Multilayer substrate

Abstract

Provided is a multilayer substrate capable of suppressing coupling between a shunt conductor layer and a radiation conductor layer. The laminated body (12) has a structure in which a plurality of insulator layers (14a-14f) are laminated along the Z axis. When viewed in the negative direction of the Z-axis, the first ground conductor layer (28) overlaps the radiation conductor layer (16), and is positioned closer to the negative side of the Z-axis than the radiation conductor layer. When viewed in the negative direction of the Z-axis, the second ground conductor layers (30a-30d) do not overlap the radiation conductor layer and are positioned further toward the positive side of the Z-axis than the first ground conductor layer. When viewed in the negative direction of the Z axis, there is no ground conductor layer other than the first ground conductor layer between the radiation conductor layer and the second ground conductor layer. The current path is connected to the radiating conductor layer. The shunt conductor layer (22) is located nearer to the negative side of the Z axis than the second ground conductor layer, and branches from the current path. At least a portion of the shunt conductor layer overlaps the second ground conductor layer when viewed in the negative direction of the Z-axis.

Description

Technical Field

[0001] This utility model relates to multilayer substrates. Background Technology

[0002] As a conventional technology involving multilayer substrates, for example, the antenna module described in Patent Document 1. This antenna module includes a ground electrode, a power supply element, power supply wiring, and a first stub. The ground electrode and the power supply element form a patch antenna. The power supply wiring transmits a high-frequency signal to a first power supply point of the power supply element. The first stub branches off from the power supply wiring.

[0003] Prior art literature

[0004] Patent documents

[0005] Patent Document 1: International Publication No. 2020 / 145392 Utility Model Content

[0006] Problems to be solved by utility models

[0007] Furthermore, in the antenna module described in Patent Document 1, there is a need to suppress coupling between the first stub and the power supply element.

[0008] Therefore, the purpose of this invention is to provide a multilayer substrate capable of suppressing the coupling between the shunt conductor layer and the radiation conductor layer.

[0009] Technical solutions for solving the problem

[0010] One embodiment of this utility model relates to a multilayer substrate comprising: a laminate, a radiating conductor layer, a first ground conductor layer, a second ground conductor layer, a current path, and a branch conductor layer.

[0011] The laminate has a structure in which multiple insulating layers are stacked along the Z-axis.

[0012] The radiation conductor layer is disposed on the laminate.

[0013] The first grounding conductor layer is disposed on the laminate, and when viewed in the negative direction of the Z-axis, it overlaps with the radiating conductor layer, and is located on the negative side of the Z-axis than the radiating conductor layer.

[0014] The second grounding conductor layer is disposed on the laminate, and when viewed in the negative direction of the Z-axis, it does not overlap with the radiating conductor layer, and is located on the positive side of the Z-axis compared to the first grounding conductor layer.

[0015] When viewed in the negative direction of the Z-axis, there is no grounding conductor layer other than the first grounding conductor layer between the radiating conductor layer and the second grounding conductor layer.

[0016] The current path is disposed in the laminate and connected to the radiating conductor layer.

[0017] The shunt conductor layer is disposed on the laminate and is located on the negative side of the Z-axis compared to the second ground conductor layer, and branches off from the current path.

[0018] When viewed in the negative direction of the Z-axis, at least a portion of the shunt conductor layer overlaps with the second ground conductor layer.

[0019] Utility Model Effect

[0020] According to the multilayer substrate of this utility model, the coupling between the shunt conductor layer and the radiation conductor layer can be suppressed. Attached Figure Description

[0021] Figure 1 This is an exploded perspective view of the multilayer substrate 10.

[0022] Figure 2 This is an exploded perspective view of the multilayer substrate 10a.

[0023] Figure 3 This is an exploded perspective view of the multilayer substrate 10b.

[0024] Figure 4 This is an exploded perspective view of the multilayer substrate 10c.

[0025] Figure 5 This is an exploded 3D view of a multilayer substrate.

[0026] Figure 6 This is a rear view of a multilayer substrate 10d.

[0027] Explanation of reference numerals in the attached figures

[0028] 10, 10a~10d: Multilayer substrate;

[0029] 12: Layered body;

[0030] 14a~14f: Insulating layers;

[0031] 16: Radiation conductor layer;

[0032] 20: Signal conductor layer;

[0033] 20a: Part 1;

[0034] 20b: Part 2;

[0035] 22: Branch conductor layer;

[0036] 24: External electrode;

[0037] 28: First grounding conductor layer;

[0038] 30a~30d: Second grounding conductor layer;

[0039] A1: Interval 1;

[0040] A2: Second interval;

[0041] P1, P2: Power supply points;

[0042] R: Current path;

[0043] v1~v5, v11, v12: Interlayer connection conductors. Detailed Implementation

[0044] (Implementation Method)

[0045] [Structure of multilayer substrate 10]

[0046] Hereinafter, the structure of a multilayer substrate 10 according to one embodiment of the present invention will be described with reference to the accompanying drawings. Figure 1 This is an exploded perspective view of the multilayer substrate 10.

[0047] Hereinafter, the stacking direction of the laminate 12 is parallel to the top and bottom axes. The top and bottom axes are aligned with the Z-axis. The upward direction is the positive direction of the Z-axis. The downward direction is the negative direction of the Z-axis. When viewing the laminate 12 from a downward direction, two sides of the laminate 12 extend along the left and right axes. When viewing the laminate 12 from a downward direction, the remaining two sides of the laminate 12 extend along the front and back axes. The left and right axes are orthogonal to the top and bottom axes. The front and back axes are orthogonal to both the top and bottom axes and the left and right axes. Furthermore, the definition of directions in this specification is an example. Therefore, the actual orientation of the multilayer substrate 10 in use does not need to be consistent with the orientation in this specification.

[0048] Multilayer substrate 10 is used, for example, in wireless communication terminals such as smartphones. Figure 1 As shown, the multilayer substrate 10 includes a laminate 12, a radiating conductor layer 16, a first ground conductor layer 28, second ground conductor layers 30a to 30d, a current path R, and a branch conductor layer 22.

[0049] The laminate 12 has a plate shape. For example... Figure 1 As shown, when viewed from below, the laminate 12 has a rectangular shape. The laminate 12 has a structure in which insulating layers 14a to 14f are stacked along the vertical axis (Z-axis). The insulating layers 14a to 14f are arranged sequentially from top to bottom. The material of the insulating layers 14a to 14f is a thermoplastic resin such as polyimide or liquid crystal polymer. Adjacent insulating layers 14a to 14f are fused together. The laminate 12 is flexible.

[0050] The radiating conductor layer 16 radiates and / or receives high-frequency signals. The radiating conductor layer 16 is disposed on the laminate 12. In this embodiment, the radiating conductor layer 16 is located on the upper main surface of the insulating layer 14a. Figure 1 As shown, when viewed from a downward direction, the radiating conductor layer 16 has a rectangular shape. Figure 1 As shown, when viewed from the downward direction, the radiation conductor layer 16 has two sides extending along the front-rear axis and two sides extending along the left-right axis.

[0051] like Figure 1 As shown, the first grounding conductor layer 28 is disposed on the laminate 12. More specifically, the first grounding conductor layer 28 is located below the radiating conductor layer 16 (on the negative side of the Z-axis). The first grounding conductor layer 28 is disposed on the lower main surface of the insulating layer 14f. Figure 1 As shown, when viewed downwards, the first ground conductor layer 28 has a rectangular shape. The first ground conductor layer 28 covers approximately the entire lower main surface of the insulating layer 14f. Thus, when viewed downwards (in the negative Z-axis direction), the first ground conductor layer 28 overlaps with the radiating conductor layer 16. The first ground conductor layer 28 is connected to ground potential. Thus, the radiating conductor layer 16 and the first ground conductor layer 28 form a patch antenna.

[0052] like Figure 1 As shown, the second grounding conductor layers 30a to 30d are disposed on the laminate 12. More specifically, the second grounding conductor layers 30a to 30d are located above the first grounding conductor layer 28 (on the positive side of the Z-axis). In this embodiment, the second grounding conductor layers 30a to 30d are respectively located on the upper main surface of the insulating layers 14a to 14d.

[0053] Furthermore, when viewed in the downward direction (negative direction of the Z-axis), the second grounding conductor layers 30a-30d have a ring shape surrounding the radiating conductor layer 16. The outer and inner edges of the second grounding conductor layers 30a-30d have a rectangular shape with two sides extending along the front-rear axis and two sides extending along the left-right axis. Thus, when viewed in the downward direction (negative direction of the Z-axis), the second grounding conductor layers 30a-30d do not overlap with the radiating conductor layer 16.

[0054] However, when viewed downwards, the second grounding conductor layers 30a-30d are located near the radiating conductor layer 16. Specifically, when viewed downwards (in the negative Z-axis direction), there is no grounding conductor layer other than the first grounding conductor layer 28 between the radiating conductor layer 16 and the second grounding conductor layers 30a-30d. The second grounding conductor layers 30a-30d are connected to the grounding potential.

[0055] High-frequency signals are transmitted through the current path R. The current path R is formed by a conductor connecting the external electrode 24 and the radiating conductor layer 16. The current path R is disposed in the laminate 12. The current path R is connected to the radiating conductor layer 16. The current path R includes a signal conductor layer 20 and interlayer connecting conductors v1 and v2.

[0056] A signal conductor layer 20 is disposed on the laminate 12. The signal conductor layer 20 is located below the radiating conductor layer 16 (on the negative side of the Z-axis). Furthermore, the signal conductor layer 20 is located above the first ground conductor layer 28 (on the positive side of the Z-axis). In this embodiment, the signal conductor layer 20 is located on the upper main surface of the insulating layer 14e. Therefore, the distance D1 between the signal conductor layer 20 and the first ground conductor layer 28 on the vertical axis (Z-axis) is shorter than the distance D2 between the signal conductor layer 20 and the radiating conductor layer 16 on the vertical axis (Z-axis).

[0057] The signal conductor layer 20 includes a first portion 20a and a second portion 20b. The first portion 20a extends along the front-rear axis. The second portion 20b extends along the left-right axis. When viewed in a downward direction, the front end of the first portion 20a overlaps with the radiation conductor layer 16. The rear end of the first portion 20a connects to the right end of the second portion 20b.

[0058] like Figure 1 As shown, the external electrode 24 is disposed on the lower main surface of the insulating layer 14f. The external electrode 24 is not in contact with the first ground conductor layer 28. Therefore, the external electrode 24 is located within the opening disposed in the first ground conductor layer 28. When viewed in the downward direction, the external electrode 24 overlaps with the left end of the second part. High-frequency signals are input or output at the external electrode 24.

[0059] Interlayer connecting conductor v1 electrically connects the radiating conductor layer 16 and the signal conductor layer 20. More specifically, interlayer connecting conductor v1 extends through the insulating layers 14a-14d along the upper and lower axes. The upper end of interlayer connecting conductor v1 contacts the radiating conductor layer 16 at the power supply point P1. The lower end of interlayer connecting conductor v1 contacts the front end of the first part 20a.

[0060] Interlayer connection conductor v2 electrically connects signal conductor layer 20 and external electrode 24. More specifically, interlayer connection conductor v2 extends through insulating layers 14e and 14f along the upper and lower axes. The upper end of interlayer connection conductor v2 contacts the left end of the second part 20b. The lower end of interlayer connection conductor v2 contacts external electrode 24.

[0061] Interlayer connecting conductors v3 to v5 electrically connect the first grounding conductor layer 28 and the second grounding conductor layers 30a to 30d. More specifically, interlayer connecting conductors v3 to v5 penetrate the insulating layers 14a to 14f along the upper and lower axes. The upper ends of interlayer connecting conductors v3 to v5 are in contact with the second grounding conductor layer 30a. The lower ends of interlayer connecting conductors v3 to v5 are in contact with the first grounding conductor layer 28. Furthermore, the middle portions of interlayer connecting conductors v3 to v5 are in contact with the second grounding conductor layers 30b to 30d.

[0062] Branch conductor layer 22 is disposed on laminate 12. Branch conductor layer 22 is located lower (negative Z-axis side) than the second ground conductor layers 30a-30d. In this embodiment, branch conductor layer 22 is located on the upper main surface of insulator layer 14e. Branch conductor layer 22 branches from current path R. More specifically, branch conductor layer 22 extends to the right from the rear end of first portion 20a and the right end of second portion 20b. Therefore, when viewed in the downward direction, branch conductor layer 22 has a linear shape. When viewed in the downward direction (negative Z-axis direction), at least a portion of branch conductor layer 22 overlaps with the second ground conductor layers 30a-30d. In this embodiment, when viewed in the downward direction, the entire branch conductor layer 22 overlaps with the second ground conductor layers 30a-30d. Therefore, when viewed in the downward direction (negative Z-axis direction), the connection portion of branch conductor layer 22 and current path R overlaps with the second ground conductor layers 30a-30d. However, when viewed in the downward direction (the negative direction of the Z-axis), the shunt conductor layer 22 does not overlap with the radiating conductor layer 16. This shunt conductor layer 22 is an open-circuit stub. Therefore, the shunt conductor layer 22 is not connected to conductor layers other than the signal conductor layer 20.

[0063] The radiation conductor layer 16, signal conductor layer 20, branch conductor layer 22, external electrode 24, first ground conductor layer 28, and second ground conductor layers 30a-30d described above are formed by patterning a metal foil adhered to the upper or lower main surface of the insulating layers 14a-14f. The metal foil is, for example, copper foil. The interlayer connecting conductors v1-v5 are formed by filling conductive paste into through-holes penetrating the insulating layers 14a-14f along the upper and lower axes, and then curing the conductive paste by heating and pressurizing.

[0064] [Effect]

[0065] According to the multilayer substrate 10, coupling between the shunt conductor layer 22 and the radiating conductor layer 16 can be suppressed. More specifically, when viewed in the downward direction, at least a portion of the shunt conductor layer 22 overlaps with the second ground conductor layers 30a to 30d. Thus, the second ground conductor layers 30a to 30d are located between the radiating conductor layer 16 and the shunt conductor layer 22. As a result, according to the multilayer substrate 10, coupling between the shunt conductor layer 22 and the radiating conductor layer 16 can be suppressed.

[0066] In this embodiment, when viewed from a downward direction, the connection portion between the shunt conductor layer 22 and the current path R overlaps with the second ground conductor layers 30a to 30d. This allows for more effective suppression of coupling between the shunt conductor layer 22 and the radiating conductor layer 16.

[0067] In this embodiment, when viewed from a downward direction, the entire shunt conductor layer 22 overlaps with the second ground conductor layers 30a to 30d. This allows for more effective suppression of coupling between the shunt conductor layer 22 and the radiation conductor layer 16.

[0068] In this embodiment, when viewed in the downward direction, the shunt conductor layer 22 does not overlap with the radiating conductor layer 16. Therefore, the coupling between the shunt conductor layer 22 and the radiating conductor layer 16 can be suppressed more effectively.

[0069] In this embodiment, the shunt conductor layer 22 branches off from the current path R. Thus, the shunt conductor layer 22 serves to match the characteristic impedance generated in the radiating conductor layer 16 with the characteristic impedance generated in the current path R. As a result, high-frequency signal reflection can be suppressed at the boundary between the radiating conductor layer 16 and the current path R, reducing high-frequency signal loss.

[0070] Furthermore, for the following reasons, the shunt conductor layer 22 is preferably not significantly distant from the radiating conductor layer 16. At the power supply point P1, a high-frequency signal is reflected. The reflected high-frequency signal is reflected again in the shunt conductor layer 22. The reflected wave is radiated from the radiating conductor layer 16 as an electromagnetic wave. In this way, in the multilayer substrate 10, the reflected wave is used as an electromagnetic wave for a high-frequency signal.

[0071] If the shunt conductor layer 22 and the radiating conductor layer 16 are significantly separated, reflected waves will experience losses between them. Therefore, the shunt conductor layer 22 is preferably not significantly separated from the radiating conductor layer 16. As a result, the gain of the radiating conductor layer 16 is increased.

[0072] In the multilayer substrate 10, when viewed from below, the second ground conductor layers 30a to 30d do not overlap with the radiating conductor layer 16 and are located above the first ground conductor layer 28. This makes it difficult for the radiation and receiving patterns of the radiating conductor layer 16 to diffuse towards the first ground conductor layer 28. Consequently, the directivity of the radiation and receiving patterns of the radiating conductor layer 16 is improved.

[0073] In this embodiment, when viewed from a downward direction, the second grounding conductor layers 30a to 30d have a ring shape surrounding the radiating conductor layer 16. As a result, the directivity of the radiation pattern and the receiving pattern of the radiating conductor layer 16 is further improved.

[0074] In the multilayer substrate 10, the distance D1 between the signal conductor layer 20 and the first ground conductor layer 28 on the vertical axis (Z-axis) is shorter than the distance D2 between the signal conductor layer 20 and the radiation conductor layer 16 on the vertical axis (Z-axis). As a result, coupling between the signal conductor layer 20 and the radiation conductor layer 16 can be suppressed.

[0075] (Example 1)

[0076] Hereinafter, the multilayer substrate 10a according to the first modified example will be described with reference to the accompanying drawings. Figure 2 This is an exploded perspective view of the multilayer substrate 10a.

[0077] The multilayer substrate 10a differs from the multilayer substrate 10 in the shape of the second ground conductor layers 30a-30d. More specifically, when viewed from the downward direction, the second ground conductor layers 30a-30d have an angular C-shape. When viewed from the downward direction, the second ground conductor layers 30a-30d do not have a front edge. Similarly, when viewed from the downward direction, the second ground conductor layers 30a-30d may also lack the ring shape surrounding the radiating conductor layer 16. The other structures of the multilayer substrate 10a are the same as those of the multilayer substrate 10, and therefore descriptions are omitted. The multilayer substrate 10a can achieve the same effects as the multilayer substrate 10.

[0078] (Second variation)

[0079] Hereinafter, the multilayer substrate 10b of the second modified example will be described with reference to the accompanying drawings. Figure 3 This is an exploded perspective view of the multilayer substrate 10b.

[0080] The multilayer substrate 10b differs from the multilayer substrate 10 in the following aspects.

[0081] • The multilayer substrate 10b does not have a second ground conductor layer 30d.

[0082] • The multilayer substrate 10b also has an interlayer interconnect conductor v11.

[0083] • Part 1 20a and Part 2 20b are disposed in different insulating layers.

[0084] Part 1 20a is located on the upper main surface of insulating layer 14d. Part 2 20b is located on the upper main surface of insulating layer 14e. Interlayer connection conductor v11 extends through insulating layer 14d along the vertical axis (Z-axis). The upper end of interlayer connection conductor v11 contacts the rear end of part 1 20a. The lower end of interlayer connection conductor v11 contacts the right end of part 20b and the left end of shunt conductor layer 22. Thus, shunt conductor layer 22 is connected to interlayer connection conductor v11. The other structures of multilayer substrate 10b are the same as those of multilayer substrate 10, and therefore description is omitted. Multilayer substrate 10b can perform the same effects as multilayer substrate 10.

[0085] (3rd variation)

[0086] Hereinafter, the multilayer substrate 10c involved in the third modified example will be described with reference to the accompanying drawings. Figure 4 This is an exploded perspective view of the multilayer substrate 10c.

[0087] The multilayer substrate 10c differs from multilayer substrate 10 in that it also includes an interlayer connection conductor v12. The interlayer connection conductor v12 electrically connects the branch conductor layer 22 and the first ground conductor layer 28. Specifically, the interlayer connection conductor v12 extends through the insulating layers 14e and 14f along the vertical axis. The upper end of the interlayer connection conductor v12 contacts the right end of the branch conductor layer 22. The lower end of the interlayer connection conductor v12 contacts the first ground conductor layer 28. Thus, the branch conductor layer 22 is a short-circuit stub. The other structures of the multilayer substrate 10c are the same as those of the multilayer substrate 10, and therefore descriptions are omitted. The multilayer substrate 10c can achieve the same effects as the multilayer substrate 10.

[0088] (4th variation)

[0089] Hereinafter, the multilayer substrate 10d involved in the fourth modified example will be described with reference to the accompanying drawings. Figure 5 This is an exploded 3D view of a multilayer substrate. Figure 6 This is a rear view of a multilayer substrate 10d.

[0090] The multilayer substrate 10d differs from the multilayer substrate 10 in that it has a first section A1 and a second section A2. More specifically, a radiating conductor layer 16 and second ground conductor layers 30a to 30d are provided in the first section A1. A signal conductor layer 20 and a first ground conductor layer 28 are provided in the second section A2. The second section A2 has a strip shape extending along the signal conductor layer 20. Furthermore, the first section A1 is not bent, while the second section A2 is bent. The other structures of the multilayer substrate 10d are the same as those of the multilayer substrate 10, and therefore descriptions are omitted. The multilayer substrate 10d can achieve the same effects as the multilayer substrate 10.

[0091] (Other implementation methods)

[0092] The multilayer substrates involved in this utility model are not limited to multilayer substrates 10, 10a to 10d, and can be modified within the scope of its intent. In addition, the structures of multilayer substrates 10, 10a to 10d can be arbitrarily combined.

[0093] Interlayer connecting conductors v11 and v12 can also penetrate multiple insulating layers.

[0094] Alternatively, when viewed from the downward direction, the connection between the shunt conductor layer 22 and the current path R does not overlap with the second ground conductor layer 30a-30d.

[0095] Alternatively, when viewed from the downward direction, a portion of the shunt conductor layer 22 may overlap with the second ground conductor layers 30a to 30d.

[0096] Alternatively, when viewed from the downward direction, the shunt conductor layer 22 may overlap with the radiation conductor layer 16.

[0097] Alternatively, the shunt conductor layer 22 may not have a linear shape. For example, the shunt conductor layer 22 may also have a circular or square shape.

[0098] Alternatively, the multilayer substrates 10, 10a to 10d may also have a power supply point P2 in addition to the power supply point P1. In this case, the electromagnetic field vibration direction of the high-frequency signal powered at the power supply point P2 is different from the electromagnetic field vibration direction of the high-frequency signal powered at the power supply point P1.

[0099] Alternatively, a third ground conductor layer may be provided on the signal conductor layer 20 in the second section A2 of the multilayer substrate 10d.

[0100] In addition, the multilayer substrates 10, 10a to 10d only need to have at least one of the second ground conductor layers 30a to 30d.

[0101] Alternatively, the second grounding conductor layers 30a to 30d may not have a ring shape surrounding the radiating conductor layer 16. Therefore, when viewed in the downward direction, each of the second grounding conductor layers 30a to 30d may consist of multiple conductor layers arranged at intervals on a ring-shaped track surrounding the radiating conductor layer 16.

[0102] This utility model has the following structure. (1)

[0104] A multilayer substrate includes: a laminate, a radiating conductor layer, a first ground conductor layer, a second ground conductor layer, a current path, and a shunt conductor layer.

[0105] The laminate has a structure in which multiple insulating layers are stacked along the Z-axis.

[0106] The radiation conductor layer is disposed on the laminate.

[0107] The first grounding conductor layer is disposed on the laminate, and when viewed in the negative direction of the Z-axis, it overlaps with the radiating conductor layer, and is located on the negative side of the Z-axis than the radiating conductor layer.

[0108] The second grounding conductor layer is disposed on the laminate, and when viewed in the negative direction of the Z-axis, it does not overlap with the radiating conductor layer, and is located on the positive side of the Z-axis compared to the first grounding conductor layer.

[0109] When viewed in the negative direction of the Z-axis, there is no grounding conductor layer other than the first grounding conductor layer between the radiating conductor layer and the second grounding conductor layer.

[0110] The current path is disposed in the laminate and connected to the radiating conductor layer.

[0111] The shunt conductor layer is disposed on the laminate and is located on the negative side of the Z-axis compared to the second ground conductor layer, and branches off from the current path.

[0112] When viewed in the negative direction of the Z-axis, at least a portion of the shunt conductor layer overlaps with the second ground conductor layer. (2)

[0114] According to the multilayer substrate described in (1), wherein,

[0115] When viewed in the negative direction of the Z-axis, the connection portion of the shunt conductor layer and the current path overlaps with the second ground conductor layer. (3)

[0117] According to the multilayer substrate described in (1) or (2), wherein,

[0118] When viewed in the negative direction of the Z-axis, the entire shunt conductor layer overlaps with the second ground conductor layer. (4)

[0120] According to any one of (1) to (3) of the multilayer substrate, wherein,

[0121] When viewed in the negative direction of the Z-axis, the shunt conductor layer does not overlap with the radiating conductor layer. (5)

[0123] According to any one of (1) to (4) of the multilayer substrate, wherein,

[0124] The current path includes interlayer connection conductors.

[0125] The interlayer connection conductor extends along the Z-axis through at least one of the plurality of insulating layers.

[0126] The shunt conductor layer is connected to the interlayer connection conductor. (6)

[0128] According to any one of (1) to (5) of the multilayer substrate, wherein,

[0129] When viewed in the negative direction of the Z-axis, the second ground conductor layer has a ring shape surrounding the radiating conductor layer. (7)

[0131] According to any one of (1) to (6) the multilayer substrate, wherein,

[0132] The current path includes a signal conductor layer.

[0133] The signal conductor layer is disposed on the laminate and is located on the negative side of the Z-axis compared to the radiating conductor layer, and on the positive side of the Z-axis compared to the first ground conductor layer.

[0134] The distance between the signal conductor layer and the first ground conductor layer on the Z-axis is shorter than the distance between the signal conductor layer and the radiation conductor layer on the Z-axis. (8)

[0136] According to any one of (1) to (7) of the multilayer substrate, wherein,

[0137] The shunt conductor layer is an open-circuit stub. (9)

[0139] According to any one of (1) to (7) of the multilayer substrate, wherein,

[0140] The shunt conductor layer is a short-circuit stub.

Claims

1. A multilayer substrate, characterized by, It includes: a laminate, a radiating conductor layer, a first ground conductor layer, a second ground conductor layer, a current path, and a branch conductor layer. The laminate has a structure in which multiple insulating layers are stacked along the Z-axis. The radiation conductor layer is disposed on the laminate. The first grounding conductor layer is disposed on the laminate, and when viewed in the negative direction of the Z-axis, it overlaps with the radiating conductor layer, and is located on the negative side of the Z-axis than the radiating conductor layer. The second grounding conductor layer is disposed on the laminate, and when viewed in the negative direction of the Z-axis, it does not overlap with the radiating conductor layer, and is located on the positive side of the Z-axis compared to the first grounding conductor layer. When viewed in the negative direction of the Z-axis, there is no grounding conductor layer other than the first grounding conductor layer between the radiating conductor layer and the second grounding conductor layer. The current path is disposed in the laminate and connected to the radiating conductor layer. The shunt conductor layer is disposed on the laminate and is located on the negative side of the Z-axis compared to the second ground conductor layer, and branches off from the current path. When viewed in the negative direction of the Z-axis, at least a portion of the shunt conductor layer overlaps with the second ground conductor layer.

2. The multilayer substrate according to claim 1, characterized in that, When viewed in the negative direction of the Z-axis, the connection portion of the shunt conductor layer and the current path overlaps with the second ground conductor layer.

3. The multilayer substrate according to claim 1 or claim 2, characterized in that, When viewed in the negative direction of the Z-axis, the entire shunt conductor layer overlaps with the second ground conductor layer.

4. The multilayer substrate according to claim 1 or claim 2, characterized in that, When viewed in the negative direction of the Z-axis, the shunt conductor layer does not overlap with the radiating conductor layer.

5. The multilayer substrate according to claim 1 or claim 2, characterized in that, The current path includes interlayer connection conductors. The interlayer connection conductor extends along the Z-axis through at least one of the plurality of insulating layers. The shunt conductor layer is connected to the interlayer connection conductor.

6. The multilayer substrate according to claim 1 or claim 2, characterized in that, When viewed in the negative direction of the Z-axis, the second ground conductor layer has a ring shape surrounding the radiating conductor layer.

7. The multilayer substrate according to claim 1 or claim 2, characterized in that, The current path includes a signal conductor layer. The signal conductor layer is disposed on the laminate and is located on the negative side of the Z-axis compared to the radiating conductor layer, and on the positive side of the Z-axis compared to the first ground conductor layer. The distance between the signal conductor layer and the first ground conductor layer on the Z-axis is shorter than the distance between the signal conductor layer and the radiation conductor layer on the Z-axis.

8. The multilayer substrate according to claim 1 or claim 2, characterized in that, The shunt conductor layer is an open-circuit stub.

9. The multilayer substrate according to claim 1 or claim 2, characterized in that, The shunt conductor layer is a short-circuit stub.

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