Server cabinet

Abstract

The application relates to the technical field of electronic equipment, and discloses a server cabinet, which comprises a cabinet, a mainboard module, an expansion module and a cooling module arranged in the cabinet, the cooling module and the expansion module are arranged at intervals along the length direction of the cabinet, the mainboard module comprises a first circuit board and a radiator arranged on the first circuit board, the expansion module comprises a second circuit board and an accelerator card arranged on the second circuit board, the second circuit board extends along the width direction of the cabinet, the mainboard module and the accelerator card extend along the length direction of the cabinet, the mainboard module and the accelerator card are arranged side by side on the second circuit board, and the first circuit board is electrically connected with the second circuit board and the accelerator card. The application aims to solve the technical problem that the layout mode of the mainboard module and the expansion module is unreasonable, thereby causing poor heat dissipation effect of the server cabinet.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and in particular to a server rack. Background Technology

[0002] AI servers are high-performance computing devices designed for artificial intelligence workloads. They combine powerful computing capabilities, optimized hardware architecture, and efficient software support to meet the computing resource requirements of AI applications.

[0003] In related technologies, the motherboard module inside the server rack is located between the expansion module and the fan module. The accelerator card is inserted into the expansion module and connected to the motherboard module. Since the heat sink on the motherboard module blocks the heat dissipation channel of the accelerator card, it is not conducive to the heat dissipation of the accelerator card and affects the heat dissipation effect of the server rack. Utility Model Content

[0004] The purpose of this application is to provide a server rack to solve the technical problem of poor heat dissipation caused by an unreasonable layout of the motherboard module and expansion module.

[0005] To achieve the above objectives, this application provides a server rack, including a chassis and a motherboard module, an expansion module and a cooling module disposed within the chassis, wherein the cooling module and the expansion module are spaced apart along the length of the chassis;

[0006] The motherboard module includes a first circuit board and a heat sink disposed on the first circuit board;

[0007] The expansion module includes a second circuit board and an accelerator card disposed on the second circuit board. The second circuit board extends along the width direction parallel to the chassis, and the motherboard module and the accelerator card extend along the length direction of the chassis. The motherboard module and the accelerator card are disposed side by side on the second circuit board, and the first circuit board is electrically connected to the second circuit board and the accelerator card.

[0008] In the server rack of this application, the motherboard module and the accelerator card are vertically mounted on the second circuit board.

[0009] In the server rack of this application, the motherboard module includes a connector, which is disposed on the first circuit board, and the first circuit board is electrically connected to the second circuit board through the connector.

[0010] In the server rack of this application, the heat sink and the connector are spaced apart along the length of the chassis, and the connector is located at the end of the heat sink away from the cooling module.

[0011] In the server rack of this application, the expansion module includes multiple acceleration cards, and the motherboard module is located between any two of the acceleration cards.

[0012] In the server rack of this application, the shape and size of the motherboard module are the same as those of the accelerator card.

[0013] In the server rack of this application, the server rack further includes a power module, which is disposed inside the chassis and is used to provide power to the motherboard module and the cooling module.

[0014] In the server rack of this application, the server rack further includes a power adapter board, which is disposed inside the chassis. The power module is electrically connected to the power adapter board, and the power adapter board is electrically connected to the first circuit board.

[0015] In the server rack of this application, the power module and the expansion module are arranged side by side in the width direction of the chassis, and the power module and the power adapter board are arranged adjacent to each other in the length direction of the chassis.

[0016] In the server rack of this application, the cooling module includes at least one cooling fan, and the air outlet of at least one cooling fan faces the motherboard module and the expansion module.

[0017] In the server rack of this application, the first circuit board is provided with a connection port, and the chassis is provided with a clearance hole corresponding to the connection port. The connection port faces the clearance hole and is used for electrical connection with external devices.

[0018] In the server rack of this application, the server rack further includes a storage module, which is disposed inside the chassis and located on the side of the cooling module away from the motherboard module.

[0019] This application provides a server rack, which has the following advantages:

[0020] The server rack of this application includes a chassis, a motherboard module, an expansion module, and a cooling module. Inside the chassis, the expansion module and cooling module are spaced apart along the length of the chassis. A second circuit board extends parallel to the width of the chassis. This application places the motherboard module and accelerator cards side-by-side on the second circuit board. The first circuit board and accelerator cards are inserted into and electrically connected to the second circuit board. Since the motherboard module and accelerator cards extend along the length of the chassis, the heatsink on the first circuit board does not obstruct the heat dissipation channel of the accelerator cards, allowing the first circuit board and accelerator cards to be cooled promptly by the cooling module. By adjusting the spatial position of the motherboard module and placing it side-by-side with the accelerator cards, the cooling airflow generated by the cooling module can smoothly reach the surface of the accelerator cards, carrying away the heat generated by the accelerator cards and avoiding the problem of obstructed heat dissipation channels caused by heatsink obstruction, thus improving the heat dissipation performance of the server rack. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the server rack structure provided in an embodiment of this application;

[0023] Figure 2 This is a schematic diagram of the internal structure of a server rack provided in an embodiment of this application;

[0024] Figure 3 This is another internal structure diagram of the server rack provided in an embodiment of this application;

[0025] Figure 4 Exploded view of the motherboard module and expansion module provided in the embodiments of this application.

[0026] Figure 5 for Figure 4 Another structural diagram;

[0027] Figure 6 This is a schematic diagram of the structure of the motherboard module provided in an embodiment of this application;

[0028] Figure 7 This is another structural schematic diagram of the motherboard module provided in an embodiment of this application.

[0029] The markings in the image are as follows:

[0030] 10. Chassis; 20. Motherboard module; 21. First circuit board; 22. Heat sink; 23. Connector; 24. Connection port; 25. Housing; 30. Expansion module; 31. Second circuit board; 32. Accelerator card; 40. Cooling module; 41. Cooling fan; 50. Power module; 60. Power adapter board; 70. Storage module; 100. Server rack; X: Length direction; Y: Width direction; Z: Height direction. Detailed Implementation

[0031] The specific embodiments of this application will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this application, but are not intended to limit the scope of this application.

[0032] In the description of this application, it should be noted that the terms "upper", "lower", "front", "rear", "inner", "outer", etc. used in this application to indicate the orientation or positional relationship are based on the positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and are not intended to indicate or imply that the device and element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0033] In the description of this application, it should be understood that the terms "first," "second," etc., are used to describe various types of information, but these terms are not limited to them and are only used to distinguish information of the same type from one another. For example, without departing from the scope of this application, "first" information may also be referred to as "second" information, and similarly, "second" information may also be referred to as "first" information.

[0034] In related technologies, the motherboard module 20 is located between the accelerator card 32 and the cooling module 40 inside the chassis 10. Because the heat sink 22 on the first circuit board 21 is large in size and occupies a certain space, it blocks the heat dissipation channel of the accelerator card 32, resulting in the heat generated by the accelerator card 32 not being dissipated in time, causing poor heat dissipation effect of the chassis.

[0035] like Figures 1 to 7As shown, this application embodiment provides a server rack 100, which includes a chassis 10 and a motherboard module 20, an expansion module 30 and a cooling module 40 disposed within the chassis 10. The cooling module 40 and the expansion module 30 are spaced apart along the length direction X of the chassis 10. The motherboard module 20 includes a first circuit board 21 and a heat sink 22 disposed on the first circuit board 21. The expansion module 30 includes a second circuit board 31 and an accelerator card 32 disposed on the second circuit board 31. The second circuit board 31 extends along the width direction Y parallel to the chassis 10. The motherboard module 20 and the accelerator card 32 extend along the length direction X of the chassis 10. The motherboard module 20 and the accelerator card 32 are disposed side by side on the second circuit board 31. The first circuit board 21, the second circuit board 31 and the accelerator card 32 are electrically connected.

[0036] In this embodiment, the server rack 100 has a length direction X, a width direction Y, and a height direction Z, and the length direction X, the width direction Y, and the height direction Z are perpendicular to each other in space.

[0037] The chassis 10 is the outer shell structure of the server rack 100, used to protect the internal motherboard module 20, expansion module 30 and cooling module 40 and other modules.

[0038] In the motherboard module 20, the first circuit board 21 is a CPU board, which integrates components such as a central processing unit, chipset, and memory controller to perform various computing tasks, such as data processing, logical operations, and instruction execution. A heatsink 22 is mounted on the first circuit board 21 and includes multiple heat dissipation fins to dissipate heat from the first circuit board 21, ensuring that the motherboard module 20 operates within its normal operating temperature range.

[0039] In the expansion module 30, the second circuit board 31 is a switch board, and an acceleration card 32 is installed on the second circuit board 31. The acceleration card 32, also known as a computing power card or artificial intelligence acceleration card, is used to enhance or improve the processing speed of the server rack 100. The second circuit board 31 (or switch board) is used for data exchange and communication between the acceleration card 32 and the first circuit board 21, achieving fast data transmission through a high-speed switching chip and interface.

[0040] In the cooling module 40, the motherboard module 20, expansion module 30, and other modules within the chassis 10 are cooled. The cooling module 40 reduces the temperature of each module through heat exchange, ensuring that each module remains within its normal operating temperature range. The cooling module 40 can be either air-cooled or water-cooled; the cooling method is not specifically limited.

[0041] Based on the above technical solution, within the chassis 10, the expansion module 30 and the cooling module 40 are spaced apart along the length X direction of the chassis 10, and the second circuit board 31 extends along the width Y direction parallel to the chassis 10. In this embodiment, the motherboard module 20 and the accelerator card 32 are arranged side by side on the second circuit board 31. The first circuit board 21 and the accelerator card 32 are inserted into the second circuit board 31 and electrically connected to it. The first circuit board 21 and the accelerator card 32 extend along the length X direction of the chassis 10, and the heat sink 22 does not obstruct the heat dissipation channel of the accelerator card 32, allowing the first circuit board 21 and the accelerator card 32 to be cooled promptly by the cooling module 40. By adjusting the spatial position of the motherboard module 20 and arranging it side by side, the cooling airflow generated by the cooling module 40 can smoothly reach the surface of the accelerator card 32, carrying away the heat generated by the accelerator card 32 and avoiding heat dissipation problems caused by the heat sink 22 obstructing the flow, thus improving the heat dissipation performance of the server rack 100.

[0042] In some embodiments, such as Figure 4 As shown, the motherboard module 20 and the accelerator card 32 are vertically mounted on the second circuit board 31, and the motherboard module 20 (or the first circuit board 21) and the accelerator card 32 are vertically inserted into the second circuit board 31 along the height direction Z.

[0043] In other embodiments, the motherboard module 20 and the accelerator card 32 may not be perpendicular to the second circuit board 31, but may be set at other angles to the second circuit board 31, such as 85 degrees or 120 degrees.

[0044] In some embodiments, such as Figure 6 and Figure 7 As shown, the motherboard module 20 includes a connector 23, which is disposed on the first circuit board 21. The first circuit board 21 is electrically connected to the second circuit board 31 through the connector 23.

[0045] For example, connector 23 is a high-speed connector. High-speed connectors have a faster data transmission speed, which can meet the high-speed transmission requirements of large amounts of data between various modules within the server. For example, in application scenarios such as cloud computing and big data processing, the server needs to process massive amounts of data. The high-speed connector can enable data to be transmitted quickly and accurately between the first circuit board 21 and the second circuit board 31, thereby improving the overall performance of the system.

[0046] In this embodiment, the second circuit board 31 is provided with a PCIe slot (or PCIe interface). The PCIe slot provides a connection for a high-speed serial computer expansion card, enabling the second circuit board 31 to perform high-speed data transmission with other components. In this embodiment, the connector 23 on the first circuit board 21 is inserted into the PCIe slot on the second circuit board 31 to achieve an electrical connection between the first circuit board 21 and the second circuit board 31, thereby enabling fast transmission between the first circuit board 21 and the second circuit board 31.

[0047] In other examples, connector 23 may also be a gold finger structure, which is a gold-plated contact piece in the shape of a finger, and is inserted into the interface on the second circuit board 31 through the gold finger structure.

[0048] In related technologies, the first circuit board 21 and the second circuit board 31 are electrically connected by a high-speed connection line. In this embodiment, the connector 23 is inserted into the PCIe slot on the second circuit board 31, eliminating the need for a high-speed connection line between the two circuit boards. This results in a simple structure and high transmission stability.

[0049] In some embodiments, the heat sink 22 and the connector 23 are spaced apart along the length X of the chassis 10, and the connector 23 is located at the end of the heat sink 22 away from the cooling module 40.

[0050] Specifically, along the length direction X of the first circuit board 21, the heat sink 22 is located at the end closer to the cooling module 40, and the connector 23 is located at the end farther away from the cooling module 40, so that the cooling module 40 can quickly cool the heat sink 22, reduce the temperature of the heat sink 22, and improve the heat dissipation performance of the heat sink 22 on the first circuit board 21.

[0051] In some embodiments, such as Figure 4 As shown, the expansion module 30 includes multiple accelerator cards 32, and the motherboard module 20 is located between any two of the accelerator cards 32.

[0052] Specifically, in this embodiment, multiple accelerator cards 32 are arranged side by side on the second circuit board 31, which can increase the computing power of the server and reduce the space occupied by the expansion module 30. The motherboard module 20 is located between two of the accelerator cards 32, and the signal transmission line between the first circuit board 21 and the accelerator cards 32 is shorter, reducing the risk of signal delay and attenuation.

[0053] For example, the number of accelerator cards 32 on both sides of the first circuit board 21 is the same; for instance, four accelerator cards 32 are arranged on the left side and four on the right side of the first circuit board 21. When more accelerator cards 32 are needed, they can be inserted on both sides of the motherboard module 20 without adjusting the position of the motherboard module 20. With the increasing performance demands of servers, adding accelerator cards 32 can improve the server's computing power, reduce the cost and difficulty of server upgrades, and enhance the server's scalability. It is understandable that when an accelerator card 32 fails, this layout facilitates the removal of the faulty accelerator card 32 from the second circuit board 31 and the insertion of a new accelerator card 32.

[0054] In some embodiments, such as Figure 4 As shown, the shape and size of the motherboard module 20 are the same as those of the accelerator card 32.

[0055] Specifically, the motherboard module 20 and the accelerator card 32 have the same structure, shape and size, similar to a card structure, so that the motherboard module 20 and the accelerator card 32 are neatly arranged on the second circuit board 31. The layout between the motherboard module 20 and the accelerator card 32 is compact, reducing the overall space occupied, thereby improving the space utilization rate inside the chassis 10.

[0056] In some embodiments, such as Figure 2 and Figure 3 As shown, the server rack 100 also includes a power module 50, which is located inside the chassis 10 and is used to provide power to the motherboard module 20 and the cooling module 40.

[0057] Specifically, the power module 50 connects to modules such as the motherboard module 20 and the cooling module 40, and is used to provide power to the power-consuming modules in the server rack 100. The power module 50 includes at least one type of rechargeable battery or supercapacitor. The rechargeable battery has high energy density, can store a large amount of electricity, and can withstand hundreds to thousands of charge-discharge cycles. The supercapacitor features high power density, rapid charge-discharge capability, and long cycle life. The rechargeable battery includes at least one type of sodium battery, lithium battery, or lead-acid battery.

[0058] In some embodiments, such as Figure 2 and Figure 3 As shown, the server rack 100 also includes a power adapter board 60, which is located inside the chassis 10. The power module 50 is electrically connected to the power adapter board 60, and the power adapter board 60 is electrically connected to the first circuit board 21.

[0059] Specifically, by setting up a power adapter board 60, the cabling structure inside the server rack 100 is simplified. The power module 50 is connected to the power adapter board 60, and the power adapter board 60 is then connected to power-consuming modules such as the motherboard module 20 via electrical connection cables, avoiding the complex cabling problems caused by directly connecting the power module 50 to each power-consuming module.

[0060] In some embodiments, such as Figure 2 and Figure 3 As shown, the power module 50 and the expansion module 30 are arranged side by side in the width direction Y of the chassis 10, and the power module 50 and the power adapter board 60 are arranged adjacent to each other in the length direction X of the chassis 10.

[0061] Specifically, the power module 50 and the power adapter board 60 are installed on the side inside the chassis 10. The power module 50 and the power adapter board 60 are arranged adjacent to each other in the length direction X of the chassis 10, and are arranged side by side with the expansion module 30 in the width direction Y. This makes full use of the space inside the chassis 10, reduces the space occupied by the power module 50 and the power adapter board 60, avoids positional conflicts between the power module 50 and the power adapter board 60 and other modules, and facilitates the connection of the power adapter board 60 with other modules.

[0062] In some embodiments, such as Figure 3 As shown, the cooling module 40 includes at least one cooling fan 41, with the air outlet of the at least one cooling fan 41 facing the motherboard module 20 and the expansion module 30.

[0063] Specifically, the cooling module 40 uses air cooling to cool the modules inside the chassis 10. The cooling module 40 includes one or more cooling fans 41, which accelerate airflow to remove heat generated by modules such as the motherboard module 20. In this embodiment, the motherboard module 20 is mounted on the second circuit board 31, and the heat dissipation airflow between the cooling fans 41, the motherboard module 20, and the accelerator card 32 is not obstructed. The air outlets of the cooling fans 41 face the motherboard module 20 and the expansion module 30, allowing the cooling airflow to directly act on the motherboard module 20 and the expansion module 30, thereby improving heat dissipation efficiency and removing heat more quickly.

[0064] In practical applications, multiple cooling fans 41 are selected based on the server's heat dissipation requirements to provide a larger cooling airflow, thereby enhancing the heat dissipation effect. It is understandable that the more accelerator cards 32 there are, the higher the heat generated during operation, and correspondingly, higher-power cooling fans 41 or more cooling fans 41 need to be installed to meet the heat dissipation demands.

[0065] In some embodiments, such as Figure 6 and Figure 7As shown, the first circuit board 21 is provided with a connection port 24, and the chassis 10 is provided with a clearance hole corresponding to the connection port 24. The connection port 24 faces the clearance hole and is used for electrical connection with external devices.

[0066] Specifically, connection port 24 is the interface for electrical connection between the first circuit board 21 and external devices, used to realize data transmission and signal interaction between the server and external devices (such as monitors, keyboards, mice, storage devices, network devices, etc.). For example, through connection port 24, the server can communicate with an external network to upload and download data.

[0067] In related technologies, the motherboard module 20 is located between the accelerator card 32 and the cooling module 40, and the first circuit board 21 needs to be led out of the chassis 10 through an interface board. In this embodiment, the motherboard module 20 is located on the second circuit board 31, and the first circuit board 21 is vertically inserted into the second circuit board 31. The connection port 24 of the first circuit board 21 is directly led out from the clearance hole of the chassis 10, eliminating the need for an interface board and helping to reduce the production cost of the server rack 100.

[0068] In some embodiments, such as Figure 6 As shown, the motherboard module 20 also includes a housing 25, which is assembled and connected to the first circuit board 21, and the heat sink 22 is covered inside the housing 25 to protect the central processing unit and other components on the first circuit board 21.

[0069] In some embodiments, such as Figure 2 As shown, the server rack 100 also includes a storage module 70, which is located inside the chassis 10 and is situated on the side of the cooling module 40 away from the motherboard module 20.

[0070] Specifically, storage module 70 includes multiple hard drives, which are components used for data storage and management. These hard drives store various data generated during server operation, including operating system files, application data, user files, etc. Through storage module 70, the server can achieve long-term data preservation and fast access, meeting users' needs for data storage and management.

[0071] In this embodiment, along the length X of the chassis 10, the cooling module 40 is located between the storage module 70 and the motherboard module 20 (or expansion module 30). Since the storage module 70 generates relatively little heat, placing the cooling module 40 close to the motherboard module 20 (or expansion module 30) allows the cooling fan 41 to directly blow cooling air onto the motherboard module 20 (or expansion module 30), improving heat dissipation performance. On the other hand, the storage module 70 is located on the side furthest from the motherboard module 20, which prevents the heat generated by the motherboard module 20 from affecting the storage module 70.

[0072] It should be understood that the term "and / or" as used in this specification and the appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes such combinations. It should be noted that, herein, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or system. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or system that includes that element.

[0073] The sequence numbers of the embodiments in this application are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments. The above descriptions are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A server rack, characterized in that, The system includes a chassis and a motherboard module, an expansion module, and a cooling module disposed within the chassis, wherein the cooling module and the expansion module are spaced apart along the length of the chassis. The motherboard module includes a first circuit board and a heat sink disposed on the first circuit board; The expansion module includes a second circuit board and an accelerator card disposed on the second circuit board. The second circuit board extends along the width direction parallel to the chassis, and the motherboard module and the accelerator card extend along the length direction of the chassis. The motherboard module and the accelerator card are disposed side by side on the second circuit board, and the first circuit board is electrically connected to the second circuit board and the accelerator card.

2. The server rack according to claim 1, characterized in that, The motherboard module and the accelerator card are vertically mounted on the second circuit board.

3. The server rack according to claim 1, characterized in that, The motherboard module includes a connector, which is disposed on the first circuit board, and the first circuit board is electrically connected to the second circuit board through the connector.

4. The server rack according to claim 3, characterized in that, The heat sink and the connector are spaced apart along the length of the chassis, with the connector located at the end of the heat sink furthest from the cooling module.

5. The server rack according to claim 1, characterized in that, The expansion module includes multiple accelerator cards, and the motherboard module is located between any two of the accelerator cards.

6. The server rack according to claim 5, characterized in that, The motherboard module has the same shape and size as the accelerator card.

7. The server rack according to claim 1, characterized in that, The server rack also includes a power module, which is located inside the chassis and is used to provide power to the motherboard module and the cooling module.

8. The server rack according to claim 7, characterized in that, The server rack also includes a power adapter board, which is located inside the chassis. The power module is electrically connected to the power adapter board, and the power adapter board is electrically connected to the first circuit board.

9. The server rack according to claim 8, characterized in that, The power module and the expansion module are arranged side by side in the width direction of the chassis, and the power module and the power adapter board are arranged adjacent to each other in the length direction of the chassis.

10. The server rack according to claim 1, characterized in that, The cooling module includes at least one cooling fan, with the air outlet of the at least one cooling fan facing the motherboard module and the expansion module.

11. The server rack according to claim 1, characterized in that, The first circuit board is provided with a connection port, and the chassis is provided with a clearance hole corresponding to the connection port. The connection port faces the clearance hole and is used for electrical connection with external devices.

12. The server rack according to claim 1, characterized in that, The server rack also includes a storage module, which is located inside the chassis and on the side of the cooling module away from the motherboard module.

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