Heat dissipation device and portable cooler

Abstract

The utility model discloses a heat dissipation device and a portable cooler, and belongs to the technical field of heat dissipation equipment. The heat dissipation device comprises a flow guide cover and a heat dissipation plate which are connected in a sealed mode, fins are arranged on the two faces of the heat dissipation plate, an air contact face and a water flow contact face are arranged on the two sides of the heat dissipation plate, a plurality of flow guide grooves are formed in the flow guide cover, and a water inlet and a water outlet are formed in the head and the tail of a flow channel of the flow guide cover respectively. An integrally-formed water tank is arranged on a flow guide cover of the heat dissipation device. According to the heat dissipation device, the integrally-formed fins are arranged on the water flow contact face of the heat dissipation plate, the heat exchange area is increased, and the heat dissipation efficiency is improved; a flow equalizing plate for adjusting the flow velocity of water-cooling liquid is added in a flow channel of the heat dissipation device, so that the flow velocity of the water-cooling liquid is uniform and the heat exchange efficiency is improved; according to the portable cooler, the water tank and the flow guide cover are integrally formed, the water outlet of the heat dissipation device is located in the top of the water tank, and it is avoided that bubbles enter a water row or the heat dissipation device to affect the heat exchange efficiency.

Description

Technical Field

[0001] This application relates to the field of heat dissipation equipment technology, and in particular to a heat dissipation device and a portable cooler. Background Technology

[0002] Chinese utility model disclosure CN218388447U discloses an extruded profile water-cooled heat dissipation structure for high-power electronic devices, including: a water-cooled heat dissipation plate and a water nozzle assembly connected to the water-cooled heat dissipation plate. The water-cooled heat dissipation plate has a plurality of heat dissipation channels inside, and each heat dissipation channel is arranged along the longitudinal direction of the water-cooled heat dissipation plate with a certain gap between them. The end of each heat dissipation channel is connected to the adjacent water channel by a machined groove, so that the flow path of the cooling water in the water-cooled heat dissipation plate is S-shaped. In this type of S-shaped heat dissipation channel, the water flow velocity is high on the outside of the corner and low on the inside, resulting in uneven flow velocity of the coolant and reducing heat exchange performance. When using this type of heat dissipation device, it is unavoidable that gas will enter the circulation of the coolant during the assembly process, thus affecting the water cooling efficiency. Summary of the Invention

[0003] This application provides a heat dissipation device and a portable cooler, which can overcome at least one or more problems existing in the prior art.

[0004] In a first aspect, this application provides a heat dissipation device, which includes a sealed flow guide shroud and a heat dissipation plate. The heat dissipation plate has fins on both sides, one side of which is an air contact surface and the other side is a water flow contact surface. The flow guide shroud has a plurality of flow guide grooves, all of which are connected in series to form an "S"-shaped flow channel. The flow guide shroud has an inlet and an outlet at the beginning and end of the flow channel. The heat dissipation plate is integrally formed.

[0005] In one possible implementation, a comb-shaped flow equalization plate is provided at the connection point between two adjacent flow channels.

[0006] The heat dissipation device provided in this application embodiment has integrally formed fins on the water flow contact surface of the heat dissipation plate to increase the heat exchange area and improve heat dissipation efficiency; a flow equalization plate for adjusting the flow rate of the coolant is added in the flow channel of the heat dissipation device to make the flow rate of the coolant uniform and improve the heat exchange efficiency.

[0007] In one possible implementation, each flow channel has a flow equalization plate at its front end, and the bottom of the flow equalization plate has several toothed openings that allow coolant to pass through.

[0008] In one possible implementation, the closer the teeth on the flow equalization plate are to the inner side of the flow guide groove, the larger the area.

[0009] In one possible implementation, the fins on the water flow contact surface are deployed along the direction of the guide channel.

[0010] In a second aspect, this application also provides a portable cooler, including the aforementioned heat dissipation device, water pump, water tank, refrigeration device, and circuit device. The outlet of the heat dissipation device is connected to the top of the water tank, the inlet of the heat dissipation device is connected to the outlet of the refrigeration device, the inlet of the refrigeration device is connected to the outlet of the water pump, and the inlet of the water pump is connected to the bottom of the water tank.

[0011] In one possible implementation, the water tank and the flow guide shroud of the heat dissipation device are integrally machined, and the interior of the water tank and the flow guide groove of the heat dissipation device are connected through the water outlet.

[0012] The portable cooler provided in this application embodiment has a water tank and a guide shroud integrally formed, and the outlet of the heat dissipation device is located at the top of the water tank to prevent air bubbles from entering the water drain or the heat dissipation device and affecting the heat exchange efficiency.

[0013] In one possible implementation, the refrigeration device includes a cooling plate and a water drain, with the heating surface of the cooling plate abutting against the water drain. The outlet of the water drain is connected to the inlet of the heat dissipation device via a second water pipe, and the inlet of the water drain is connected to the outlet of the water pump via a first water pipe.

[0014] In one possible implementation, the cooling device further includes a heat-conducting plate and a magnet, with the cooling surface of the cooling plate abutting against the heat-conducting plate, which is a good conductor of heat, and a magnet disposed around the outer periphery of the cooling plate.

[0015] In one possible implementation, a fan is provided on the air contact surface of the heat dissipation device.

[0016] It should be noted that any of the possible implementations of any of the above aspects can be combined, provided that the solutions do not contradict each other. Attached Figure Description

[0017] Figure 1 This is an exploded view of a portable cooler provided in an embodiment of this application.

[0018] Figure 2 This is a schematic diagram of the structure of a portable cooler provided in an embodiment of this application.

[0019] Figure 3 This is a schematic diagram of the internal components of a portable cooler provided in an embodiment of this application.

[0020] Figure 4 This is a schematic diagram of a heat dissipation device provided in an embodiment of this application, applied to a portable cooler.

[0021] Figure 5 yes Figure 4 Another angle of the exploded view.

[0022] Figure 6This is a schematic diagram of the structure of the flow guide shroud in a heat dissipation device provided in an embodiment of this application.

[0023] Figure 7 This is a schematic diagram of the flow distribution plate in a heat dissipation device provided in an embodiment of this application.

[0024] Explanation of reference numerals in the attached figures:

[0025] 10. Flow guide cover; 11. Flow guide groove; 12. Inlet; 13. Outlet; 14. Flow equalization plate; 141. Toothed joint; 20. Heat dissipation plate; 21. Water flow contact surface; 22. Air contact surface; 30. Water pump; 40. Water tank; 50. Fan; 60. Refrigeration device; 61. Refrigeration chip; 62. Water drain; 63. First water pipe; 64. Second water pipe; 65. Heat-conducting plate; 66. Magnet; 70. Circuit device; 71. Circuit board; 72. Button; 73. Display; 74. Electrical interface; 80. Housing; 81. Main housing; 82. Back housing; 83. Exhaust hood. Detailed Implementation

[0026] The present application will now be described with reference to the accompanying drawings, which illustrate several embodiments of the present application.

[0027] On the one hand, embodiments of this application provide a heat dissipation device, which can be referred to in conjunction with the following: Figure 4 and Figure 5 , Figure 4 and Figure 5 The structure of the heat dissipation device is shown from different angles. The heat dissipation device includes a sealed flow guide shroud 10 and a heat dissipation plate 20. The heat dissipation plate 20 has fins on both sides, with one side being an air contact surface 22 and the other side being a water flow contact surface 21. The flow guide shroud 10 has several flow guide grooves 11 inside. All the flow guide grooves 11 are connected in series to form an "S" shaped flow channel. The flow guide shroud 10 has an inlet 12 and an outlet 13 at the beginning and end of the flow channel. In order to make the flow velocity of the coolant at the corner of the flow channel uniform, a comb-shaped flow equalization plate 14 is provided at the connection between two adjacent flow guide grooves 11. The heat dissipation plate 20 is integrally formed.

[0028] Please refer to the following for details. Figure 6 and Figure 7 , Figure 6 and Figure 7 The structures of the flow guide shroud 10 and the flow equalization plate 14 are shown respectively. Each flow guide trough 11 has a flow equalization plate 14 horizontally arranged at the front end. The bottom of the flow equalization plate 14 is provided with a number of teeth 141 that allow coolant to pass through. The teeth 141 on the flow equalization plate 14 have a larger area as they are closer to the inner side of the flow guide trough 11. The coolant flow velocity is low on the side of the flow channel closer to the inner side at the corner. The flow equalization plate 14 allows more coolant to pass through on the side with the low flow velocity, thereby adjusting the overall flow velocity of the coolant at the corner of the flow channel.

[0029] To increase the heat exchange area, the fins on the water flow contact surface 21 are deployed along the direction of the guide groove 11.

[0030] Embodiments of this application also provide a portable cooler, which can be referred to in conjunction with the embodiments. Figure 1 and Figure 2 , Figure 1 and Figure 2 The structure of the portable water cooler is shown from different angles. The portable water cooler includes the aforementioned heat dissipation device, water pump 30, water tank 40, refrigeration device 60, and circuit device 70. The outlet 13 of the heat dissipation device is connected to the top of the water tank 40, the inlet 12 of the heat dissipation device is connected to the outlet of the refrigeration device 60, the inlet of the refrigeration device 60 is connected to the outlet of the water pump 30, and the inlet of the water pump 30 is connected to the bottom of the water tank 40. In this way, the high-temperature coolant discharged from the refrigeration device 60 enters the heat dissipation device, and after being cooled by the heat dissipation device, the low-temperature coolant is pumped back to the refrigeration device 60, continuously circulating. Air bubbles in the coolant are left in the water tank 40 to prevent air bubbles from entering the refrigeration device 60 or the heat dissipation device and affecting the heat exchange efficiency.

[0031] Specifically, the water tank 40 and the flow guide shroud 10 in the heat dissipation device are integrally formed, and the interior of the water tank 40 is connected to the flow guide groove 11 of the heat dissipation device through the water outlet 13.

[0032] In one possible implementation, please refer to Figure 3 , Figure 3 An internal structure of a portable water cooler is shown. The cooling device 60 includes a cooling plate 61 and a water drain 62. The heating surface of the cooling plate 61 abuts against the water drain 62. The outlet of the water drain 62 is connected to the water inlet 12 of the heat dissipation device through a second water pipe 64. The inlet of the water drain 62 is connected to the outlet of the water pump 30 through a first water pipe 63.

[0033] The refrigeration device 60 also includes a heat-conducting plate 65 and a magnet 66. The cooling surface of the refrigeration plate 61 abuts against the heat-conducting plate 65, which is a good conductor of heat. The magnet 66 is provided on the outer periphery of the refrigeration plate 61 so that the refrigeration device 60 can be magnetically connected to the heat-dissipating equipment.

[0034] The aforementioned circuit device 70 includes a circuit board 71, a button 72, a display 73, and an electrical interface 74. The cooling chip 61, the button 72, the display 73, and the electrical interface 74 are electrically connected to the circuit board 71.

[0035] In some possible implementations, the housing 80 of the portable cooler includes a main housing 81, a back housing 82, and an exhaust hood 83. The aforementioned heat dissipation device, water pump 30, water tank 40, fan 50, and circuit device 70 are all housed within the housing 80. A display 73 and several buttons 72 are located on the front of the main housing 80, several electrical interfaces 74 are located on the top surface of the main housing 80, and a circuit board 71 is fixed to the inner surface of the main housing 81. The fan 50 is mounted on the fins of the air contact surface 22 of the heat dissipation device, and the exhaust hood 83 is located at the air outlet of the fan 50, with air outlet holes on the exhaust hood 83.

[0036] While exemplary embodiments of this application have been described, those skilled in the art will understand that various changes and modifications can be made to the exemplary embodiments of this application without departing from the spirit and scope thereof. Therefore, all changes and modifications are included within the scope of protection of this application as defined by the claims. This application is defined by the appended claims, and equivalents of those claims are also included.

Claims

1. A heat dissipation device, comprising a sealed flow guide shroud (10) and a heat dissipation plate (20), wherein the heat dissipation plate (20) is provided with fins on both sides, and the two sides of the heat dissipation plate (20) are air contact surfaces (22) and water flow contact surfaces (21), wherein the flow guide shroud (10) is provided with a plurality of flow guide grooves (11), all the flow guide grooves (11) are connected in series to form an "S" shaped flow channel, and the flow guide shroud (10) is provided with an inlet (12) and an outlet (13) at the beginning and end of the flow channel, characterized in that, The heat sink (20) is integrally formed.

2. The heat dissipating device according to claim 1, wherein A comb-shaped flow equalization plate (14) is provided at the connection between two adjacent flow guide channels (11).

3. The heat dissipating device of claim 2, wherein, Each of the flow channels (11) has a flow equalization plate (14) at its front end, and the bottom of the flow equalization plate (14) has a number of toothed openings (141) that allow water coolant to pass through.

4. The heat dissipating device of claim 2, wherein, The closer the toothed opening (141) on the flow equalization plate (14) is to the inner side of the flow guide groove (11), the larger its area.

5. The heat dissipation device according to claim 1, characterized in that, The fins on the water flow contact surface (21) are deployed along the direction of the guide groove (11).

6. A portable cooler characterized by, The device includes a heat dissipation device as described in any one of claims 1-4, a water pump (30), a water tank (40), a refrigeration device (60), and a circuit device (70), wherein the outlet (13) of the heat dissipation device is connected to the top of the water tank (40), the inlet (12) of the heat dissipation device is connected to the outlet of the refrigeration device (60), the inlet of the refrigeration device (60) is connected to the outlet of the water pump (30), and the inlet of the water pump (30) is connected to the bottom of the water tank (40).

7. The portable cooler of claim 6, wherein, The water tank (40) and the flow guide shroud (10) in the heat dissipation device are integrally formed, and the interior of the water tank (40) and the flow guide groove (11) of the heat dissipation device are connected through the water outlet (13).

8. The portable cooler of claim 6, wherein, The refrigeration device (60) includes a cooling plate (61) and a water drain (62). The heating surface of the cooling plate (61) abuts against the water drain (62). The outlet of the water drain (62) is connected to the inlet (12) of the heat dissipation device through a second water pipe (64). The inlet of the water drain (62) is connected to the outlet of the water pump (30) through a first water pipe (63).

9. The portable cooler of claim 8, wherein, The refrigeration device (60) further includes a heat-conducting plate (65) and a magnet (66). The refrigeration surface of the refrigeration plate (61) abuts against the heat-conducting plate (65), which is a good conductor of heat. The magnet (66) is provided on the outer periphery of the refrigeration plate (61).

10. The portable cooler of claim 6, wherein, A fan (50) is provided on the air contact surface (22) of the heat dissipation device.

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