Test fixture for semiconductor package testing

Abstract

The application provides a test rack for semiconductor package testing, which comprises a test base, a placement plate arranged on the top of the test base, a plurality of test slots for placing semiconductor to be tested arranged on the top of the placement plate, and a plurality of first ventilation slots arranged on one side of the placement plate; a test structure is arranged on the top of the test base, and the test structure comprises a detection device and a detection needle for detecting the semiconductor to be tested; a plurality of test benches are arranged in the plurality of test slots respectively, and each test bench comprises a bearing seat, a cooling base arranged at the bottom of the bearing seat, an adsorption air duct formed between the bearing seat and the cooling base, a plurality of adsorption holes arranged on the top of the bearing seat, and a plurality of bearing columns arranged in the plurality of adsorption holes and located at adsorption positions or ejection positions, so that negative pressure adsorption and bottom heat dissipation are realized; test boxes with cooling air ducts are arranged on both sides of the cooling base, and the test boxes are internally provided with slidable semiconductor test pins; during testing, the semiconductor test pins are pressed down to enter the cooling air ducts to realize heat dissipation of contact parts, and the test stability is improved.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor technology, and more specifically, relates to a test fixture for semiconductor packaging testing. Background Technology

[0002] Semiconductor packaging technology continues to evolve towards miniaturization, high density, and multi-pin designs. The pin spacing of chip packages is constantly shrinking, and the requirements for positioning accuracy, contact stability, and heat dissipation during testing are continuously increasing. Among these requirements, the test fixture serves as a device that carries the chip and performs electrical signal detection.

[0003] Existing test fixtures often employ independent adsorption, ejection, and heat dissipation mechanisms. The separate arrangement of these three mechanisms occupies a significant amount of internal space, compressing the space available for heat dissipation channels and resulting in insufficient heat dissipation capacity. Furthermore, in most test fixtures, the test pins and cooling structures are set up separately. The cooling structure primarily cools the semiconductor, but the heat generated at the contact points between the pins and chip pins during testing cannot be effectively dissipated in a timely manner. This can lead to signal drift during prolonged continuous testing, affecting the accuracy of the test results. Summary of the Invention

[0004] To address the aforementioned technical problems, this invention provides a test fixture for semiconductor packaging testing. This solves the problem in the prior art where traditional test fixtures often employ independent adsorption structures, ejection structures, and heat dissipation mechanisms, with test pins and cooling structures set up separately. The cooling structure primarily cools the semiconductor, and the heat generated at the contact points between the pins and chip pins cannot be dissipated in a timely manner, easily leading to signal drift.

[0005] The purpose and effectiveness of the test fixture for semiconductor packaging testing of the present invention are achieved by the following specific technical means:

[0006] Test fixtures for semiconductor packaging testing include:

[0007] The test base has a placement plate on top. The top of the placement plate has multiple sets of test slots for placing semiconductors to be tested. On one side of the placement plate, there are multiple sets of through first ventilation slots corresponding to the multiple sets of test slots. The multiple sets of test slots located in the same longitudinal position are connected through one of the first ventilation slots.

[0008] Multiple test platforms are installed in multiple test slots. Each test platform includes a support base with a cooling base at the bottom. The gap between the support base and the cooling base forms an adsorption air duct. The adsorption air duct and one of the first ventilation slots are located on the same axis. Multiple adsorption holes are opened on the top of the support base. Each adsorption hole is equipped with a support column located at the adsorption position or the ejection position. The diameter of the support column is smaller than the diameter of the adsorption hole.

[0009] The test structure is mounted on top of the test base and includes a testing device and a testing probe for testing the semiconductor to be tested.

[0010] According to a preferred embodiment, the test stage includes multiple sets of guide cylinders. Multiple sets of guide cylinders are provided on the top of the cooling base corresponding to multiple sets of adsorption holes. Each set of guide cylinders has a through groove parallel to the adsorption air duct on one side. Multiple sets of support columns are respectively inserted into the multiple sets of guide cylinders. Each set of support columns has a sealing plate on its periphery. The sealing plates are slidably connected to the multiple sets of guide cylinders. A sliding sealing ring is provided on the periphery of the sealing plate. The top of each set of support columns is in contact with the semiconductor to be tested. An ejection spring is provided inside the guide cylinder for moving the support column to the ejection position.

[0011] When the support column is in the adsorption position, both the support column and the sealing plate are located inside the guide cylinder. The top of the support column is flush with the top surface of the support seat. The adsorption air duct is connected to the adsorption hole, and the ejection spring is in a compressed state.

[0012] When the support column is in the top position, the top of the support column passes through the adsorption hole, the sealing plate is located in the adsorption hole to seal it, the adsorption air duct is not connected to the adsorption hole, and the top spring is in the extended state.

[0013] According to a preferred embodiment, guide boxes are provided on both sides of the cooling base, and test boxes are provided on the top of the guide boxes. A through cooling air channel is opened at one end of each of the two test boxes. Multiple sets of second ventilation slots are opened on one side of the placement plate. The two sets of cooling air channels are respectively connected to two sets of second ventilation slots. Multiple sets of sliding test slots are equidistantly opened on the adjacent side of the two sets of test boxes. Semiconductor test pins located at the blocking position or detection position are slidably arranged in the multiple sets of sliding test slots. The semiconductor test pins are used to contact the pins of the semiconductor to be tested. A blocking block is provided on one side of the semiconductor test pins. A detection circuit board is provided on the top of the cooling base corresponding to the multiple sets of semiconductor test pins.

[0014] When the semiconductor test pin is in the blocked position, the semiconductor test pin is blocked in the sliding test groove, and the semiconductor pin to be tested is outside the cooling air duct.

[0015] When the semiconductor test pin is in the detection position, both the semiconductor test pin and the semiconductor pin under test are located in the cooling air duct, and the bottom of the blocking block is in contact with the inner wall of the sliding test groove.

[0016] According to a preferred embodiment, a groove is provided on the top of the guide box, and a mounting slot is provided on one side of the groove corresponding to multiple sets of semiconductor test pins. An L-shaped guide seat is provided in each of the multiple sets of mounting slots. A guide slot is provided on one side of the L-shaped guide seat. A guide frame is provided at the bottom of the semiconductor test pin. One side of the guide frame is slidably connected to the guide slot. Mounting posts are provided at the top of the L-shaped guide seat and at the bottom of the guide frame. A sealing spring is provided between the two sets of mounting posts.

[0017] When the semiconductor test pin is in the plugged position, the guide frame is at the upper stop of the guide groove, and the plugging spring is in an extended state.

[0018] When the semiconductor test pin is in the detection position, the guide frame is at the lower stop of the guide groove, and the sealing spring is compressed.

[0019] According to a preferred embodiment, the test base has two sets of third ventilation slots on the top, and air guide hoods are provided at both ends of the placement plate. The adjacent side of the two sets of air guide hoods is connected to multiple sets of first ventilation slots and second ventilation slots, and the other side of the air guide hoods is connected to two sets of third ventilation slots respectively. A fan is provided inside the test base, and a dust filter pad is provided at the air inlet end of the fan. The air outlet end of the fan is connected to one of the air guide hoods.

[0020] According to a preferred embodiment, the test base is provided with two sets of first linear modules on the top, the top of the sliders of the two sets of first linear modules are connected to the second linear modules, a test structure is provided on one side of the slider of the second linear module, and a protective cover is provided on the outside of the test structure.

[0021] The test structure also includes a fixed cylinder, one side of which is connected to the slider of the second linear module. The pneumatic rod of the fixed cylinder is connected to a moving block. A first movable plate is set at the bottom of the moving block. Two sets of mounting frames are set on one side of the first movable plate. Two sets of fixed sliders are set at the bottom of the first movable plate. The bottom of the fixed sliders is slidably connected to the sliding rails. The bottom of both sets of sliding rails is connected to the fixed plate.

[0022] According to a preferred embodiment, a mounting block is provided on one side of the mounting frame, and a first adjusting cylinder is provided at the bottom of the mounting block. The axis of the pneumatic rod of the first adjusting cylinder is parallel to the length direction of the sliding rail. Connecting frames are provided on both sides of the fixing plate, and a first connecting sleeve is provided on the connecting frame. One end of the pneumatic rod of the first adjusting cylinder is connected to the first connecting sleeve. Multiple sets of through slots are opened on the top of the fixing plate corresponding to the detection pin. A sliding rod is provided at the bottom of the fixing plate, and a temperature probe is slidably provided at the bottom end of the sliding rod. A first spring is sleeved around the periphery of the sliding rod. Multiple sets of fixing rods are also provided at the bottom of the fixing plate, and the bottom ends of the multiple sets of fixing rods are in contact with the top of the semiconductor to be tested.

[0023] According to a preferred embodiment, a third linear module is provided on one side of the movable block, a first mounting plate is provided on one side of the slider of the third linear module, sliding frames are provided on both sides of the first mounting plate, a sliding groove is provided on one side of the sliding frame, a sliding block is provided in the sliding groove, the adjacent sides of the two sets of sliding blocks are connected to the second movable plate, a second adjusting cylinder is provided on one side of the sliding frame, a mounting seat is provided on the side of the sliding block away from the second movable plate, a second connecting sleeve is provided on the mounting seat, one end of the pneumatic rod of the second adjusting cylinder is connected to the second connecting sleeve, and multiple sets of guide sleeves and multiple sets of guide rods are respectively provided on the side of the first mounting plate adjacent to the second movable plate, and the multiple sets of guide sleeves are slidably connected to the multiple sets of guide rods respectively.

[0024] According to a preferred embodiment, four sets of horizontal slide rails are provided on the side of the first mounting plate adjacent to the second movable plate. The four sets of horizontal slide rails are slidably connected to four sets of adjusting columns. A second mounting plate is provided on the top of both the first mounting plate and the second movable plate. A slide cylinder is provided on the side of the adjacent two sets of second mounting plates. An L-shaped push plate is provided on the slider side of the slide cylinder. An interval adjusting plate is provided at the bottom of the L-shaped push plate. Four sets of interval adjusting grooves are opened on one side of the interval adjusting plate. The four sets of interval adjusting grooves are all obliquely distributed. A sliding column is provided on one side of each of the four sets of adjusting columns. The four sets of sliding columns slide through the four sets of interval adjusting grooves respectively.

[0025] According to a preferred embodiment, the test structure includes two sets of detection devices and eight sets of detection needles. Each of the four sets of adjustment columns has two sets of fixing blocks on one side. Each of the two sets of fixing blocks has a sliding hole at its top. The detection needle slides through the sliding hole. A fixing ring and a sliding ring are arranged around the detection needle. The fixing ring is fixedly connected to the detection needle, and the sliding ring is slidably connected to the detection needle. The fixing ring and the sliding ring are both located between the two sets of fixing blocks. The bottom of one set of fixing blocks is connected to the sliding ring. A second spring is sleeved around the detection needle. The second spring is located between the fixing ring and the detection needle. A detection device is arranged on one side of the L-shaped push plate. The tops of the four sets of detection needles are connected to the detection device through signal lines.

[0026] Compared with the prior art, the present invention has the following beneficial effects:

[0027] 1. By setting up the support column and the adsorption hole, the support column can switch between the top-out position and the adsorption position as the chip is placed and removed. When the support column is in the top-out position, the sealing plate simultaneously seals the adsorption hole, which can prevent external dust and debris from entering the adsorption air duct and avoid the air duct blockage affecting the use. At the same time, the support column lifts the chip upward, which provides convenience for chip placement and removal. When the support column is in the adsorption position, the adsorption hole and the adsorption air duct are connected. The adsorption air duct can simultaneously realize the negative pressure adsorption and fixation of the chip and the bottom heat dissipation. This simplifies the internal structural layout of the stage, expands the available space of the heat dissipation channel, avoids the problems of asynchronous action and jamming that are prone to occur in traditional independent mechanisms, and also ensures the stability of chip fixation and the continuity of heat dissipation.

[0028] 2. The semiconductor test pins adopt a sliding linkage structure, combined with the through-cooling air channel inside the test box. In the non-test state, the test pins are in the blocked position within the sliding test slot under the action of the blocking spring. In the test state, the chip is pressed down, causing the test pins to move to the detection position against the elastic force of the blocking spring. At this time, the bottom of the blocking block contacts the inner wall of the sliding test slot to achieve the lower stop limit. The test pins and chip pins enter the cooling air channel at the same time. The airflow flowing through the cooling air channel can directly contact the contact parts of the pins and pins, carrying away the heat generated at the contact parts. This solves the problem of the traditional test holder cooling structure being separated from the test pins, and the heat generated at the contact parts of the pins and chip pins not being able to be dissipated in time. This avoids the signal drift phenomenon that occurs during long-term continuous testing and improves the accuracy of the test results.

[0029] 3. The test structure employs adjustable probes. A sliding cylinder moves the interval adjustment plate, and obliquely distributed interval adjustment slots push the adjustment column along the horizontal slide rail, allowing for flexible adjustment of the transverse spacing of the probes. A second adjustment cylinder moves the second movable plate along the guide rod, adjusting the longitudinal spacing of the probes. This design can adapt to the testing needs of chips with different pin specifications and package sizes. Furthermore, the fixing rod at the bottom of the fixing plate and the temperature probe are integrated. The fixing rod applies pressure to the chip, and the temperature probe directly contacts the chip surface to collect the chip's test temperature, eliminating the need for frequent changes to the test fixture and reducing auxiliary operation time during testing. The integrated structure also simplifies the space layout of the upper part of the test fixture, improving the overall integration of the equipment. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the assembled structure of the present invention;

[0031] Figure 2 This is a schematic diagram of the structure of the present invention after it has been unfolded;

[0032] Figure 3 This is a schematic diagram of the assembled test platform in this invention;

[0033] Figure 4 This is a schematic diagram of the disassembled test platform in this invention;

[0034] Figure 5 This is a schematic diagram of the structure after the guide cylinder and the bearing column are separated in this invention;

[0035] Figure 6 This is a schematic diagram of the structure of the guide box and the test box after assembly in this invention;

[0036] Figure 7 This is a schematic diagram of the structure of the guide box and the test box after separation in this invention;

[0037] Figure 8 This is a schematic diagram of the structure after the placement plate and the air guide cover are assembled in this invention;

[0038] Figure 9 This is a schematic diagram of the structure after the placement plate and the air guide cover are separated in this invention;

[0039] Figure 10 This is a schematic diagram of the assembled test structure in this invention;

[0040] Figure 11 This is a schematic diagram of the disassembled test structure in this invention;

[0041] Figure 12 This is a schematic diagram of the structure of the third linear module and the fixed cylinder assembled in this invention;

[0042] Figure 13 This is a schematic diagram of the structure of the third linear module and the fixed cylinder after separation in this invention;

[0043] Figure 14 This is a schematic diagram of the structure after the fixed plate and the first movable plate are assembled in this invention;

[0044] Figure 15 This is a schematic diagram of the structure after the fixed plate and the first movable plate are separated in this invention;

[0045] Figure 16 This is a schematic diagram of the assembled detection device and detection needle in this invention;

[0046] Figure 17 This is a schematic diagram of the structure of the detection device and the detection needle after separation in this invention.

[0047] In the diagram, the correspondence between component names and drawing numbers is as follows:

[0048] 101. Test base; 102. Placement plate; 103. Semiconductor to be tested; 104. Test slot; 105. First ventilation slot; 106. Third ventilation slot; 107. Air guide shroud; 108. Fan; 109. Dust filter pad; 110. First linear module; 111. Second linear module; 112. Protective cover; 201. Support base; 202. Cooling base; 203. Adsorption air duct; 204. Adsorption hole; 205. Support column; 206. Guide cylinder; 207. Through slot; 208. Sealing plate 209. Sliding sealing ring; 210. Ejection spring; 211. Guide box; 212. Test box; 213. Cooling air duct; 214. Second ventilation slot; 215. Sliding test slot; 216. Semiconductor test pin; 217. Blocking block; 218. Groove; 219. Mounting slot; 220. L-shaped guide seat; 221. Guide groove; 222. Guide frame; 223. Mounting post; 224. Sealing spring; 225. Test circuit board; 301. Test equipment; 302. Test probe; 30 3. Fixed cylinder; 304. Moving block; 305. First movable plate; 306. Mounting frame; 307. Fixed slider; 308. Sliding rail; 309. Fixed plate; 310. Mounting block; 311. First adjusting cylinder; 312. Connecting bracket; 313. First connecting sleeve; 314. Sliding rod; 315. Temperature probe; 316. First spring; 317. Fixed rod; 318. Third linear module; 319. First mounting plate; 320. Sliding frame; 321. Sliding groove; 322. Sliding... 323. Moving block; 324. Second movable plate; 325. Second adjusting cylinder; 326. Mounting base; 327. Second connecting sleeve; 328. Guide sleeve; 329. Guide rod; 320. Horizontal slide rail; 330. Adjusting column; 331. Second mounting plate; 332. Slide cylinder; 333. L-shaped push plate; 334. Interval adjusting plate; 335. Interval adjusting groove; 336. Sliding column; 338. Fixed block; 339. Fixed ring; 340. Sliding ring; 341. Second spring; 342. Signal line. Detailed Implementation

[0049] The embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate the technical solutions of the present invention, but should not be used to limit the scope of protection of the present invention.

[0050] Example:

[0051] As attached Figures 1 to 17 As shown:

[0052] This invention provides a test fixture for semiconductor packaging testing, comprising: a test base 101, a placement plate 102 disposed on the top of the test base 101, and multiple sets of test slots 104 for placing semiconductors 103 to be tested being formed on the top of the placement plate 102. Multiple sets of through-hole first ventilation slots 105 are formed on one side of the placement plate 102 corresponding to the multiple sets of test slots 104. The multiple sets of test slots 104 located in the same longitudinal position are connected through one set of first ventilation slots 105. The first ventilation slots 105 provide a lateral flow channel for airflow, allowing airflow within the first ventilation slots 105 to sequentially pass through the same longitudinal direction. Multiple test slots 104 and multiple test stages are respectively installed in the test slots 104. The test stages are used to directly support the semiconductor 103 under test and to fix and dissipate heat from the chip. The test stage includes a support base 201, which provides a direct support plane for the semiconductor 103 under test. A cooling base 202 is provided at the bottom of the support base 201. The gap between the support base 201 and the cooling base 202 forms an adsorption air duct 203. The adsorption air duct 203 and one of the first ventilation slots 105 are located on the same axis, ensuring that the airflow can smoothly enter the adsorption air duct 203. On the one hand, 203 can create negative pressure when the airflow passes through at high speed, providing power for the adsorption and fixation of the chip. On the other hand, the flowing airflow can carry away the heat from the bottom of the carrier 201 and the semiconductor 103 under test, thus achieving heat dissipation of the chip. The top of the carrier 201 has multiple sets of adsorption holes 204, and each set of adsorption holes 204 has a carrier post 205 located at the adsorption position or the ejection position. The diameter of the carrier post 205 is smaller than the diameter of the adsorption hole 204, so that an airflow channel is formed between the carrier post 205 and the inner wall of the adsorption hole 204, ensuring that the negative pressure and airflow in the adsorption air duct 203 can act on the chip under test through this channel. At the bottom of the test semiconductor 103, the support post 205 can switch between the adsorption position and the ejection position to provide support for chip placement and fixation. The test structure is installed on the top of the test base 101. The test structure is used to complete the test operation of the semiconductor 103 under test. The test structure includes a test device 301 and a test probe 302 for testing the semiconductor 103 under test. The test probe 302 is used to contact the pins of the semiconductor 103 under test and transmit test electrical signals. The test device 301 is used to receive and process the electrical signals transmitted by the test probe 302 and output the test results of the semiconductor 103 under test.

[0053] The test platform includes multiple sets of guide cylinders 206. Multiple sets of guide cylinders 206 are also provided on the top of the cooling base 202 corresponding to multiple sets of adsorption holes 204. The guide cylinders 206 provide coaxial guiding constraints for the reciprocating movement of the support columns 205, ensuring that the support columns 205 do not sway during movement. Each set of guide cylinders 206 has a through groove 207 parallel to the adsorption duct 203 on one side. The through groove 207 provides an airflow channel between the adsorption duct 203 and the interior of the guide cylinders 206, allowing airflow from the adsorption duct 203 to enter the interior of the guide cylinders 206 through the through groove 207. Multiple sets of support columns 205 are respectively inserted into the multiple sets of guide cylinders 206, and each set of support columns 205 has a sealing plate 2 on its periphery. 08. Multiple sets of sealing plates 208 are slidably connected to multiple sets of guide cylinders 206. A sliding sealing ring 209 is provided on the periphery of the sealing plate 208. The sliding sealing ring 209 can fill the gap between the sealing plate 208 and the inner wall of the guide cylinder 206, and between the sealing plate 208 and the inner wall of the adsorption hole 204. The tops of multiple sets of bearing columns 205 are in contact with the semiconductor 103 to be tested, and can directly transmit the downward pressure of the semiconductor 103 to be tested and the supporting force when ejecting. An ejection spring 210 is provided in the guide cylinder 206 for moving the bearing column 205 to the ejection position. The two ends of the ejection spring 210 are in contact with the bottom of the guide cylinder 206 and the bottom of the sealing plate 208, respectively, providing elastic power for the reset of the bearing column 205.

[0054] In this embodiment, when the support column 205 is in the adsorption position, both the support column 205 and the sealing plate 208 are located inside the guide cylinder 206. The top of the support column 205 is flush with the top surface of the support seat 201, and the sealing plate 208 is located below the through groove 207, making the through groove 207 completely open. The adsorption air duct 203 is connected to the adsorption hole 204 through the through groove 207 and the inside of the guide cylinder 206. The ejection spring 210 is in a compressed state and stores elastic potential energy. When the support column 205 is in the ejection position, the top of the support column 205 passes through the adsorption hole 204, and the sealing plate 208 rises synchronously with the support column 205 into the adsorption hole 204 to seal it. The sliding sealing ring 209 is in close contact with the inner wall of the adsorption hole 204, blocking the airflow channel between the adsorption air duct 203 and the adsorption hole 204. The ejection spring 210 is in an extended state and releases elastic potential energy.

[0055] It should be noted that the support post 205 can automatically switch between the ejection position and the adsorption position as the semiconductor 103 under test is placed and removed, without the need for an additional independent drive mechanism. When the support post 205 is in the ejection position, the sealing plate 208 simultaneously seals the adsorption hole 204, preventing external dust and debris from entering the adsorption air duct 203 and avoiding air duct blockage that could affect subsequent use. At the same time, the support post 205 lifts the semiconductor 103 under test upwards, creating a gap between the semiconductor 103 under test and the top surface of the support base 201, facilitating chip placement and removal. When the support post 205 is in the adsorption position, the adsorption hole 204 and the adsorption air duct 203 are fully connected. The same adsorption air duct 203 can simultaneously achieve negative pressure adsorption fixation and bottom heat dissipation of the semiconductor 103 under test, eliminating the need for separate adsorption and heat dissipation pipelines. This simplifies the internal structural layout of the stage, expands the available space of the heat dissipation channel, avoids the problems of asynchronous operation and jamming that are prone to occur in traditional independent mechanisms, and also ensures the stability of chip fixation and the continuity of heat dissipation.

[0056] Guide boxes 211 are provided on both sides of the cooling base 202, and test boxes 212 are provided on the top of the guide boxes 211. Each set of test boxes 212 has a through-type cooling air duct 213 at one end. The test boxes 212 are used to carry semiconductor test pins 216 and form independent cooling airflow channels. The cooling air ducts 213 provide a longitudinal flow path for the airflow. Multiple sets of second ventilation slots 214 are provided on one side of the placement plate 102. The two sets of cooling air ducts 213 are connected to two of the second ventilation slots 214 respectively, allowing airflow to enter the cooling air duct 213 of the corresponding test box 212 through the second ventilation slots 214. Multiple sets of sliding test slots 215 are equidistantly provided on adjacent sides of the two sets of test boxes 212. The sliding test slots 215 provide vertical sliding guide tracks for the semiconductor test pins 216, restricting the semiconductor... The horizontal displacement of the test pin 216 ensures its positional accuracy during movement. Semiconductor test pins 216 are slidably arranged in multiple sets of sliding test slots 215, located at the blocking or detection positions. The semiconductor test pins 216 are used to form electrical contact with the pins of the semiconductor 103 under test and transmit the electrical signals required for testing. A blocking block 217 is provided on one side of the semiconductor test pin 216 to limit the downward movement of the semiconductor test pin 216 and prevent excessive contact pressure from damaging the pins or leads. A detection circuit board 225 is provided on the top of the cooling base 202 corresponding to multiple sets of semiconductor test pins 216. The detection circuit board 225 is electrically connected to the semiconductor test pins 216 and is used to receive the electrical signals transmitted by the semiconductor test pins 216 and transmit them to external testing equipment.

[0057] In this embodiment, when the semiconductor test pin 216 is in the blocked position, the semiconductor test pin 216 is located at the upper part of the sliding test groove 215 under the action of the elastic member. The semiconductor test pin 216 is blocked inside the sliding test groove 215, and the pin of the semiconductor 103 to be tested is located outside the cooling air channel 213. When the semiconductor test pin 216 is in the detection position, the semiconductor 103 to be tested is driven by the downward pressure to move the semiconductor test pin 216 downward along the sliding test groove 215 against the elastic force, so that the semiconductor test pin 216 and the pin of the semiconductor 103 to be tested are both located inside the cooling air channel 213. The bottom of the blocking block 217 contacts the inner wall of the sliding test groove 215, restricting the semiconductor test pin 216 from moving further downward, ensuring that the contact pressure between the pin and the pin is stable. The airflow flowing through the cooling air channel 213 can directly contact the contact part of the pin and the pin, and take away the heat generated at the contact part.

[0058] The top of the guide box 211 has a groove 218. On one side of the groove 218, a mounting slot 219 is provided corresponding to multiple sets of semiconductor test pins 216. Each mounting slot 219 contains an L-shaped guide seat 220. One side of the L-shaped guide seat 220 has a guide groove 221. The guide groove 221 is arranged vertically, restricting the guide frame 222 to reciprocate only in the vertical direction, preventing horizontal offset of the guide frame 222. A guide frame 222 is provided at the bottom of the semiconductor test pins 216. One side of the guide frame 222 is slidably connected to the guide groove 221. The frame 222 can drive the semiconductor test pin 216 to move synchronously along the guide groove 221, realizing the switching of the semiconductor test pin 216. The top of the L-shaped guide seat 220 and the bottom of the guide frame 222 are respectively provided with mounting posts 223. The mounting posts 223 are used to fix the two ends of the sealing spring 224 to prevent the sealing spring 224 from shifting during the extension and contraction process, and to ensure that the elastic force is always in the vertical direction. The sealing spring 224 is provided between the two sets of mounting posts 223. The sealing spring 224 provides elastic power for the reset of the semiconductor test pin 216.

[0059] In this embodiment, when the semiconductor test pin 216 is in the blocked position, the guide frame 222 is located at the upper stop of the guide groove 221 under the elastic force of the blocking spring 224, and the blocking spring 224 is in an extended state. At this time, the semiconductor test pin 216 is synchronously located at the upper position of the sliding test groove 215 along with the guide frame 222. When the semiconductor test pin 216 is in the detection position, the semiconductor to be tested 103 is driven by downward pressure, causing the semiconductor test pin 216 and the guide frame 222 to move down synchronously. The guide frame 222 moves down along the guide groove 221 to the lower stop. The blocking spring 224 is compressed by the guide frame 222 and stores elastic potential energy. When the downward pressure on the semiconductor to be tested 103 disappears, the blocking spring 224 releases elastic potential energy, pushing the guide frame 222 and the semiconductor test pin 216 to automatically reset to the blocked position.

[0060] Further explanation: The semiconductor test pin 216 adopts a sliding linkage structure, which, together with the through cooling air channel 213 inside the test box 212, enables automatic switching of workstations without the need for an additional independent drive mechanism. In the test state, the chip is pressed down, causing the semiconductor test pin 216 to move to the detection position against the force of the sealing spring 224. At this time, the bottom of the blocking block 217 contacts the inner wall of the sliding test groove 215 to achieve the lower stop limit. The semiconductor test pin 216 and the pin of the semiconductor 103 under test enter the cooling air channel 213 at the same time. The airflow flowing through the cooling air channel 213 can directly contact the contact parts of the pin and the pin, carrying away the heat generated at the contact parts. This solves the problem that the traditional test frame cooling structure is separated from the test pin, and the heat generated at the contact parts of the pin and the chip pin cannot be discharged in time. It avoids the signal drift phenomenon that occurs during long-term continuous testing and improves the accuracy of the test results.

[0061] The test base 101 has two sets of third ventilation slots 106 on its top. These two sets of third ventilation slots 106 serve as the main air intake and main air outlet channels for the entire ventilation system, respectively. Both ends of the placement plate 102 are equipped with air guide hoods 107, which are used to collect and distribute airflow. One adjacent side of each of the two sets of air guide hoods 107 is connected to multiple sets of first ventilation slots 105 and second ventilation slots 214, while the other side of each air guide hood 107 is connected to the two sets of third ventilation slots 106. This allows the air guide hoods 107 on the air intake side to distribute the airflow from the main air intake channel to all the first ventilation slots 105 and second ventilation slots 214, and the air outlet... The side air guide shroud 107 can collect the airflow after each workstation and discharge it through the main air outlet channel. The test base 101 is equipped with a fan 108, which provides directional airflow power for the entire ventilation system and drives the airflow to circulate along a preset path. The air inlet of the fan 108 is equipped with a dust filter pad 109, which can filter the external air entering the fan 108 and prevent dust, debris and other foreign objects in the air from entering the ventilation system. This avoids foreign objects from adhering to the inner wall of the air duct, the chip surface or the test pins and affecting the test results. The air outlet of the fan 108 is connected to one of the air guide shrouds 107.

[0062] Specifically, when the fan 108 is activated, the air blown out enters multiple sets of first ventilation slots 105 and multiple sets of second ventilation slots 214 through the air inlet side guide shroud 107. The air through the first ventilation slots 105 enters the adsorption air channels 203 of each test stage at the corresponding longitudinal position. The air flowing at high speed through the adsorption air channels 203 creates negative pressure. Through the connection between the adsorption air channels 203 and the adsorption holes 204, the negative pressure acts on the bottom of the semiconductor 103 under test, forming a downward adsorption force to fix the semiconductor 103 under test. At the same time, the airflow flowing through the adsorption air channels 203 can directly... The airflow makes contact with the bottom of the carrier 201 and the bottom of the semiconductor under test 103, carrying away the heat generated by the semiconductor under test 103 during operation. The airflow entering the second ventilation slot 214 passes through the cooling air channel 213 of the corresponding test box 212. The airflow through the cooling air channel 213 blows directly over the contact area between the pins of the semiconductor under test 103 and the semiconductor test pin 216, carrying away the heat generated by the current passing through the contact area. After completing the heat exchange, the two airflows finally converge at the air outlet side guide shroud 107 and are discharged outside the device through the third ventilation slot 106 on the air outlet side, forming a complete airflow cycle.

[0063] Two sets of first linear modules 110 are provided on the top of the test base 101. The two sets of first linear modules 110 are arranged parallel to each other along the length of the test base 101, providing the test structure with the X-axis direction of movement. This allows the test structure to be moved directly above any test slot 104, adapting to the continuous testing requirements of multiple stations. The top of the sliders of the two sets of first linear modules 110 are connected to the second linear module 111. The second linear module 111 is arranged along the width of the test base 101, providing the test structure with the Y-axis direction of movement. This allows the relative position between the test structure and the semiconductor 103 under test to be adjusted. The test structure is provided on one side of the slider of the second linear module 111. A protective cover 112 is provided on the outside of the test structure. The protective cover 112 can protect the test structure and prevent external dust and debris from entering the component, thus avoiding affecting the operating accuracy and service life of the component.The test structure also includes a fixed cylinder 303. One side of the fixed cylinder 303 is connected to the slider of the second linear module 111, providing vertical power for the downward pressing action of the test structure. The pneumatic rod of the fixed cylinder 303 is connected to a moving block 304, which can move up and down synchronously with the pneumatic rod of the fixed cylinder 303. A first movable plate 305 is provided at the bottom of the moving block 304. Two sets of mounting frames 306 are provided on one side of the first movable plate 305. Two sets of fixed sliders 307 are provided at the bottom of the first movable plate 305. The bottom of the fixed sliders 307 is slidably connected to the sliding rails 308. All components are connected to the fixed plate 309, restricting the fixed plate 309 to move horizontally only along the length direction of the sliding rail 308. A mounting block 310 is provided on one side of the mounting frame 306, and a first adjusting cylinder 311 is provided at the bottom of the mounting block 310. The axis of the pneumatic rod of the first adjusting cylinder 311 is parallel to the length direction of the sliding rail 308, providing power for the horizontal adjustment of the fixed plate 309. Connecting frames 312 are provided on both sides of the fixed plate 309, and first connecting sleeves 313 are provided on the connecting frames 312. One end of the pneumatic rod of the first adjusting cylinder 311 is connected to the first connecting sleeve 313, enabling the extension and retraction of the first adjusting cylinder 311. The device can directly drive the fixing plate 309 to move horizontally along the sliding rail 308, adjusting the relative position of the fixing plate 309 and the semiconductor 103 under test, adapting to semiconductors 103 of different sizes and specifications. The top of the fixing plate 309 has multiple sets of through slots corresponding to the detection probe 302, providing clearance for the vertical movement of the detection probe 302 and preventing interference between the detection probe 302 and the fixing plate 309. A sliding rod 314 is provided at the bottom of the fixing plate 309, and a temperature probe 315 is slidably mounted at the bottom end of the sliding rod 314. The sliding rod 314 provides vertical sliding guidance for the temperature probe 315. A first spring 316 is provided around the periphery of the 314. The two ends of the first spring 316 contact the bottom of the fixing plate 309 and the top of the temperature probe 315 respectively, providing elastic support for the temperature probe 315. This allows the temperature probe 315 to adapt to the height difference of the surface of the semiconductor 103 under test, ensuring good contact while avoiding damage to the chip surface. The bottom of the fixing plate 309 is also provided with multiple sets of fixing rods 317. The bottom ends of the multiple sets of fixing rods 317 contact the top of the semiconductor 103 under test, which can evenly transmit the downward pressure of the fixing cylinder 303 to the surface of the semiconductor 103 under test, pushing the semiconductor 103 under test to move downward.

[0064] In this embodiment, before testing, the test structure is moved to directly above the test slot 104 where the semiconductor 103 to be tested is located by the coordinated movement of two sets of first linear modules 110 and second linear modules 111. According to the size specifications of the semiconductor 103 to be tested, the first adjusting cylinder 311 is activated to drive the fixing plate 309 to move horizontally along the sliding rail 308, adjusting the position of the fixing plate 309 so that the fixing rod 317 and the temperature probe 315 are aligned with the corresponding area on the top of the semiconductor 103 to be tested. Then, the fixing cylinder 303 is activated to push the moving block 304 and the first movable plate 305 downward, driving the fixing plate 309 to move downward synchronously. During the movement, the temperature probe 315 first contacts the top of the semiconductor 103 to be tested, and then moves downward with the fixing plate 309. 9. As the probe continues to move downward, the temperature probe 315 moves upward along the sliding rod 314 to compress the first spring 316 until the bottom of the temperature probe 315 is at the same level as the bottom of the multiple sets of fixing rods 317. Then, the bottom of the multiple sets of fixing rods 317 contacts the top of the semiconductor 103 under test and continues to press down on the semiconductor 103 under test, so that the bottom surface of the semiconductor 103 under test contacts the top surface of the carrier 201. At the same time, the carrier column 205 moves down to the adsorption position and the semiconductor test pin 216 moves down to the detection position, completing the fixing and position switching of the semiconductor 103 under test. During the test, the temperature probe 315 is always in contact with the top of the semiconductor 103 under test under the elastic force of the first spring 316, and the surface temperature of the semiconductor 103 under test is collected in real time.

[0065] A third linear module 318 is provided on one side of the movable block 304. The third linear module 318 is arranged vertically and is used to provide power for the up-and-down movement of the detection probe 302. It can drive the detection probe 302 to adjust its position in the vertical direction, so as to realize the contact and disengagement of the detection probe 302 with the pin of the semiconductor 103 under test. A first mounting plate 319 is provided on one side of the slider of the third linear module 318. Sliding frames 320 are provided on both sides of the first mounting plate 319. A sliding groove 321 is opened on one side of the sliding frame 320. The sliding groove 321 is arranged horizontally and a sliding block 322 is provided in the sliding groove 321. The adjacent sides of the two sets of sliding blocks 322 are connected to the second movable plate 323. The second movable plate 323 can move synchronously along the sliding groove 321 with the sliding block 322. A second adjusting cylinder 324 is provided on one side of the sliding frame 320. Power is provided for the horizontal movement of the second movable plate 323. A mounting base 325 is provided on the side of the sliding block 322 away from the second movable plate 323. A second connecting sleeve 326 is provided on the mounting base 325. One end of the pneumatic rod of the second adjusting cylinder 324 is connected to the second connecting sleeve 326, so that the extension and retraction of the second adjusting cylinder 324 can directly drive the sliding block 322 and the second movable plate 323 to move synchronously. Multiple sets of guide sleeves 327 and multiple sets of guide rods 328 are respectively provided on the side of the first mounting plate 319 adjacent to the second movable plate 323. The multiple sets of guide sleeves 327 are slidably connected to the multiple sets of guide rods 328. The guide sleeves 327 and guide rods 328 cooperate to form an auxiliary guiding structure, which can further limit the movement direction of the second movable plate 323, prevent the second movable plate 323 from swaying during movement, and ensure the stability of the spacing adjustment of the detection needles 302.

[0066] In this embodiment, before testing, based on the longitudinal spacing of the pins of the semiconductor 103 under test, the second adjusting cylinder 324 is activated to push the sliding block 322 to move horizontally within the sliding groove 321, causing the second movable plate 323 to move synchronously. At this time, the guide rod 328 slides synchronously within the guide sleeve 327, providing auxiliary guidance for the movement of the second movable plate 323, thereby adjusting the spacing between the first mounting plate 319 and the second movable plate 323, so that the eight sets of detection pins 302 respectively mounted on the first mounting plate 319 and the second movable plate 323 are aligned with the corresponding pins of the semiconductor 103 under test, completing the adjustment of the longitudinal spacing of the detection pins 302. Subsequently, the third linear module 318 is activated. The first mounting plate 319, the second movable plate 323, and the eight sets of detection pins 302 are moved downward as a whole, so that the bottom of the eight sets of detection pins 302 are in close contact with the corresponding pins of the semiconductor 103 under test. In conjunction with the semiconductor test pins 216, the circuit board 225 is connected via wired or wireless means to transmit the electrical signals of the semiconductor 103 under test to the testing equipment 301 through the detection pins 302 and the semiconductor test pins 216, thereby completing various electrical performance tests of the semiconductor 103 under test. After the test is completed, the third linear module 318 is activated to move the detection pins 302 upward and disengage them from the pins of the semiconductor 103 under test, leaving operating space for the subsequent removal and replacement of the chip.

[0067] Four sets of horizontal slide rails 329 are provided on the side adjacent to the first mounting plate 319 and the second movable plate 323. The four sets of horizontal slide rails 329 are slidably connected to four sets of adjusting columns 330. The four sets of horizontal slide rails 329 are arranged in parallel in the horizontal direction, providing horizontal sliding guide constraints for the adjusting columns 330, restricting the adjusting columns 330 to move only along the length direction of the horizontal slide rails 329, and preventing the adjusting columns 330 from deviating in the vertical direction. The adjusting columns 330 are used to support and fix the detection needles 302, and can drive the detection needles 302 to move synchronously along the horizontal slide rails 329 to realize the adjustment of the lateral spacing of the detection needles 302. The top of the first mounting plate 319 and the second movable plate 323 are both provided with second mounting plates 331. A slide cylinder 332 is provided on the side adjacent to the two sets of second mounting plates 331. An L-shaped push plate 333 is provided on the slider side of the slide cylinder 332. An interval adjustment plate 334 is provided at the bottom of the L-shaped push plate 333.

[0068] The slide cylinder 332 provides power for the up-and-down movement of the interval adjustment plate 334. The L-shaped push plate 333 is used to connect the slider of the slide cylinder 332 and the interval adjustment plate 334, transmitting the vertical thrust of the slide cylinder 332 to the interval adjustment plate 334. Four sets of interval adjustment slots 335 are provided on one side of the interval adjustment plate 334. The four sets of interval adjustment slots 335 are all obliquely distributed. Each of the four sets of adjustment columns 330 is provided with a sliding column 336 on one side. The sliding column 336 is used to connect the adjustment column 330 and the interval adjustment slot 335, transmitting motion and power. The four sets of sliding columns 336 slide through the four sets of interval adjustment slots 335 respectively. The interval adjustment plate 334 drives the adjustment column 330 to produce horizontal displacement through its own up-and-down movement. With the help of the obliquely distributed interval adjustment slots 335, the vertical movement of the interval adjustment plate 334 can be converted into the horizontal movement of the adjustment column 330.

[0069] In this embodiment, before testing, based on the lateral spacing of the pins of the semiconductor 103 to be tested, the slide cylinder 332 on the top of the first mounting plate 319 or the second movable plate 323 is activated. The slider of the slide cylinder 332 drives the L-shaped push plate 333 to move vertically, thereby pushing the interval adjustment plate 334 to move up and down synchronously. The inner walls of the four sets of interval adjustment grooves 335 obliquely distributed on the interval adjustment plate 334 contact the corresponding sliding column 336 and generate relative sliding, pushing the four sets of sliding columns 336 to drive the corresponding adjustment column 330 to move synchronously along the horizontal slide rail 329, thereby adjusting the lateral spacing between the four sets of adjustment columns 330, thereby realizing the adjustment of the lateral spacing of the four sets of detection pins 302. Combined with the longitudinal spacing adjustment realized by the second adjustment cylinder 324, it can adapt to the chip testing requirements of different pin specifications and different package sizes, without the need for frequent replacement of test fixtures.

[0070] The test structure includes two sets of detection devices 301 and eight sets of detection probes 302. The detection devices 301 receive, process, and output test results from the detection probes 302. The detection probes 302 form electrical contact with the pins of the semiconductor 103 under test, transmitting the electrical signals required for the test. Each of the four sets of adjusting columns 330 has two sets of fixing blocks 338 on one side. Each of the fixing blocks 338 has a sliding hole at its top, arranged vertically. The detection probes 302 slide through the sliding holes, restricting their reciprocating movement to a vertical direction to prevent horizontal deviation. A fixing ring 339 and a sliding ring 340 are arranged around the detection probes 302. The fixing ring 339 is fixedly connected to the detection probe 302 and can move synchronously with it. The sliding ring 340 slides around the detection probe 302. The movable connection allows relative sliding along the length of the detection needle 302. The fixed ring 339 and the sliding ring 340 are both located between two sets of fixed blocks 338. The bottom of one set of fixed blocks 338 is connected to the sliding ring 340, keeping the position of the sliding ring 340 fixed. A second spring 341 is sleeved around the periphery of the detection needle 302. The second spring 341 is located between the fixed ring 339 and the sliding ring 340, providing elastic support and reset power for the detection needle 302. A detection device 301 is provided on one side of the L-shaped push plate 333. The two sets of detection devices 301 correspond to the four sets of detection needles 302 on the first mounting plate 319 and the second movable plate 323, respectively. The tops of the four sets of detection needles 302 are connected to the detection device 301 through signal lines 342. The signal lines 342 are used to transmit the electrical signals collected by the detection needles 302 to the detection device 301.

[0071] Specifically, when the third linear module 318 moves the detection pin 302 downward, and the bottom end of the detection pin 302 contacts the pin of the semiconductor 103 under test, the detection pin 302 is subjected to an upward reaction force and moves upward along the sliding hole. The moving detection pin 302 drives the fixing ring 339 to move upward synchronously, compressing the second spring 341. The downward elastic force generated by the second spring 341 reacts to the fixing ring 339 and the detection pin 302, so that the detection pin 302 and the pin of the semiconductor 103 under test maintain stable contact, while avoiding hard contact that could damage the pin of the semiconductor 103 under test or the detection pin 302. After the test is completed, the third linear module 318 moves the detection pin 302 upward, the reaction force of the semiconductor 103 under test on the detection pin 302 disappears, and the second spring 341 releases its elastic potential energy to push the fixing ring 339 and the detection pin 302 downward along the sliding hole, resetting to the initial position, and preparing for the next test.

[0072] The specific usage and function of this embodiment: When using the device, first place the semiconductor to be tested 103 in the test slot 104. At this time, the support post 205 is in the ejected position under the elastic force of the ejection spring 210. The top of the support post 205 contacts the bottom of the semiconductor to be tested 103 and supports the semiconductor to be tested 103 upward, which facilitates the chip placement operation. At the same time, the pins of the semiconductor to be tested 103 contact the top of the semiconductor test pin 216 in the sealed position, completing the initial placement and alignment of the chip.

[0073] During fixation, the fixing cylinder 303 is activated to push the first movable plate 305 downwards, moving it synchronously with the fixing plate 309. During the movement, the temperature probe 315 at the bottom of the fixing plate 309 first contacts the top of the semiconductor 103 under test. As the fixing plate 309 continues to move downwards, the temperature probe 315 moves upwards along the sliding rod 314 and compresses the first spring 316 until the bottom of the temperature probe 315 is at the same level as the bottom of the multiple sets of fixing rods 317. Subsequently, the bottom of the multiple sets of fixing rods 317 contacts the top of the semiconductor 103 under test and continues to press down on the semiconductor 103 under test, so that the bottom surface of the semiconductor 103 under test contacts the top surface of the support base 201. The moving semiconductor 103 under test simultaneously presses down on the support column 205, causing the support column 205 to overcome the elastic force of the ejection spring 210 and move downwards to the adsorption position. At this time, the support column 205 and the sealing plate 201 are in contact. All 8 are located inside the guide cylinder 206. The top of the support column 205 is flush with the top surface of the support seat 201. The adsorption air channel 203 is connected to the adsorption hole 204 through the through groove 207 and the inside of the guide cylinder 206. The ejection spring 210 is in a compressed state and stores elastic potential energy. At the same time, the lowered semiconductor to be tested 103 also presses down the semiconductor test pin 216, so that the semiconductor test pin 216 overcomes the elastic force of the sealing spring 224 and moves down along the sliding test groove 215 to the detection position. At this time, the semiconductor test pin 216 and the pin of the semiconductor to be tested 103 both enter the interior of the cooling air channel 213. The bottom of the blocking block 217 contacts the inner wall of the sliding test groove 215, restricting the semiconductor test pin 216 from moving further down, ensuring that the contact pressure between the pin and the pin is stable, and completing the clamping and fixing of the semiconductor to be tested 103 and the switching of the work positions of related components.

[0074] When the fan 108 is started, the airflow blown by the fan 108 is distributed through the air inlet side guide shroud 107 to multiple sets of first ventilation slots 105 and multiple sets of second ventilation slots 214. The airflow through the first ventilation slots 105 enters the adsorption air ducts 203 of each test stage at the corresponding longitudinal position. The high-speed airflow creates a negative pressure in the adsorption air ducts 203. The negative pressure acts on the bottom of the semiconductor 103 under test through the adsorption holes 204, forming a downward adsorption force to achieve secondary fixation of the semiconductor 103 under test. At the same time, the airflow flowing through the adsorption air ducts 203... The airflow directly contacts the bottom of the carrier 201 and the bottom of the semiconductor under test 103, carrying away the heat generated by the semiconductor under test 103 during operation; the airflow entering the second ventilation slot 214 passes through the cooling air channel 213 of the corresponding test box 212, and blows directly over the contact area between the pins of the semiconductor under test 103 and the semiconductor test pin 216, carrying away the heat generated by the current passing through the contact area. After completing the heat exchange, the two airflows finally converge to the air guide shroud 107 on the air outlet side and are discharged through the third ventilation slot 106 on the air outlet side.

[0075] Before testing, based on the pin specifications of the semiconductor 103 under test, the slide cylinder 332 on the top of the first mounting plate 319 and the second movable plate 323 is activated. The slider of the slide cylinder 332 drives the L-shaped push plate 333 to move vertically, thereby pushing the interval adjustment plate 334 to move up and down synchronously. The inner walls of the four sets of interval adjustment grooves 335 obliquely distributed on the interval adjustment plate 334 contact the corresponding sliding column 336 and generate relative sliding, pushing the four sets of sliding columns 336 to drive the corresponding adjustment column 330 to move along the horizontal slide rail 329, thereby adjusting the lateral spacing between the four sets of adjustment columns 330, and thus realizing the four sets of The lateral spacing of the detection pins 302 is adjusted; then the second adjusting cylinder 324 is activated to push the sliding block 322 to move horizontally in the sliding groove 321, which drives the second movable plate 323 to move synchronously. At this time, the guide rod 328 slides synchronously in the guide sleeve 327 to provide auxiliary guidance for the movement of the second movable plate 323, thereby adjusting the longitudinal spacing between the first mounting plate 319 and the second movable plate 323, so that the eight sets of detection pins 302 installed on the first mounting plate 319 and the second movable plate 323 are aligned with the corresponding pins of the semiconductor 103 to be tested, thus completing the position adjustment of the detection pins 302.

[0076] The third linear module 318 is activated, causing the first mounting plate 319, the second movable plate 323, and the eight sets of detection pins 302 to move downwards. This allows the bottom ends of the eight sets of detection pins 302 to contact the corresponding pins of the semiconductor 103 under test. The semiconductor test pins 216 and the test circuit board 225 are then connected via wired or wireless means. The electrical signals of the semiconductor 103 under test are transmitted to the testing device 301 through the detection pins 302 and the semiconductor test pins 216, completing various electrical performance tests on the semiconductor 103. During the test, the temperature probe 315 remains in contact with the semiconductor under test under the elastic force of the first spring 316. The top of the semiconductor 103 is contacted, and the surface temperature of the semiconductor 103 under test is collected in real time. After the test is completed, the third linear module 318 is activated to drive the detection pin 302 to move upward and disengage from the pin of the semiconductor 103 under test. Then, the fixing cylinder 303 is activated to drive the fixing plate 309 to move upward and reset. The downward pressure on the semiconductor 103 under test disappears, and the bearing column 205 is reset to the ejection position under the elastic force of the ejection spring 210, which lifts the semiconductor 103 under test upward. At the same time, the semiconductor test pin 216 is reset to the sealing position under the elastic force of the sealing spring 224, and the semiconductor that has been tested can be taken out.

[0077] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A test fixture for semiconductor packaging testing, characterized in that, include: The test base has a placement plate on top. The top of the placement plate has multiple sets of test slots for placing semiconductors to be tested. On one side of the placement plate, there are multiple sets of through first ventilation slots corresponding to the multiple sets of test slots. The multiple sets of test slots located in the same longitudinal position are connected through one of the first ventilation slots. Multiple test platforms are installed in multiple test slots. Each test platform includes a support base with a cooling base at the bottom. The gap between the support base and the cooling base forms an adsorption air duct. The adsorption air duct and one of the first ventilation slots are located on the same axis. Multiple adsorption holes are opened on the top of the support base. Each adsorption hole is equipped with a support column located at the adsorption position or the ejection position. The diameter of the support column is smaller than the diameter of the adsorption hole. The test structure is mounted on top of the test base and includes a testing device and a testing probe for testing the semiconductor to be tested.

2. The test fixture for semiconductor packaging testing according to claim 1, characterized in that: The test stage includes multiple sets of guide cylinders. Multiple sets of guide cylinders are provided on the top of the cooling base corresponding to multiple sets of adsorption holes. Each set of guide cylinders has a through groove parallel to the adsorption air duct on one side. Multiple sets of support columns are respectively inserted into the multiple sets of guide cylinders. Each set of support columns has a sealing plate on its periphery. The sealing plates are slidably connected to the multiple sets of guide cylinders. Sliding sealing rings are provided on the periphery of the sealing plates. The tops of the multiple sets of support columns are in contact with the semiconductor to be tested. An ejection spring is provided inside the guide cylinder for moving the support column to the ejection position. When the support column is in the adsorption position, both the support column and the sealing plate are located inside the guide cylinder. The top of the support column is flush with the top surface of the support seat. The adsorption air duct is connected to the adsorption hole, and the ejection spring is in a compressed state. When the support column is in the top position, the top of the support column passes through the adsorption hole, the sealing plate is located in the adsorption hole to seal it, the adsorption air duct is not connected to the adsorption hole, and the top spring is in the extended state.

3. The test fixture for semiconductor packaging testing according to claim 1, characterized in that: The cooling base has guide boxes on both sides, and test boxes on the top of the guide boxes. Each of the two test boxes has a through cooling air channel at one end. Multiple sets of second ventilation slots are opened on one side of the placement plate. The two sets of cooling air channels are connected to two of the second ventilation slots respectively. Multiple sets of sliding test slots are opened at equal intervals on the adjacent side of the two sets of test boxes. Semiconductor test pins located at the blocking position or detection position are slidably arranged in the multiple sets of sliding test slots. The semiconductor test pins are used to contact the pins of the semiconductor to be tested. A blocking block is provided on one side of the semiconductor test pins. A detection circuit board is provided on the top of the cooling base corresponding to the multiple sets of semiconductor test pins. When the semiconductor test pin is in the blocked position, the semiconductor test pin is blocked in the sliding test groove, and the semiconductor pin to be tested is outside the cooling air duct. When the semiconductor test pin is in the detection position, both the semiconductor test pin and the semiconductor pin under test are located in the cooling air duct, and the bottom of the blocking block is in contact with the inner wall of the sliding test groove.

4. The test fixture for semiconductor packaging testing according to claim 3, characterized in that: The top of the guide box has a groove, and one side of the groove has a mounting slot corresponding to multiple sets of semiconductor test pins. Each set of mounting slots has an L-shaped guide seat. One side of the L-shaped guide seat has a guide slot. The bottom of the semiconductor test pins has a guide frame. One side of the guide frame is slidably connected to the guide slot. The top of the L-shaped guide seat and the bottom of the guide frame are each provided with a mounting post. A sealing spring is provided between the two sets of mounting posts. When the semiconductor test pin is in the plugged position, the guide frame is at the upper stop of the guide groove, and the plugging spring is in an extended state. When the semiconductor test pin is in the detection position, the guide frame is at the lower stop of the guide groove, and the sealing spring is compressed.

5. The test fixture for semiconductor packaging testing according to claim 3, characterized in that: The test base has two sets of third ventilation slots on the top. Both ends of the placement plate are equipped with air guide hoods. The adjacent side of the two sets of air guide hoods is connected to multiple sets of first and second ventilation slots. The other side of the air guide hoods is connected to two sets of third ventilation slots respectively. A fan is installed inside the test base. A dust filter pad is installed at the air inlet of the fan. The air outlet of the fan is connected to one of the air guide hoods.

6. The test fixture for semiconductor packaging testing according to claim 1, characterized in that: The test base is provided with two sets of first linear modules on the top. The top of the slider of each set of first linear modules is connected to the second linear module. A test structure is provided on one side of the slider of the second linear module, and a protective cover is provided on the outside of the test structure. The test structure also includes a fixed cylinder, one side of which is connected to the slider of the second linear module. The pneumatic rod of the fixed cylinder is connected to a moving block. A first movable plate is set at the bottom of the moving block. Two sets of mounting frames are set on one side of the first movable plate. Two sets of fixed sliders are set at the bottom of the first movable plate. The bottom of the fixed sliders is slidably connected to the sliding rails. The bottom of both sets of sliding rails is connected to the fixed plate.

7. The test fixture for semiconductor packaging testing according to claim 6, characterized in that: A mounting block is provided on one side of the mounting frame, and a first adjusting cylinder is provided at the bottom of the mounting block. The axis of the pneumatic rod of the first adjusting cylinder is parallel to the length direction of the sliding rail. Connecting frames are provided on both sides of the fixing plate, and a first connecting sleeve is provided on the connecting frame. One end of the pneumatic rod of the first adjusting cylinder is connected to the first connecting sleeve. Multiple sets of through slots are opened on the top of the fixing plate corresponding to the detection pin. A sliding rod is provided at the bottom of the fixing plate, and a temperature probe is slidably installed at the bottom end of the sliding rod. A first spring is sleeved around the periphery of the sliding rod. Multiple sets of fixing rods are also provided at the bottom of the fixing plate, and the bottom ends of the multiple sets of fixing rods are in contact with the top of the semiconductor to be tested.

8. The test fixture for semiconductor packaging testing according to claim 6, characterized in that: A third linear module is provided on one side of the movable block. A first mounting plate is provided on one side of the slider of the third linear module. Sliding frames are provided on both sides of the first mounting plate. A sliding groove is opened on one side of the sliding frame, and a sliding block is provided in the sliding groove. The adjacent sides of the two sets of sliding blocks are connected to the second movable plate. A second adjusting cylinder is provided on one side of the sliding frame. A mounting seat is provided on the side of the sliding block away from the second movable plate. A second connecting sleeve is provided on the mounting seat. One end of the pneumatic rod of the second adjusting cylinder is connected to the second connecting sleeve. Multiple sets of guide sleeves and multiple sets of guide rods are respectively provided on the side of the first mounting plate adjacent to the second movable plate. The multiple sets of guide sleeves are slidably connected to the multiple sets of guide rods.

9. The test fixture for semiconductor packaging testing according to claim 8, characterized in that: Four sets of horizontal slide rails are provided on the side adjacent to the first mounting plate and the second movable plate. The four sets of horizontal slide rails are slidably connected to four sets of adjusting columns. A second mounting plate is provided on the top of both the first mounting plate and the second movable plate. A slide cylinder is provided on the side adjacent to the two sets of second mounting plates. An L-shaped push plate is provided on the slider side of the slide cylinder. An interval adjusting plate is provided at the bottom of the L-shaped push plate. Four sets of interval adjusting slots are opened on one side of the interval adjusting plate. The four sets of interval adjusting slots are all distributed obliquely. A sliding column is provided on one side of each of the four sets of adjusting columns. The four sets of sliding columns slide through the four sets of interval adjusting slots respectively.

10. The test fixture for semiconductor packaging testing according to claim 9, characterized in that: The test structure includes two sets of testing equipment and eight sets of testing needles. Each of the four sets of adjusting columns has two sets of fixing blocks on one side. The top of each of the two sets of fixing blocks has a sliding hole, and the testing needle slides through the sliding hole. The testing needle has a fixing ring and a sliding ring around its periphery. The fixing ring is fixedly connected to the testing needle, and the sliding ring is slidably connected to the testing needle. The fixing ring and the sliding ring are both located between the two sets of fixing blocks. The bottom of one set of fixing blocks is connected to the sliding ring. A second spring is sleeved around the testing needle and is located between the fixing ring and the testing needle. The testing equipment is set on one side of the L-shaped push plate, and the tops of the four sets of testing needles are connected to the testing equipment through signal lines.

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