High-efficiency liquid cooling heat dissipation unit and heat dissipation device

Abstract

The high-efficiency liquid cooling heat dissipation unit comprises a cover plate, a vapor chamber, a flow guide plate, a water cooling channel and a water outlet channel, the vapor chamber and the cover plate are connected in a sealed mode, a vacuum heat exchange cavity is formed in a sinking area, supporting columns are arranged in the vacuum heat exchange cavity in a dot matrix mode, and the vacuum heat exchange cavity is filled with phase change liquid. The water cooling channel surrounds the water cooling fin set and communicates with an external cooling liquid supply system, the flow guide plate is arranged above the water cooling fin set and provided with a flow guide hole corresponding to the middle of the water cooling fin set, and the water outlet channel is arranged above the water cooling fin set and connected with the water cooling channel through the water cooling fin set. Water flow enters the heat dissipation water channels of the water cooling fin set from the water cooling channels on the two sides and flows out through the flow guide holes and the water outlet channels, the surrounding type water cooling channels are matched with the flow guide plates and the water outlet channels, the water cooling circulation path is effectively shortened, therefore, liquid flow energy loss is reduced, the circulation efficiency is improved, and the heat dissipation device is suitable for rapid and uniform heat dissipation of heating elements such as high-power chips and processors.

Description

Technical Field

[0001] This application relates to the field of radiator technology, specifically to a high-efficiency liquid cooling heat dissipation unit and heat dissipation device. Background Technology

[0002] With the rapid development of the electronics industry, the performance of electronic devices is constantly improving, and their integration is becoming increasingly higher, leading to a significant increase in their heat flux density. Research shows that excessively high temperatures are a major cause of electronic device failure. Traditional heat dissipation methods, such as natural cooling and forced air cooling, are no longer sufficient to meet the heat dissipation requirements of high-power, highly integrated electronic components. Liquid cooling technology has gradually become a research hotspot due to its high efficiency. However, existing liquid cooling technologies still suffer from insufficient heat dissipation efficiency and heat accumulation in high heat density scenarios. Utility Model Content

[0003] To solve the above-mentioned technical problems, this application provides a high-efficiency liquid cooling heat dissipation unit, including a cover plate, an array of water-cooled fins, the water-cooled fins being arranged in the same direction and a heat dissipation channel for connecting the water-cooling channels on both sides being formed between adjacent water-cooled fins.

[0004] A heat spreader has a recessed area in its middle that is adapted to the shape of a cover plate and the bottom of the recessed area is in contact with a heat source. The heat spreader is sealed to the cover plate and forms a vacuum heat exchange chamber in the recessed area. The vacuum heat exchange chamber is filled with phase change liquid and has support columns arranged in a lattice.

[0005] A water-cooling channel is arranged around the water-cooling fin assembly and is connected to an external coolant supply system;

[0006] A flow guide plate is installed above the water-cooled fin assembly, and the flow guide plate has flow guide holes in the middle of the water-cooled fin assembly.

[0007] And a water outlet channel, which is provided above the water-cooled fin assembly and connected to the water-cooled channel through the water-cooled fin assembly. Water flows from the water-cooled channels on both sides into the heat dissipation channel of the water-cooled fin assembly and flows out through the guide hole and the water outlet channel.

[0008] In one embodiment, the main extension direction of the flow guide hole is perpendicular to the direction of the water-cooled fins.

[0009] In one embodiment, the support column and the heat spreader are integrally formed and both are made of thermally conductive metal.

[0010] In one embodiment, the support column is a solid copper column or a hollow copper column, with the hollow part filled with a phase change liquid.

[0011] In one embodiment, the support columns are arranged in a uniform lattice or a non-uniform lattice within the vacuum heat exchange chamber, with the density decreasing from the center of the sinking region to the edge.

[0012] In one embodiment, the heat spreader further includes a fixing part integrally formed outside the sinking area, and a cover plate is embedded in the sinking area of ​​the heat spreader and has a height difference relative to the fixing part, for forming a water collection trough for concentrating water flow between the fixing part and the water-cooled fin assembly.

[0013] In one embodiment, the heat spreader is provided with a raised edge that extends along the sunken area, and the cover plate is placed on the raised edge with its bottom in contact with the support column.

[0014] In one embodiment, the phase change liquid filling the vacuum heat exchange chamber is water, or a mixture of liquids with different boiling points.

[0015] In one embodiment, the heat spreader is welded to the cover plate or connected via a detachable snap-fit ​​structure.

[0016] This application also provides a heat dissipation device, which further includes:

[0017] The housing is located outside the high-efficiency liquid cooling heat dissipation unit and has a liquid inlet and a liquid outlet. The liquid inlet is connected to the water cooling channel and the liquid outlet is connected to the water outlet channel.

[0018] At least one pair of liquid inlet connectors and liquid outlet connectors are provided, corresponding to the liquid inlet and liquid outlet of the housing, respectively;

[0019] The power mechanism is used to guide the water flow to form a water-cooled circulation inside the heat dissipation device;

[0020] The heat spreader is located at the bottom of the housing and is used to contact the heat source.

[0021] This application provides a high-efficiency liquid cooling heat dissipation unit and heat dissipation device, which is suitable for the heat dissipation needs of high-power, highly integrated electronic devices, and has the following beneficial effects:

[0022] 1. The vacuum heat exchange chamber is equipped with lattice support columns and filled with phase change liquid. The phase change liquid rapidly absorbs and transfers heat through a vaporization-condensation cycle.

[0023] 2. The surrounding water cooling channel, in conjunction with the baffle plate and water outlet channel, effectively shortens the water cooling circulation path, thereby reducing liquid flow energy loss and improving circulation efficiency;

[0024] 3. The synergistic effect of the phase change liquid vaporization-condensation cycle and the coolant flow path in the vacuum chamber significantly improves heat transfer efficiency. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0027] Figure 1 This is an exploded view of the heat dissipation unit;

[0028] Figure 2 This is a structural diagram of the heat dissipation unit;

[0029] Figure 3 This is a schematic diagram of the liquid cooling circulation path;

[0030] Figure 4 This is a diagram of the overall structure of the heat dissipation device.

[0031] Explanation of key component symbols:

[0032] 1. Cover plate; 11. Water-cooled fin assembly; 12. Air nozzle; 13. Water collection tank;

[0033] 2. Heat spreader; 21. Recessed area; 211. Support column; 22. Fixing part; 23. Lifting edge;

[0034] 3. Flow guide plate; 31. Flow guide hole;

[0035] 4. Shell;

[0036] 5. Liquid inlet connector;

[0037] 6. Liquid outlet connector;

[0038] 7. Heat source. Detailed Implementation

[0039] In the description of this utility model, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and "axial," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0040] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," "fixed connection," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0041] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0042] The present invention will be further described and illustrated below with reference to specific embodiments and accompanying drawings.

[0043] This patent application provides a high-efficiency liquid cooling heat dissipation unit and heat dissipation device, which has high heat conduction efficiency and high circulation efficiency compared with existing air cooling and VC liquid cooling technologies, and is suitable for heat dissipation scenarios of high-power and highly integrated electronic devices.

[0044] As attached Figure 1-4 As shown, this application provides a high-efficiency liquid-cooled heat dissipation unit, including:

[0045] Cover plate 1, with arrayed water-cooled fins 11 arranged in the same direction, and adjacent water-cooled fins forming heat dissipation channels connecting the water-cooling channels on both sides; heat spreader 2, with a recessed area 21 in the middle adapted to the shape of cover plate 1, and the bottom of the recessed area in contact with heat source 7, heat spreader 2 is sealed to cover plate 1 and forms a vacuum heat exchange chamber in the recessed area, the vacuum heat exchange chamber is dotted with support columns 211 and filled with phase change liquid, the phase change liquid rapidly absorbs and transfers heat through vaporization-condensation cycle; water-cooling channels are arranged around the water-cooled fins 11 and connected to external cooling. The liquid supply system is connected; a guide plate 3 is set above the water-cooled fin assembly 11 and a guide hole 31 is set in the middle of the water-cooled fin assembly 11; and a water outlet channel is set above the water-cooled fin assembly 11 and connected to the water-cooling channel through the water-cooled fin assembly 11. Water flows from the water-cooling channels on both sides into the heat dissipation channel of the water-cooled fin assembly 11 and flows out through the guide hole 31 and the water outlet channel. The surrounding water-cooling channel, in conjunction with the guide plate 3 and the water outlet channel, effectively shortens the water-cooling circulation path, thereby reducing liquid flow energy loss and improving circulation efficiency. It is suitable for rapid and uniform heat dissipation of heat-generating components such as high-power chips and processors.

[0046] In one embodiment of this application, the main extension direction of the guide hole 31 is perpendicular to the direction of the water-cooled fins. This design causes lateral turbulence in the coolant as it flows through the heat dissipation channel, breaking the laminar boundary layer, enhancing heat exchange efficiency, and reducing the risk of localized overheating. The guide hole 31 can be a strip-shaped hole, an S-shaped hole, or a wavy hole, etc., to further enhance the turbulence of the coolant and improve heat exchange efficiency.

[0047] In one embodiment of this application, the support column 211 and the heat spreader 2 are integrally formed and both are made of thermally conductive metal. The integral forming process avoids welding or assembly gaps, ensures that the support column 211 is in close contact with the cavity wall, reduces contact thermal resistance, and has high stability and strong pressure resistance. The thermally conductive metal can be selected from copper / copper alloys with high thermal conductivity and stable physicochemical properties.

[0048] In one embodiment of this application, the support column 211 is a solid copper column. Optionally, the support column 211 can be a hollow copper column with the hollow part filled with phase change liquid. The hollow structure can expand the contact area of ​​the phase change liquid and improve the latent heat utilization efficiency. The dual phase change (phase change liquid inside the copper column and in the vacuum heat exchange chamber) significantly enhances the transient heat dissipation capability.

[0049] In one embodiment of this application, the support columns 211 are arranged in a uniform or non-uniform lattice within the vacuum heat exchange chamber, with the density decreasing from the center to the edge of the recessed region 21. The support columns 211 are densely packed in the central high heat flux density region and sparsely packed in the edge region, which is beneficial for balancing structural strength and controlling costs.

[0050] In one embodiment of this application, the heat spreader 2 further includes a fixing part 22, which is integrally formed outside the sunken area 21. The cover plate 1 is embedded in the sunken area 21 of the heat spreader 2 and has a height difference relative to the fixing part 22. The cover plate 1 is used to form a water collection tank 13 between the fixing part 22 and the water-cooled fin assembly 11 to collect the water flow. The water collection tank 13 collects the coolant, avoids the dispersion of the liquid flow in the edge area or when the radiator is started, improves the heat dissipation efficiency, and avoids heat accumulation.

[0051] In one embodiment of this application, the heat spreader 2 is provided with a raised edge 23 extending along the sunken region 21, and the cover plate 1 is placed on the raised edge 23 with its bottom in contact with the support column 211. The raised edge 23 provides precise positioning, prevents the cover plate 1 from shifting, and cooperates with the support column 211 to support the cover plate 1, thereby enhancing structural strength and preventing chamber deformation.

[0052] In one embodiment of this application, the phase change liquid filling the vacuum heat exchange chamber is water, or a mixed medium composed of multiple liquids with different boiling points. Optionally, the vacuum heat exchange chamber is filled with a boiling point gradient mixed medium, such as water and ethanol mixed in a 7:3 volume ratio. The mixed medium vaporizes in stages within the range of 50°C to 90°C to meet the heat dissipation requirements of a wide temperature range, thereby expanding the effective operating temperature range. At the same time, the multi-stage phase change of liquids with different boiling points improves the heat dissipation stability under high heat flux density.

[0053] In one embodiment of this application, the heat spreader 2 is welded to the cover plate 1, or connected via a detachable snap-fit ​​structure. Laser welding ensures airtightness and is suitable for long-term, high-reliability applications, while the snap-fit ​​structure (such as a spring lock) facilitates quick assembly and disassembly during maintenance, reducing maintenance costs and supporting modular replacement.

[0054] In one embodiment of this application, a gas nozzle 12 is fixedly mounted on the cover plate 1. The gas nozzle 12 is located on the same side of the cover plate 1 and perpendicular to the cover plate 1, and is used to draw a vacuum into the vacuum heat exchange chamber. Optionally, the gas nozzle 12 can also be equipped with a liquid injection function. During normal use, the gas nozzle 12 is hidden inside the radiator housing 4.

[0055] This application also provides a heat dissipation device, which further includes:

[0056] The housing 4 is disposed outside the high-efficiency liquid cooling heat dissipation unit and has a liquid inlet and a liquid outlet. The liquid inlet is connected to the water cooling channel and the liquid outlet is connected to the water outlet channel.

[0057] At least one pair of liquid inlet connector 5 and liquid outlet connector 6 are provided, respectively corresponding to the liquid inlet and liquid outlet of the housing 4;

[0058] The power mechanism is used to guide the water flow to form a water-cooled circulation inside the heat dissipation device;

[0059] The heat spreader 2 is disposed at the bottom of the housing 4 and is used to contact the heat source 7.

[0060] This heat dissipation device can work with a high-performance liquid cooling unit to complete a closed-loop liquid cooling cycle. It can be integrated into the heat dissipation system of high-performance GPUs, CPUs, 5G base stations and other devices. By optimizing heat conduction and liquid cooling paths, it significantly improves heat dissipation efficiency and reliability, and is suitable for high heat flux density scenarios.

[0061] The above provides a detailed description of a high-efficiency liquid-cooled heat dissipation unit and heat dissipation device provided in this application. Specific examples have been used to illustrate the principle and implementation of this utility model. The description of the above embodiments is only for the purpose of helping to understand the core idea of ​​this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea and method of this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A high-performance liquid cooling heat dissipation unit, characterized in that, include: The cover plate is equipped with an array of water-cooled fins arranged in the same direction, and the adjacent water-cooled fins form a heat dissipation channel to connect the water-cooling channels on both sides. A heat spreader has a recessed area in its middle that is adapted to the shape of a cover plate and the bottom of the recessed area is in contact with a heat source. The heat spreader is sealed to the cover plate and forms a vacuum heat exchange chamber in the recessed area. The vacuum heat exchange chamber is filled with phase change liquid and has support columns arranged in a lattice. A water-cooling channel is arranged around the water-cooling fin assembly and is connected to an external coolant supply system; A flow guide plate is installed above the water-cooled fin assembly, and the flow guide plate has flow guide holes in the middle of the water-cooled fin assembly. And a water outlet channel, which is provided above the water-cooled fin assembly and connected to the water-cooled channel through the water-cooled fin assembly. Water flows from the water-cooled channels on both sides into the heat dissipation channel of the water-cooled fin assembly and flows out through the guide hole and the water outlet channel.

2. The high performance liquid cooling heat sink unit of claim 1, wherein, The main extension direction of the flow guide hole is perpendicular to the direction of the water-cooled fins.

3. The high performance liquid cooling heat sink unit of claim 1, wherein, The support column and the heat spreader are integrally formed and both are made of thermally conductive metal.

4. The high performance liquid cooling heat sink unit of claim 3, wherein, The support column is a solid copper column or a hollow copper column, with the hollow part filled with a phase change liquid.

5. The high performance liquid cooling heat sink unit of claim 1, wherein, The support columns are arranged in a uniform or non-uniform lattice within the vacuum heat exchange chamber, with the density decreasing from the center to the edge of the sinking area.

6. The high performance liquid cooling heat sink unit of claim 1, wherein, The heat spreader also includes a fixing part, which is integrally formed outside the sinking area. A cover plate is embedded in the sinking area of ​​the heat spreader and has a height difference relative to the fixing part, which is used to form a water collection trough for concentrating water flow between the fixing part and the water-cooled fin assembly.

7. The high performance liquid cooling heat sink unit of claim 1, wherein, The heat spreader is provided with a raised edge that extends along the sunken area, and the cover plate is placed on the raised edge with its bottom in contact with the support column.

8. The high performance liquid cooling heat sink unit of claim 1, wherein, The phase change liquid filled in the vacuum heat exchange chamber is water.

9. The high performance liquid cooling heat sink unit of claim 1, wherein, The cover plate is fixedly mounted with an air nozzle on the same side as the water-cooled fins for drawing a vacuum into the vacuum heat exchange chamber; the heat spreader is welded to the cover plate or connected by a detachable snap-fit ​​structure.

10. A heat dissipating device characterized by comprising: Also includes: The housing is disposed outside the high-efficiency liquid cooling heat dissipation unit as described in any one of claims 1-9, and has a liquid inlet and a liquid outlet, wherein the liquid inlet is connected to the water cooling channel and the liquid outlet is connected to the water outlet channel; At least one pair of liquid inlet connectors and liquid outlet connectors are provided, corresponding to the liquid inlet and liquid outlet of the housing, respectively; The power mechanism is used to guide the water flow to form a water-cooled circulation inside the heat dissipation device; The heat spreader is located at the bottom of the housing and is used to contact the heat source.

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