Multi-RGB integrated high-voltage chip
By integrating multiple RGB diode units on the transparent display chip substrate and adopting a series connection structure of the same color, the problems of low brightness and easy damage of lamp beads in large transparent LED displays are solved, achieving a transparent display effect with high brightness and low failure rate.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN SHENGJIE INTELLIGENT DISPLAY TECHNOLOGY CO LTD
- Filing Date
- 2024-12-23
- Publication Date
- 2026-04-21
AI Technical Summary
Large transparent LED displays face significant challenges in achieving precise voltage control due to their large size, leading to reduced brightness. Furthermore, existing driving methods are prone to damaging LED chips, impacting the visual effect.
Multiple RGB diode units are integrated on the chip substrate, with more R diodes than G and B diodes. They adopt a series connection structure of the same color, three-wire input and single-wire output, to achieve low current light emission with high voltage power supply, avoid voltage drop and improve brightness.
It achieves a high-brightness transparent display effect, reduces the failure rate of LED beads, extends service life, and is energy-saving and environmentally friendly.
Smart Images
Figure CN224154582U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a multi-RGB integrated high-voltage chip, and relates to the field of display device technology. Background Technology
[0002] Large LED displays are usually assembled from multiple screens, and then driven by driver ICs to drive the LED beads that are already packaged in the screens. Conventional large screens mostly use monochrome LED beads, that is, one to three LED beads form a pixel for full-color display. This type of display has a large overall weight, more complex driving, higher power consumption, and lower screen brightness.
[0003] Transparent displays are a type of large LED display. By using transparent chip substrates and transparent conductive lines, they can achieve a transparent display effect. However, since existing transparent displays are all full-color displays using RGB three-color LEDs, and the materials of different colored LEDs are different, resulting in different voltage drops, although the power supply voltage can be controlled to some extent through the driving circuit, the larger the screen size, the higher the control requirements and the more difficult it is to control the voltage precisely. Therefore, many transparent displays use a lower voltage driving scheme to prevent damage to the LEDs. As a result, the screen brightness is reduced, affecting the visual effect. Utility Model Content
[0004] The purpose of this invention is to address the defects or deficiencies in the existing technology by providing a multi-RGB integrated high-voltage chip. This chip connects multiple R, G, and B diode units in series with the same color, with more R diodes than G and B diodes. It integrates multiple RGB diode units onto a single light-emitting chip, features three-wire input and single-wire output, and achieves high-voltage power supply and low-current light emission without voltage drop, thus preventing damage to the LEDs. Furthermore, the integration of multiple light-emitting units results in higher overall brightness.
[0005] To achieve the above objectives, the present invention adopts the following technical solution: it includes a chip substrate 1, on the front side of which a first light-emitting component 2, a second light-emitting component 3, and a third light-emitting component 4 are disposed. The first light-emitting component 2, the second light-emitting component 3, and the third light-emitting component 4 are connected in parallel. The first light-emitting component 2 is a string of red light-emitting diodes, the second light-emitting component 3 is a string of green light-emitting diodes, and the third light-emitting component 4 is a string of blue light-emitting diodes.
[0006] Furthermore, the first light-emitting component 2 includes five red light-emitting diodes, the second light-emitting component 3 includes four green light-emitting diodes, and the third light-emitting component 4 includes four blue light-emitting diodes. The first light-emitting component 2 is arranged between the second light-emitting component 3 and the third light-emitting component 4. The five red light-emitting diodes are arranged vertically in parallel and connected end to end in series, while the green and blue light-emitting diodes are arranged horizontally and connected end to end in series.
[0007] Furthermore, a pad 6 on the R-tube is provided at one corner of the front side of the chip substrate 1, and the pad 6 on the R-tube is electrically connected to the first light-emitting component 2.
[0008] Furthermore, the chip substrate 1 has G-tube pads 7 and B-tube pads 8 at two opposite corners on the front side, and the G-tube pads 7 and B-tube pads 8 are electrically connected to the second light-emitting component 3 and the third light-emitting component 4, respectively.
[0009] Furthermore, electrode pads 5 are provided diagonally on the front side of the chip substrate 1 and the pads 6 on the R tube, and the electrode pads 5 are electrically connected to the first light-emitting component 2, the second light-emitting component 3, and the third light-emitting component 4.
[0010] Furthermore, the back side of the chip substrate 1 is provided with electrode lower pad 10, R-tube lower pad 11, G-tube lower pad 12, and B-tube lower pad 13, which are respectively connected to electrode upper pad 5, R-tube upper pad 6, G-tube upper pad 7, and B-tube upper pad 8.
[0011] Furthermore, a top adhesive layer 9 is provided on the upper layer of the chip substrate 1, which covers the entire chip substrate 1 and covers the first light-emitting component 2, the second light-emitting component 3, and the third light-emitting component 4.
[0012] Furthermore, the electrode lower pad 10 is a current output terminal connected to the switch on / off drive circuit.
[0013] Furthermore, the electrode lower pad 10, R-tube lower pad 11, G-tube lower pad 12, and B-tube lower pad 13 are connected to the output terminal of the drive circuit.
[0014] The working principle of this utility model is as follows: Multiple RGB light-emitting diodes are integrated on the chip substrate 1. The number of R-tubes is greater than that of G-tubes and B-tubes. The R-tubes are placed as the first light-emitting component 2 between the G-tubes and B-tubes. Since it is used on a large transparent screen, increasing the number of R-tubes can improve the red light brightness, making the display effect more warm and the display effect more obvious. Since 13 RGB tubes are set on one chip substrate for display, and since they are in series, the current is constant while ensuring that the driving diodes emit light normally. The number of diodes is greater than that of traditional single beads, and the overall brightness is much higher than that of a single bead or a simple three-color RGB lamp bead. Therefore, the voltage of the entire circuit is higher than that of a traditional single bead, but the operating conditions of each diode remain unchanged and the current is constant. Compared with the traditional method of increasing the voltage and current of a single bead to increase brightness, a better effect can be obtained with low current. This prevents voltage drop during conduction and light emission, thereby reducing the failure rate of RGB tubes and extending their service life.
[0015] After adopting the above technical solution, the beneficial effects of this utility model are as follows: multiple R, G, and B diode units are connected in series with the same color, and the number of R diodes is greater than that of G and B diodes. Multiple RGB diode units are integrated on a single light-emitting chip with three-wire input and single-wire output, which realizes high-voltage power supply and low-current light emission without voltage drop, thus preventing damage to the LED beads. Moreover, multiple light-emitting units are integrated into one, resulting in higher overall brightness. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0017] Figure 1 This is a schematic diagram of the structure of this utility model;
[0018] Figure 2 yes Figure 1 The second angle view;
[0019] Figure 3 yes Figure 1 The third-angle view;
[0020] Figure 4 yes Figure 1 A bottom view;
[0021] Figure 5 yes Figure 1 The left view;
[0022] Figure 6 This is the circuit schematic diagram of this utility model.
[0023] Explanation of reference numerals in the attached figures: 1. Chip substrate; 2. First light-emitting component; 3. Second light-emitting component; 4. Third light-emitting component; 5. Upper electrode pad; 6. Upper R-tube pad; 7. Upper G-tube pad; 8. Upper B-tube pad; 9. Top adhesive layer; 10. Lower electrode pad; 11. Lower R-tube pad; 12. Lower G-tube pad; 13. Lower B-tube pad. Detailed Implementation
[0024] See Figures 1-6 As shown, the technical solution adopted in this specific embodiment is as follows: It includes a chip substrate 1, on the front side of which a first light-emitting component 2, a second light-emitting component 3, and a third light-emitting component 4 are disposed. The first light-emitting component 2, the second light-emitting component 3, and the third light-emitting component 4 are connected in parallel. The first light-emitting component 2 is a string of red light-emitting diodes, the second light-emitting component 3 is a string of green light-emitting diodes, and the third light-emitting component 4 is a string of blue light-emitting diodes. In this embodiment, three sets of RGB light-emitting diodes are disposed on the chip substrate to form an integrated chip. The three sets of RGB light-emitting diodes are respectively the first light-emitting component, the second light-emitting component, and the third light-emitting component. One end of the three sets of light-emitting components is connected in parallel with a common line, and the other end is connected to the driving circuit. By integrating RGB light-emitting diode strings on one chip substrate, each RGB light-emitting diode is a pixel, and multiple pixels are integrated on one chip substrate. According to the overall display screen... The specific requirements and specifications are such that a single chip substrate can also serve as a pixel, making it suitable for use in giant screens. By concentrating the light emission of multiple RGB tubes, the overall brightness is higher. At the same time, when the driving circuit powers and drives a single integrated chip, since multiple LEDs are connected in series, the overall voltage of the single integrated chip is higher, but the voltage of a single LED remains at its rated voltage. Meanwhile, the operating current is constant. The brightness of multiple LEDs being driven simultaneously is far higher than that of traditional monochrome LEDs or RGB three-in-one LED structures. To increase the brightness of traditional LEDs, it is necessary to increase the individual voltage or current, which will result in a voltage drop. However, the structure of multiple LEDs connected in series in this application not only has a brightness far higher than that of traditional LEDs, but also reduces the current and voltage as needed to achieve the same effect as traditional LEDs, which is more energy-efficient and eliminates the voltage drop issue. This achieves high-voltage, low-current operation, effectively improving the brightness of a single chip and extending the lifespan of the components.
[0025] In addition, the chip driving is controlled by the main controller. After each chip is installed, it is uniformly controlled by the main control circuit. In one embodiment, a display screen composed of a 24x160 chip matrix is used, where 12x160 are grouped together and controlled by a group of main control circuits. The main control circuit includes a voltage regulator circuit, a driving circuit, and a power supply circuit. The power supply circuit supplies power to the voltage regulator circuit, the driving circuit, and the chip matrix. The voltage regulator circuit ensures that the voltage is stably output to the driving circuit and the chip matrix. The signal input terminal outputs the signal to the driving circuit and then to the chip matrix, thereby controlling the RGB tube string to emit corresponding color light. The driving circuit can accurately control each chip. Therefore, the integrated chips used in the implementation can better adapt to transparent display screens of various sizes and specifications. At the same time, each chip has a simple structure and low cost, which is conducive to the promotion and use of large transparent screens.
[0026] More specifically, the first light-emitting component 2 includes five red light-emitting diodes, the second light-emitting component 3 includes four green light-emitting diodes, and the third light-emitting component 4 includes four blue light-emitting diodes. The first light-emitting component 2 is arranged between the second light-emitting component 3 and the third light-emitting component 4. The five red light-emitting diodes are arranged vertically in parallel and connected end to end in series. The green and blue light-emitting diodes are arranged horizontally and connected end to end in series. In this embodiment, the R, G, and B diode strings are all connected in series. Specifically, the R diodes are connected in series vertically, with five R diodes in one string and four G and B diodes in one string. At the same time, the R diode strings are set between the G and B diodes as the main lamp structure. More specifically, the R diodes are set between the connection gaps of the G and B diodes and at the beginning and end positions, so that from a visual angle, there is an R diode on each side of each G and B diode. When working, two R diodes can work with one G and B diode to emit light, which can enhance the red light effect. When displayed on a transparent screen, it is not easily affected by the background light, resulting in a better display effect and also increasing the brightness of the single chip to a certain extent.
[0027] More specifically, the chip substrate 1 has an R-tube pad 6 at one corner of its front side, which is electrically connected to the first light-emitting component 2. The chip substrate 1 also has G-tube pads 7 and B-tube pads 8 at two opposite corners of its front side, which are electrically connected to the second light-emitting component 3 and the third light-emitting component 4, respectively. Furthermore, electrode pads 5 are located diagonally opposite the R-tube pad 6 on the front side of the chip substrate 1, and are electrically connected to the first light-emitting component 2, the second light-emitting component 3, and the third light-emitting component 4. By setting these pads on the front side of the chip substrate, electrical connections are made to each circuit. Simultaneously, the three sets of RGB transistor strings converge on the electrode pads, achieving a three-input, one-output configuration, making component packaging more convenient.
[0028] More specifically, the back of the chip substrate 1 is provided with electrode lower pad 10, R-tube lower pad 11, G-tube lower pad 12, and B-tube lower pad 13, which are respectively connected to electrode upper pad 5, R-tube upper pad 6, G-tube upper pad 7, and B-tube upper pad 8.
[0029] More specifically, the chip substrate 1 is provided with a top adhesive layer 9, which covers the entire chip substrate 1 and covers the first light-emitting component 2, the second light-emitting component 3, and the third light-emitting component 4. The top adhesive layer covers and encapsulates the entire chip substrate, providing good waterproofing.
[0030] More specifically, the electrode pad 10 is a current output terminal connected to the switch on / off driving circuit, and the output terminal of the integrated chip is connected to the switch on / off driving circuit. Moreover, one switch on / off driving circuit can be connected to two integrated chips to control their on / off states, making the display control of the screen more precise.
[0031] More specifically, the electrode pad 10, R-tube pad 11, G-tube pad 12, and B-tube pad 13 are connected to the output of the drive circuit. The drive circuit can drive and control multiple integrated chips and can be combined and used according to the actual screen specifications to better match the usage scenario.
[0032] The working principle of this utility model is as follows: Multiple RGB light-emitting diodes are integrated on the chip substrate 1. The number of R-tubes is greater than that of G-tubes and B-tubes. The R-tubes are placed as the first light-emitting component 2 between the G-tubes and B-tubes. Since it is used on a large transparent screen, increasing the number of R-tubes can improve the red light brightness, making the display effect more warm and the display effect more obvious. Since 13 RGB tubes are set on one chip substrate for display, and since they are in series, the current is constant while ensuring that the driving diodes emit light normally. The number of diodes is greater than that of traditional single beads, and the overall brightness is much higher than that of a single bead or a simple three-color RGB lamp bead. Therefore, the voltage of the entire circuit is higher than that of a traditional single bead, but the operating conditions of each diode remain unchanged and the current is constant. Compared with the traditional method of increasing the voltage and current of a single bead to increase brightness, a better effect can be obtained with low current. This prevents voltage drop during conduction and light emission, thereby reducing the failure rate of RGB tubes and extending their service life.
[0033] The above description is only used to illustrate the technical solution of this utility model and is not intended to limit it. Any other modifications or equivalent substitutions made by those skilled in the art to the technical solution of this utility model, as long as they do not depart from the spirit and scope of the technical solution of this utility model, should be covered within the scope of the claims of this utility model.
Claims
1. A multi-RGB integrated high voltage chip, characterized by: It includes a chip substrate (1), on the front side of which are arranged a first light-emitting component (2), a second light-emitting component (3), and a third light-emitting component (4). The first light-emitting component (2), the second light-emitting component (3), and the third light-emitting component (4) are connected in parallel. The first light-emitting component (2) is a string of red light-emitting diodes, the second light-emitting component (3) is a string of green light-emitting diodes, and the third light-emitting component (4) is a string of blue light-emitting diodes. The first light-emitting component (2) includes five red light-emitting diodes, the second light-emitting component (3) includes four green light-emitting diodes, and the third light-emitting component (4) includes four blue light-emitting diodes. The first light-emitting component (2) is arranged between the second light-emitting component (3) and the third light-emitting component (4). The five red light-emitting diodes are arranged vertically in parallel and connected end to end in series. The green light-emitting diodes and blue light-emitting diodes are arranged horizontally and connected end to end in series. The chip substrate (1) has an electrode pad (5) at the diagonal position of the front side and the pad (6) on the R tube. The electrode pad (5) is electrically connected to the first light-emitting component (2), the second light-emitting component (3), and the third light-emitting component (4). The back of the chip substrate (1) is provided with electrode lower pad (10), R-tube lower pad (11), G-tube lower pad (12), and B-tube lower pad (13). The electrode lower pad (10), R-tube lower pad (11), G-tube lower pad (12), and B-tube lower pad (13) are respectively connected to electrode upper pad (5), R-tube upper pad (6), G-tube upper pad (7), and B-tube upper pad (8).
2. The multi-RGB integrated high voltage chip of claim 1, wherein: The chip substrate (1) has an R-tube pad (6) on one corner of its front side, and the R-tube pad (6) is electrically connected to the first light-emitting component (2).
3. The multi-RGB integrated high voltage chip of claim 1, wherein: The chip substrate (1) has two opposite corners on the front side with G-tube pads (7) and B-tube pads (8), which are electrically connected to the second light-emitting component (3) and the third light-emitting component (4), respectively.
4. The multi-RGB integrated high voltage chip of claim 1, wherein: The chip substrate (1) is provided with a top adhesive layer (9), which covers the entire chip substrate (1) and covers the first light-emitting component (2), the second light-emitting component (3), and the third light-emitting component (4).
5. The multi-RGB integrated high voltage chip of claim 1, wherein: The electrode pad (10) is a current output terminal connected to the switch on / off drive circuit.
6. The multi-RGB integrated high voltage chip of claim 1, wherein: The electrode pad (10), R-tube pad (11), G-tube pad (12), and B-tube pad (13) are connected to the output terminal of the drive circuit.