Reinforced packaging device for improving stability of chip

Abstract

The utility model provides a reinforced packaging device for improving the stability of a chip, and the device comprises a protection assembly which comprises a buffer pad, a heat conduction plate, a first cavity, a heat insulation plate, a shielding cover, a heat dissipation plate, a second cavity, an air inlet pipe, a liquid return pipe, and heat dissipation fins. A heat conduction plate is arranged outside the buffer pad, a first cavity is formed in the heat conduction plate, a heat insulation plate is fixedly connected to the top of the heat conduction plate, and a shielding cover is fixedly connected to the outer side wall of the heat insulation plate. According to the utility model, the buffer pad made of the memory alloy material is arranged between the substrate and the chip, the mechanical stress on the chip is relieved by utilizing the capability of automatically adjusting the shape according to the temperature change or the external stress, and the chip is protected from being damaged. The cavity is filled with the refrigerant with the low boiling point, after the heat conduction plate absorbs heat and the temperature rises, the refrigerant evaporates to enter the heat dissipation plate and flows back to the heat conduction plate after being cooled, the heat dissipation speed of the chip is increased, and the heat dissipation effect of the chip is improved.

Description

Technical Field

[0001] This utility model relates to a rugged packaging device, and more particularly to a rugged packaging device for improving chip stability, belonging to the field of chip protection technology. Background Technology

[0002] A chip is a miniature electronic circuit that integrates a large number of tiny electronic components onto a single semiconductor substrate. It is the brain of an electronic device, responsible for performing various tasks such as processing information, storing data, performing calculations, and controlling operations. These electronic components are integrated onto a small semiconductor wafer through precise design and manufacturing processes, forming a complex circuit structure.

[0003] Chip stability refers to its ability to perform its intended function under specified conditions and within a specified time. Insufficient stability directly affects chip reliability. Under prolonged operation or high-temperature environments, chips may malfunction due to overheating or material aging, causing equipment to fail to function properly. Furthermore, chips with insufficient stability are more susceptible to damage when subjected to external impacts or vibrations. Therefore, a ruggedized packaging device for improving chip stability is proposed. Utility Model Content

[0004] In view of this, the present invention provides a ruggedized packaging device for improving chip stability, so as to solve or alleviate one of the technical problems existing in the prior art, and at least provide a beneficial option.

[0005] The technical solution of this utility model embodiment is implemented as follows: a ruggedized packaging device for improving chip stability includes a protective component, wherein the protective component includes a buffer pad, a heat-conducting plate, a first cavity, a heat insulation plate, a shielding cover, a heat sink, a second cavity, an air inlet pipe, a liquid return pipe, and heat dissipation fins.

[0006] The buffer pad is externally provided with a heat-conducting plate, and the heat-conducting plate is internally provided with a first cavity. A heat insulation plate is fixedly connected to the top of the heat-conducting plate, and a shielding cover is fixedly connected to the outer wall of the heat insulation plate. A heat dissipation plate is fixedly connected to the outer wall of the shielding cover. The heat dissipation plate is internally provided with a second cavity. An air inlet pipe and a liquid return pipe are connected to the top of the first cavity. One end of the air inlet pipe and the liquid return pipe are connected to the second cavity. Heat dissipation fins are uniformly fixedly connected to the top of the heat dissipation plate. By filling the first cavity with a low-boiling-point refrigerant, when the heat-conducting plate absorbs heat and its temperature rises, the refrigerant inside the first cavity evaporates and enters the second cavity of the heat dissipation plate. After being cooled by the heat dissipation fins, it flows back to the heat-conducting plate, thus accelerating the heat dissipation speed of the chip.

[0007] A further preferred embodiment: the top of the shielding cover is fixedly connected to a first protective shell and a second protective shell.

[0008] A further preferred embodiment: the first protective shell is disposed outside the air intake pipe.

[0009] A further preferred embodiment: the second protective shell is disposed outside the return pipe.

[0010] A further preferred embodiment: the bottom of the protective component is provided with a main body component, the main body component including a substrate and a chip;

[0011] A chip is mounted on the top of the substrate.

[0012] A further preferred embodiment: an adhesive layer is provided between the substrate and the chip.

[0013] A further preferred embodiment: the buffer pad is disposed between the substrate and the chip.

[0014] A further preferred embodiment: the heat-conducting plate is disposed on the outside of the chip.

[0015] The present invention has the following advantages due to the adoption of the above technical solution:

[0016] I. This utility model provides a buffer pad made of shape memory alloy between the substrate and the chip. By utilizing the buffer pad’s ability to automatically adjust its shape according to temperature changes or external stress, the mechanical stress on the chip is relieved and the chip is protected from damage.

[0017] Second, this utility model fills the cavity with a low-boiling-point refrigerant. When the heat-conducting plate absorbs heat and its temperature rises, the refrigerant evaporates and enters the heat dissipation plate. After cooling, it flows back into the heat-conducting plate, which accelerates the heat dissipation speed of the chip, improves the heat dissipation effect of the chip, and reduces the probability of chip failure.

[0018] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present invention will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a structural diagram of the present invention;

[0021] Figure 2 This is a structural diagram of the present invention after the protective shell has been removed;

[0022] Figure 3 This is a diagram showing the internal structure of the heat-conducting plate of this utility model.

[0023] Reference numerals: 10, main component; 11, substrate; 12, adhesive layer; 13, chip; 20, protective component; 21, buffer pad; 22, heat-conducting plate; 23, first cavity; 24, heat insulation plate; 25, shielding cover; 26, heat sink; 27, second cavity; 28, air inlet pipe; 29, liquid return pipe; 210, heat dissipation fins; 211, first protective shell; 212, second protective shell. Detailed Implementation

[0024] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this invention. Therefore, the drawings and description are considered exemplary in nature and not restrictive.

[0025] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0026] like Figures 1-3 As shown, this utility model embodiment provides a ruggedized packaging device for improving chip stability, including a protective component 20. The protective component 20 includes a buffer pad 21, a heat-conducting plate 22, a first cavity 23, a heat insulation plate 24, a shielding cover 25, a heat dissipation plate 26, a second cavity 27, an air inlet pipe 28, a liquid return pipe 29, and heat dissipation fins 210.

[0027] A heat-conducting plate 22 is provided on the outside of the buffer pad 21. A first cavity 23 is provided inside the heat-conducting plate 22. A heat insulation plate 24 is fixedly connected to the top of the heat-conducting plate 22. A shielding cover 25 is fixedly connected to the outer wall of the heat insulation plate 24. A heat dissipation plate 26 is fixedly connected to the outer wall of the shielding cover 25. A second cavity 27 is provided inside the heat dissipation plate 26. An air inlet pipe 28 and a liquid return pipe 29 are connected to the top of the first cavity 23. One end of the air inlet pipe 28 and the liquid return pipe 29 are connected to the second cavity 27. Heat dissipation fins 210 are uniformly fixedly connected to the top of the heat dissipation plate 26. By filling the first cavity 23 with a low-boiling-point refrigerant, when the heat-conducting plate 22 absorbs heat and its temperature rises, the refrigerant inside the first cavity 23 evaporates and enters the second cavity 27 of the heat dissipation plate 26. After being cooled by the heat dissipation fins 210, it flows back to the heat-conducting plate 22, thereby accelerating the heat dissipation speed of the chip 13.

[0028] In this embodiment, specifically: the top of the shield 25 is fixedly connected to a first protective shell 211 and a second protective shell 212. The first protective shell 211 and the second protective shell 212 are made of ceramic material, which has good hardness and wear resistance.

[0029] In this embodiment, specifically: the first protective shell 211 is disposed outside the air intake pipe 28. The first protective shell 211 is used to protect the air intake pipe 28 and prevent the air intake pipe 28 from being damaged by impact. The air intake pipe 28 is used for the evaporated gas to enter the interior of the heat sink 26.

[0030] In this embodiment, specifically: the second protective shell 212 is disposed outside the return pipe 29. The second protective shell 212 is used to protect the return pipe 29 and prevent the return pipe 29 from being damaged by impact. The return pipe 29 is used for the refrigerant to flow back after cooling.

[0031] In this embodiment, specifically: the bottom of the protective component 20 is provided with a main component 10, which includes a substrate 11 and a chip 13;

[0032] A chip 13 is mounted on the top of the substrate 11, and the chip 13 and the substrate 11 are bonded together by an epoxy resin adhesive layer 12 to enhance structural stability.

[0033] In this embodiment, specifically: an adhesive layer 12 is provided between the substrate 11 and the chip 13. The adhesive layer 12 can be firmly attached to the surface of the chip 13 and the substrate 11, providing sufficient mechanical support. A deformable material is introduced between the substrate 11 and the chip 13 to realize automatic stress relief and adaptive adjustment of the chip 13, thereby improving the mechanical stability and reliability of the packaging structure.

[0034] In this embodiment, specifically: the buffer pad 21 is disposed between the substrate 11 and the chip 13.

[0035] In this embodiment, specifically, the heat-conducting plate 22 is disposed on the outside of the chip 13.

[0036] In operation, this invention features: an epoxy resin adhesive layer 12 strengthens the structural stability between the chip 13 and the substrate 11, providing sufficient mechanical support; a memory alloy buffer pad 21 is placed between the substrate 11 and the chip 13, which automatically adjusts its shape according to temperature changes or external stress, alleviating mechanical stress on the chip 13 and protecting it from damage; a high-efficiency electromagnetic wave shield 25 is formed using metal composite materials, protecting the chip 13 from electromagnetic interference; and a low-boiling-point refrigerant is filled inside the first cavity 23. When the heat-conducting plate 22 absorbs heat and its temperature rises, the refrigerant evaporates into the second cavity 27 of the heat sink 26, cools down using the heat sink fins 210, and flows back into the heat-conducting plate 22, accelerating the heat dissipation of the chip 13, improving its heat dissipation effect, and reducing the probability of chip 13 failure.

[0037] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this utility model, and these should all be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A ruggedized packaging apparatus for improving chip stability, comprising a protection assembly (20), characterized in that: The protective assembly (20) includes a buffer pad (21), a heat-conducting plate (22), a first cavity (23), a heat insulation plate (24), a shield (25), a heat dissipation plate (26), a second cavity (27), an air inlet pipe (28), a liquid return pipe (29), and heat dissipation fins (210). The buffer pad (21) is provided with a heat-conducting plate (22) on the outside. The heat-conducting plate (22) is provided with a first cavity (23) inside. The top of the heat-conducting plate (22) is fixedly connected to a heat insulation plate (24). The outer side wall of the heat insulation plate (24) is fixedly connected to a shield (25). The outer side wall of the shield (25) is fixedly connected to a heat dissipation plate (26). The heat dissipation plate (26) is provided with a second cavity (27) inside. The top of the first cavity (23) is connected to an air inlet pipe (28) and a liquid return pipe (29). One end of the air inlet pipe (28) and the liquid return pipe (29) is connected to the second cavity (27). The top of the heat dissipation plate (26) is uniformly fixedly connected to heat dissipation fins (210).

2. The ruggedized packaging device for improving chip stability of claim 1, wherein: The top of the shield (25) is fixedly connected to a first protective shell (211) and a second protective shell (212).

3. The ruggedized packaging device for improving chip stability of claim 2, wherein: The first protective shell (211) is disposed outside the air intake pipe (28).

4. The ruggedized packaging device for improving chip stability of claim 2, wherein: The second protective shell (212) is disposed outside the return pipe (29).

5. A ruggedized packaging device for improving chip stability according to claim 1, characterized in that: The bottom of the protective component (20) is provided with a main component (10), which includes a substrate (11) and a chip (13). A chip (13) is mounted on the top of the substrate (11).

6. The ruggedized packaging device for improving the stability of a chip according to claim 5, wherein: An adhesive layer (12) is provided between the substrate (11) and the chip (13).

7. The ruggedized packaging device for improving the stability of a chip of claim 5, wherein: The buffer pad (21) is disposed between the substrate (11) and the chip (13).

8. The ruggedized packaging device for improving the stability of a chip according to claim 5, wherein: The heat-conducting plate (22) is disposed on the outside of the chip (13).

Images