Flat plate electroplating bath device for electrolytic copper foil

Abstract

The utility model provides a flat plate electroplating bath device for electrolytic copper foil, which comprises an electroplating component, the electroplating component comprises an electroplating bath body, a mounting piece and an electrode plate, and the electrode plate is fixed in the electroplating bath body through the mounting piece; the electrode plates comprise a cathode plate and an anode plate; two sides of the cathode plate and the back surface far away from the anode plate are tightly attached to the inner wall of the mounting piece or the electroplating bath body. According to the utility model, the problems of concentration polarization and flow field distribution on the surface of the cathode in the use process of the flat plate electroplating bath are solved, so that the reliability of experimental data of the flat plate electroplating bath is improved, and the research and development efficiency of electrolytic copper foil is improved.

Description

Technical Field

[0001] This utility model relates to the field of electrolytic copper foil technology, and in particular to a flat electroplating tank device for electrolytic copper foil. Background Technology

[0002] Electrolytic copper foil is an important industrial material in the manufacture of printed circuit boards, flexible circuit boards, and lithium-ion batteries. In recent years, with the maturity of industrial technology, the development of differentiated copper foils for various specific applications has become the main direction of electrolytic copper foil research and development.

[0003] In the production of electrolytic copper foil, the deposition of the original foil on the cathode roller is the core of the entire process. During research and development, in order to obtain copper foil with the required performance parameters such as tensile strength and elongation, it is necessary to continuously adjust and experiment with the process parameters of the original foil deposition and the electrolyte formulation. Therefore, to avoid excessive early R&D investment due to a large waste of production materials, researchers often use flat electroplating tanks to conduct small-scale studies on the deposition of the original foil to determine more accurate process parameters and electrolyte formulations. However, compared with continuous industrial equipment, the intermittent electroplating mode of the static electrolyte used in the currently widely used flat electroplating tanks cannot well simulate the diffusion process of various reactants on the cathode surface during the preparation of electrolytic copper foil. This easily leads to severe concentration polarization on the surface of the flat cathode plate, resulting in a loose structure and decreased mechanical properties of the generated original foil.

[0004] Therefore, designing a small electroplating tank that can eliminate concentration polarization problems and fully simulate real electrolytic copper foil experimental equipment is of great significance for the research and development of electrolytic copper foil. Utility Model Content

[0005] To address the aforementioned problems in the prior art, this utility model provides a flat plate electroplating tank device for electrolytic copper foil, which solves the concentration polarization problem on the cathode surface during use, thereby improving the reliability of experimental data from the flat plate electroplating tank and increasing the R&D efficiency of electrolytic copper foil.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0007] In a first aspect, this utility model provides a flat electroplating tank device for electrolytic copper foil, including an electroplating assembly. The electroplating assembly includes an electroplating tank body, a mounting component, and an electrode plate. The electrode plate is fixed in the electroplating tank body by the mounting component.

[0008] The electrode plate includes a cathode plate and an anode plate, with the two sides of the cathode plate and the back away from the anode plate in close contact with the mounting component or the inner wall of the electroplating tank.

[0009] The beneficial effects of this utility model are as follows: by tightly fixing the sides and back of the cathode plate to the mounting component or the inner wall of the electroplating tank, the sides and back of the cathode plate are reduced to contact with the electroplating solution, thereby avoiding the deposition of copper on the sides and back of the cathode plate due to the electric field effect during the experiment. This solves the concentration polarization problem on the cathode surface during the use of the flat plate electroplating tank, thereby improving the reliability of experimental data of the flat plate electroplating tank and increasing the research and development efficiency of electrolytic copper foil.

[0010] Optionally, the mounting component includes two T-shaped components, which are respectively mounted at both ends of the electroplating tank. One side of the electrode plate is in close contact with the inner wall of the electroplating tank, and the other side is in close contact with the protrusion of the T-shaped component.

[0011] Optionally, the mounting component further includes a gasket, and both the T-shaped component and the gasket are detachably connected to the electroplating tank.

[0012] The gasket is disposed between the electrode plate and the inner wall of the electroplating tank.

[0013] As described above, the distance between the cathode plate and the anode plate can be adjusted by replacing T-shaped parts of different sizes and corresponding gaskets.

[0014] Optionally, the distance between the cathode plate and the anode plate is in the range of 4-12 mm.

[0015] Optionally, the electroplating tank, the gasket, and the T-shaped piece are made of polytetrafluoroethylene, polyimide, or polypropylene.

[0016] Optionally, the electroplating assembly further includes a square liquid inlet, the two ends of the length of the liquid inlet being aligned with the two ends of the length of the electroplating tank, and the two sides of the width being aligned with the opposite sides between the electrode plates.

[0017] As described above, by establishing a correspondence between the liquid inlet and the electrode plate, the sides and back of the cathode plate will not come into contact with the electroplating solution, thus further solving the concentration polarization problem on the cathode surface during the use of the flat plate electroplating tank.

[0018] Optionally, the electroplating assembly further includes a funnel-shaped buffer, the electroplating tank is connected to the buffer through the liquid inlet, and the bottom surface of the buffer is provided with a buffer interface.

[0019] As described above, the funnel-shaped buffer ensures that the electroplating solution flows uniformly between the electrode plates in a parallel manner, thus guaranteeing a uniform flow field during the electroplating process and more closely resembling actual production equipment.

[0020] Optionally, it also includes a liquid storage component and a power circulation component, wherein the liquid storage component includes a liquid storage tank, and the electroplating tank is connected to the liquid storage tank through the power circulation component;

[0021] The power circulation assembly includes a return pipe, and the electroplating assembly also includes a return tank. The electroplating tank has a return tank connected to each of its upper two sides. The return outlet below the return tank is connected to the return inlet of the storage tank through the return pipe.

[0022] Optionally, the liquid storage assembly further includes a heating unit and a temperature control unit, wherein the heating unit is electrically connected to the temperature control unit, the heating unit is located inside the liquid storage tank, and the temperature control unit is located outside the liquid storage tank;

[0023] A liquid replenishment port is provided above the liquid storage tank.

[0024] Optionally, the power circulation assembly further includes an inlet pipe, a magnetic pump unit, a flow control valve, and a flow meter unit with a digital display. One end of the inlet pipe is connected to the buffer interface, and the other end is connected to the outlet of the storage tank. The magnetic pump unit is installed in the middle of the inlet pipe. The flow control valve is located between the magnetic pump unit and the buffer interface. The flow meter unit is electrically connected to the flow control valve. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the structure of a flat electroplating tank device for electrolytic copper foil according to an embodiment of the present invention;

[0026] Figure 2 This is a top view of the electroplating component according to an embodiment of the present utility model;

[0027] Figure 3 This is a top view of the electroplating assembly according to an embodiment of the present invention after the electrode plate spacing has been changed.

[0028] Explanation of reference numerals in the attached figures:

[0029] 1. Electroplating tank; 2. Buffer component; 3. Buffer interface; 4. Return tank; 5 and 5', gasket; 6. Cathode plate; 7. Return outlet; 8. Inlet; 9 and 9', T-shaped component; 10. Heating unit; 11. Temperature control unit; 12. Outlet; 13. Return inlet; 14. Replenishment port; 15. Storage tank; 16. Inlet pipe; 17. Return pipe; 18. Flow control valve; 19. Flow meter unit; 20. Magnetic pump unit; 21. Anode plate; 22. Groove component;

[0030] a and a', the thickness of the protrusion on the T-shaped part; b and b', the distance between the upper side of the T-shaped part and the inner wall of the electroplating tank; c and c', the distance between the lower side of the T-shaped part and the inner wall of the electroplating tank; d and d', the internal thickness of the electroplating tank. Detailed Implementation

[0031] To better understand the above technical solutions, exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present invention can be understood more clearly and thoroughly, and that the scope of the present invention can be fully conveyed to those skilled in the art.

[0032] Example 1

[0033] Please refer to Figure 1 and Figure 2 A flat electroplating tank device for electrolytic copper foil includes an electroplating component, a liquid storage component, and a power circulation component, wherein the electroplating component is vertically connected to the liquid storage component through the power circulation component.

[0034] like Figure 2 As shown, the electroplating assembly includes an electroplating tank 1, mounting components, electrode plates, and a return liquid tank 4. The electrode plates include a cathode plate 6 and an anode plate 21, both fixed inside the electroplating tank 1 by the mounting components. A return liquid tank 4 is connected to each of the upper two sides of the electroplating tank 1. At this time, the sides of the cathode plate 6 and its back surface away from the anode plate 21 are in close contact with the mounting components or the inner wall of the electroplating tank 1. In this embodiment, the mounting components include two T-shaped components 9, which are respectively installed at both ends of the electroplating tank 1. One side of the electrode plate is in close contact with the inner wall of the electroplating tank 1, and the other side is in close contact with the protrusion of the T-shaped component 9. Here, the electrode plate includes the cathode plate 6, thus reducing the contact between the sides and back surface of the cathode plate 6 and the electroplating solution, thereby preventing copper deposition on the sides and back surface of the cathode plate 6 due to the electric field effect during the experiment.

[0035] As a preferred embodiment, the mounting components in this embodiment also include a gasket 5. Both the T-shaped component 9 and the gasket 5 are detachably connected to the electroplating tank 1, allowing the T-shaped component 9 and the gasket 5 to be replaceable. The T-shaped component 9 is detachably connected via a groove 22 provided on the electroplating tank 1. This detachable connection can be a snap-fit ​​connection, an upper and lower insertion connection, etc., while the gasket 5 is detachably connected via an insertion connection.

[0036] In this embodiment, the gasket 5 is disposed between the electrode plate and the inner wall of the electroplating tank 1. For example... Figure 1As shown, in this embodiment, the gasket 5 is disposed between the cathode plate 6 and the inner wall of the electroplating tank 1, in which case the back side of the cathode plate 6 is in close contact with the gasket 5. In other equivalent embodiments, the gasket 5 can also be disposed between the anode plate 21 and the inner wall of the electroplating tank 1, in which case the back side of the cathode plate 6 is in close contact with the inner wall of the electroplating tank 1; or both can be disposed, in which case the back side of the cathode plate 6 is in close contact with the gasket 5. That is, regardless of whether the gasket 5 is disposed on the back side of the cathode plate 6 or the back side of the anode plate 21, the sides and back side of the cathode plate 6 are always in close contact with other components. At the same time, the above-mentioned gasket 5 arrangement allows for the adjustment of the distance between the cathode plate 6 and the anode plate 21 by replacing T-shaped parts 9 of different sizes and corresponding gaskets 5 without replacing the cathode plate 6 and the anode plate 21.

[0037] As a preferred embodiment, the electroplating assembly also includes a square liquid inlet 8, the two ends of which are aligned with the two ends of the length of the electroplating tank 1, and the two sides of which are aligned with the opposite sides between the electrode plates. In this case, the electroplating solution flows in between the electrode plates, ensuring that the sides and back of the cathode plate 6 do not come into contact with the electroplating solution, further solving the concentration polarization problem on the cathode surface during use of the flat electroplating tank.

[0038] As a preferred embodiment, the electroplating assembly also includes a funnel-shaped buffer 2. The electroplating tank 1 is connected to the buffer 2 through the liquid inlet 8, and the bottom surface of the buffer 2 is provided with a buffer interface 3. In this way, the small stream of electroplating solution flowing in from the buffer interface 3 is guided by the buffer 2 and flows evenly between the electrode plates in a parallel manner, ensuring the uniformity of the flow field during the electroplating process, which is closer to the actual production equipment.

[0039] In this embodiment, the liquid storage assembly includes a liquid storage tank 15, a heating unit 10, and a temperature control unit 11. The liquid storage tank 15 has a replenishment port 14 at its top and a liquid outlet 12 at its lower side wall. The replenishment port 14 is used to replenish the electroplating solution or additives used in the experiment. The heating unit 10 is electrically connected to the temperature control unit 11. The heating unit 10 is located inside the liquid storage tank 15 and is a heating and cooling pipe used to heat the electroplating solution in the liquid storage tank 15. The temperature control unit 11 is located outside the liquid storage tank 15 and is a digital display temperature-controlled heating cabinet used to accept manual parameter adjustments to control the heating and cooling pipe, thereby regulating the temperature of the electroplating solution in the liquid storage tank 15. Its temperature control range is 30-80℃.

[0040] In this embodiment, as Figure 1As shown, the power circulation assembly includes a return pipe 17, an inlet pipe 16, a magnetic pump unit 20, a flow control valve 18, and a flow meter unit 19 with a digital display. At this time, the return outlet 7 below the return tank 4 is connected to the return inlet 13 of the storage tank 15 via the return pipe 17, used to guide excess electroplating solution in the electroplating tank 1 back to the storage tank 15, realizing the recycling of the electroplating solution. One end of the inlet pipe 16 is connected to the buffer interface 3, and the other end is connected to the outlet 12 of the storage tank 15. The magnetic pump unit 20 is installed in the middle of the inlet pipe 16, used to pump the electroplating solution in the storage tank 15 into the electroplating tank 1 through the inlet pipe 16 and the connected buffer interface 3. In this embodiment, the maximum flow rate of the magnetic pump unit 20 is set to 15 L / min. The flow control valve 18 is located between the magnetic pump unit 20 and the buffer interface 3. The flow meter unit 19 is electrically connected to the flow control valve 18. The flow rate of the electroplating solution during the experiment can be adjusted by adjusting the size of the flow control valve 18, and the value can be read by the flow meter unit 19.

[0041] In this embodiment, as Figure 1 As shown, the electroplating tank 1, buffer component 2, buffer interface 3, return tank 4, gasket 5, return outlet 7, T-shaped component 9, storage tank 15, inlet pipe 16, and return pipe 17 are all made of polypropylene. The inlet pipe 16 and return pipe 17 are DN15. The pipes are fixed and sealed to the buffer interface 3, magnetic pump unit 20, outlet 12, and return inlet 13 using DIN standard clamps. In other embodiments, the materials can be polytetrafluoroethylene or polyimide, and the pipe type and sealing method can be selected according to the actual situation.

[0042] In this embodiment, refer to Figure 2 It can be seen that the internal thickness d of the electroplating tank 1 is 22mm, the thickness of the anode plate 21 is 6mm, the thickness of the cathode plate 6 is 5mm, and the distance between the anode plate 21 and the cathode plate 6 is the thickness a of the protrusion on the T-shaped part 9, which is 10mm. At this time, the distance b between the upper side of the T-shaped part 9 and the inner wall of the electroplating tank 1 is 6mm, which is used to place the anode plate 21 and keep it in close contact. The distance c between the lower side of the T-shaped part 9 and the inner wall of the electroplating tank 1 is 6mm, which requires a 1mm shim 5 to place the cathode plate 6 and keep it in close contact.

[0043] As can be seen from the above, the working process of this embodiment is as follows: After the electrolyte is heated to a preset temperature in the storage tank 15, the magnetic pump unit 20, the flow control valve 18, and the flow meter unit 19 are started. The magnetic pump unit 20 delivers the electrolyte in the storage tank 15 to the buffer 2 through the inlet pipe 16, so that it flows evenly between the cathode plate 6 and the anode plate 21 in a parallel manner with the electrode plates to electrolyze copper foil. At this time, the excess electrolyte in the electroplating tank 1 flows back to the storage tank 15 through the return tank 4 and the return pipe 17 to realize the recycling of the electroplating solution.

[0044] Example 2

[0045] Please refer to Figure 1 and Figure 3 A flat electroplating tank device for electrolytic copper foil, based on the above-described embodiment one, requires changing the distance between the anode plate 21 and the cathode plate 6 to 6 mm. In this case, refer to... Figure 3 It can be seen that the internal thickness d' of the electroplating tank 1 is still 22mm, the thickness a' of the protrusion on the T-shaped part 9' is 6mm, the distance b' between the upper side of the T-shaped part 9' and the inner wall of the electroplating tank 1 is 6mm, which is used to place the anode plate 21 and keep it in close contact, and the distance c' between the lower side of the T-shaped part 9' and the inner wall of the electroplating tank 1 is 10mm, which requires a 5mm shim 5' to place the cathode plate 6 and keep it in close contact.

[0046] In other embodiments, the distance between the cathode plate 6 and the anode plate 21 is 4-12mm, and only the T-shaped piece 9' and the corresponding gasket 5' need to be replaced at the same time.

[0047] In summary, this embodiment tightly fixes the sides and back of the cathode plate 6 to the mounting component or the inner wall of the electroplating tank 1. By ensuring the correspondence between the inlet 8 and the electrode plates, the sides and back of the cathode plate 6 are prevented from contacting the electroplating solution, thus avoiding copper deposition on the sides and back of the cathode plate 6 due to the electric field effect during the experiment. This solves the concentration polarization problem on the cathode surface during the use of the flat electroplating tank. The funnel-shaped buffer 2 ensures that the electroplating solution flows uniformly between the electrode plates in a parallel manner, guaranteeing a uniform flow field during electroplating. Furthermore, by replacing T-shaped parts 9 of different sizes and corresponding gaskets 5, the distance between the cathode and anode plates can be adjusted. Therefore, this embodiment improves the reliability of experimental data from the flat electroplating tank and increases the research and development efficiency of electrolytic copper foil.

[0048] In the description of this utility model, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0049] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0050] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "beneath" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0051] In the description of this specification, the terms "one embodiment," "some embodiments," "embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0052] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make modifications, alterations, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A flat sheet plating cell apparatus for electrodepositing copper foil, characterized by, The electroplating assembly includes an electroplating tank, a mounting component, and an electrode plate, wherein the electrode plate is fixed in the electroplating tank by the mounting component. The electrode plate includes a cathode plate and an anode plate, with the two sides of the cathode plate and the back away from the anode plate in close contact with the mounting component or the inner wall of the electroplating tank.

2. The flat electroplating tank device for electrolytic copper foil according to claim 1, characterized in that, The mounting component includes two T-shaped pieces, which are respectively installed at both ends of the electroplating tank. One side of the electrode plate is in close contact with the inner wall of the electroplating tank, and the other side is in close contact with the protrusion of the T-shaped piece.

3. A sheet plating cell apparatus for electrodepositing copper foil according to claim 2, wherein The mounting component also includes a gasket, and both the T-shaped component and the gasket are detachably connected to the electroplating tank. The gasket is disposed between the electrode plate and the inner wall of the electroplating tank.

4. A sheet plating cell apparatus for electrodepositing copper foil according to claim 3, wherein The distance between the cathode plate and the anode plate is 4-12 mm.

5. The flat plating cell apparatus for electrolysis of copper foil according to claim 3, wherein The electroplating tank, the gasket, and the T-shaped component are made of polytetrafluoroethylene, polyimide, or polypropylene.

6. The flat sheet plating cell apparatus for electrodepositing copper foil according to claim 1, wherein The electroplating assembly also includes a square liquid inlet, the two ends of the length of the liquid inlet being aligned with the two ends of the length of the electroplating tank, and the two sides of the width being aligned with the opposite sides between the electrode plates.

7. A sheet plating cell apparatus for electrodepositing copper foil according to claim 6, wherein The electroplating assembly also includes a funnel-shaped buffer, the electroplating tank is connected to the buffer through the liquid inlet, and the bottom surface of the buffer is provided with a buffer interface.

8. A sheet plating cell apparatus for electrodepositing copper foil according to claim 7, wherein It also includes a liquid storage component and a power circulation component. The liquid storage component includes a liquid storage tank, and the electroplating tank is connected to the liquid storage tank through the power circulation component. The power circulation assembly includes a return pipe, and the electroplating assembly also includes a return tank. The electroplating tank has a return tank connected to each of its upper two sides. The return outlet below the return tank is connected to the return inlet of the storage tank through the return pipe.

9. A sheet plating cell apparatus for electrodepositing copper foil according to claim 8, wherein The liquid storage assembly further includes a heating unit and a temperature control unit. The heating unit is electrically connected to the temperature control unit. The heating unit is located inside the liquid storage tank, and the temperature control unit is located outside the liquid storage tank. A liquid replenishment port is provided above the liquid storage tank.

10. The flat sheet plating cell apparatus for electrodepositing copper foil according to claim 8, wherein The power circulation assembly also includes an inlet pipe, a magnetic pump unit, a flow control valve, and a flow meter unit with a digital display. One end of the inlet pipe is connected to the buffer interface, and the other end is connected to the outlet of the storage tank. The magnetic pump unit is installed in the middle of the inlet pipe. The flow control valve is located between the magnetic pump unit and the buffer interface. The flow meter unit is electrically connected to the flow control valve.

Images