Waste recovery device for semiconductor packaging equipment

Abstract

The utility model relates to a waste recovery device for semiconductor packaging equipment, which belongs to the technical field of waste recovery and comprises a recovery shell, an inner box is arranged on the inner side of the recovery shell, a flow guide frame positioned above the inner box is fixed on the inner side of the recovery shell, and a vibration motor is fixedly mounted at the bottom of the inner box. An induction assembly is installed on the outer side of the inner box, a discharging assembly is installed at the bottom of the inner box, visible windows are fixedly installed on the front face of the inner box and the front face of the recycling shell in a penetrating mode, and the induction assembly comprises two conduction rods fixed to the inner bottom wall of the inner box; a plurality of extrusion springs are fixed between the outer side of the inner box and the inner side of the recycling shell, a plurality of supporting springs are fixed between the bottom of the inner box and the inner bottom wall of the recycling shell, and two rubber frames are fixed to the outer side of the inner box. According to the waste recovery device for the semiconductor packaging equipment, the space utilization rate in the recovery device can be improved through simpler structural cooperation.

Description

Technical Field

[0001] This utility model relates to the field of waste recycling technology, specifically a waste recycling device for semiconductor packaging equipment. Background Technology

[0002] Semiconductors are materials whose conductivity at room temperature is between that of conductors and insulators. Semiconductor packaging equipment cuts wafers from the front-end wafer process into small chips through a dicing process. The cut chips are then glued onto small islands on the corresponding substrate frame. Ultra-fine metal wires or conductive resins are used to connect the bonding pads of the chips to the corresponding pins on the substrate to form the required circuit. The individual chips are then encapsulated and protected with plastic shells. After encapsulation, the finished product needs to be trimmed to remove excess frame material. The material generated from trimming is waste and needs to be recycled and stored.

[0003] According to a semiconductor packaging waste collection device disclosed in Chinese Patent Publication No. CN221186757U, the patent can make the collection box move up and down in a reciprocating motion through the cooperation between the first push block, the second push block and the driving device, thereby simulating the effect of vibration. This can prevent the waste accumulated inside from only accumulating on one side of the collection box, improve the space utilization rate and is very practical.

[0004] However, this patent has certain shortcomings in actual use. Because multiple structures need to work together to achieve the contact movement of the second push block and the first push block, and the contact surface is prone to wear during long-term operation, the smoothness of the movement is affected, and regular maintenance or replacement is required, which increases the actual use cost. In this regard, this application provides a waste recycling device for semiconductor packaging equipment to solve the above problems. Summary of the Invention

[0005] (a) Technical problems to be solved

[0006] To address the shortcomings of existing technologies, this utility model provides a waste recycling device for semiconductor packaging equipment. It has the advantages of improving the internal space utilization of the recycling device by using a simpler structural arrangement, and solves the problem that existing semiconductor packaging waste collection devices require a large number of transmission structures and are prone to wear during actual use.

[0007] To achieve the above-mentioned goal of improving the internal space utilization of the recycling device by using a simpler structural arrangement, this utility model provides the following technical solution: a waste recycling device for semiconductor packaging equipment, including a recycling shell, an inner box placed inside the recycling shell, a guide frame fixed on the inner side of the recycling shell above the inner box, a vibration motor fixedly installed at the bottom of the inner box, a sensing component installed on the outer side of the inner box, a discharge component installed at the bottom of the inner box, and a viewing window through and fixedly installed on the front of both the inner box and the recycling shell;

[0008] The sensing assembly includes two conductive rods fixed to the bottom wall of the inner box, several compression springs fixed between the outer side of the inner box and the inner side of the recycling shell, several support springs fixed between the bottom of the inner box and the inner bottom wall of the recycling shell, two rubber frames fixed to the outer side of the inner box, three transparent sheets embedded and fixedly installed on the inner left side wall of the inner box, three mounting holes opened on the left side of the recycling shell, infrared sensors fixedly installed inside the mounting holes, a support plate fixed to the right side of the recycling shell, and an audible and visual alarm fixedly installed on the top of the support plate.

[0009] Furthermore, the discharge assembly includes a discharge pipe fixed to the bottom of the inner box, a manual valve connected to the inside of the discharge pipe is fixedly installed on the discharge pipe, and an movable hole is opened at the bottom of the recycling shell for the discharge pipe to pass through and move. A rubber ring is fixed to the outside of the discharge pipe and fixedly connected to the inside of the movable hole.

[0010] Furthermore, the bottom end of the discharge pipe penetrates the interior of the movable hole and extends to the bottom of the recycling shell.

[0011] Furthermore, the manual valve is located below the recycling shell, and the inner bottom wall of the inner tank is inclined towards the side closer to the discharge pipe.

[0012] Furthermore, the inner diameter of the top wall of the guide frame is larger than the inner diameter of the bottom wall, and the inner diameter of the bottom wall of the guide frame is smaller than the inner diameter of the inner box.

[0013] Furthermore, the outer side of the rubber frame and the inner side of the recycling shell are fixedly connected, with the two rubber frames located at the top and bottom of the outer side of the inner box, respectively.

[0014] Furthermore, the left side of the inner box has three through holes for the three transparent sheets to pass through and be installed, and the positions of the three through holes correspond to the positions of the three installation holes.

[0015] Compared with the prior art, the present invention provides a waste recycling device for semiconductor packaging equipment, which has the following advantages:

[0016] This waste recycling device for semiconductor packaging equipment, through the coordinated use of an inner box, guide frame, vibration motor, sensing components, and discharge components inside the recycling shell, can improve the internal space utilization of the recycling device with a simpler structural arrangement. It reduces the number of structures used for transmission, allowing for more direct vibration of the accumulated waste inside, ensuring the top of the waste is level, thereby improving space utilization. At the same time, the sensing elements can detect the height of the accumulated waste, making it easier for users to intuitively determine whether the recycling device is full, thus effectively improving the practicality of the waste recycling device for semiconductor packaging equipment. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of this utility model;

[0018] Figure 2 This is a three-dimensional cross-sectional view of the guide frame in the structure of this utility model;

[0019] Figure 3 This is a front view schematic diagram of the structure of this utility model.

[0020] In the diagram: 1. Recycling outer shell, 2. Inner box, 3. Flow guide frame, 4. Vibration motor, 500. Sensing component, 501. Conducting rod, 502. Compression spring, 503. Support spring, 504. Rubber frame, 505. Transparent sheet, 506. Mounting hole, 507. Infrared sensor, 508. Support plate, 509. Audible and visual alarm, 600. Discharge component, 601. Discharge pipe, 602. Manual valve, 603. Movable hole, 604. Rubber ring, 7. Viewing window. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see Figures 1 to 3This utility model provides a technical solution: a waste recycling device for semiconductor packaging equipment, including a recycling shell 1, an inner box 2 placed inside the recycling shell 1, a guide frame 3 fixed inside the recycling shell 1 above the inner box 2, a vibration motor 4 fixedly installed at the bottom of the inner box 2, a sensing component 500 installed on the outside of the inner box 2, and a discharge component 600 installed at the bottom of the inner box 2. A viewing window 7 is provided and fixedly installed on the front of both the inner box 2 and the recycling shell 1. Through the coordinated use of the inner box 2, the guide frame 3, the vibration motor 4, the sensing component 500, and the discharge component 600 inside the recycling shell 1, a simpler structural arrangement can improve the internal space utilization of the recycling device, reduce the number of transmission structures, and enable more direct vibration of the accumulated waste inside, ensuring the top of the waste is horizontal, thereby improving space utilization. Simultaneously, the sensing element can detect the accumulation height of the waste, allowing users to more intuitively determine whether the recycling device is full, thus effectively improving the practicality of the waste recycling device for semiconductor packaging equipment.

[0023] It should be noted that, as Figure 2 As shown, the inner diameter of the top wall of the guide frame 3 is larger than the inner diameter of the bottom wall, and the inner diameter of the bottom wall of the guide frame 3 is smaller than the inner diameter of the inner box 2. This allows the guide frame 3 to guide the incoming waste material, enabling the waste material to enter the inner box 2 normally.

[0024] In this embodiment, the sensing component 500 is a structure used to provide elastic support for the inner box 2 so that it can vibrate and can sense the waste material stored inside.

[0025] like Figure 1 As shown, the sensing component 500 includes two conductive rods 501 fixed to the inner bottom wall of the inner box 2, several compression springs 502 fixed between the outer side of the inner box 2 and the inner side of the recycling shell 1, several support springs 503 fixed between the bottom of the inner box 2 and the inner bottom wall of the recycling shell 1, two rubber frames 504 fixed to the outer side of the inner box 2, three transparent sheets 505 embedded and fixedly installed on the inner left side wall of the inner box 2, three mounting holes 506 opened on the left side of the recycling shell 1, an infrared sensor 507 fixedly installed on the inner side of the mounting hole 506, a support plate 508 fixedly installed on the right side of the recycling shell 1, and an audible and visual alarm 509 fixedly installed on the top of the support plate 508.

[0026] It should be noted that the outer side of the rubber frame 504 is fixedly connected to the inner side of the recycling shell 1. The two rubber frames 504 are located at the top and bottom of the outer side of the inner box 2, respectively, so that the rubber frame 504 can restrict the movement of the inner box 2 to a certain extent, so that it can vibrate normally without generating excessive amplitude. The left side of the inner box 2 has three through holes for three transparent sheets 505 to pass through and be installed. The positions of the three through holes correspond to the positions of the three mounting holes 506, so that the infrared sensor 507 can sense the waste inside the inner box 2 through the corresponding through holes and transparent sheets 505. When all three infrared sensors 507 are blocked, the sound and light alarm 509 can be triggered to allow the surrounding staff to notice.

[0027] In this embodiment, the discharge component 600 is a structure used to discharge waste materials.

[0028] like Figure 1 and Figure 3 As shown, the discharge assembly 600 includes a discharge pipe 601 fixed to the bottom of the inner box 2. A manual valve 602 connected to the inside of the discharge pipe 601 is fixedly installed on the discharge pipe 601. The bottom of the recycling shell 1 is provided with an movable hole 603 for the discharge pipe 601 to pass through and move. A rubber ring 604 is fixedly connected to the inner side of the movable hole 603 on the outside of the discharge pipe 601.

[0029] It should be noted that the bottom end of the discharge pipe 601 passes through the interior of the movable hole 603 and extends to the bottom of the recycling shell 1. The manual valve 602 is located below the recycling shell 1. The inner bottom wall of the inner box 2 is inclined towards the side close to the discharge pipe 601, so that the waste inside the inner box 2 can be easily discharged through the discharge pipe 601. Under the action of the rubber ring 604, the movement of the discharge pipe 601 can be restricted, so that the inner box 2 can vibrate normally without the amplitude being too large.

[0030] The working principle of the above embodiments is as follows:

[0031] During use, waste from the semiconductor packaging equipment enters through the top of the recycling shell 1 and accumulates inside the inner box 2 under the guidance of the inner side of the guide frame 3. The vibration motor 4 is started, allowing the inner box 2 to vibrate and shift appropriately under the elastic support of the compression spring 502, the support spring 503, and the rubber frame 504. This allows the waste inside the inner box 2 to be spread out flat under the vibration. The transmission rod 501 improves the efficiency of vibration transmission, making the top of the waste relatively flat. At the same time, the vibration motor 4 can be started at a set time to save some energy. When all three infrared sensors 507 are blocked by waste, the audible and visual alarm 509 is activated to alert the user. The manual valve 602 is opened, allowing the waste inside the inner box 2 to be discharged through the discharge pipe 601, thus completing the waste discharge work and preventing the waste accumulated inside the inner box 2 from overflowing and affecting the production line.

[0032] Compared with existing technologies, this waste recycling device for semiconductor packaging equipment, through the coordinated use of the inner box 2, guide frame 3, vibration motor 4, sensing component 500, and discharge component 600 inside the recycling shell 1, can improve the internal space utilization of the recycling device with a simpler structural arrangement, reduce the number of transmission structures, and enable more direct vibration of the accumulated waste inside, so that the top of the waste is in a horizontal state, thereby improving space utilization. At the same time, it can also sense the accumulation height of the waste through the sensing element, making it easier for users to intuitively find out whether the recycling device is full. This effectively improves the practicality of the waste recycling device for semiconductor packaging equipment and solves the problem that existing semiconductor packaging waste collection devices require a lot of transmission structures and are prone to wear during actual use.

[0033] All electrical components mentioned in this article are electrically connected to the main controller and power supply. The provision of power supply is common knowledge in the field. The main controller can be a conventional known device such as a computer that can be controlled. It can be implemented by a person skilled in the art through simple programming. All of these are existing public power connection technologies, which will not be described in detail in this article.

[0034] It should be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0035] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention.

Claims

1. A waste recycling device for semiconductor packaging equipment, comprising a recycling housing (1), characterized in that: An inner box (2) is placed inside the recycling shell (1). A guide frame (3) located above the inner box (2) is fixed inside the recycling shell (1). A vibration motor (4) is fixedly installed at the bottom of the inner box (2). A sensing component (500) is installed on the outside of the inner box (2). A discharge component (600) is installed at the bottom of the inner box (2). A viewing window (7) is provided and fixedly installed on the front of both the inner box (2) and the recycling shell (1). The sensing component (500) includes two conductive rods (501) fixed to the inner bottom wall of the inner box (2), a number of compression springs (502) fixed between the outer side of the inner box (2) and the inner side of the recycling shell (1), a number of support springs (503) fixed between the bottom of the inner box (2) and the inner bottom wall of the recycling shell (1), two rubber frames (504) fixed to the outer side of the inner box (2), three transparent pieces (505) embedded and fixedly installed on the inner left side wall of the inner box (2), three mounting holes (506) are opened on the left side of the recycling shell (1), an infrared sensor (507) is fixedly installed on the inner side of the mounting hole (506), a support plate (508) is fixed to the right side of the recycling shell (1), and an audible and visual alarm (509) is fixedly installed on the top of the support plate (508).

2. The waste recycling device for semiconductor packaging equipment according to claim 1, characterized in that: The discharge assembly (600) includes a discharge pipe (601) fixed to the bottom of the inner box (2). A manual valve (602) connected to the inside of the discharge pipe (601) is fixedly installed on the discharge pipe (601). The bottom of the recycling shell (1) is provided with an active hole (603) through which the discharge pipe (601) passes and moves. A rubber ring (604) is fixed to the outside of the discharge pipe (601) and fixedly connected to the inside of the active hole (603).

3. A waste recycling device for semiconductor packaging equipment according to claim 2, characterized in that: The bottom end of the discharge pipe (601) passes through the interior of the movable hole (603) and extends to the bottom of the recycling shell (1).

4. A waste recycling device for semiconductor packaging equipment according to claim 2, characterized in that: The manual valve (602) is located below the recovery housing (1), and the inner bottom wall of the inner box (2) is inclined toward the side closer to the discharge pipe (601).

5. A waste recycling device for semiconductor packaging equipment according to claim 1, characterized in that: The inner diameter of the top wall of the guide frame (3) is greater than the inner diameter of the bottom wall, and the inner diameter of the bottom wall of the guide frame (3) is smaller than the inner diameter of the inner box (2).

6. A waste recycling device for semiconductor packaging equipment according to claim 1, characterized in that: The outer side of the rubber frame (504) is fixedly connected to the inner side of the recycling shell (1), and the two rubber frames (504) are located at the top and bottom of the outer side of the inner box (2), respectively.

7. A waste recycling device for semiconductor packaging equipment according to claim 1, characterized in that: The inner box (2) has three through holes on its left side for three transparent sheets (505) to pass through and be installed. The positions of the three through holes correspond to the positions of the three mounting holes (506).

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