Fixing piece and power equipment
By setting spring-loaded fasteners on both sides of the substrate, the problem of low assembly efficiency of electronic component fasteners in non-standard equipment is solved, achieving stable clamping of multiple electronic components and saving space, while improving heat dissipation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN SICARRIER IND MACHINES CO LTD
- Filing Date
- 2025-03-26
- Publication Date
- 2026-04-21
AI Technical Summary
In non-standard equipment, the assembly efficiency of fixing components for electronic components is poor, especially in a limited space where it is difficult to efficiently fix multiple electronic components.
The substrate is equipped with first and second spring contacts on both sides. The electronic components are pressed against the base plate by the first and second spring contacts, thereby fixing multiple electronic components. The connection between the substrate and the base plate is achieved through the spring contact structure design, which enhances the spring contact's rebound ability and stability, and optimizes space utilization.
It improves the assembly efficiency of the fasteners, saves internal space, ensures stable clamping and uniform heat dissipation of electronic components, and avoids component damage caused by concentrated pressure.
Smart Images
Figure CN224154498U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of power equipment technology, specifically to a fastener and power equipment. Background Technology
[0002] In non-standard equipment, some electronic components (such as Metal-Oxide-Semiconductor Field-Effect Transistors, MOSFETs) are often soldered onto printed circuit boards (PCBs), such as power modules and power modules. In order to dissipate the heat of electronic components in a timely manner and ensure their normal operation, a heat dissipation base plate with a cooling function is often set up, and electronic components are pressed into the preset position of the heat dissipation base plate by fasteners to improve the heat dissipation effect of the corresponding electronic components. However, in the existing technology, pressing and fixing electronic components such as MOSFETs requires a lot of fasteners, and the space for fastener installation inside non-standard equipment is limited, resulting in poor assembly efficiency of fasteners. Utility Model Content
[0003] This application discloses a fastener and an electrical device to solve the problem of poor assembly efficiency of fasteners in confined spaces.
[0004] In a first aspect, this application provides a fastener for fixing electronic components. The fastener includes a substrate with opposing first and second sides. The first side of the substrate is provided with at least one first spring clip, and the second side of the substrate is provided with at least one second spring clip. The substrate can be fixed to the base plate of an electrical device. The first and second spring clips are used to press the electronic components located on both sides of the substrate against the base plate.
[0005] By providing a first spring and a second spring on opposite first and second sides of the substrate, and both the first and second springs can be used to press the electronic components, when the substrate is fixed to the base plate of the power equipment, the electronic components located on both sides of the substrate are pressed against the base plate under the action of the first and second springs. One fastener can press multiple electronic components on both sides, saving internal space and improving the assembly efficiency of the fastener while being able to fix multiple electronic components at the same time.
[0006] In one possible implementation, the first spring includes a first outer bending plate, which has a first predetermined angle with the substrate and extends in a direction away from the second side; the second spring includes a second outer bending plate, which has a second predetermined angle with the substrate and extends in a direction away from the first side. The first outer bending plate of the first spring and the substrate have an angle, and the second outer bending plate of the second spring also have an angle with the substrate, meaning that the first and second outer bending plates are inclined relative to the substrate. During the deformation process when the first and second outer bending plates contact the corresponding electronic components, they can absorb more energy, thereby enhancing the spring's resilience and stability, and improving the pressing effect on the electronic components.
[0007] In one possible implementation, the first spring sheet further includes a first connecting plate, one end of which is connected to a first side of the substrate, and the other end of which is connected to a first outer bending plate. A first arc-shaped bend is provided between the first connecting plate and the first outer bending plate. The second spring sheet further includes a second connecting plate, one end of which is connected to a second side of the substrate, and the other end of which is connected to a second outer bending plate. A second arc-shaped bend is provided between the second connecting plate and the second outer bending plate. By connecting the substrate and the first outer bending plate through the first connecting plate, and connecting the substrate and the second outer bending plate through the second connecting plate, and by providing both the first and second arc-shaped bends, it is easy for the first and second outer bending plates to achieve elastic deformation.
[0008] In one possible implementation, the end of the first outer bending plate opposite to the first connecting plate has a first plane, and the end of the second outer bending plate opposite to the second connecting plate has a second plane, with the first plane and the second plane being parallel. This allows for the uniform distribution of pressure across the surface of the electronic component, while reducing the pressure per unit area, thus preventing indentations, deformation, or even damage to the surface of the electronic component due to pressure concentration.
[0009] In one possible implementation, all the first spring contacts are sequentially arranged on the first side along the extension direction of the substrate, and all the second spring contacts are sequentially arranged on the second side along the extension direction of the substrate; adjacent first spring contacts and / or adjacent second spring contacts are connected by a connecting plate, and the connecting plate is connected to the substrate. The connecting plate can strengthen the strength between adjacent first spring contacts and the strength between adjacent second spring contacts, so as to improve the overall stability of the fastener.
[0010] In one possible implementation, the first and second springs are symmetrically arranged. When the first and second springs are symmetrical about the substrate, it is not necessary to distinguish between the first and second sides of the substrate, which facilitates the installation of the fastener.
[0011] In one possible implementation, the substrate has first mounting holes, which are sequentially arranged along the extension direction of the substrate. This facilitates fixing the substrate, thereby securing the fastener to the base plate of the power equipment.
[0012] In one possible implementation, all the first mounting holes are located in the middle of the line connecting the first and second sides of the substrate. This allows the substrate to distribute stress more evenly when subjected to external forces from the first or second side, thereby preventing substrate deformation or damage caused by excessive force on the first or second side.
[0013] In one possible implementation, the substrate is further provided with positioning holes for a positioning member to pass through, so as to position the substrate at a preset position on the base plate, thereby improving the mounting accuracy of the substrate.
[0014] In one possible implementation, the fastener is an integral unit. This improves the stability and integrity of the structure while simplifying installation and maintenance.
[0015] Secondly, this application provides an electrical device including any of the aforementioned fasteners. By incorporating these fasteners, the electrical device can save its internal space.
[0016] In one possible implementation, the system further includes a base plate and electronic components. The base plate has a groove containing a heat-conducting element. The electronic components are disposed on the side of the heat-conducting element facing away from the base plate. A fixing member is mounted on the base plate to press the electronic components located on both sides of the substrate to the base plate. The heat-conducting element on the base plate transfers heat from the electronic components to the base plate for heat dissipation, ensuring the normal operation of the electronic components. The fixing member further enhances the heat dissipation effect by pressing the electronic components to the base plate.
[0017] In one possible implementation, the power equipment is specifically a power supply box device, and the electronic component is specifically a MOSFET. By clamping the MOSFET with a fixing component, the heat dissipation effect of the MOSFET, which has characteristics such as small size, high power, and high heat generation, is ensured, thereby enabling its normal operation and ensuring the normal operation of the power supply box device containing the MOSFET. Attached Figure Description
[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0019] Figure 1This is a schematic diagram of the structure when the fastener is relatively short according to an embodiment of this application;
[0020] Figure 2 This is a schematic diagram of the structure of another fastener according to an embodiment of this application;
[0021] Figure 3 This is a schematic diagram of the structure of a longer fastener according to an embodiment of this application;
[0022] Figure 4 This is a structural diagram of the fastener used in the embodiments of this application;
[0023] Figure 5 This is an exploded view of the fastener used in the embodiments of this application.
[0024] Explanation of reference numerals in the attached figures:
[0025] 10-Electronic components;
[0026] 20-Fasteners;
[0027] 201 - Substrate; 202 - First spring contact; 203 - Second spring contact; 204 - Connecting plate;
[0028] 2011 - First mounting hole; 2012 - Positioning hole; 2021 - First connecting plate; 2022 - First outer bending plate; 2031 - Second connecting plate; 2032 - Second outer bending plate;
[0029] 30-Base plate;
[0030] 40 - Positioning component;
[0031] 50-Ceramic disc;
[0032] 60-Single board;
[0033] 70 - Connector. Detailed Implementation
[0034] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0035] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.
[0036] In non-standard equipment, electronic components are usually pressed into preset positions on the heat dissipation base plate by fasteners to improve the heat dissipation effect of the corresponding electronic components. However, in the existing technology, pressing and fixing electronic components such as MOSFETs requires a lot of fasteners, and the space for fastener installation inside non-standard equipment is limited, resulting in poor assembly efficiency of fasteners.
[0037] Based on this, this application provides a fastener 20 to solve the problem of poor assembly efficiency of the fastener 20 in a limited space.
[0038] In the description of this application, it should be understood that the terms "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the position or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations of this application.
[0039] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more” unless the context clearly indicates otherwise.
[0040] Figure 1 This is a schematic diagram of the structure when the fastener is relatively short according to an embodiment of this application; please refer to... Figure 1 In a first aspect, this application provides a fastener 20 for fixing electronic components 10. The fastener 20 includes a substrate 201, which has a first side and a second side. The first side of the substrate 201 is provided with at least one first spring piece 202, and the second side of the substrate 201 is provided with at least one second spring piece 203. The substrate 201 can be fixed to the base plate 30 of the power equipment. The first spring piece 202 and the second spring piece 203 are used to press the electronic components 10 located on both sides of the substrate 201 against the base plate 30.
[0041] By providing a first spring 202 and a second spring 203 on the first and second opposite sides of the substrate 201, and by using both the first spring 202 and the second spring 203 to press the electronic components 10, when the substrate 201 is fixed to the base plate 30 of the power equipment, the electronic components 10 located on both sides of the substrate 201 are pressed against the base plate 30 under the action of the first spring 202 and the second spring 203. One fastener 20 can press multiple electronic components 10 on both sides, thereby saving internal space and improving the assembly efficiency of the fastener 20 while being able to fix multiple electronic components 10 at the same time.
[0042] Figure 2 This is a schematic diagram of the structure of another fastener according to an embodiment of this application; Figure 3 This is a structural diagram of a longer fixing member according to an embodiment of this application; please continue reading. Figure 1 And see Figure 2 and Figure 3 The number of first spring contacts 202 and second spring contacts 203 can be set according to the number of electronic components 10 located on the first and second sides of the substrate 201. For example, when there are two electronic components 10 on both the first and second sides of the substrate 201, the fixing member 20 can be set to be shorter. The fixing member 20 includes two first spring contacts 202 corresponding to the two electronic components 10 on the first side and two second spring contacts 203 corresponding to the two electronic components 10 on the second side. When there are six electronic components 10 on both the first and second sides of the substrate 201, the fixing member 20 can be set to be longer. The fixing member 20 includes six first spring contacts 202 corresponding to the six electronic components 10 on the first side and six second spring contacts 203 corresponding to the six electronic components 10 on the second side.
[0043] When the number of electronic components 10 on the first and second sides of the substrate 201 is different, the number of first springs 202 and second springs 203 can be increased or decreased according to the relative number of electronic components 10, so as to ensure that the electronic components 10 are all pressed by the corresponding first springs 202 or second springs 203, and there are no empty first springs 202 and second springs 203, so as to further reduce the volume of the fastener 20 and save space.
[0044] In one possible implementation, the first spring 202 includes a first outer bending plate 2022, which has a first preset angle with the substrate 201 and extends in a direction away from the second side; the second spring 203 includes a second outer bending plate 2032, which has a second preset angle with the substrate 201 and extends in a direction away from the first side. The first outer bending plate 2022 of the first spring 202 has an angle with the substrate 201, and the second outer bending plate 2032 of the second spring 203 also has an angle with the substrate 201. That is, the first outer bending plate 2022 and the second outer bending plate 2032 are inclined relative to the substrate 201. During the deformation process of the first outer bending plate 2022 and the second outer bending plate 2032 in contact with the corresponding electronic component 10, they can absorb more energy, thereby enhancing the spring's resilience and stability, and improving the pressing effect on the electronic component 10.
[0045] The first preset angle and the second preset angle can be adjusted according to the required pressure on the electronic component 10. When the same fastener 20 is used to fix the same type of electronic component 10, the first preset angle and the second preset angle can be set to the same angle (e.g., both set to 45°). When the electronic components 10 on the first side and the second side of the substrate 201 are of different types, the specific angles of the first preset angle and the second preset angle can be set respectively. For example, the first preset angle can be set to 45° and the second preset angle can be set to 60° to ensure the pressing effect on the electronic component 10. When there are two or more types of electronic components 10 on the first side of the substrate 201, the first preset angle between each first outer bending plate 2022 and the substrate 201 can be adjusted according to the actual needs of each electronic component 10. Similarly, when there are two or more types of electronic components 10 on the second side of the substrate 201, the second preset angle between each second outer bending plate 2032 and the substrate 201 can be adjusted according to the actual needs of each electronic component 10.
[0046] In one possible implementation, the first spring piece 202 further includes a first connecting plate 2021, one end of which is connected to a first side of the substrate 201, and the other end is connected to a first outer bending plate 2022. A first arc-shaped bend is provided between the first connecting plate 2021 and the first outer bending plate 2022. The second spring piece 203 further includes a second connecting plate 2031, one end of which is connected to a second side of the substrate 201, and the other end is connected to a second outer bending plate 2032. A second arc-shaped bend is provided between the second connecting plate 2031 and the second outer bending plate 2032. The substrate 201 and the first outer bending plate 2022 are connected by the first connecting plate 2021, and the substrate 201 and the second outer bending plate 2032 are connected by the second connecting plate 2031. The presence of both the first and second arc-shaped bends facilitates elastic deformation of the first and second outer bending plates 2022.
[0047] The first connecting plate 2021 and the second connecting plate 2031 can extend to the top of the substrate 201 and protrude from the substrate 201, so that the tops of the first connecting plate 2021 and the second connecting plate 2031 are set relatively high. This facilitates the first outer bending plate 2022 connected to the end of the first connecting plate 2021 away from the substrate 201 to extend obliquely relative to the substrate 201. Similarly, this facilitates the second outer bending plate 2032 connected to the end of the second connecting plate 2031 away from the substrate 201 to extend obliquely relative to the substrate 201. The end of the first outer bending plate 2022 away from the first connecting plate 2021 contacts the electronic component 10 located on the first side of the substrate 201, and the end of the second outer bending plate 2032 away from the second connecting plate 2031 contacts the electronic component 10 located on the second side of the substrate 201. The system achieves the pressing of the electronic component 10. Through the first arc-shaped bending setting, the first outer bending plate 2022 can more easily change its bending angle relative to the first connecting plate 2021 when it undergoes small deformation during the pressing of the electronic component 10. Similarly, through the second arc-shaped bending setting, the second outer bending plate 2032 can more easily change its bending angle relative to the second connecting plate 2031 when it undergoes small deformation during the pressing of the electronic component 10. This improves the flexibility and adaptability of the first spring 202 and the second spring 203. Simultaneously, the change in bending angle disperses pressure to avoid excessive pressure concentration on the electronic component 10, effectively protecting its integrity and function.
[0048] The height of the first outer bending plate 2022 away from the first connecting plate 2021 relative to the substrate 201, and the height of the second outer bending plate 2032 away from the second connecting plate 2031 relative to the substrate 201, can be adjusted according to actual needs, which will not be elaborated here.
[0049] In one possible implementation, the first outer bending plate 2022 has a first plane at the end opposite to the first connecting plate 2021, and the second outer bending plate 2032 has a second plane at the end opposite to the second connecting plate 2031. The first and second planes are parallel, which can evenly distribute the pressure to the surface of the electronic component 10, while reducing the pressure per unit area and avoiding indentations, deformation, or even damage to the surface of the electronic component 10 due to pressure concentration. Furthermore, the edges of the first and second planes are designed with arcs to create clearance space when the first and second outer bending plates 2022 and 2032 contact the electronic component 10, preventing scratches on the surface of the electronic component 10. The first and second planes can be designed to be parallel to the substrate 201, so that when the substrate 201 is attached to the base plate 30, the first and second planes are parallel to the base plate 30, facilitating attachment to the upper surface of the electronic component 10.
[0050] In one possible implementation, all first spring pieces 202 are sequentially arranged on a first side along the extension direction of the substrate 201, and all second spring pieces 203 are sequentially arranged on a second side along the extension direction of the substrate 201. Adjacent first spring pieces 202 and / or adjacent second spring pieces 203 are connected by connecting plates 204, and the connecting plates 204 are connected to the substrate 201. Specifically, the connecting plates 204 are located between adjacent first connecting plates 2021 and between adjacent second connecting plates 2031, strengthening the strength between the first connecting plates 2021 or the second connecting plates 2031. This allows the connecting plates 204 to strengthen the strength between adjacent first spring pieces 202 and adjacent second spring pieces 203, resulting in higher overall stability of the fastener 20.
[0051] In one possible implementation, the first spring 202 and the second spring 203 are symmetrically arranged. When the first spring 202 and the second spring 203 are symmetrical about the substrate 201, when the fixing member 20 rotates horizontally by 180°, the positions of the first spring 202 and the second spring 203 are interchanged. If the same type of electronic component 10 is to be fixed, there is no need to distinguish between the first side and the second side of the substrate 201, which facilitates the installation of the fixing member 20. Alternatively, the first spring 202 and the second spring 203 can be arranged to be staggered along the extension direction of the substrate 201 according to the specific position of the electronic component 10, as long as it can achieve the pressing of the corresponding electronic component 10, which will not be elaborated here.
[0052] In one possible implementation, the substrate 201 is provided with first mounting holes 2011, which are sequentially arranged along the extending direction of the substrate 201. Connectors 70 (which may be locking screws) are provided on the first mounting holes 2011 to facilitate the fixing of the substrate 201, thereby fixing the fastener 20 to the base plate 30 of the power equipment. Using the fastener 20 provided in this embodiment, first spring pieces 202 and second spring pieces 203 are respectively provided on the first and second opposing sides of the substrate 201, and both the first spring pieces 202 and the second spring pieces 203 can be used to press the electronic components 10. One fastener 20 can press multiple electronic components 10 on both sides, reducing the number of fasteners 20 and connectors 70, further saving internal space. All the first mounting holes 2011 are located in the middle of the substrate 201 along the line connecting the first and second sides. This allows the substrate 201 to distribute stress more evenly when subjected to external forces from the first or second side, thereby preventing the substrate 201 from deforming or being damaged due to excessive force on the first or second side.
[0053] To improve the mounting accuracy of the substrate 201, the substrate 201 is also provided with positioning holes 2012. Positioning holes 2012 are used for the positioning member 40 to pass through, thereby positioning the substrate 201 to a preset position on the base plate 30. When the substrate 201 is relatively short (e.g., the fixing member 20 includes two first spring pieces 202 and two second spring pieces 203), one positioning hole 2012 is sufficient for positioning the substrate 201. When the substrate 201 is relatively long (e.g., the fixing member 20 includes six first spring pieces 202 and six second spring pieces 203), multiple positioning holes 2012 can be provided for positioning the substrate 201. Among the multiple positioning holes 2012, a round hole and multiple oblong holes can be used. Specifically, the round hole restricts the lateral movement of the substrate 201, and the oblong holes restrict the rotation of the substrate 201. The positioning member 40 at the oblong holes is easy to pass through and fix, facilitating the positioning of the substrate 201. Furthermore, the fixing member 20 is an integral piece. It can improve the stability and integrity of the structure, while simplifying the installation and maintenance process.
[0054] Secondly, this application provides an electrical device including the aforementioned fastener 20. By incorporating the fastener 20, the electrical device can save its internal space while also possessing all the beneficial effects of the fastener 20.
[0055] Figure 4 This is a structural diagram of the fastener used in the embodiments of this application; Figure 5 This is an exploded view of the fastener used in the embodiments of this application; please refer to... Figure 4 and Figure 5 In one possible implementation, the power equipment further includes a base plate 30 and electronic components 10. The base plate 30 has a groove containing a heat-conducting element. The electronic components 10 are disposed on the side of the heat-conducting element facing away from the base plate 30. A fixing member 20 is mounted on the base plate 30 to press the electronic components 10 located on both sides of the substrate 201 to the base plate 30. The heat-conducting element on the base plate 30 transfers heat from the electronic components 10 to the base plate 30 for heat dissipation, thereby ensuring the normal operation of the electronic components 10. The fixing member 20 further enhances the heat dissipation effect of the electronic components 10 by pressing them to the base plate 30.
[0056] In one possible implementation, the power equipment is specifically a power supply box device, that is, a power supply box product (such as an RF power supply), and the electronic component 10 is specifically a MOSFET. By pressing the MOSFET with the fixing member 20, the heat dissipation effect of the MOSFET, which has the characteristics of small size, high power, and high heat generation, is ensured, thereby enabling its normal operation and ensuring the normal operation of the power supply box device with the MOSFET. The positions of multiple MOSFETs are relatively fixed by the single board 60. Then, thermal conductive gel is evenly brushed into the groove of the base plate 30 (heat sink), and the heat conduction component (a ceramic sheet 50 can be used) is placed in the groove. The positioning component 40 (a positioning pin can be used) is fastened to the pin hole of the base plate 30. Then, the MOSFET and the single board 60 integrated with it are placed so that the MOSFET is in contact with the heat conduction component. After the fixing component 20 is placed in the corresponding position, the first spring 202 and the second spring 203 can contact the side of the corresponding MOSFET away from the heat conduction component. The fixing component 20 is fixed by the locking screw so that the first spring 202 and the second spring 203 press the MOSFET.
[0057] It should be noted that in this specification, relational terms such as first and second are used only to distinguish one entity from several other entities, and do not necessarily require or imply any such actual relationship or order between these entities.
[0058] The above-described preferred embodiments have further detailed the purpose, technical solutions, and advantages of this application. It should be understood that the above description is only a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A fastener for fixing electronic components, characterized in that, The fastener includes a substrate having a first side and a second side opposite to each other. The first side of the substrate is provided with at least one first spring tab, and the second side of the substrate is provided with at least one second spring tab. The substrate can be fixed to the base plate of the power equipment. The first spring tab and the second spring tab are used to press the electronic components located on both sides of the substrate against the base plate.
2. The fastener according to claim 1, characterized in that, The first spring sheet includes a first outer bending plate, and the first outer bending plate has a first preset angle with the substrate and extends in a direction away from the second side; The second spring includes a second outer bending plate, which has a second preset angle with the substrate and extends in a direction away from the first side.
3. The fastener according to claim 2, characterized in that, The first spring sheet further includes a first connecting plate, one end of which is connected to the first side of the substrate, and the other end is connected to the first outer bending plate. A first arc-shaped bend is provided between the first connecting plate and the first outer bending plate. The second spring sheet also includes a second connecting plate, one end of which is connected to the second side of the substrate and the other end is connected to the second outer bending plate. A second arc-shaped bend is provided between the second connecting plate and the second outer bending plate.
4. The fastener according to claim 3, characterized in that, The first outer bending plate has a first plane at the end opposite to the first connecting plate, and the second outer bending plate has a second plane at the end opposite to the second connecting plate. The first plane and the second plane are parallel.
5. The fastener according to claim 1, characterized in that, All the first spring sheets are sequentially arranged on the first side along the extension direction of the substrate, and all the second spring sheets are sequentially arranged on the second side along the extension direction of the substrate; Two adjacent first spring pieces and / or two adjacent second spring pieces are connected by a connecting plate, and the connecting plate is connected to the substrate.
6. The fastener according to claim 1, characterized in that, The first and second springs are arranged symmetrically.
7. The fastener according to claim 1, characterized in that, The substrate is provided with a first mounting hole, which is arranged sequentially along the extension direction of the substrate.
8. The fastener according to claim 7, characterized in that, All of the first mounting holes are located in the middle of the substrate in the direction of the line connecting the first side and the second side.
9. The fastener according to claim 1, characterized in that, The substrate is also provided with positioning holes for a positioning component to pass through, so as to position the substrate at a preset position on the base plate.
10. The fastener according to any one of claims 1-9, characterized in that, The fastener is a single, integrated component.
11. An electrical power device, characterized by Includes the fastener as described in any one of claims 1-10 above.
12. The power device of claim 11, wherein, The application further comprises a bottom plate and the electronic components, the bottom plate is provided with a recess, the recess is provided with a heat conducting element, the electronic components are arranged on the side of the heat conducting element away from the bottom plate, and the fixing element is arranged on the bottom plate and used for pressing the electronic components on both sides of the substrate to the bottom plate.
13. The power device of claim 11, wherein, The power equipment is specifically a power BOX equipment, and the electronic components are specifically MOS tubes.