Overhead driving mechanism of semiconductor packaging press

Abstract

The utility model relates to an upper-mounted driving mechanism of a semiconductor packaging press, which comprises a servo driving mechanism mounted on an upper base of the semiconductor packaging press. Comprising a lead screw mechanism, the lead screw mechanism comprises a lead screw and a lifting block which are vertically arranged, the lifting block is connected with the lead screw in a matched mode, and the lead screw is in transmission connection with a servo driving mechanism and drives the lifting block to ascend and descend through the servo driving mechanism; comprising connecting rod mechanisms which are oppositely distributed on the two sides of a lead screw mechanism. The lifting seat is used for mounting an upper die seat of the packaging die; and the screw rod mechanism is respectively hinged with the lifting block, the upper base and the lifting seat and drives the lifting seat to lift through the lifting of the lifting block. According to the utility model, the driving mechanism is arranged on the upper base of the packaging press, so that the position of the packaging mold is moved downwards, particularly, the height of the upper-layer mold can be reduced, high-altitude operation can be avoided, the operation risk of equipment can be reduced, and meanwhile, the maintenance difficulty of the mold is reduced.

Description

Technical Field

[0001] This utility model belongs to the technical field of semiconductor packaging equipment, and in particular relates to an upper-mounted drive mechanism for a semiconductor packaging press. Background Technology

[0002] The applicant filed an invention patent application on September 30, 2024, entitled "A Hot-Pressure Servo Packaging Double-Layer Press," with application number 202411376424.8. This invention discloses a molding device with a double-layer mold for IC semiconductor product packaging, and a bottom-mounted mold-closing drive mechanism. The upward lifting action of the drive mechanism drives the upper and lower mold layers to close. In practical use, this type of packaging double-layer press, due to the bottom-mounted drive mechanism, results in a relatively high mold height, especially for the upper mold. This requires operators to work at height, increasing safety risks and equipment maintenance difficulties. This application represents a further improvement based on this prior art. Summary of the Invention

[0003] This invention provides an upper-mounted drive mechanism for a semiconductor packaging press, which can reduce the height of the mold in the semiconductor packaging press.

[0004] The technical solution adopted by this utility model to solve its technical problem is to provide a top-mounted drive mechanism for a semiconductor packaging press:

[0005] Includes a servo drive mechanism, which is mounted on the upper base of the semiconductor packaging press;

[0006] It includes a lead screw mechanism, which includes a lead screw and a lifting block arranged vertically. The lifting block is connected to the lead screw, and the lead screw is connected to a servo drive mechanism for transmission and drives the lifting block to move up and down through the servo drive mechanism.

[0007] This includes linkage mechanisms, which are distributed on both sides of the lead screw mechanism;

[0008] It also includes a lifting seat for mounting the upper mold base of the packaging mold. The screw mechanism is hinged to the lifting block, the upper base and the lifting seat respectively, and drives the lifting seat to rise and fall through the lifting block.

[0009] In another embodiment of this utility model, the servo drive mechanism includes a servo motor, a transmission assembly, and a lead screw drive wheel. The servo motor and the lead screw drive wheel are driven by the transmission assembly, and the lead screw drive wheel is connected to the lead screw drive.

[0010] In another embodiment of this utility model, the lead screw mechanism includes two parallel lead screws, and the lifting block is respectively connected to the two lead screws.

[0011] In another embodiment of this utility model, a U-shaped block is installed at the bottom of the upper base, and a lead screw is rotatably installed between the upper base and the U-shaped block.

[0012] In another embodiment of the present invention, the linkage mechanism includes a first link, a second link and a third link. One end of the first link is hinged to the lifting block and the other end is hinged to the second link. The second link is hinged to the upper base and the third link respectively, and the third link is hinged to the lifting seat.

[0013] In another embodiment of the present invention, the second link has a lug on the side opposite to the first link, and the hinge positions of the second link with the first link, the upper base and the third link are triangularly distributed.

[0014] In another embodiment of the present invention, the linkage mechanism on each side includes two first links, two second links and three third links, the three third links being alternately hinged to the two second links, and the two first links being respectively hinged to the two second links.

[0015] In another embodiment of the present invention, the lifting seat can be slidably installed vertically between the support columns on both sides of the semiconductor packaging press. Beneficial effects

[0016] This invention is a further improvement on the existing hot-press servo packaging double-layer press, providing an upper-mounted drive mechanism for semiconductor packaging presses. By placing the drive mechanism on the upper base of the packaging press, the position of the packaging mold is lowered. For packaging presses with double-layer molds, this is particularly beneficial for avoiding high-altitude operations, thereby reducing the operational risks of the equipment and reducing the difficulty of mold maintenance. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram from one perspective of an embodiment of the present utility model.

[0018] Figure 2 This is a three-dimensional structural diagram from another perspective of an embodiment of the present utility model.

[0019] Figure 3 This is a structural diagram showing the connection between the servo drive mechanism, the lead screw mechanism, the connecting rod mechanism, and the lifting seat in an embodiment of this utility model.

[0020] Figure 4 This is a schematic diagram of the overall structure of a semiconductor packaging press with a top-mounted drive mechanism. Detailed Implementation

[0021] The present invention will be further illustrated below with reference to specific embodiments. It should be understood that these embodiments are for illustrative purposes only and are not intended to limit the scope of the present invention. Furthermore, it should be understood that after reading the teachings of this invention, those skilled in the art can make various alterations or modifications to the present invention, and these equivalent forms also fall within the scope defined by the appended claims.

[0022] like Figure 1-4 The semiconductor packaging press shown has an upper drive mechanism, including a servo drive mechanism 1, a lead screw mechanism 3, a connecting rod mechanism 4, and a lifting seat 5 for mounting the upper mold base of the packaging mold.

[0023] like Figure 1 and Figure 2 As shown, the servo drive mechanism 1 is mounted on the upper base 2 of the semiconductor packaging press. Specifically, in this embodiment, the servo drive mechanism 1 includes a servo motor 1-1, a transmission assembly 1-2, and two lead screw drive wheels 1-3 arranged in a front-to-back direction. The servo motor 1-1 and the lead screw drive wheels 1-3 are connected by the transmission assembly 1-2, as shown... Figure 3 As shown, the lead screw drive wheel 1-3 is connected to the upper end of the lead screw 3-1. In this embodiment, the transmission assembly 1-2 adopts belt drive, such as... Figure 1 As shown, the servo motor 1-1 is mounted on the bottom surface of the upper base 2, and two lead screw drive wheels 1-3 arranged in the front-to-back direction are mounted on the top surface of the upper base 2. When the servo motor 1-1 is driven to rotate, the double-headed drive wheels are driven to rotate by the first transmission belt at the bottom of the upper base 2, as shown. Figure 2 As shown, the double-headed drive wheel and the two lead screw drive wheels 1-3 are connected by a second drive belt at the top of the upper base 2, thereby driving the two lead screws 3-1 to rotate. The transmission assembly 1-2 also includes a steering wheel and a tensioning wheel as needed. Of course, in other embodiments, the specific composition and layout of the transmission assembly 1-2 can be adjusted according to actual needs, and are not limited to the description in this embodiment.

[0024] like Figure 3 As shown, the lead screw mechanism includes a lead screw 3-1 arranged vertically and a lifting block 3-2. Two lead screws 3-1 are provided, spaced apart along the front-to-back direction. Figure 1 As shown, a U-shaped block 2-1 is installed at the bottom of the upper base 2. Two lead screws 3-1 are rotatably mounted between the upper base 2 and the U-shaped block 2-1 via bearings, and the upper ends of the two lead screws 3-1 are respectively connected to two lead screw drive wheels 1-3. The lifting block 3-2 is threadedly connected to the two lead screws 3-1, and is driven to rotate by the servo drive mechanism 1, thereby driving the lifting block 3-2 to rise and fall.

[0025] like Figure 1 and Figure 3As shown, in this embodiment, the length direction of the lifting block 3-2 is along the front-to-back direction, and the two sets of linkage mechanisms 4 are distributed opposite each other on the left and right sides of the lead screw mechanism 3. Of course, in other embodiments, the direction of the lead screw mechanism can be adjusted as needed, and the two sets of linkage mechanisms 4 can be distributed opposite each other on the front and back sides of the lead screw mechanism 3. One set of linkage mechanism 4 includes two first connecting rods 4-1, two second connecting rods 4-2, and three third connecting rods 4-3. For example... Figure 3 As shown, one end of the first connecting rod 4-1 is hinged to the side of the lifting block 3-2, and the other end is hinged to the second connecting rod 4-2. The upper end of the second connecting rod 4-2 is hinged to the upper base 2, and the lower end is hinged to the upper end of the third connecting rod 4-3. The lower end of the third connecting rod 4-3 is hinged to the lifting seat 5. The second connecting rod 4-2 has a lug on one side relative to the first connecting rod 4-1, and hinge holes are provided at its upper and lower ends and on the lug, so that the hinge positions of the second connecting rod 4-2 with the first connecting rod 4-1, the upper base 2, and the third connecting rod 4-3 are triangularly distributed. The three third connecting rods 4-3 are staggered with the two second connecting rods 4-2, and the two first connecting rods 4-1 are hinged with the two second connecting rods 4-2. When the lifting block 3-2 moves up and down, it drives the lifting seat 5 to move up and down through the connecting rod mechanism 4 on both sides.

[0026] like Figure 4 As shown, the lifting seat 5 can be vertically slidably installed between the support columns 6 on both sides of the semiconductor packaging press. For details, please refer to the disclosure of invention patent 202411376424.8; the specific structure will not be repeated here. The lifting seat 5's lifting movement drives the opening and closing of the packaging press mold.

[0027] This embodiment provides an upper-mounted drive mechanism for semiconductor packaging presses, which is a further improvement on existing hot-press servo packaging double-layer presses. By placing the drive mechanism on the upper base of the packaging press, the position of the packaging mold is lowered. For packaging presses with double-layer molds, this can help avoid high-altitude operations, thereby reducing the operational risks of the equipment and reducing the difficulty of mold maintenance.

[0028] It should be noted that the terms "front," "rear," "left," and "right" used in the instruction manual are for the purpose of clearly describing the technical solution and should not be taken as a limitation on the technical content.

Claims

1. A top-mounted drive mechanism for a semiconductor packaging press, characterized in that: Includes a servo drive mechanism (1), which is mounted on the upper base (2) of the semiconductor packaging press. It includes a lead screw mechanism (3), which includes a lead screw (3-1) and a lifting block (3-2) arranged vertically. The lifting block (3-2) is connected to the lead screw (3-1), and the lead screw (3-1) is connected to the servo drive mechanism (1) for transmission and drives the lifting block (3-2) to rise and fall through the servo drive mechanism (1). It includes a linkage mechanism (4), which is distributed on both sides of the lead screw mechanism (3); It also includes a lifting seat (5) for installing the upper mold base of the packaging mold. The screw mechanism (3) is hinged to the lifting block (3-2), the upper base (2) and the lifting seat (5) respectively, and drives the lifting seat (5) to rise and fall through the lifting block (3-2).

2. A semiconductor package press on-car drive mechanism according to claim 1, characterized in that: The servo drive mechanism (1) includes a servo motor (1-1), a transmission assembly (1-2), and a lead screw drive wheel (1-3). The servo motor (1-1) and the lead screw drive wheel (1-3) are driven by the transmission assembly (1-2), and the lead screw drive wheel (1-3) is connected to the lead screw (3-1).

3. A semiconductor package press on-car drive mechanism as claimed in claim 1, wherein: The lead screw mechanism (3) includes two parallel lead screws (3-1), and the lifting block (3-2) is connected to the two lead screws (3-1) respectively.

4. A drive mechanism for a semiconductor packaging press according to claim 1 or 3, wherein: A U-shaped block (2-1) is installed at the bottom of the upper base (2), and a lead screw (3-1) is rotatably installed between the upper base (2) and the U-shaped block (2-1).

5. A semiconductor package press on-car drive mechanism as claimed in claim 1, wherein: The linkage mechanism (4) includes a first link (4-1), a second link (4-2) and a third link (4-3). One end of the first link (4-1) is hinged to the lifting block (3-2) and the other end is hinged to the second link (4-2). The second link (4-2) is hinged to the upper base (2) and the third link (4-3) respectively. The third link (4-3) is hinged to the lifting seat (5).

6. A semiconductor package press on-car drive mechanism as set forth in claim 5, further characterized by: The second link (4-2) has a lug on one side relative to the first link (4-1). The hinge positions of the second link (4-2) with the first link (4-1), the upper base (2) and the third link (4-3) are arranged in a triangular pattern.

7. A semiconductor package press on-car drive mechanism according to claim 5 or 6, wherein: The linkage mechanism (4) on each side includes two first links (4-1), two second links (4-2) and three third links (4-3). The three third links (4-3) are respectively hinged to the two second links (4-2), and the two first links (4-1) are respectively hinged to the two second links (4-2).

8. A semiconductor package press on-car drive mechanism as defined in claim 1, wherein: The lifting seat (5) can be vertically slidably installed between the support columns (6) on both sides of the semiconductor packaging press.

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