0065] Exemplary, in some embodiments of this disclosure, reference is made to Figure 2 The display substrate 200 includes a display area AA and a plurality of pixel units PX located within the display area AA. Each pixel unit PX includes a plurality of pixels SP. The plurality of pixels SP are arranged in an array along a first direction X and a second direction Y. For example, the plurality of pixels include a first pixel SP1, a second pixel SP2, and a third pixel SP3 that are adjacent in the first direction X. For example, the first pixel SP1 is blue, the second pixel SP2 is red, and the third pixel SP3 is green. The display substrate 200 also includes a pixel defining layer 18, which has a plurality of pixel openings 181 that define the plurality of pixels SP. The pixel openings may be opening regions that include light-emitting areas.

[0066] Exemplary, in some embodiments of this disclosure, reference is made to Figure 2 and Figure 3AThe display substrate 200 includes a substrate 11 and a first electrode layer 17 disposed on the substrate 11. The substrate 11 is, for example, a silicon-based substrate. Silicon-based substrates have mature manufacturing processes and stable performance, making them suitable for fabricating highly integrated micro-display devices. For example, the display device is a silicon-based micro-organic light-emitting diode display device. The first electrode layer 17 includes a plurality of first sub-electrodes 171, second sub-electrodes 172, and third sub-electrodes 173. The plurality of first sub-electrodes 171, second sub-electrodes 172, and third sub-electrodes 173 are arranged in an array in a first direction X and a second direction Y. The orthographic projections of a plurality of pixel openings 181 on the substrate 11 fall within the orthographic projections of the plurality of first sub-electrodes 171 on the substrate 11. That is, the plurality of first sub-electrodes 171 correspond one-to-one with the positions of a plurality of pixels SP, and the area of ​​the first electrode layer 17 is larger than the light-emitting area of ​​the pixel.

[0067] In some embodiments of this disclosure, reference is made to Figures 3A-3C The display substrate 200 includes a driving circuit layer 12 located on the substrate 11. The driving circuit layer 12 includes a driving circuit, which comprises a voltage control circuit and a pixel circuit. The connection layer 13 includes a first connection portion 131, a second connection portion 132, and a third connection portion 133. The first reflective portion 151, the second reflective portion 152, and the third reflective portion 153 are respectively connected to the driving circuit layer 12 through the first connection portion 131, the second connection portion 132, and the third connection portion 133. The height s1 of the first connection portion 131 is less than the height s2 of the second connection portion 132, and the height s2 of the second connection portion 132 is less than the height s3 of the third connection portion 133.

[0068] In some embodiments of this disclosure, the display substrate 200 includes a planarization layer 14 located on one side of the substrate 11. The planarization layer 14 includes a first groove portion 141, a second groove portion 142 and a third groove portion 143, which are respectively located in the first pixel SP1, the second pixel SP2 and the third pixel SP3.

[0069] The display substrate 200 also includes a reflective layer 15, which includes a first reflective portion 151, a second reflective portion 152 and a third reflective portion 153, which are located on the bottom and sidewall of the first groove portion 141, the second groove portion 142 and the third groove portion 143, respectively. The first reflective portion 151, the second reflective portion 152 and the third reflective portion 153 each include a bottom portion 1511 and a sidewall portion 1512.

[0070] The display substrate 200 further includes a first electrode layer 17, which includes a first sub-electrode 171, a second sub-electrode 172, and a third sub-electrode 173, located on the side of the first reflective portion 151, the second reflective portion 152, and the third reflective portion 153 away from the substrate 11, respectively. The distances between the bottom 1511 of the first reflective portion 151, the surface away from the substrate 11, and the surface of the substrate 11 near the reflective layer 15 are a first distance d1, a second distance d2, and a third distance d3, respectively, and these distances are not equal. The distance d4 between the surface of the first sub-electrode 171, the second sub-electrode 172, and the third sub-electrode 173 away from the substrate 11 and the surface of the substrate 11 near the reflective layer 15 are equal.

[0071] For example, a planarization layer 14 covers the driving circuit layer 12. The material of the planarization layer 14 can be an organic resin material, such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin. These materials have good insulating properties and film-forming properties, and can effectively cover particles and defects on the substrate 11 to form a flat and smooth surface. In this way, the planarization layer 14 can significantly reduce optical and electrical non-uniformity caused by unevenness of the substrate 11 surface, thereby improving display quality. In addition, the planarization layer 14 can also improve the electrical connection between the driving circuit layer 12 and the OLED structure. By providing openings in the planarization layer 14, the electrical connection between the driving circuit layer 12 and the OLED structure can be realized, while reducing electrical interference and ensuring stable signal transmission.

[0072] According to some exemplary embodiments, a first recess 141, a second recess 142, and a third recess 143 are formed in the planarization layer 14 by etching to form a space that at least accommodates the reflective layer 15 and the microcavity modulation layer 16. The first recess 141, the second recess 142, and the third recess 143 are located in the first pixel SP1, the second pixel SP2, and the third pixel SP3, respectively. The depth h1 of the first recess 141 is greater than the depth h2 of the second recess 142, the depth h2 of the second recess 142 is greater than the depth h3 of the third recess 143, and the thickness of the planarization layer 14 is greater than the depth h1 of the first recess 141; for example, the thickness h4 of the planarization layer 14 is greater than...

[0073] Reference Figures 3A-3CThe cross-sections of the first groove 141, the second groove 142, and the third groove 143 along the light-emitting direction of the display substrate can be designed as inverted trapezoids. The beveled design of the inverted trapezoidal structure allows for better coverage of the sidewalls and bottom during metal deposition. Metal atoms gradually deposit along the beveled edge during the deposition process, forming a continuous film layer. Compared to grooves with vertical sidewalls, this structure can significantly improve the coverage of metal on the sidewalls and bottom, thereby achieving a more uniform and continuous metal layer.

[0074] The display substrate 200 includes a reflective layer 15, which is deposited onto the bottom and sidewalls of the first recess 141, the second recess 142, and the third recess 143 via a deposition process. The inverted trapezoidal structure of the recesses facilitates continuous coverage of the reflective layer 15 across the entire recess surface. The reflective material portion protruding from the upper surface of the planarization layer 14 is removed by a chemical mechanical planarization (CMP) process. Since the depth h1 of the first recess 141 is greater than the depth h2 of the second recess 142, and the depth h2 of the second recess 142 is greater than the depth h3 of the third recess 143, the first distance d1 between the bottom surface of the first reflective portion 151 away from the substrate 11 and the surface of the substrate 11 near the reflective layer 15 is less than the second distance d2 between the bottom surface of the second reflective portion away from the substrate 11 and the surface of the substrate 11 near the reflective layer 15. The second distance d2 is less than the third distance d3 between the bottom surface of the third reflective portion away from the substrate 11 and the surface of the substrate 11 near the reflective layer 15.

[0075] For example, the reflective layer 15 is made of aluminum and titanium. Aluminum is used for the reflective layer 15 because it has good reflective properties and is relatively inexpensive. Titanium protects the aluminum, preventing its migration and affecting the overall device function. The reflective layer 15 is electrically connected to the driving circuit layer 12 via a connecting layer 13, which is made of a metal, such as tungsten. Vias filled with tungsten are also called tungsten vias (W-vias). The fabrication process for tungsten vias is mature, and their formation ensures the stability of the conductive path, thus reducing the contact resistance between the reflective layer 15 and the driving circuit layer 12.

[0076] In some embodiments of this disclosure, the display substrate 200 further includes a microcavity modulation layer 16 located on the side of the reflective layer 15 away from the substrate 11. The microcavity modulation layer 16 includes a first microcavity portion 161, a second microcavity portion 162, and a third microcavity portion 163, which are respectively located in a first recessed portion 141, a second recessed portion 142, and a third recessed portion 143. The thickness t1 of the first microcavity portion 161 is greater than the thickness t2 of the second microcavity portion 162, and the thickness t2 of the second microcavity portion 162 is greater than the thickness t3 of the third microcavity portion 163.

[0077] For example, refer to Figures 3A-3C The first microcavity 161 is located in the first pixel SP1, the second microcavity 162 is located in the second pixel SP2, and the third microcavity 163 is located in the third pixel SP3. The microcavity modulation layer 16 is a light-transmitting material, allowing light emitted from the light-emitting functional layer 19 to pass through and reach the reflective layer 15 for reflection. For example, the microcavity modulation layer 16 can have high light transmittance, and the light reflected by the reflective layer 15 is emitted outward with almost no loss, thus ensuring high light output brightness and high light output efficiency of the display substrate.

[0078] In the embodiments of this disclosure, by employing first microcavity portions 161, second microcavity portions 162, and third microcavity portions 163 of different thicknesses in the first pixel SP1, second pixel SP2, and third pixel SP3, microcavities of different lengths can be realized. Utilizing the strong microcavity effect, the light emitted by the light-emitting layer of each pixel near the wavelength corresponding to the resonant wavelength of the microcavity length is enhanced and its spectrum broadened, while light of other wavelengths not corresponding to the resonant wavelength is weakened and its spectrum narrowed. Since the color of the light emitted from each pixel's light-emitting structure layer is the same as the color of the light allowed to pass through the corresponding color filter layer 21, the light energy loss through the color filter layer 21 is minimized, improving light extraction efficiency and thus enhancing display brightness.

[0079] In some embodiments of this disclosure, the first microcavity 161 includes a first sub-microcavity 1611, a second sub-microcavity 1612, and a third sub-microcavity 1613; the second microcavity 162 includes a second sub-microcavity 1612 and a third sub-microcavity 1613; and the third microcavity 163 includes a third sub-microcavity 1613. The surfaces of the first microcavity 161, the second microcavity 162, and the third microcavity 163 that are away from the substrate 11 are equidistant from the surface of the substrate 11 that is near the reflective layer 15.

[0080] Reference Figure 3C A microcavity modulation layer 16 is formed on the reflective layer 15. The fabrication method includes: forming a first sub-microcavity portion 1611 on the first reflective portion 151 through a first patterning process; forming a second sub-microcavity portion 1612 and a fourth sub-microcavity portion 1614 on the first reflective portion 151 and the second reflective portion 152 respectively through a second patterning process; and forming a third sub-microcavity portion 1613, a fifth sub-microcavity portion 1615, and a sixth sub-microcavity portion 1616 on the first reflective portion 151, the second reflective portion 152, and the third reflective portion 153 respectively through a third patterning process. The microcavity modulation layer 16 is made of oxide material, and the thickness of the different sub-microcavities is different, thereby obtaining microcavities of different thicknesses as required. The upper surfaces of the first microcavity portion 161, the second microcavity portion 162, and the third microcavity portion 163 are flush, so that the subsequently fabricated first electrode layer 17, pixel defining layer 18, and second electrode layer 20 have no step difference.

[0081] For example, the thickness of the first sub-microcavity 1611 is The thicknesses of the second sub-microcavity 1612 and the fourth sub-microcavity 1614 are The thicknesses of the third sub-microcavity 1613, the fifth sub-microcavity 1615, and the sixth sub-microcavity 1616 are: By combining these sub-microcavities of different thicknesses, the total thickness of the first microcavity 161 is obtained as follows: The total thickness of the second microcavity 162 is The total thickness of the third microcavity 163 is

[0082] In the embodiments of this disclosure, a microcavity structure is formed between the reflective portion in each pixel and the second electrode layer 20. The microcavity length refers to the optical length between two reflective mirrors. By precisely controlling the total thickness of the first microcavity portion 161, the second microcavity portion 162, and the third microcavity portion 163, the microcavity length can be effectively controlled, thereby achieving the adjustment of the emission wavelength of different pixels.

[0083] Figures 4A-4C The diagram schematically illustrates cross-sectional and plan views of the relative positions of the reflective layer and the first electrode layer according to some exemplary embodiments of the present disclosure. Figure 4D The diagram schematically illustrates a plan view of pixel openings of different shapes in the related art.

[0084] In some embodiments of this disclosure, the first sub-electrode 171, the second sub-electrode 172, and the third sub-electrode 173 are respectively connected to the upper edge of the sidewall portion of the first reflective portion 151, the second reflective portion 152, and the third reflective portion 153; the orthographic projection of the sidewall portion of the reflective layer 15 on the substrate 11 surrounds at least a portion of the orthographic projection of the first electrode layer 17 on the substrate 11.

[0085] Reference Figures 4A-4C The first sub-electrode 171 is connected to the side or upper surface of the sidewall of the first reflective portion 151. In the orthographic projection on the substrate 11, the connection between the two forms a ring and is located at the edge of the first sub-electrode 171. This design maximizes the aperture ratio and avoids connecting the first sub-electrode 171 and the first reflective portion 151 by drilling holes. Drilling holes would occupy the area that could originally be used for light transmission, reducing the area of ​​the effective light-transmitting area and thus reducing the aperture ratio. By adopting this ring-shaped edge connection method, the effective light-transmitting area is preserved, thereby improving the brightness and optical performance of the display device. The relative positions of the second sub-electrode 172 and the second reflective portion 152, and the third sub-electrode 173 and the third reflective portion 153 can be the same as or similar to the relative positions of the first sub-electrode 171 and the first reflective portion 151, and will not be described further here.

[0086] Reference Figure 4D In related technologies, the punching process leads to a loss in aperture ratio, with a maximum aperture ratio of 52.93%. For example, when the pixel aperture is circular, the maximum achievable aperture ratio is 42.54%, a loss of approximately 10.39% compared to the maximum aperture ratio; when the pixel aperture is elliptical, the maximum achievable aperture ratio is 44.6%, a loss of approximately 8.33% compared to the maximum aperture ratio; and when the pixel aperture is octagonal, the maximum achievable aperture ratio is 46.64%, an increase of approximately 2% compared to the elliptical aperture, but still a loss of approximately 6.3% compared to the maximum aperture ratio. In the embodiments of this disclosure, since the punching process is avoided, it is not limited by the maximum aperture ratio in conventional punching processes, thereby enabling the achievement of a higher aperture ratio.

[0087] In some embodiments of this disclosure, the first sub-electrode 171, the second sub-electrode 172, and the third sub-electrode 173 are respectively connected to the surfaces of the first reflective portion 151, the second reflective portion 152, and the third reflective portion 153 away from the substrate 11; the orthographic projection of the first electrode layer 17 on the substrate 11 covers the orthographic projection of the sidewall portion of the reflective layer 15 on the substrate 11. The orthographic projections of the first pixel opening 181, the second pixel opening 182, and the third pixel opening 183 on the substrate 11 are respectively located within the orthographic projections of the first reflective portion 151, the second reflective portion 152, and the third reflective portion 153 on the substrate 11.

[0088] Reference Figures 4B-4C The first sub-electrode 171 is connected to the upper surface of the first reflective portion 151, and the first sub-electrode 171 completely covers the first reflective portion 151. That is, the orthogonal projection area of ​​the first electrode layer 17 on the substrate 11 is greater than the orthogonal projection area of ​​the sidewall portion of the reflective layer 15 on the substrate 11. This design helps to increase the contact area between the first sub-electrode 171 and the first reflective portion 151, effectively avoiding poor electrical connection caused by misalignment, thereby improving the stability and reliability of the device.

[0089] Reference Figures 4A-4B The first sub-electrode 171 may be located in the first recess 141, and the surface of the first sub-electrode 171 away from the substrate 11 is flush with the surface of the first recess 141 away from the substrate 11. (Refer to...) Figure 4C The first sub-electrode 171 can be located outside the first groove portion 141, and the first sub-electrode 171, the second sub-electrode 172, and the third sub-electrode 173 are located on the same plane. At this time, the upper edge of the first electrode layer 17 can act as a planarization layer, so that the pixel defining layer 18 can be fabricated flat, thereby avoiding diffuse reflection.

[0090] In some embodiments of this disclosure, the shapes of the orthographic projections of the first sub-electrode 171, the second sub-electrode 172, and the third sub-electrode 173 onto the substrate 11 are different from the shapes of the orthographic projections of the first reflective portion 151, the second reflective portion 152, and the third reflective portion 153 onto the substrate 11. For example, the orthographic projections of the first reflective portion 151, the second reflective portion 152, and the third reflective portion 153 onto the substrate 11 are regular polygons, while the orthographic projections of the first sub-electrode 171, the second sub-electrode 172, and the third sub-electrode 173 onto the substrate 11 are circles.

[0091] In at least some embodiments, reference is made to Figures 4A-4C The shape of the orthographic projection of the first reflective portion 151 onto the substrate 11 can be various regular shapes, such as rectangles, circles, ellipses, parallelograms, regular polygons, trapezoids, etc. Alternatively, the first reflective portion 151 can also have irregular shapes, such as zigzag, curved, honeycomb, etc. Within the orthographic projection on the substrate 11, the shape of the first reflective portion 151 can be the same as or different from the shape of the first sub-electrode 171. For example, within the orthographic projection on the substrate 11, the shape of the first reflective portion 151 is the same as the shape of the first sub-electrode 171. In this way, the reflection by the first reflective portion 151 ensures more uniform brightness of the emitted light. For another example, the shape of the first sub-electrode 171 is circular, and the shape of the first reflective portion 151 is regular hexagonal. Further, in this case, the orthographic projection of the circular first sub-electrode 171 onto the plane of the substrate 11 covers the orthographic projection of the regular hexagonal first reflective portion 151 onto the plane of the substrate 11. In this way, almost all the light passing through the circular first sub-electrode 171 is incident on the regular hexagonal first reflective portion 151 and reflected, thereby improving the light extraction efficiency and brightness of the display substrate. The shapes of the second sub-electrode and the second reflective portion, and the third sub-electrode and the third reflective portion can be the same as or similar to the shapes of the first sub-electrode 171 and the first reflective portion 151, which will not be described in detail here.

[0092] Figure 5 A schematic cross-sectional view illustrating the relative positions of a pixel-defining layer and a reflective layer according to some exemplary embodiments of the present disclosure is shown.

[0093] Reference Figure 3A and Figure 5In some embodiments of this disclosure, the display substrate 200 further includes a pixel defining layer 18, which is located on the side of the first electrode layer 17 away from the substrate 11. The pixel defining layer 18 includes a first pixel opening 181, a second pixel opening 182, and a third pixel opening 183. The orthographic projections of the first pixel opening 181, the second pixel opening 182, and the third pixel opening 183 on the substrate 11 are respectively located within the orthographic projections of the first reflective portion 151, the second reflective portion 152, and the third reflective portion 153 on the substrate 11. The pixel defining layer 18 includes a first pixel defining portion 184, a second pixel defining portion 185, and a third pixel defining portion 186. The first pixel defining portion 184 is located between the first pixel opening 181 and the second pixel opening 182. The second pixel defining portion 185 is located between the second pixel opening 182 and the third pixel opening 183. The third pixel defining portion 186 is located between the third pixel opening 183 and the first pixel opening 181. The distance d5 between the surfaces of the first pixel defining portion 184, the second pixel defining portion 185, and the third pixel defining portion 186 away from the substrate 11 and the surface of the substrate 11 near the reflective layer 15 is equal to each other.

[0094] For example, the pixel defining layer 18 includes a first pixel defining portion 184 located between two adjacent first pixel openings 181 and second pixel openings 182. The first pixel defining portion 184 has an undercut structure UDC on both the side facing the first pixel opening 181 and the side facing the second pixel opening 182. The display substrate 200 also includes a light-emitting functional layer 19 disposed on the side of the pixel defining layer 18 away from the substrate 11, wherein the light-emitting functional layer 19 includes a charge generating layer 191. The charge generating layer 191 is interrupted at the undercut structure UDC.

[0095] For example, refer to Figure 5 In multilayer OLED devices, due to the high conductivity of the charge generation layer 191, lateral crosstalk between pixels can easily occur when the charge generation layers between adjacent pixels are not separated. By designing undercut structures at both ends of the pixel boundary, the charge generation layers between adjacent pixels can be disconnected at the undercut structures, thereby reducing lateral crosstalk between pixels and improving the display effect of the display substrate.

[0096] For example, the pixel demarcation layer 18 may include multiple pixel demarcation sublayers, and the materials of the multiple pixel demarcation sublayers may be the same or different. For example, refer to Figure 5The undercut structure UDC includes a first part UDC1, a second part UDC2, and a third part UDC3. The third part UDC3 is located on the side of the second part UDC2 away from the substrate 11. The second part UDC2 is recessed by a first distance n1 relative to the third part UDC3 in a direction away from the pixel opening. The first part UDC1 protrudes by a second distance n2 relative to the third part UDC3 in a direction toward the pixel opening. For example, the plurality of pixel defining sublayers may include a first pixel defining sublayer PDL1, a second pixel defining sublayer PDL2, and a third pixel defining sublayer PDL3. The material of the first pixel defining sublayer PDL1 may include SiO2. x ; and / or, the material of the second pixel defining sublayer PDL2 may include SiN x ; and / or, the material of the third pixel defining sublayer PDL3 includes SiO2. x Multiple pixel-defining sublayers can have different etching rates under the same etching process. For example, the etching rate of the second pixel-defining sublayer can be higher than that of the third pixel-defining sublayer. This allows the second part UDC2 to be recessed relative to the third part UDC3 in a direction away from the pixel opening during the etching process, forming a pixel-defining portion with an undercut structure. This effectively isolates the charge generation layer, reduces lateral crosstalk between pixels, lowers the leakage rate, improves the transfer rate of the display substrate, and enhances the display effect of the display substrate.

[0097] In some embodiments of this disclosure, refer back to Figure 3A The display substrate 200 further includes: a light-emitting functional layer 19 located on the side of the first electrode layer 17 away from the substrate 11; and a color filter layer 21 located on the side of the light-emitting functional layer 19 away from the substrate 11. The color filter layer 21 includes a first filter portion B, a second filter portion R, and a third filter portion G. The first filter portion B is located in a first pixel SP1, the second filter portion R is located in a second pixel SP2, and the third filter portion G is located in a third pixel SP3. Light emitted from the light-emitting functional layer 19 emits light of a first wavelength after passing through the first filter portion B, light emitted from the light-emitting functional layer 19 emits light of a second wavelength after passing through the second filter portion R, and light emitted from the light-emitting functional layer 19 emits light of a third wavelength after passing through the third filter portion G. For example, the third wavelength is greater than the first wavelength, and the second wavelength is greater than the third wavelength.

[0098] Exemplary examples, in some embodiments of this disclosure, the display substrate may include a silicon-based OLED display substrate. The silicon-based OLED can achieve color display using a white light + three-color filter approach. A white OLED typically includes multiple stacked light-emitting layers, with different layers producing different colors of light. White light is formed by mixing different colors of light, and further, this mixed white light is combined with a filter structure to achieve a color display effect. For example, different light-emitting layers may include a yellow light-emitting layer and a blue light-emitting layer, or a red-green mixed light-emitting layer and a blue light-emitting layer. White light emission can be achieved through a yellow and blue light mixing design, or a red-green mixed light and blue light mixing design.

[0099] In some embodiments of this disclosure, the display substrate 200 further includes: a second electrode layer 20 and an encapsulation layer TFE located on the side of the light-emitting functional layer 19 away from the substrate 11; an isolation layer IL located on the side of the color filter layer 21 away from the substrate 11; and a lens 22 located on the side of the second isolation layer IL2 away from the substrate 11.

[0100] In at least some embodiments, the first electrode layer 17 is a transparent electrode layer. For example, the first electrode layer 17 may be made of a light-transmitting material or a semi-light-transmitting material. Similarly, the second electrode layer 20 may also be a transparent electrode layer, for example, made of a light-transmitting material or a semi-light-transmitting material. Light-transmitting materials are, for example, transparent conductive oxides, including but not limited to indium tin oxide (ITO), indium zinc oxide (IZO), cadmium tin oxide (CTO), stannum dioxide (SnO2), and zinc oxide (ZnO). For example, the first electrode layer 17 is made of ITO. Because ITO has a higher work function than ordinary molybdenum and titanium metals, it is suitable as an OLED anode material, and because ITO has high transmittance, light emitted from the organic light-emitting functional layer 19 can pass through the first electrode layer with almost no loss, further improving the light extraction efficiency and brightness of the display device. In a silicon-based micro-OLED display device, one of the first electrode layer 17 and the second electrode layer 20 is used as an anode, and the other is used as a cathode. Lens 22 also includes a protective layer 23 on its surface. The material used to make lens 22 can be photoresist. The shape of the lens can be hemispherical, or other shapes that can focus light. Lens 22 acts as a light-focusing element, improving light efficiency while reducing the viewing angle. It can bring large-angle viewing angles into the positive viewing angle range and reduce stray light from large viewing angles.

[0101] Figure 6 The illustration schematically shows a cross-sectional view of a display substrate including a cathode ring structure according to some exemplary embodiments of the present disclosure.

[0102] In some embodiments of this disclosure, reference is made to Figure 3B and Figure 6 The second electrode layer 20 includes a main body 201 and an extension 202. The main body 201 includes a first sub-main body 2011, a second sub-main body 2012, and a third sub-main body 2013. The orthographic projections of the first sub-main body 2011, the second sub-main body 2012, and the third sub-main body 2013 onto the substrate 11 respectively cover the orthographic projections of the first sub-electrode 171, the second sub-electrode 172, and the third sub-electrode 173 onto the substrate 11. The distance d6 between the surfaces of the first sub-main body 2011, the second sub-main body 2012, and the third sub-main body 2013 away from the substrate 11 and the surface of the substrate 11 near the reflective layer 15 is equal to each other. The extension 202 is connected to the main body 201, and the orthographic projection of the extension 202 onto the substrate 11 surrounds the display area.

[0103] In some embodiments of this disclosure, the display substrate 200 further includes a power supply adapter structure 203, through which the extension 202 supplies power to the main body 201. The power supply adapter structure 203 includes a first adapter structure 2031, a second adapter structure 2032, and a third adapter structure 2033. The first adapter structure 2031 and the third reflective portion 153 are located on the same layer, the second adapter structure 2032 and the third microcavity portion 163 are located on the same layer, and the third adapter structure 2033 and the third sub-electrode 173 are located on the same layer.

[0104] The extension 202 surrounds the display area and together with the power supply transition structure 203 on the side closest to the substrate 11, forms a cathode ring structure. This cathode ring structure provides a stable electrical connection to the second electrode layer 20 via the electrical signal provided by the drive circuit layer. This design ensures that the current is evenly distributed throughout the display area, thereby improving the uniformity and consistency of the display effect. The power supply transition structure 203 has a similar structure to the third reflective portion 153, the third microcavity portion 163, and the third sub-electrode 173 of the third pixel SP3, and can be fabricated in the same layer as its corresponding portions. This in-layer fabrication method not only simplifies the process flow but also reduces additional manufacturing steps.

[0105] Embodiments of this disclosure also provide a display device, which may be an electroluminescent display device. When the display device is an electroluminescent display device, it may be an organic light-emitting diode (OLED) or a quantum dot light-emitting diode (QLED).

[0106] Figure 7This is a schematic diagram of the structure of a display device 1000 provided in an embodiment of the present disclosure. The display device 1000 includes a device body 300 and a display substrate 200 disposed on the device body 300. The device body 300 includes a housing and components such as a processor, power supply, and camera disposed within the housing. The display device 1000 may use the display substrate 200 provided in the above embodiment.

[0107] Display device 1000 may include any device or product with display functionality. For example, display device 1000 may be a smartphone, mobile phone, e-book reader, desktop computer (PC), laptop PC, netbook PC, personal digital assistant (PDA), portable multimedia player (PMP), digital audio player, mobile medical device, camera, wearable device (such as head-mounted device, electronic clothing, electronic bracelet, electronic necklace, electronic accessory, electronic tattoo, or smartwatch), television set, etc.

[0108] It should be understood that the display device 1000 according to some exemplary embodiments of the present disclosure has all the features and advantages of the display substrate 200 described above, which can be referred to in the above description of the display substrate 200 and will not be repeated here.

[0109] Figure 8 A flowchart illustrating a method for fabricating a display substrate according to an embodiment of the present disclosure is shown schematically. Figures 9A-9B A flowchart illustrating the fabrication process of a display substrate according to an embodiment of the present disclosure is shown schematically. Figures 10A-10I A cross-sectional view schematically illustrating a method for fabricating a display substrate according to an embodiment of the present disclosure is shown.

[0110] According to some exemplary embodiments, refer to Figure 3A and Figure 8 The method for preparing the display substrate 200 includes the following steps S810 to S840.

[0111] In step S810, a driving circuit layer 12 is formed on the substrate 11. The driving circuit layer 12 includes a plurality of driving circuits arranged in an array.

[0112] In step S820, a planarization layer 14 is formed on the side of the driving circuit layer 12 away from the substrate 11. The planarization layer 14 includes a first groove portion 141, a second groove portion 142 and a third groove portion 143, which are located in the first pixel SP1, the second pixel SP2 and the third pixel SP3, respectively.

[0113] In step S830, a reflective layer 15 is formed on the side of the planarization layer 14 away from the substrate 11. The reflective layer 15 includes a first reflective portion 151, a second reflective portion 152, and a third reflective portion 153, which are located on the bottom and sidewall of the first groove portion 141, the second groove portion 142, and the third groove portion 143, respectively. The first reflective portion 151, the second reflective portion 152, and the third reflective portion 153 each include a bottom portion and a sidewall portion.

[0114] In step S840, a first electrode layer 17 is formed on the side of the reflective layer 15 away from the substrate 11. The first electrode layer 17 includes a first sub-electrode 171, a second sub-electrode 172, and a third sub-electrode 173, which are located on the side of the first reflective portion 151, the second reflective portion 152, and the third reflective portion 153 away from the substrate 11, respectively.

[0115] In the embodiments of this disclosure, the distances between the bottom surfaces of the first reflective portion 151, the second reflective portion 152, and the third reflective portion 153 that are away from the substrate 11 and the surface of the substrate 11 that is close to the reflective layer 15 are a first distance d1, a second distance d2, and a third distance d3, respectively, and the first distance d1, the second distance d2, and the third distance d3 are not equal to each other; the distance d4 between the surfaces of the first sub-electrode 171, the second sub-electrode 172, and the third sub-electrode 173 that are away from the substrate 11 and the surface of the substrate 11 that is close to the reflective layer 15 are equal to each other.

[0116] Reference Figure 9A The fabrication process of planarization layer 14 includes: material deposition; exposure, transferring a pattern onto photoresist using a photomask; etching, transferring the pattern from the photoresist onto a substrate material; stripping, removing residual photoresist; and cleaning, removing impurities, residues, and contaminants from the substrate surface. The fabrication process of reflective layer 15 includes: material deposition; chemical mechanical planarization, removing protruding reflective layer material from the pixel spacing regions; and cleaning.

[0117] The fabrication process of the microcavity modulation layer 16 includes fabricating a first sub-microcavity 1611 in the first recess 141, specifically including deposition, exposure, etching, stripping, and cleaning steps. A second sub-microcavity 1612 and a fourth sub-microcavity 1614 are fabricated in the first recess 141 and the second recess 142, respectively, specifically including deposition, exposure, etching, stripping, and cleaning steps. A third sub-microcavity 1613, a fifth sub-microcavity 1615, and a sixth sub-microcavity 1616 are fabricated in the first recess 141, the second recess 142, and the third recess 143, respectively, specifically including deposition, exposure, etching, stripping, and cleaning steps. The fabrication process of the first electrode layer 17 includes: material deposition; chemical mechanical planarization to remove protruding first electrode layer material; and cleaning.

[0118] Reference Figure 9B The fabrication process of the pixel defining layer 18 includes: material deposition; cleaning; forming a cathode ring opening through a single exposure, etching, and lift-off process; and forming a pixel opening through another single exposure, etching, and lift-off process. The fabrication process of the light-emitting functional layer 19 includes: evaporating light-emitting materials; depositing the second electrode layer 20; and performing photoelectric property testing. The fabrication process of the encapsulation layer includes: depositing encapsulation materials and cleaning. The fabrication process of the color filter layer includes: coating the isolation layer with photoresist, baking, and exposing the first filter B, the second filter R, and the third filter G. The fabrication process of the lens includes: coating the isolation layer with photoresist, baking, exposing and developing the lens, and forming the lens using PDO3 photoresist material through exposure, etching, and lift-off processes.

[0119] Reference Figures 10A-10I The fabrication process of the first groove 141, the second groove 142, and the third groove 143 is as follows: Figures 10A-10C As shown; using photoresist 31 and mask 32, the first groove portion 141, the second groove portion 142, and the third groove portion 143 are sequentially fabricated through exposure, etching, and lift-off processes to obtain the following... Figure 10D In the structure shown, exemplarily, the depth h1 of the first groove portion 141 is... The depth h2 of the second groove 142 is The depth h3 of the third groove 143 is Next, a reflective layer 15 is deposited to obtain the following: Figure 10E The structure shown; by removing the protruding reflective layer material, the result is as follows: Figure 10F The structure shown; a microcavity modulation layer is deposited in the groove to obtain a first microcavity portion 161, a second microcavity portion 162, and a third microcavity portion 163, respectively, resulting in the structure shown. Figure 10H The structure shown; the first electrode layer 17 is prepared to obtain the structure shown. Figure 10G The structure shown is fabricated by preparing a pixel defining layer 18, a light-emitting functional layer 19, and a second electrode layer 20, resulting in the structure shown. Figure 10I The structure shown represents the completion of the main structure fabrication.

[0120] As used herein, the terms “substantially,” “approximately,” “about,” and other similar terms are used as terms of approximation rather than as terms of degree, and they are intended to account for inherent deviations in measured or calculated values ​​that would be recognized by one of ordinary skill in the art. Taking into account factors such as process variations, measurement problems, and errors associated with the measurement of a particular quantity (i.e., limitations of the measurement system), “approximately” or “about” as used herein includes the stated value and indicates that the particular value is within an acceptable range of deviation for one of ordinary skill in the art. For example, “approximately” may mean within one or more standard deviations, or within ±10% or ±5% of the stated value.

[0121] While some embodiments based on the general inventive concept of this disclosure have been illustrated and described, those skilled in the art will understand that changes may be made to these embodiments without departing from the principles and spirit of the general inventive concept of this disclosure, the scope of which is defined by the claims and their equivalents.

Claims

1. A display substrate, comprising: Substrate; Multiple pixels are located on one side of the substrate, and the multiple pixels are arranged in an array along a first direction and a second direction. The multiple pixels include a first pixel, a second pixel and a third pixel. A planarization layer, located on one side of the substrate, includes a first groove, a second groove, and a third groove, which are respectively located in the first pixel, the second pixel, and the third pixel; A reflective layer, comprising a first reflective portion, a second reflective portion, and a third reflective portion, respectively located on the bottom and sidewall of the first groove portion, the second groove portion, and the third groove portion, wherein the first reflective portion, the second reflective portion, and the third reflective portion each include a bottom portion and a sidewall portion; and The first electrode layer includes a first sub-electrode, a second sub-electrode, and a third sub-electrode, which are respectively located on the side of the first reflective portion, the second reflective portion, and the third reflective portion away from the substrate. Wherein, the distances between the bottom surfaces of the first reflective portion, the second reflective portion, and the third reflective portion away from the substrate and the surface of the substrate near the reflective layer are respectively a first distance, a second distance, and a third distance, and the first distance, the second distance, and the third distance are not equal to each other; The surfaces of the first sub-electrode, the second sub-electrode, and the third sub-electrode that are away from the substrate are equidistant from the surface of the substrate that is closer to the reflective layer. 2.The display substrate of claim 1, wherein, The depth of the first groove is greater than the depth of the second groove, and the depth of the second groove is greater than the depth of the third groove; and The first distance is less than the second distance, and the second distance is less than the third distance. 3.The display substrate of claim 1, wherein, The display substrate further includes: A microcavity modulation layer is located on the side of the reflective layer away from the substrate, and includes a first microcavity portion, a second microcavity portion, and a third microcavity portion, which are respectively located in the first groove portion, the second groove portion, and the third groove portion; the thickness of the first microcavity portion is greater than the thickness of the second microcavity portion, and the thickness of the second microcavity portion is greater than the thickness of the third microcavity portion. 4.The display substrate of claim 3, wherein, The first microcavity includes a first sub-microcavity, a second sub-microcavity, and a third sub-microcavity; the second microcavity includes a fourth sub-microcavity and a fifth sub-microcavity; and the third microcavity includes a sixth sub-microcavity. The second sub-microcavity and the fourth sub-microcavity are located on the same layer, and the third sub-microcavity, the fifth sub-microcavity, and the sixth sub-microcavity are located on the same layer. The surfaces of the first, second, and third microcavities away from the substrate are equidistant from the surface of the substrate near the reflective layer. 5.The display substrate according to any one of claims 1-4, wherein, The first sub-electrode, the second sub-electrode, and the third sub-electrode are respectively connected to the upper edge of the sidewall portion of the first reflective part, the second reflective part, and the third reflective part; The orthographic projection of the sidewall portion of the reflective layer onto the substrate surrounds at least a portion of the orthographic projection of the first electrode layer onto the substrate. 6.The display substrate of claim 5, wherein, The first sub-electrode, the second sub-electrode, and the third sub-electrode are respectively connected to the sidewalls of the first reflective portion, the second reflective portion, and the third reflective portion away from the surface of the substrate. The orthographic projection of the first electrode layer on the substrate covers the orthographic projection of the sidewall portion of the reflective layer on the substrate. 7.The display substrate of claim 6, wherein, The shapes of the orthographic projections of the first sub-electrode, the second sub-electrode, and the third sub-electrode on the substrate are different from the shapes of the orthographic projections of the first reflective portion, the second reflective portion, and the third reflective portion on the substrate. 8.The display substrate of claim 7, wherein, The orthographic projections of the first reflective portion, the second reflective portion, and the third reflective portion on the substrate are regular polygons, and the orthographic projections of the first sub-electrode, the second sub-electrode, and the third sub-electrode on the substrate are circles.

9. The display substrate according to any one of claims 1-4, wherein, The first sub-electrode, the second sub-electrode, and the third sub-electrode are respectively located in the first groove, the second groove, and the third groove, and the surfaces of the first sub-electrode, the second sub-electrode, and the third sub-electrode away from the substrate are respectively flush with the surface of the planarization layer away from the substrate; or The first sub-electrode, the second sub-electrode, and the third sub-electrode are located outside the first groove portion, the second groove portion, and the third groove portion, respectively. The surfaces of the first sub-electrode, the second sub-electrode, and the third sub-electrode near the substrate are respectively flush with the surfaces of the planarization layer away from the substrate.

10. The display substrate according to any one of claims 1-4, wherein, The display substrate further includes: A pixel defining layer is located on the side of the first electrode layer away from the substrate. The pixel defining layer includes a first pixel opening, a second pixel opening, and a third pixel opening. The orthographic projections of the first pixel opening, the second pixel opening, and the third pixel opening on the substrate are respectively located within the orthographic projections of the first reflective portion, the second reflective portion, and the third reflective portion on the substrate. 11.The display substrate of claim 10, wherein, The pixel defining layer includes a first pixel defining portion, a second pixel defining portion, and a third pixel defining portion. The first pixel defining portion is located between a first pixel opening and a second pixel opening. The second pixel defining portion is located between a second pixel opening and a third pixel opening. The third pixel defining portion is located between a third pixel opening and a first pixel opening. The surfaces of the first pixel defining portion, the second pixel defining portion, and the third pixel defining portion that are away from the substrate are equidistant from the surfaces of the substrate that are closer to the reflective layer. 12.The display substrate of claim 4, wherein, The display substrate further includes: The second electrode layer includes a main body and an extension. The main body is located on the side of the first electrode layer away from the substrate. The main body includes a first sub-main body, a second sub-main body, and a third sub-main body. The orthographic projections of the first sub-main body, the second sub-main body, and the third sub-main body on the substrate respectively cover the orthographic projections of the first sub-electrode, the second sub-electrode, and the third sub-electrode on the substrate. The surfaces of the first sub-main body, the second sub-main body, and the third sub-main body away from the substrate are equidistant from the surfaces of the substrate near the reflective layer. The extension is connected to the main body, and the orthographic projection of the extension on the substrate surrounds the display area. 13.The display substrate of claim 12, wherein, The display substrate further includes: A power supply adapter structure is provided, wherein the extension provides power to the main body through the power supply adapter structure. The power supply adapter structure includes a first adapter structure, a second adapter structure, and a third adapter structure. The first adapter structure is located on the same layer as the third reflective part, the second adapter structure is located on the same layer as the third microcavity part, and the third adapter structure is located on the same layer as the third sub-electrode.

14. The display substrate according to any one of claims 1-4, wherein, The display substrate further includes: A driving circuit layer is located on one side of the substrate. The connection layer includes a first connection portion, a second connection portion, and a third connection portion. The first reflective portion, the second reflective portion, and the third reflective portion are electrically connected to the driving circuit layer through the first connection portion, the second connection portion, and the third connection portion, respectively. The height of the first connection portion is less than the height of the second connection portion, and the height of the second connection portion is less than the height of the third connection portion.

15. A display device comprising: The display device includes a display substrate according to any one of claims 1 to 14.

Images