Pretreatment device for fragments in machine table

Abstract

The utility model provides a pretreatment device for fragments in a machine table, which comprises a machine room, the machine room comprises a detection module and a gas path system, the detection module comprises a light source, a light source plane is provided with correlation photoelectricity installed through a light source support, the light source support is further provided with a camera, the camera directly faces the surface of a silicon wafer, and the camera is connected with the light source. A probe module is arranged below the silicon wafer, the air path system comprises copper pipe air guns, the copper pipe air guns are installed on the left side and the right side of the light source support and face the camera lens direction, and the copper pipe air guns are connected with an air pressure adjusting valve and an electromagnetic valve through air pipes. According to the device, fragments can be automatically detected and cleaned in the equipment operation process, the influence of the fragments on equipment operation and detection precision is avoided, and the automation degree, the operation efficiency and the detection precision of the equipment are improved.

Description

Technical Field

[0001] This utility model relates to the field of photovoltaic silicon wafer sorting machines, specifically to a fragment pretreatment device inside the machine. Background Technology

[0002] In the photovoltaic silicon wafer industry, DC silicon wafer sorting machines are the mainstream equipment for inspecting silicon wafer defects. However, due to various factors in the upstream slicing process (such as mechanical damage, transportation vibration, and natural force damage), silicon wafers are prone to chipping and breakage during processing and transportation. These fragments often end up in the final sorting, inspection, and packaging stages. The detection accuracy of silicon wafer sorting machines is extremely sensitive to fragments. Once fragments enter the machine, it can lead to misjudgments, missed detections, or even DC phenomena in the detection module, resulting in a series of problems, including customer complaints, rework (loss rate ≥15%), reduced yield, equipment downtime, and increased costs.

[0003] Currently, mainstream sorting equipment mainly relies on adding fragment detection and rejection mechanisms in the loading area to reduce the possibility of fragments entering the machine. However, with the continuous improvement of transmission speed, existing technologies still cannot completely prevent fragments from entering the machine. In particular, smaller fragments can still enter the machine, and the warning time after fragments enter the machine is long, or sometimes there is no warning, which leads to the need for shutdown for manual confirmation and cleaning. Although mainstream sorting machines have added algorithms to the module detection to judge fragment obstruction and issue warnings, manual intervention is still required for cleaning and identification after the warning. The existing processing methods still cannot effectively solve the problems of false judgment, missed detection and DC problems in the detection module, resulting in a series of negative impacts such as customer complaints, increased rework wafers, decreased yield, equipment downtime and increased costs. Therefore, there is an urgent need for a more efficient and automated fragment pre-processing technology to solve the above problems and improve the detection accuracy and operating efficiency of silicon wafer sorting machines. Utility Model Content

[0004] The purpose of this invention is to address the problem that current sorting equipment often has long warning times for debris, or even no warnings at all, which necessitates machine shutdown for manual confirmation and cleaning. This invention provides an in-machine debris pre-processing method to achieve automated debris pre-processing.

[0005] The objective of this utility model is achieved through the following technical solution:

[0006] A fragment pretreatment device for use in a machine, suitable for silicon wafer sorting machines, comprising:

[0007] The cabin,

[0008] The detection module is located inside the machine bay. The detection module includes a light source, a light source support on the light source plane, a through-beam photoelectric sensor mounted on the light source plane via the light source support, and a camera mounted on the light source support. The camera faces the silicon wafer surface, and probe modules are located above and below the silicon wafer.

[0009] An air path system is installed inside the machine compartment. The air path system includes at least two copper tube air guns, which are respectively installed on the left and right sides of the light source bracket and facing the camera lens. The copper tube air guns are connected to an air pressure regulating valve and a solenoid valve through air pipes.

[0010] This device integrates a detection module and a pneumatic system to achieve precise detection and efficient debris removal. The detection module combines a light source with a through-beam photoelectric sensor to provide a stable illumination environment and accurately capture debris information. The camera, positioned directly above the silicon wafer surface, acquires high-definition images in real time, ensuring accurate detection. Simultaneously, the probe module, located beneath the silicon wafer, further enhances the comprehensiveness and precision of the detection. Regarding the pneumatic system, copper tube air guns are mounted on both sides of the light source support, effectively cleaning debris, keeping the camera lens clean, and ensuring the detection process is unaffected by contamination. The copper tube air guns are connected to a pressure regulating valve and a solenoid valve via air tubing, enabling more precise airflow control and improving cleaning effectiveness.

[0011] Furthermore, the through-beam photoelectric sensor has a through-beam area covering the entire light source plane, and is installed at a height of 5-10 cm from the light source. This allows the through-beam photoelectric sensor sufficient reaction time to trigger and transmit the fragment falling signal to the PLC.

[0012] Furthermore, the copper tube air gun includes at least a light source copper tube air gun, a camera copper tube air gun, and a probe copper tube air gun, which are arranged at intervals. They are used respectively to clean debris scattered on the light source, camera lens, and probe.

[0013] Furthermore, the number of the light source copper tube air guns is several, so that the number of the light source copper tube air guns can cover the light source plane.

[0014] Furthermore, the camera copper tube air gun is installed at an angle of 30-45° to the horizontal, and the distance between the camera copper tube air gun and the camera lens is 2-5cm. When the copper tube air gun is in operation, it can automatically clean dust and debris from the camera lens.

[0015] Furthermore, the probe copper tube air gun should be installed above the lower probe module, at a distance of 1cm-3cm. The probe copper tube air gun is designed to be telescopic to adjust the extended length. Adjusting the distance does not affect the detection of the probe module and avoids scratching the silicon wafer, which could affect the detection.

[0016] Furthermore, the air pressure value range of the air pressure regulating valve does not exceed 0.2 MPa.

[0017] Furthermore, the solenoid valve is connected to the PLC module via signal transmission. When the PLC receives a signal, it triggers the copper tube air gun to automatically blow air to remove debris.

[0018] Furthermore, the light source plane is arranged parallel to the silicon wafer surface, the light emission direction of the light source is perpendicular to the silicon wafer surface, and the brightness of the light source is adjustable.

[0019] Furthermore, the probe module includes an upper probe and a lower probe, which are fixed on the light source bracket, and the detection directions of the upper probe and the lower probe are both facing the silicon wafer surface.

[0020] In summary, this technical solution has the following advantages:

[0021] (1) Automated operation, improved efficiency: The system can realize fully automatic detection and cleaning of debris, ensuring the high efficiency of the debris detection process, avoiding manual intervention, and maximizing work efficiency.

[0022] (2) Simple debugging and maintenance: The system is designed to be simple and the debugging and maintenance process is very convenient, which can reduce the difficulty of operation and time cost, and improve the overall operability of the production line.

[0023] (3) Precise fragment identification and cleaning: Through advanced automatic identification technology, the system can quickly and accurately identify fragments and clean them automatically, ensuring the comprehensiveness of the detection and the timeliness of the cleaning, achieving 100% full inspection and fully automatic cleaning.

[0024] (4) Reduce reliance on personnel and reduce human error: This technical solution does not require human intervention and the operators do not need to have professional skills, which effectively reduces reliance on professional and technical personnel and avoids the occurrence of human error.

[0025] (5) Stable equipment operation ensures high-precision detection: The application of automated equipment can continuously ensure the detection accuracy and stability of the equipment, reduce errors caused by manual operation, and improve the overall reliability of the system. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of a fragment pretreatment device inside a machine according to the present invention;

[0027] Figure 2 This is another structural schematic diagram of a fragment pretreatment device inside a machine according to the present invention.

[0028] In the diagram: 1. Cabin; 2. Detection module; 201. Light source; 202. Light source bracket; 203. Through-beam photoelectric sensor; 204. Camera; 205. Probe module; 2051. Upper probe; 2052. Lower probe; 3. Pneumatic system; 301. Copper tube air gun; 3011. Light source copper tube air gun; 3012. Camera copper tube air gun; 3013. Probe copper tube air gun; 302. Air tube; 303. Air pressure regulating valve; 304. Solenoid valve; 900. Silicon wafer. Detailed Implementation

[0029] To more clearly illustrate the overall concept of this utility model, a detailed description will be provided below with reference to the accompanying drawings.

[0030] It should be noted that many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present invention is not limited to the specific embodiments disclosed below.

[0031] Figure 1 and Figure 2 This is used to illustrate the structure of a fragment pretreatment device inside a machine according to the present invention. For example... Figure 1-2As shown, an in-machine fragment pretreatment device, suitable for silicon wafer sorting machines, includes a chamber 1, a detection module 2, and an air supply system 3. The detection module 2 is located inside the chamber 1 and includes a light source 201, a light source support 202, a through-beam photoelectric sensor 203, a camera 204, and a probe module 205. The plane of the light source 201 is parallel to the surface of the silicon wafer 900, the light emission direction of the light source 201 is perpendicular to the surface of the silicon wafer 900, and the brightness of the light source 201 is adjustable. The through-beam photoelectric sensor 203 is mounted on the light source support 202, with its installation height approximately 5-10 cm from the light source 201, and its through-beam area covers the entire light source plane. The camera 204 faces the surface of the silicon wafer 900 and is used to capture images of the silicon wafer surface. Probe modules 205 are respectively located above and below the silicon wafer 900. The probe module 205 includes an upper probe 2051 and a lower probe 2052, both fixed on the light source support 202, with the detection direction facing the surface of the silicon wafer 900. The air circuit system 3 includes copper tube air guns 301, which are installed on the left and right sides of the light source bracket 202, facing the lens of the camera 204, and connected to the air pressure regulating valve 303 and the solenoid valve 304 via air tubes 302. The copper tube air guns 301 include a light source copper tube air gun 3011, a camera copper tube air gun 3012, and a probe copper tube air gun 3013, arranged at intervals. There are several light source copper tube air guns 3011, covering the plane of the light source 201; the camera copper tube air gun 3012 is installed at a 30-45° angle to the horizontal plane relative to the camera 204, and is 2-5 cm away from the lens of the camera 204; the probe copper tube air gun 3013 is installed above the lower probe module 205, approximately 1-3 cm away from the probe module 205, and is designed to be retractable to adjust its extension length. The air pressure regulating valve 303 has an air pressure range of no more than 0.2 MPa, and the solenoid valve 304 is connected to the PLC module to achieve precise control of the air circuit.

[0032] Once the machine is started, the light source, through-beam photoelectric sensor, and probe module in the detection module work together to monitor obstructions on the light source plane in real time. If a piece of debris falls and blocks the beam of the through-beam photoelectric sensor, the sensor and probe module will immediately send a signal to the PLC. After receiving the signal, the PLC controls the air pressure regulating valve and solenoid valve to trigger the air blowing pipeline in the air circuit system, causing the copper tube air gun to automatically start blowing air to clean up the debris. At the same time, the camera system monitors the surface of the silicon wafer in real time and connects to the existing debris obstruction detection function of the sorting machine to determine whether debris is present. If the camera system confirms the presence of debris, it transmits a signal to the PLC, further triggering the automatic cleaning system to clean it.

[0033] The technical solutions protected by this utility model are not limited to the above embodiments. It should be noted that any combination of the technical solutions of any embodiment with one or more other embodiments is within the protection scope of this utility model. Although this utility model has been described in detail above with general descriptions and specific embodiments, some modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, all such modifications or improvements made without departing from the spirit of this utility model are within the scope of protection claimed by this utility model.

Claims

1. A pre-processing device for wafer fragments in a wafer sorting machine, characterized in that, include: Cabin (1), A detection module (2) is installed inside the housing (1). The detection module (2) includes a light source (201), a light source bracket (202) is provided on the plane of the light source (201), a through-beam photoelectric sensor (203) is provided on the plane of the light source (201) and mounted on the light source bracket (202), and a camera (204) is also mounted on the light source bracket (202). The camera faces the surface of the silicon wafer (900), and probe modules (205) are provided above and below the silicon wafer (900). The air system (3) is installed inside the machine compartment (1). The air system (3) includes at least two copper tube air guns (301). The at least two copper tube air guns (301) are respectively installed on the left and right sides of the light source bracket (202) and facing the direction of the lens of the camera (204). The copper tube air guns (301) are connected to the air pressure regulating valve (303) and the solenoid valve (304) through the air pipe (302).

2. The in-line debris pre-processing apparatus of claim 1, wherein, The through-beam photoelectric sensor (203) has an through-beam area that covers the entire light source plane, and is installed at a height of 5-10 cm from the light source (201).

3. The in-line debris pre-processing apparatus of claim 1, wherein, The copper tube air gun (301) includes at least a light source copper tube air gun (3011), a camera copper tube air gun (3012), and a probe copper tube air gun (3013), which are arranged at intervals.

4. The in-line debris pre-processing apparatus of claim 3, wherein, The number of the light source copper tube air guns (3011) is several, so that the number of the light source copper tube air guns (3011) can cover the plane of the light source (201).

5. The in-line debris pre-processing apparatus of claim 3, wherein, The camera copper tube air gun (3012) is installed at an angle of 30°-45° to the horizontal direction with respect to the camera (204), and the distance between the camera copper tube air gun (3012) and the lens of the camera (204) is 2-5cm.

6. The in-line debris pre-processing apparatus of claim 3, wherein, The probe copper tube air gun (3013) is installed above the probe module (205) on the lower side, and the distance between the probe module (205) and the probe copper tube air gun (3013) is 1cm-3cm. The probe copper tube air gun (3013) is designed to be telescopic to adjust the length of the extension.

7. The in-line debris pre-processing apparatus of claim 1, wherein, The pressure range of the pressure regulating valve (303) does not exceed 0.2 MPa.

8. The in-line debris pre-processing apparatus of claim 1, wherein, The solenoid valve (304) is connected to the PLC module via signal.

9. The in-line debris pre-processing apparatus of claim 1, wherein, The light source (201) plane is arranged parallel to the surface of the silicon wafer (900), the light emission direction of the light source (201) is perpendicular to the surface of the silicon wafer (900), and the brightness of the light source (201) is adjustable.

10. The in-line debris pre-processing apparatus of claim 1, wherein, The probe module (205) includes an upper probe (2051) and a lower probe (2052), which are fixed on the light source bracket (202). The detection directions of the upper probe (2051) and the lower probe (2052) are both facing the surface of the silicon wafer (900).

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