Double-sided liquid cooling radiator of high-power IGBT module

Abstract

The utility model relates to the technical field of IGBT (Insulated Gate Bipolar Translator) modules, in particular to a double-sided liquid cooling radiator of a high-power IGBT module, which comprises a shell, the shell is of a T-shaped structure, a plurality of slots distributed at equal intervals are arranged on two side walls of the shell, the IGBT modules are detachably arranged in the slots through fixing pieces, and the IGBT modules are connected with the shell through the fixing pieces. A plurality of heat exchange cavities corresponding to the positions of the IGBT modules are formed in the shell, the heat exchange cavities are communicated with one another through communication grooves, the two sides of the shell are connected with a water inlet pipe and a communication pipe which are communicated with the heat exchange cavities respectively, and two symmetrically-arranged heat dissipation cavities are formed in the bottom of the shell; according to the double-sided liquid cooling radiator of the high-power IGBT module, the shell is of the T-shaped structure, the IGBT modules are vertically installed on the two sides of the shell, and meanwhile, the heat exchange cavity in the shell can provide the liquid cooling heat dissipation effect for the IGBT modules on the two sides at the same time, so that the size of the whole radiator can be reduced, and the internal installation space of equipment is saved.

Description

Technical Field

[0001] This utility model relates to the field of IGBT module technology, specifically to a double-sided liquid-cooled heat sink for a high-power IGBT module. Background Technology

[0002] As IGBT modules evolve towards higher power and higher integration, their heat flux density continues to increase. During operation, IGBT modules generate significant heat due to conduction and switching losses. If this heat cannot be dissipated promptly, the IGBT module temperature will rise rapidly, severely impacting its performance, safety, and reliability. Therefore, heat sinks are typically installed at the bottom of the IGBT module to achieve forced cooling. However, existing IGBT modules are generally planar mounted. When dealing with the cooling needs of multiple IGBT modules, larger heat sinks are required, leading to insufficient internal space within the equipment. Utility Model Content

[0003] To address the shortcomings of existing technologies, this utility model provides a double-sided liquid-cooled heat sink for high-power IGBT modules, solving the technical problem of large heat sink size when dealing with the heat dissipation needs of multiple IGBT modules.

[0004] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a double-sided liquid-cooled heat sink for a high-power IGBT module, including a shell, the shell having a "T"-shaped structure, multiple equally spaced slots on both sides of the shell, an IGBT module being detachably installed in the slots by fasteners, multiple heat exchange chambers corresponding to the positions of the IGBT modules being opened inside the shell, and the multiple heat exchange chambers being interconnected by connecting slots, water inlet pipes and connecting pipes communicating with the heat exchange chambers being connected to both sides of the shell respectively, two symmetrically arranged heat dissipation chambers being opened at the bottom of the shell, branch pipes communicating with the two heat dissipation chambers being connected to both sides of the shell, and the two branch pipes being connected to the connecting pipe and the water outlet pipe respectively by tee connectors;

[0005] The fastener includes a plug plate and a fixing plate. The plug plate is inserted into the slot and connected to the connecting block fixed to the IGBT module by screws. The fixing plate is connected to the top of the housing by screws.

[0006] Preferably, the outer shell is composed of two L-shaped plates, and the two L-shaped plates are fixed together by multiple bolts.

[0007] Preferably, the inner wall of the heat exchange cavity is provided with a plurality of protrusions arranged in an array.

[0008] Preferably, a sealing ring is fitted on the end of the water inlet pipe and the connecting pipe inside the outer casing.

[0009] Preferably, heat dissipation fins are fixed at the bottom of the outer casing, and the heat dissipation fins are located directly above the heat dissipation cavity.

[0010] Preferably, mounting blocks with holes are fixed on both sides of the bottom of the outer casing.

[0011] By employing the above technical solution, this utility model provides a double-sided liquid-cooled heat sink for a high-power IGBT module, which has at least the following beneficial effects:

[0012] 1. The double-sided liquid-cooled heat sink of this high-power IGBT module has a "T"-shaped shell structure, with IGBT modules vertically installed on both sides of the shell. At the same time, the heat exchange chamber inside the shell can provide liquid cooling for the IGBT modules on both sides simultaneously. This reduces the overall size of the heat sink, thereby saving internal installation space.

[0013] 2. The double-sided liquid-cooled heat sink of this high-power IGBT module uses a fixing component. The insertion plate is used to position the IGBT module during installation, while the fixing plate is used to fix the installation position of the IGBT module. This allows for easy removal of one IGBT module when maintenance is needed in the future. Attached Figure Description

[0014] The accompanying drawings, which are included to provide a further understanding of the present invention, form part of this application:

[0015] Figure 1 This is a three-dimensional structural diagram of the entire utility model;

[0016] Figure 2 This is a schematic diagram of the structure of the L-shaped plate of this utility model near the heat exchange cavity;

[0017] Figure 3 This is a structural diagram of the L-shaped plate, the fastener, and the IGBT module after disassembly.

[0018] Figure 4 This is a partial cross-sectional view of the bottom of the L-shaped plate of this utility model.

[0019] Figure label:

[0020] 1. Outer shell; 11. L-shaped plate; 111. Slot; 112. Heat exchange chamber; 113. Protrusion; 114. Connecting slot; 115. Heat dissipation chamber; 116. Mounting block; 2. Fixing component; 21. Insert plate; 22. Fixing piece; 3. IGBT module; 31. Connecting block; 4. Water inlet pipe; 5. Connecting pipe; 6. Sealing ring; 7. Heat dissipation fins; 8. Branch pipe; 9. T-joint; 10. Water outlet pipe. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Insulated Gate Bipolar Transistor (IGBT) modules are key components in new energy conversion systems and high-voltage power switching devices, widely used in lighting, automotive, high-speed rail, metallurgy, and renewable energy fields. IGBTs combine the advantages of metal-oxide-semiconductor field-effect transistors (MOSFETs) and bipolar transistors, offering advantages such as simple drive circuits, low steady-state losses, and strong short-circuit withstand capabilities. They significantly improve motor drive efficiency and occupy an important position among high-power semiconductors.

[0023] Due to the technical drawbacks of existing technologies, such as the large size of the heat sink affecting installation, please refer to... Figures 1-4 This embodiment provides a double-sided liquid-cooled heat sink for a high-power IGBT module, which can reduce the overall volume of the heat sink, thereby saving internal installation space. It includes a housing 1, which has a "T"-shaped structure. Multiple equally spaced slots 111 are provided on both side walls of the housing 1. An IGBT module 3 is detachably installed in each slot 111 via a fastener 2. Multiple heat exchange chambers 112 corresponding to the positions of the IGBT modules 3 are provided inside the housing 1, and these chambers are interconnected via connecting grooves 114. Water inlet pipes 4 and connecting pipes 5, which communicate with the heat exchange chambers 112, are connected to both sides of the housing 1. Two... The symmetrically arranged heat dissipation chambers 115 have branch pipes 8 connected to both sides of the outer shell 1, which communicate with the two heat dissipation chambers 115. The two branch pipes 8 are connected to the connecting pipe 5 and the outlet pipe 10 respectively through a tee connector 9. IGBT modules 3 are vertically installed on both sides of the "T"-shaped outer shell 1. The internal heat exchange chamber 112 can simultaneously provide liquid cooling for the IGBT modules 3 on both sides, reducing the size of the radiator and saving internal installation space. Multiple heat exchange chambers 112 are connected by a connecting groove 114, allowing the coolant to flow in each heat exchange chamber 112, achieving a more efficient heat dissipation circulation. The heat dissipation chambers 115, together with the branch pipes 8, tee connectors 9, etc., improve the coolant circulation path of the heat dissipation system.

[0024] Furthermore, the fixing component 2 includes an insertion plate 21 and a fixing plate 22. The insertion plate 21 is inserted into the slot 111 and is connected to the connecting block 31 fixed to the IGBT module 3 by screws. The fixing plate 22 is connected to the top of the housing 1 by screws. The insertion plate 21 is used to position the IGBT module 3 during installation, while the fixing plate 22 is used to fix the installation position of the IGBT module 3. This allows for easy disassembly of one IGBT module 3 when maintenance is required later.

[0025] The existing radiator shell 1 is a single piece, which makes it difficult to machine the heat exchange cavity 112 inside, resulting in manufacturing difficulties. To address this issue, the shell 1 is composed of two L-shaped plates 11, which are fixed together by multiple bolts. The heat exchange cavity 112 can be machined on each of the two L-shaped plates 11 first, and then the two L-shaped plates 11 can be assembled to form a complete shell 1. This makes it easy to machine a shell 1 with a heat exchange cavity 112, and has the advantage of simple manufacturing.

[0026] Since the area of ​​the inner wall of the heat exchange chamber 112 is limited, the heat exchange efficiency with the coolant is poor. To address this issue, multiple arrayed protrusions 113 are provided on the inner wall of the heat exchange chamber 112. The protrusions 113 increase the contact area between the inner wall of the heat exchange chamber 112 and the coolant, enhance the heat exchange process, and improve the heat dissipation efficiency.

[0027] There is a risk of water leakage at the connection between the water inlet pipe 4 and the connecting pipe 5 and the outer casing 1, which may affect the normal operation of the heat dissipation system. To address this issue, a sealing ring 6 is fitted on the end of the water inlet pipe 4 and the connecting pipe 5 inside the outer casing 1. The sealing ring 6 can effectively prevent coolant leakage, ensure the stable operation of the heat dissipation system, and guarantee the heat dissipation effect.

[0028] After the coolant has undergone heat exchange, it needs to be recirculated. After multiple cycles, the coolant temperature will gradually increase, thus affecting the heat exchange and cooling effect. To address this issue, heat dissipation fins 7 are fixed at the bottom of the outer casing 1, and the heat dissipation fins 7 are located directly above the heat dissipation cavity 115. After the coolant returns, it can dissipate the heat exchanged heat into the air under the action of the heat dissipation fins 7, thereby reducing the temperature of the coolant.

[0029] Furthermore, perforated mounting blocks 116 are fixed on both sides of the bottom of the outer casing 1; the perforated mounting blocks 116 facilitate the overall fixing of the outer casing 1 to the equipment, making the installation more convenient and stable.

[0030] It should be noted that the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0031] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A double-sided liquid cooling heat sink for high-power IGBT modules, comprising a housing (1), characterized in that: The outer shell (1) has a "T" shaped structure. Multiple slots (111) are provided on both sides of the outer shell (1). IGBT modules (3) are detachably installed in the slots (111) through fasteners (2). Multiple heat exchange chambers (112) corresponding to the positions of the IGBT modules (3) are provided inside the outer shell (1). The multiple heat exchange chambers (112) are interconnected through connecting grooves (114). Water inlet pipes (4) and connecting pipes (5) connected to the heat exchange chambers (112) are respectively connected to both sides of the outer shell (1). Two symmetrically arranged heat dissipation chambers (115) are provided at the bottom of the outer shell (1). Branch pipes (8) connected to the two heat dissipation chambers (115) are connected to both sides of the outer shell (1). The two branch pipes (8) are connected to the connecting pipes (5) and the water outlet pipes (10) respectively through tee connectors (9).

2. The double-sided liquid-cooled heat sink for high-power IGBT modules according to claim 1, characterized in that: The fastener (2) includes a plug plate (21) and a fixing plate (22). The plug plate (21) is inserted into the slot (111). The plug plate (21) is connected to the connecting block (31) fixed on the IGBT module (3) by screws. The fixing plate (22) is connected to the top of the housing (1) by screws.

3. The double-sided liquid-cooled heat sink for high-power IGBT modules of claim 1, wherein: The outer shell (1) is composed of two L-shaped plates (11), and the two L-shaped plates (11) are fixed together by multiple bolts.

4. The double-sided liquid-cooled heat sink for high-power IGBT modules of claim 1, wherein: The inner wall of the heat exchange cavity (112) is provided with a plurality of arrayed protrusions (113).

5. The double-sided liquid-cooled heat sink for high-power IGBT modules of claim 1, wherein: The water inlet pipe (4) and the connecting pipe (5) are both fitted with sealing rings (6) at the ends inside the outer shell (1).

6. The double-sided liquid-cooled heat sink for high-power IGBT modules of claim 1, wherein: The bottom of the outer shell (1) is fixed with heat dissipation fins (7), which are located directly above the heat dissipation cavity (115).

7. The double-sided liquid-cooled heat sink for high-power IGBT modules of claim 1, wherein: Mounting blocks (116) with holes are fixed on both sides of the bottom of the outer casing (1).

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