Flexible semiconductor chilling plate and refrigeration equipment
By using a flexible substrate and substrate design, combined with the flexible connection between the semiconductor module and the heat transfer plate, the problem of bonding the semiconductor cooling chip to a complex surface is solved, achieving efficient cooling effect and circuit stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN BEIBEI INTELLIGENT CO LTD
- Filing Date
- 2025-05-12
- Publication Date
- 2026-04-21
AI Technical Summary
Existing thermoelectric coolers use rigid substrates, which make it difficult to fit tightly into complex installation environments, resulting in reduced cooling performance and easy damage.
By employing flexible substrates and flexible substrate design, and combining semiconductor modules, heat transfer plates and circuit layers, flexible semiconductor cooling sheets can be formed through parallel or series connections to adapt to complex surface shapes.
This technology enables flexible semiconductor cooling chips to bend according to surface shape, enhancing fit and adaptability, avoiding stress concentration, and ensuring circuit connection stability and cooling effect.
Smart Images
Figure CN224151195U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor refrigeration technology, and in particular to a flexible semiconductor refrigeration chip and refrigeration equipment. Background Technology
[0002] Semiconductor cooling technology based on the Peltier effect is a technology that achieves cooling through thermoelectric semiconductor materials. Its basic principle is that when direct current passes through a thermoelectric material and electrodes, an endothermic effect is generated at one end of the thermoelectric material, thus achieving cooling, while an exothermic effect is generated at the other end, thus achieving heating. This technology has been widely used in many fields due to its high efficiency and environmental friendliness. However, despite the many advantages of semiconductor cooling technology, it still faces some challenges in practical applications. Currently, semiconductor cooling chips are usually constructed by placing substrates at opposite ends of a semiconductor particle assembly. This structure allows one end of the semiconductor cooling chip to achieve cooling, while the other end achieves heating. Most existing semiconductor cooling chip substrates are made of rigid materials such as ceramic sheets. While this rigid substrate design provides a certain structural strength and stability for the semiconductor cooling chip, it also limits its application flexibility. When facing complex installation environments, such as curved surfaces, spherical surfaces, or other irregularly shaped surfaces, it is often difficult for a rigid substrate semiconductor cooling chip to achieve a tight fit. This insufficient fit not only reduces the cooling effect but may also lead to damage to the cooling chip due to stress concentration. Utility Model Content
[0003] To address the problem that existing semiconductor refrigeration chips cannot adapt to complex installation environments, this utility model proposes a flexible semiconductor refrigeration chip and refrigeration equipment.
[0004] The technical solution of this utility model is to provide a flexible semiconductor cooling chip, including a first flexible substrate, a plurality of semiconductor modules disposed on the first flexible substrate, a plurality of second flexible substrates disposed on the side of the semiconductor modules facing away from the first flexible substrate, a plurality of heat transfer plates disposed on the side of the first flexible substrate facing away from the semiconductor modules, and a heat transfer plate disposed on the side of each second flexible substrate facing away from the semiconductor modules, and adjacent second flexible substrates are either completely disconnected or partially connected.
[0005] Furthermore, the first flexible substrate is composed of multiple flexible sub-substrates, and at least some of the adjacent flexible sub-substrates are connected together.
[0006] Furthermore, two adjacent second flexible substrates are connected by two connectors, which are located at both ends of the gap between the two adjacent second flexible substrates.
[0007] Furthermore, multiple semiconductor modules are arranged in a matrix on the first flexible substrate, with the two ends of each semiconductor module being the cold end and the hot end, respectively, and the cold ends of all semiconductor modules facing the same side.
[0008] Furthermore, the heat transfer plate includes a heat-conducting plate and a cold-conducting plate, with the heat-conducting plate located on the side closer to the hot end and the cold-conducting plate located on the side closer to the cold end.
[0009] Furthermore, a second flexible substrate is provided on the side of each semiconductor module facing away from the first flexible substrate.
[0010] Furthermore, both the first flexible substrate and the second flexible substrate have a circuit layer for connecting to the semiconductor module on the side facing the semiconductor module, and multiple semiconductor modules are connected in parallel or in series through the circuit layer.
[0011] Furthermore, each semiconductor module includes at least one P-type semiconductor element and one N-type semiconductor element.
[0012] Furthermore, multiple second flexible substrates are arranged in a nested configuration, forming a concentric circle structure or a U-shaped structure.
[0013] This application also discloses a refrigeration device having the aforementioned flexible semiconductor refrigeration chip.
[0014] Compared with the prior art, the flexible semiconductor refrigeration chip proposed in this application can be bent and changed according to the shape of the working surface on which the refrigeration chip is installed, so as to fit working surfaces of different shapes and have a wider range of applications. Attached Figure Description
[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model.
[0017] Figure 2 for Figure 1 Enlarged view of the structure at point A.
[0018] Figure 3 This is a schematic diagram of the first flexible substrate structure of this utility model.
[0019] Figure 4 This is a schematic diagram of another embodiment of the first flexible substrate of this utility model.
[0020] Figure 5 This is a schematic diagram of another embodiment of the second flexible substrate of this utility model.
[0021] Figure 6 This is a schematic diagram of the concentric circle structure of the second flexible substrate of this utility model.
[0022] Figure 7 This is a schematic diagram of the second flexible substrate of this utility model forming a U-shaped structure.
[0023] Figure label:
[0024] First flexible substrate 1; second flexible substrate 2; connector 21; semiconductor module 3; heat transfer plate 4; power supply wire 5. Detailed Implementation
[0025] To make the technical problem to be solved, the technical solution, and the beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.
[0026] Therefore, a feature pointed out in this specification is used to describe one feature of one embodiment of the present invention, and does not imply that every embodiment of the present invention must have the described feature. Furthermore, it should be noted that this specification describes many features. Although certain features may be combined to illustrate possible system designs, these features may also be used in other combinations not explicitly stated. Therefore, unless otherwise stated, the described combinations are not intended to be limiting.
[0027] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0028] In the description of this application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0029] The principle and structure of this utility model will be described in detail below with reference to the accompanying drawings and embodiments.
[0030] Example 1
[0031] Please see Figures 1 to 3This embodiment provides a flexible semiconductor cooling chip, including a first flexible substrate 1, a second flexible substrate 2, and semiconductor modules 3. Multiple semiconductor modules 3 are arranged in a matrix on the first flexible substrate 1. Multiple second flexible substrates 2 are disposed on the side of the semiconductor modules 3 facing away from the first flexible substrate 1. Circuit layers connected to the semiconductor modules 3 are disposed on the side of both the first and second flexible substrates 1 and facing the semiconductor modules 3. The multiple semiconductor modules 3 are connected in parallel or in series through the circuit layers.
[0032] Each semiconductor module 3 consists of a P-type semiconductor element and an N-type semiconductor element. The top and bottom ends of each semiconductor module 3 are the cold end and the hot end, respectively, used for cooling and heating functions. Here, the cold ends of all semiconductor modules 3 face the first flexible substrate 1 and are connected to it, while the hot ends face the second flexible substrate 2 and are connected to it. Multiple heat transfer plates 4 are disposed on the side of the first flexible substrate 1 facing away from the semiconductor modules 3. Specifically, a heat transfer plate 4 is disposed at the corresponding position of each row of semiconductor modules 3 on the first flexible substrate 1. A second flexible substrate 2 is disposed on the side of each row of semiconductor modules 3 facing away from the first flexible substrate 1, and each second flexible substrate 2 has a heat transfer plate 4 disposed on the side facing away from the semiconductor modules 3. The shape and size of the heat transfer plates 4 on the second flexible substrate 2 match those of the second flexible substrate 2.
[0033] In this embodiment, a heat transfer plate 4 is provided at both ends of each row of semiconductor modules 3. In other embodiments, the heat transfer plate 4 can be provided for multiple rows of semiconductor modules 3 as needed.
[0034] In this embodiment, the heat transfer plate 4 on the first flexible substrate 1 is a cold-conducting plate, and the heat transfer plate 4 on the second flexible substrate 2 is a heat-conducting plate. A power supply wire 5 is connected to both sides of one of the lower edges of the first flexible substrate 1, and the circuit of the flexible semiconductor cooling chip is connected through the power supply wire 5 to the external power source.
[0035] It is important to note that, such as Figure 2As shown, in this embodiment, the first flexible substrate 1 is a single unit, and the two adjacent second flexible substrates 2 are completely disconnected. In practical applications, cooling requirements often exist on various complex surfaces, including curved surfaces and other non-planar structures. The first flexible substrate 1 of the flexible semiconductor cooling chip proposed in this application can be bent and adjusted according to the contour of the bonding surface, thereby better fitting the surface requiring cooling. Since the multiple second flexible substrates 2 are completely disconnected and independent, the gaps between the second flexible substrates 2 provide sufficient displacement margin when the first flexible substrate 1 is bent and deformed. Therefore, it can effectively avoid the possibility of breakage of the flexible semiconductor cooling chip due to stress concentration during bending, allowing the flexible semiconductor cooling chip to bend without damaging the internal circuit connections, ensuring that the flexible semiconductor cooling chip can still operate normally after bending, thereby guaranteeing the overall reliability.
[0036] This design enables the flexible semiconductor refrigeration chip proposed in this application to bend and change the surface to be cooled as needed, allowing it to work on working surfaces of various complex shapes, thereby enhancing its adaptability and application range.
[0037] Example 2
[0038] This embodiment provides a flexible semiconductor cooling chip, which differs from Embodiment 1 in that at least two adjacent second flexible substrates 2 are partially connected together.
[0039] Here, when the first flexible substrate 1 bends according to the shape of the bonding surface, the second flexible substrates 2 that are partially connected can not only provide the necessary displacement margin between each other to accommodate the bending deformation, but also form a certain mutual constraint force between adjacent second flexible substrates 2.
[0040] Specifically, this partially connected design not only avoids the risk of breakage of the second flexible substrate 2 due to excessive stress during bending, but also, the constraint force between adjacent second flexible substrates 2 helps maintain the structural stability and integrity of the entire cooling chip in a bent state, preventing excessive local deformation from affecting the cooling effect and the reliability of the circuit connection. This design allows the flexible semiconductor cooling chip to more effectively adapt to extreme local deformation situations that may be encountered in practical applications, thus ensuring both the cooling effect and the stability and safety of the circuit connection.
[0041] Example 3
[0042] Please see Figure 4 This embodiment provides a flexible semiconductor cooling chip. The difference from Embodiment 1 is that the first flexible substrate 1 is composed of multiple flexible sub-substrates, and at least some of the adjacent flexible sub-substrates are connected together.
[0043] Here, the multi-segment design of the first flexible substrate 1 allows it to better conform to more complex working surfaces. Furthermore, the interconnection between the multiple flexible sub-substrates ensures that the flexible semiconductor cooling chip maintains circuit connectivity during bending, guaranteeing its continued normal operation even after bending.
[0044] Example 4
[0045] Please see Figure 4 and Figure 5 This embodiment provides a flexible semiconductor cooling chip. The difference from Embodiment 1 is that the first flexible substrate 1 is composed of multiple flexible sub-substrates, and at least partially connected between adjacent flexible sub-substrates. Each pair of adjacent second flexible substrates 2 is connected by two connectors 21. In this embodiment, the connectors 21 can be flexible copper sheets or wires. Figure 5 As shown, the connector 21 is disposed at the upper and lower ends of the second flexible substrate 2, so that the middle area of the multiple second flexible substrates 2 has a larger displacement margin, and the upper and lower ends of the multiple second flexible substrates 2 have a restraining force, thereby ensuring the stability of the overall structure.
[0046] Example 5
[0047] This embodiment provides a flexible semiconductor cooling chip, which differs from Embodiment 1 in that the multiple second flexible substrates 2 are arranged in a nested configuration. The multiple second flexible substrates 2 can be collectively formed as shown in the image. Figure 6 The concentric circle structure shown, specifically, when a flexible semiconductor cooling chip needs to be attached to a spherical working surface, the second flexible substrate 2 of this concentric circle structure can deform accordingly according to the curvature of the sphere, making the contact between the flexible semiconductor cooling chip proposed in this application and the sphere more compact.
[0048] Furthermore, the design of flexible semiconductor cooling chips also possesses high flexibility and customizability. Depending on the specific shape and requirements of the working surface to be bonded, multiple second flexible substrates 2 can be flexibly configured as follows: Figure 7 The proposed flexible semiconductor cooling chip can be a U-shaped structure, or any other shape adapted to a specific application scenario. This characteristic enables it to be widely used on working surfaces of various complex shapes and sizes, thus broadening its application scope.
[0049] Example 6
[0050] This embodiment provides a flexible semiconductor cooling chip. The difference from Embodiment 1 is that the cold ends of all semiconductor modules 3 are oriented towards the second flexible substrate 2 and are all connected to the second flexible substrate 2, while the hot ends are oriented towards the first flexible substrate 1 and are all connected to the first flexible substrate 1. In this embodiment, the heat transfer plate 4 on the first flexible substrate 1 is a heat-conducting plate, and the heat transfer plate 4 on the second flexible substrate 2 is a cold-conducting plate.
[0051] In summary, this application also provides a cooling device having the aforementioned flexible semiconductor cooling chip.
[0052] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A flexible semiconductor cooling sheet comprising a first flexible substrate (1), characterized in that, Multiple sets of semiconductor modules (3) are disposed on the first flexible substrate (1). Multiple second flexible substrates (2) are disposed on the side of the semiconductor module (3) facing away from the first flexible substrate (1). Multiple heat transfer plates (4) are disposed on the side of the first flexible substrate (1) facing away from the semiconductor module (3). Each second flexible substrate (2) is provided with a heat transfer plate (4) on the side facing away from the semiconductor module (3). Two adjacent second flexible substrates (2) are either completely disconnected or partially connected.
2. The flexible semiconductor refrigeration sheet of claim 1, wherein, The first flexible substrate (1) is composed of multiple flexible sub-substrates, and at least some of the two adjacent flexible sub-substrates are connected together.
3. The flexible semiconductor refrigeration sheet of claim 2, wherein, Two adjacent second flexible substrates (2) are connected by two connectors (21), which are located at the two ends of the gap between the two adjacent second flexible substrates (2).
4. The flexible semiconductor refrigeration sheet of claim 1, wherein, Multiple semiconductor modules (3) are arranged in a matrix on the first flexible substrate (1). The two ends of each semiconductor module (3) are a cold end and a hot end, respectively, and the cold ends of all semiconductor modules (3) face the same side.
5. The flexible semiconductor refrigeration sheet of claim 4, wherein, The heat transfer plate (4) includes a heat-conducting plate and a cold-conducting plate, wherein the heat-conducting plate is located on the side closer to the hot end and the cold-conducting plate is located on the side closer to the cold end.
6. The flexible semiconductor refrigeration sheet of claim 4, wherein, Each of the semiconductor modules (3) in each column has a second flexible substrate (2) on the side facing away from the first flexible substrate (1).
7. The flexible semiconductor refrigeration sheet of claim 1, wherein, Both the first flexible substrate (1) and the second flexible substrate (2) have a circuit layer for connecting to the semiconductor module (3) on the side facing the semiconductor module (3), and multiple semiconductor modules (3) are connected in parallel or in series through the circuit layer.
8. The flexible semiconductor refrigeration sheet of claim 1, wherein, Each of the semiconductor modules (3) includes at least one P-type semiconductor element and one N-type semiconductor element.
9. The flexible semiconductor refrigeration sheet of claim 1, wherein, Multiple second flexible substrates (2) are arranged in an inner and outer nested configuration to form a concentric circle structure or a square structure.
10. A refrigeration appliance characterized in that, The refrigeration device has a flexible semiconductor refrigeration chip as described in any one of claims 1 to 9.