Semiconductor package substrate (LED chip)

CN310076074SActive Publication Date: 2026-07-07SHENZHEN WUXIN MATERIALS TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
SHENZHEN WUXIN MATERIALS TECHNOLOGY CO LTD
Filing Date
2025-09-10
Publication Date
2026-07-07

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Abstract

1. Name of the designed product: semiconductor package substrate (LED chip). 2. Use of the designed product: for packaging semiconductor (LED chip). 3. Design points of the designed product: in shape. 4. Picture or photo best indicating the design points: perspective view.
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