Wafer sample processing device

Abstract

The utility model belongs to the technical field of sample detection devices, and discloses a wafer sample processing device which comprises a testing device, the testing device comprises a testing platform, the testing platform comprises a supporting seat, a universal connecting piece and a carrying table, the carrying table is used for bearing a wafer sample, and the carrying table is movably connected with the supporting seat through the universal connecting piece so that the carrying table can incline up and down; and the suction nozzle is used for dragging the test liquid on the wafer sample to move. The technical problem that in the prior art, an automatic wafer detection device is large in occupied area can be solved.

Description

Technical Field

[0001] This application belongs to the technical field of sample testing devices, specifically relating to a wafer sample processing device. Background Technology

[0002] Wafer products are easily contaminated by metal impurities. To ensure wafer quality, the metal content in the wafer needs to be tested during the wafer production process. Existing wafer testing equipment is usually automated. Automated wafer testing equipment integrates components such as conveying devices and positioning devices, which occupy a large area. Utility Model Content

[0003] The purpose of this application is to provide a wafer sample processing device to solve the technical problem that existing automated wafer inspection equipment has a large footprint.

[0004] To achieve the above objectives, embodiments of this application provide a wafer sample processing apparatus, including a testing device. The testing device includes: a testing platform, which includes a support base, a universal connector, and a stage. The stage is used to support the wafer sample and is movably connected to the support base via the universal connector so that the stage can tilt up and down; and a suction nozzle for moving the test liquid on the wafer sample.

[0005] In some embodiments, the testing apparatus further includes a gas delivery mechanism, a gas storage unit, and an outlet pipe assembly connected to the gas storage unit. The gas storage unit is used to contain sample cleaning gas, and the gas delivery mechanism is used to deliver protective gas into the gas storage unit so that the protective gas drives the sample cleaning gas to be output from the outlet pipe assembly. The outlet pipe assembly has an outlet end facing the stage and is used to guide the protective gas and sample cleaning gas to the wafer sample.

[0006] In some embodiments, the exhaust pipe assembly includes an exhaust pipe and an exhaust component. The exhaust component has a cleaning channel and an exhaust gas channel. The cleaning channel is connected to the gas storage component through the exhaust pipe. The outlet of the cleaning channel is located at the exhaust end. The cleaning channel is used to guide the protective gas and sample cleaning gas to the wafer sample. The inlet of the exhaust gas channel is located at the exhaust end. The exhaust gas channel is used to guide the protective gas and sample cleaning gas to the outside of the wafer sample processing device.

[0007] In some embodiments, the gas delivery mechanism includes a gas supply device, an inlet pipe, a pressure reducing valve, and a pressure gauge. The two ends of the inlet pipe are respectively connected to the gas supply device and the gas storage device. The gas supply device is used to deliver protective gas to the gas storage device through the inlet pipe. The pressure reducing valve and the pressure gauge are both connected to the inlet pipe.

[0008] In some embodiments, the stage includes a bearing surface, and a negative pressure channel is provided in the stage. The negative pressure channel has an air inlet and an air outlet, and the air inlet is located on the bearing surface. The wafer sample processing apparatus also includes a vacuum extraction component, which is connected to the air outlet.

[0009] In some embodiments, the vacuum extraction assembly includes a vacuum extractor, a vacuum tube, a valve, and a vacuum gauge. The two ends of the vacuum tube are connected to the outlet and the vacuum extractor, respectively, and the valve and the vacuum gauge are both connected to the vacuum tube.

[0010] In some embodiments, the testing apparatus further includes a reservoir, a pipette, and a test container. The reservoir is used to contain the test liquid, the pipette is used to transfer the test liquid from the reservoir to the wafer sample, and the pipette is also used to transfer the test liquid from the wafer sample to the test container.

[0011] In some embodiments, the universal connector is a universal joint.

[0012] In some embodiments, the sample processing apparatus further includes a protective cover, and the testing device is disposed inside the protective cover.

[0013] In some embodiments, the protective cover is provided with an observation window and a glove opening, and the protective cover includes an operating glove connected to the glove opening.

[0014] The advantages of the wafer sample processing apparatus provided in this application are as follows: The stage of this application is movably connected to the support base via a universal connector, which allows control of the stage and the wafer sample to tilt up and down in different directions. This facilitates the suction nozzle to drag the test liquid on the wafer sample in different directions, thereby easily controlling the extraction of metal ions from the surface of the wafer sample by the test liquid. Moreover, both the control console and the suction nozzle can be manually controlled, eliminating the need for conveying and positioning devices. The wafer sample processing apparatus has a small footprint and low cost. This application can solve the technical problem of large footprint in automated wafer inspection equipment. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of a wafer sample processing apparatus provided in some embodiments of this application;

[0017] Figure 2 This is a schematic diagram of the internal structure of the protective cover provided in some embodiments of this application;

[0018] Figure 3 Schematic diagram of an exhaust component provided for some embodiments of this application;

[0019] Figure 4 A flowchart illustrating a wafer sample testing method provided in some embodiments of this application.

[0020] The following are the labeling elements in the figure:

[0021] 100. Wafer sample processing device;

[0022] 10. Testing device; 11. Testing platform; 111. Stage; 1111. Negative pressure channel; 1112. Bearing surface; 112. Universal connector; 113. Support base; 12. Nozzle; 13. Gas delivery mechanism; 131. Gas supply equipment; 132. Inlet pipe; 133. Pressure reducing valve; 134. Pressure gauge; 14. Gas storage device; 15. Outlet pipe assembly; 151. Outlet pipe; 152. Exhaust device; 1521. Cleaning channel; 1522. Waste gas channel; 1523. Outlet end; 16. Pipette; 17. Test container;

[0023] 20. Protective shield; 21. Observation window; 22. Glove opening;

[0024] 30. Vacuum extraction assembly; 31. Vacuum extractor; 32. Vacuum tube; 33. Valve; 34. Vacuum gauge. Detailed Implementation

[0025] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0026] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0027] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0029] This application provides a wafer sample processing apparatus for detecting wafer samples.

[0030] Please refer to Figure 1 and Figure 2 The wafer sample processing apparatus 100 of this application embodiment includes a testing device 10, which includes a testing platform 11 and a suction nozzle 12. The testing platform 11 includes a support base 113, a universal connector 112, and a stage 111. The stage 111 is used to support the wafer sample. The stage 111 is movably connected to the support base 113 through the universal connector 112 so that the stage 111 can tilt up and down. The suction nozzle 12 is used to drag the test liquid on the wafer sample.

[0031] The support base 113 is used to support the platform 111.

[0032] The stage 111 is movably connected to the support base 113 via a universal connector 112, allowing the stage 111 to rotate omnidirectionally relative to the support base 113. Rotating the stage 111 up and down tilts it, thereby tilting the wafer sample on the stage 111. Optionally, the center of the stage 111 is connected to the universal connector 112. When rotating the stage 111 via its edge, the lever length formed between different positions of the edge of the stage 111 and the universal connector 112 is approximately equal, allowing a small force to be applied to rotate the stage 111 from different positions. Optionally, the universal connector 112 can be a universal joint, ball joint, etc.

[0033] The suction nozzle 12 can draw in air and generate negative pressure. Positioning the nozzle 12 near the test liquid and drawing in air creates a negative pressure between the test liquid and the nozzle 12, causing the test liquid to move towards the nozzle 12 under atmospheric pressure. Optionally, the test liquid can be a mixture of HF, H2O2, HNO3, and ultrapure water (UPW), which can effectively dissolve metals in the wafer sample. For example, HF:H2O2:HNO3:UPW = 1:1:3:7.

[0034] In use, the tester places the wafer sample on the stage 111 and cleans the oxide layer on the wafer sample. Then, the test solution is added to the wafer sample, and the stage 111 is rotated to a tilted position to tilt the wafer sample. While the stage 111 is tilted, the nozzle 12 is used to drag the test solution downward on the surface of the wafer sample. When it is necessary to change the direction of movement of the test solution, the tilt direction of the stage 111 and the position of the nozzle 12 are adjusted so that the test solution moves downward along the tilt direction of the stage 111. When the test solution moves on the surface of the wafer sample, it can extract metal ions from the surface of the wafer sample.

[0035] The beneficial effects of this application embodiment are as follows: the stage 111 is movably connected to the support base 113 via the universal connector 112, which allows the stage 111 and the wafer sample to be tilted up and down in different directions, facilitating the suction nozzle 12 to drag the test liquid on the wafer sample in different directions, thereby easily controlling the extraction of metal ions from the surface of the wafer sample by the test liquid; moreover, both the control console and the suction nozzle 12 can be manually controlled, eliminating the need for components such as conveying devices and positioning devices, resulting in a smaller footprint and lower cost for the wafer sample processing device 100. This application embodiment can solve the technical problem of large footprint in automated wafer inspection equipment.

[0036] In some embodiments, please refer to Figure 2 The test platform 11 also includes a force-saving handle fixed to the platform 111. The force-saving handle extends from the edge of the platform 111 away from the center of the platform 111. By holding the force-saving handle to rotate the platform 111, the lever length formed between the gripping position and the universal connector 112 is increased, making it easier to rotate the platform 111 and more convenient to operate.

[0037] In some embodiments, please refer to Figure 2 The testing apparatus 10 also includes a gas delivery mechanism 13, a gas storage unit 14, and an outlet pipe assembly 15 connected to the gas storage unit 14. The gas storage unit 14 is used to contain sample cleaning gas, and the gas delivery mechanism 13 is used to deliver protective gas into the gas storage unit 14 so that the protective gas drives the sample cleaning gas to be output from the outlet pipe assembly 15. The outlet pipe assembly 15 has an outlet end facing the stage 111 and is used to guide the protective gas and the sample cleaning gas to the wafer sample.

[0038] Optionally, the gas storage component 14 can be a container such as a gas storage tank or gas cylinder.

[0039] The cleaning gas can remove the oxide layer on the surface of the wafer sample, forming a hydrophobic surface. Optionally, the cleaning gas may include HF gas or ozone gas, etc.

[0040] The gas delivery mechanism 13 is used to deliver protective gas into the gas storage unit 14 so that the protective gas drives the sample cleaning gas to be output from the gas outlet assembly 15. That is, both the gas delivery mechanism 13 and the gas outlet assembly 15 are connected to the inside of the gas storage unit 14. The gas delivery mechanism 13 delivers protective gas into the gas storage unit 14, which can increase the pressure in the gas storage unit 14, so that the mixed gas of sample cleaning gas and protective gas can enter the gas outlet assembly 15.

[0041] Optionally, the gas delivery mechanism 13 may include a gas compressor and a pipeline. The gas compressor is connected to the gas storage unit 14 via the pipeline and is able to deliver protective gas into the gas storage unit 14.

[0042] Optionally, the gas delivery mechanism 13 may also include a gas pressure tank and a pipeline. The gas pressure tank is connected to the gas storage unit 14 through the pipeline, and the high-pressure protective gas in the gas pressure tank can flow to the gas storage unit 14 through the pipeline.

[0043] Optionally, the protective gas may include nitrogen, helium, or argon.

[0044] With the outlet end of the gas outlet assembly 15 facing the stage 111, the protective gas and sample cleaning gas flow towards the stage 111 when they are output from the outlet end. After the wafer sample is placed on the stage 111, it is convenient to control the gas outlet assembly 15 to be directly facing the wafer sample, so that the protective gas and sample cleaning gas can flow to the wafer sample.

[0045] Optionally, the gas outlet assembly 15 may include a pipe and a nozzle. The nozzle is connected to the gas storage unit 14 through the pipe. The nozzle can uniformly spray protective gas and sample cleaning gas, and can also change the flow rate of protective gas and sample cleaning gas.

[0046] Optionally, the outlet assembly 15 may also include a pipe through which protective gas and sample cleaning gas are directly discharged, resulting in a simpler structure.

[0047] In use, the wafer sample is placed on the stage 111, and then the gas delivery mechanism 13 is turned on. The gas delivery mechanism 13 inputs protective gas into the gas storage device 14, and the pressure in the gas storage device 14 increases. The protective gas and sample cleaning gas in the gas storage device 14 enter the gas outlet assembly 15 and flow from the gas outlet to the wafer sample. The sample cleaning gas reacts with the oxide layer of the wafer sample to remove the oxide layer on the wafer sample. The protective gas provides a stable environment so that the sample cleaning gas can stably remove the oxide layer.

[0048] The beneficial effects of this application embodiment are as follows: the gas delivery mechanism 13 can deliver protective gas to the gas storage component 14 and allow the protective gas and sample cleaning gas to flow into the gas outlet assembly 15. The gas outlet 151 can guide the protective gas and sample cleaning gas to the wafer sample, which can remove the oxide layer of the wafer sample and facilitate the extraction of metal ions from the surface of the wafer sample by the test solution.

[0049] In some embodiments, please refer to Figure 2 and Figure 3 The exhaust pipe assembly 15 includes an exhaust pipe 151 and an exhaust component 152. The exhaust component 152 is provided with a cleaning channel 1521 and an exhaust gas channel 1522. The cleaning channel 1521 is connected to the gas storage component 14 through the exhaust pipe 151. The outlet of the cleaning channel 1521 is located at the exhaust end. The cleaning channel 1521 is used to guide the protective gas and sample cleaning gas to the wafer sample. The inlet of the exhaust gas channel 1522 is located at the exhaust end. The exhaust gas channel 1522 is used to guide the protective gas and sample cleaning gas to the outside of the wafer sample processing device 100.

[0050] The exhaust component 152 is connected to the gas storage component 14 through the exhaust pipe 151.

[0051] The cleaning channel 1521 is connected to the gas storage device 14 through the gas outlet pipe 151, so the protective gas and sample cleaning gas in the gas storage device 14 can enter the gas storage device 14 through the gas outlet pipe 151. The outlet of the cleaning channel 1521 is located at the gas outlet end, that is, the outlet of the cleaning channel 1521 faces the stage 111. After the wafer sample is placed on the stage 111, the protective gas and sample cleaning gas can come into contact with the wafer sample after flowing out from the outlet of the cleaning channel 1521.

[0052] The portion of the mixture of sample cleaning gas and protective gas that does not react with the wafer sample is considered waste gas. The inlet of waste gas channel 1522 is located at the outlet, meaning the inlet of waste gas channel 1522 is positioned near the outlet of cleaning channel 1521 for convenient waste gas discharge. Optionally, waste gas channel 1522 is connected to a suction device to accelerate waste gas discharge. The outlet of waste gas channel 1522 is connected to the outside of wafer sample processing device 100. Optionally, the outlet of waste gas channel 1522 can be located outside of wafer sample processing device 100. Optionally, the outlet of waste gas channel 1522 can also be connected to a pipe outside wafer sample processing device 100.

[0053] The cleaning channel 1521 and the exhaust gas channel 1522 are arranged alternately. Optionally, the cleaning channel 1521 and the exhaust gas channel 1522 can be nested, with the cleaning channel 1521 surrounding the exhaust gas channel 1522 or the exhaust gas channel 1522 surrounding the cleaning channel 1521. The exhaust gas channel 1522 easily collects exhaust gas around the wafer sample. Optionally, the cleaning channel 1521 and the exhaust gas channel 1522 can be arranged side by side, resulting in a simpler structure.

[0054] The beneficial effects of this application embodiment are as follows: the cleaning channel 1521 is connected to the gas storage device 14 through the gas outlet pipe 151, which can guide the sample cleaning gas and protective gas in the gas storage device 14 to the wafer sample, making it convenient to remove the oxide layer on the wafer sample. The exhaust gas channel 1522 can discharge unreacted exhaust gas, preventing exhaust gas from corroding the equipment or affecting the test personnel.

[0055] In some embodiments, please refer to Figure 2 The gas delivery mechanism 13 includes a gas supply device 131, an inlet pipe 132, a pressure reducing valve 133, and a pressure gauge 134. The two ends of the inlet pipe 132 are connected to the gas supply device 131 and the gas storage device 14, respectively. The gas supply device 131 is used to deliver protective gas to the gas storage device 14 through the inlet pipe 132. The pressure reducing valve 133 and the pressure gauge 134 are both connected to the inlet pipe 132.

[0056] Optionally, the gas supply device 131 can be a gas pressure tank capable of storing protective gas. Alternatively, the gas supply device 131 can also be a gas compressor.

[0057] The two ends of the air inlet pipe 132 are connected to the inside of the air supply device 131 and the inside of the air storage device 14, respectively.

[0058] The pressure reducing valve 133 can control the pressure of the protective gas in the inlet pipe 132 to maintain a stable pressure, thereby controlling the flow state of the sample cleaning gas and the protective gas to maintain a stable flow state. The pressure gauge 134 can display the pressure in the inlet pipe 132, making it convenient for testers to monitor the pressure.

[0059] In some embodiments, please refer to Figure 2 The stage 111 includes a bearing surface 1112 and a negative pressure channel 1111 in the stage 111. The negative pressure channel 1111 has an air inlet and an air outlet. The air inlet is located on the bearing surface 1112. The wafer sample processing device 100 also includes a vacuum extraction component 30, which is connected to the air outlet.

[0060] The bearing surface 1112 refers to the surface on the stage 111 used to place the wafer sample.

[0061] The outlet of the negative pressure channel 1111 is connected to the vacuum extraction component 30, which can evacuate the negative pressure channel 1111. After the wafer sample is placed on the support surface 1112 and the outlet is blocked, activating the vacuum extraction component 30 to evacuate the negative pressure channel 1111 creates a pressure difference on both sides of the wafer sample, fixing the wafer sample on the stage 111 under air pressure. Optionally, the inlet is located at the center of the support surface 1112, which can fix the wafer sample at the center of the stage 111. The distance the wafer sample moves after rotating the stage 111 is small, facilitating stable testing of the wafer sample. Optionally, the vacuum extraction component 30 may include a vacuum pump or a suction pump, etc.

[0062] The beneficial effects of this application embodiment are that: the negative pressure channel 1111 and the vacuum extraction component 30 can fix the wafer sample by air pressure, and the wafer sample is more stable when the stage 111 is rotated.

[0063] In some embodiments, please refer to Figure 2 The vacuum extraction assembly 30 includes a vacuum extractor 31, a vacuum tube 32, a valve 33, and a vacuum gauge 34. The two ends of the vacuum tube 32 are connected to the air outlet and the vacuum extractor 31, respectively. The valve 33 and the vacuum gauge 34 are both connected to the vacuum tube 32.

[0064] The vacuum extractor 31 is connected to the outlet via the vacuum tube 32, enabling it to evacuate the negative pressure channel 1111. Optionally, the vacuum extractor 31 can be a vacuum pump or a suction pump, etc.

[0065] The flow rate and vacuum level of the gas inside the vacuum tube 32 can be controlled by adjusting the opening degree of valve 33, and the on / off state of the vacuum tube 32 can also be controlled. Vacuum gauge 34 can display the vacuum level inside the vacuum tube 32, making it convenient for testers to monitor the pressure.

[0066] In other embodiments, the testing apparatus 10 further includes a clamping and fixing device connected to the stage 111, which can fix the wafer sample onto the stage 111.

[0067] In some embodiments, please refer to Figure 2 The testing apparatus 10 also includes a liquid storage container, a pipette 16, and a test container 17. The liquid storage container is used to contain the test liquid, the pipette 16 is used to transfer the test liquid from the liquid storage container to the wafer sample, and the pipette 16 is also used to transfer the test liquid from the wafer sample to the test container 17.

[0068] Optionally, the liquid storage container may include a liquid storage bottle, a measuring cup, etc.

[0069] Optionally, pipette 16 can be a pipette, which makes it easy to control the volume of test solution transferred. Optionally, pipette 16 can also be a pipette for convenient operation.

[0070] After removing the oxide layer on the surface of the wafer sample, the test solution is transferred from the storage container to the wafer sample using pipette 16. Then, the pipette tip 12 is controlled to drag the test solution to extract metal ions. The test solution containing metal ions is then transferred from the wafer sample to the test container 17 using pipette 16, and the test solution in the test container 17 is tested.

[0071] The beneficial effects of this application embodiment are: the liquid storage container, pipette 16 and test container 17 facilitate the addition of test solution to the wafer sample, and facilitate the removal of the test solution after metal ion extraction for subsequent detection.

[0072] In some embodiments, the universal connector 112 is a universal joint, which can stably connect the platform 111 and the support 113. The universal joint is also known as a universal joint or universal coupling.

[0073] In some embodiments, please refer to Figure 1 and Figure 2 The sample processing device also includes a protective cover 20, and the testing device 10 is located inside the protective cover 20.

[0074] The protective cover 20 isolates the testing device 10 from the external environment, keeping the testing environment stable. Optionally, the cleanliness level of the protective cover 20 is Class 1.

[0075] Optionally, when the wafer sample processing apparatus 100 is provided with an exhaust gas channel 1522, the exhaust gas channel 1522 is used to guide the protective gas and sample cleaning gas to the outside of the protective cover 20.

[0076] Optionally, the protective cover 20 is equipped with an acid exhaust device, which can exhaust the gas inside the protective cover 20. The acid exhaust device can be connected to the outlet of the exhaust gas channel 1522.

[0077] In some embodiments, the wafer sample processing apparatus 100 further includes an ultrapure water (UPW) gun and a nitrogen gun disposed inside the protective cover 20, to facilitate rinsing and purging of the protective cover 20 and the testing apparatus 10.

[0078] In some embodiments, please refer to Figure 1 The protective cover 20 is provided with an observation window 21 and a glove opening 22, and the protective cover 20 includes an operating glove connected to the glove opening 22.

[0079] Testers wearing operating gloves can operate the components inside the protective cover 20 from outside the protective cover 20, preventing testers from affecting the stability of the environment inside the protective cover 20 and preventing exhaust gases inside the protective cover 20 from causing harm to the testers.

[0080] Optionally, the observation window 21 is positioned above the glove opening 22 for easy observation.

[0081] In some embodiments, please refer to Figure 1 and Figure 2 The wafer sample processing apparatus 100 includes a testing device 10, a protective cover 20, and a vacuum extraction assembly 30. The protective cover 20 has a cleanliness level of Class 1, and the testing device 10 is housed within the protective cover 20. The testing device 10 includes a testing platform 11, a pipette 12, a liquid storage container, a pipette 16, and a testing container 17. The liquid storage container is used to hold the test liquid, and the pipette 16 is used to transfer the test liquid from the liquid storage container to the wafer sample. The pipette 16 is also used to transfer the test liquid from the wafer sample to the testing container 17. The testing platform 11 includes a support base 113, a universal connector 112, and a stage 111. The stage 111 is movably connected to the support base 113 via the universal connector 112, allowing the stage 111 to tilt up and down. The stage 111 is used to support the wafer sample; the pipette 12 is used to move the test liquid on the wafer sample.

[0082] The testing apparatus 10 also includes a gas delivery mechanism 13, a gas storage unit 14, and an outlet pipe assembly 15 connected to the gas storage unit 14. The gas storage unit 14 is used to contain sample cleaning gas, and the gas delivery mechanism 13 is used to deliver protective gas into the gas storage unit 14 so that the protective gas drives the sample cleaning gas to be output from the outlet pipe assembly 15. The outlet pipe assembly 15 has an outlet end facing the stage 111 and is used to guide the protective gas and the sample cleaning gas to the wafer sample.

[0083] The stage 111 includes a bearing surface 1112 and a negative pressure channel 1111 in the stage 111. The negative pressure channel 1111 has an air inlet and an air outlet. The air inlet is located on the bearing surface 1112. The wafer sample processing device 100 also includes a vacuum extraction component 30 connected to the air outlet.

[0084] The test solution is a mixture of HF, H2O2, HNO3, and ultrapure water (UPW), with a ratio of HF:H2O2:HNO3:UPW = 1:1:3:7. The sample cleaning gas is HF gas, and the protective gas is nitrogen gas.

[0085] Wafer sample testing is conducted within a protective enclosure 20 to prevent particulate contamination and leakage of chemicals such as HF. Please refer to [reference needed]. Figure 4 Wafer sample testing methods include:

[0086] S100. Place the wafer sample on the stage 111 and start the vacuum extraction assembly 30 to fix the wafer sample. Use the gas delivery mechanism 13 to deliver nitrogen to the gas storage unit 14. Use the nitrogen to carry the HF gas to the gas outlet assembly 15. The gas outlet assembly 15 guides the nitrogen and HF gas to the wafer sample. The HF gas contacts the surface of the wafer sample and removes the oxide layer to form a hydrophobic surface.

[0087] S200. Use pipette 16 to transfer 0.2-0.5 mL of test solution to the groove position on the wafer sample.

[0088] S300: The test droplet is dragged across the surface of the wafer sample by the nozzle 12, while the stage 111 is tilted slightly so that the nozzle 12 can drag the test droplet, so that the test liquid can extract metal ions from the surface of the wafer sample.

[0089] After metal ion extraction (S400), the test solution is transferred to the test container 17 using pipette 16. The volume of the test solution in the test container 17 is adjusted to 1 ml, and then the metal ions in the test solution are detected using an inductively coupled plasma mass spectrometer (ICPMS).

[0090] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A wafer sample processing apparatus, characterized by, Includes a testing apparatus, the testing apparatus comprising: The test platform includes a support base, a universal connector, and a stage. The stage is used to support wafer samples. The stage is movably connected to the support base through the universal connector so that the stage can tilt up and down. A suction nozzle is used to move the test liquid on the wafer sample.

2. The wafer sample processing apparatus of claim 1, wherein The testing apparatus further includes a gas delivery mechanism, a gas storage unit, and a gas outlet assembly connected to the gas storage unit. The gas storage unit is used to contain sample cleaning gas, and the gas delivery mechanism is used to deliver protective gas into the gas storage unit so that the protective gas drives the sample cleaning gas to be output from the gas outlet assembly. The gas outlet assembly has an outlet end facing the stage and is used to guide the protective gas and the sample cleaning gas to the wafer sample.

3. The wafer sample processing apparatus of claim 2, wherein The exhaust pipe assembly includes an exhaust pipe and an exhaust component. The exhaust component has a cleaning channel and an exhaust gas channel. The cleaning channel is connected to the gas storage component through the exhaust pipe. The outlet of the cleaning channel is located at the exhaust end. The cleaning channel is used to guide the protective gas and the sample cleaning gas to the wafer sample. The inlet of the exhaust gas channel is located at the exhaust end. The exhaust gas channel is used to guide the protective gas and the sample cleaning gas to the outside of the wafer sample processing device.

4. The wafer sample processing apparatus of claim 2, wherein The gas delivery mechanism includes a gas supply device, an inlet pipe, a pressure reducing valve, and a pressure gauge. The two ends of the inlet pipe are respectively connected to the gas supply device and the gas storage device. The gas supply device is used to deliver the protective gas to the gas storage device through the inlet pipe. The pressure reducing valve and the pressure gauge are both connected to the inlet pipe.

5. The wafer sample processing apparatus of claim 1, wherein The stage includes a bearing surface and a negative pressure channel. The negative pressure channel has an air inlet and an air outlet, and the air inlet is located on the bearing surface. The wafer sample processing device also includes a vacuum extraction component, which is connected to the air outlet.

6. The wafer sample processing apparatus of claim 5, wherein The vacuum extraction assembly includes a vacuum extractor, a vacuum tube, a valve, and a vacuum gauge. The two ends of the vacuum tube are respectively connected to the air outlet and the vacuum extractor, and the valve and the vacuum gauge are both connected to the vacuum tube.

7. The wafer sample processing apparatus of claim 1, wherein The testing apparatus further includes a liquid reservoir, a pipette, and a testing container. The liquid reservoir is used to contain the test liquid, the pipette is used to transfer the test liquid from the liquid reservoir to the wafer sample, and the pipette is also used to transfer the test liquid from the wafer sample to the testing container.

8. The wafer sample processing apparatus of claim 1, wherein The universal connector is a universal joint.

9. The wafer sample processing apparatus of any one of claims 1-8, wherein, The sample processing device also includes a protective cover, and the testing device is located inside the protective cover.

10. The wafer sample processing apparatus of claim 9, wherein The protective cover is provided with an observation window and a glove opening, and the protective cover includes an operating glove connected to the glove opening.

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