Deburring tool for cleaning nozzle of semiconductor silicon wafer

Abstract

The utility model discloses a semiconductor silicon wafer cleaning nozzle deburring tool which comprises a base and a supporting column which are formed by engineering plastics in an injection molding mode, the middle of the base is provided with a step type positioning groove which is divided into three steps, the first step is located at the lowermost portion and is a supporting column positioning inserting groove, the inner diameter of the supporting column positioning inserting groove is matched with the outer diameter of the supporting column, and the second step is located at the lower portion of the supporting column positioning inserting groove. Wherein the second step is a plug positioning groove of which the inner diameter is matched with the outer diameter of a splicing plug of the semiconductor silicon wafer cleaning nozzle, and the third step is a threaded connection groove of which the inner diameter is matched with the outer diameter of a threaded connection part of the semiconductor silicon wafer cleaning nozzle and which is provided with a corresponding internal threaded connection surface; the diameter of the supporting column is matched with the negative tolerance of the diameter of a flow channel in the middle of the semiconductor silicon wafer cleaning nozzle, and the length of the supporting column is larger than the sum of the length of the flow channel and the depth of the supporting column positioning inserting groove. By means of the mode, the burr removing device can be matched with an automatic burr removing device, work efficiency is improved, and meanwhile the problem that burrs fly around is solved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing equipment, and in particular to a deburring fixture for cleaning nozzles on semiconductor silicon wafers. Background Technology

[0002] Semiconductor cleaning nozzles are typically made of high-performance engineering plastics, such as polytetrafluoroethylene (PTFE), polyetheretherketone (PEEK), and polypropylene (PP), to ensure that they remain unaffected by prolonged immersion in chemical cleaning solutions. During manufacturing, plastic materials are prone to burrs and edge curling due to machining, cutting, or wear. This is especially true in the processing of small holes on water spray plates, where burrs directly affect the uniformity and angle of water flow during cleaning, thus impacting wafer yield. Therefore, all burrs must be removed. Traditionally, burrs are removed manually using a magnifying glass. This method is slow, time-consuming, and limited by the operator's skill and physical condition, easily damaging the hole structure and causing burr omissions. Furthermore, the removed burrs are lightweight and may fall around or even float in the air, posing a threat to the respiratory health of on-site operators. Utility Model Content

[0003] The main technical problem solved by this utility model is to provide a deburring fixture for cleaning nozzles of semiconductor silicon wafers, which can improve the deburring efficiency of nozzles.

[0004] To solve the above-mentioned technical problems, the present invention provides a deburring fixture for a semiconductor silicon wafer cleaning nozzle. The semiconductor silicon wafer cleaning nozzle is made of engineering plastic. The nozzle body has a flow channel in the middle, a water spray plate with multiple spray holes at the front end, and a threaded connection and a splicing plug at the rear. The deburring fixture includes a base and a support column, both of which are injection molded from engineering plastic. The base has a stepped positioning groove in the middle, which is divided into three stages. The first stage is located at the bottom and is a support column positioning slot with an inner diameter matching the outer diameter of the support column. The second stage is a plug positioning groove with an inner diameter matching the outer diameter of the splicing plug. The third stage is a threaded connection groove with an inner diameter matching the outer diameter of the threaded connection and having a corresponding internal threaded connection surface. The diameter of the support column is negatively tolerant to the diameter of the flow channel in the middle of the semiconductor silicon wafer cleaning nozzle, and the length of the support column is greater than the sum of the length of the flow channel and the depth of the support column positioning slot.

[0005] In a preferred embodiment of this utility model, the length of the support column is less than the sum of the length of the flow channel and half the depth of the support column positioning slot and the depth of the plug positioning slot.

[0006] In a preferred embodiment of this invention, the sum of the depth of the plug positioning groove and the depth of the threaded connection groove is not less than the total length of the threaded connection portion of the semiconductor silicon wafer cleaning nozzle and the splicing plug. The depth of the plug positioning groove is not greater than the length of the splicing plug. The depth of the threaded connection groove is greater than the length of the threaded connection portion.

[0007] The beneficial effects of this utility model are as follows: This utility model is a special tooling made according to the shape characteristics of the semiconductor silicon wafer cleaning nozzle, which can be matched with the automatic deburring device. By using this tooling, the semiconductor silicon wafer cleaning nozzle can be fixed and placed on the work station using a three-jaw chuck. During the deburring process, the drill bit scrapes off the burrs, and the burrs are drilled into the top of the support column in the tooling along with the guide surface and the top of the drill bit. Then, taking advantage of the material characteristics of the support column, the burrs are left in the support column when the drill bit withdraws. In this way, after all the spray holes are cleaned, only the support column needs to be replaced directly. This method can not only work with the automatic deburring device to quickly remove burrs and other foreign objects from the water spray holes, but also eliminates the safety hazards of burrs flying around during conventional deburring, significantly improving the on-site working environment and work efficiency. Attached Figure Description

[0008] Figure 1 This is a schematic diagram illustrating the working principle of a preferred embodiment of the present invention;

[0009] Figure 2 This is a schematic diagram of the assembly structure of the embodiment shown;

[0010] Figure 3 This is a three-dimensional structural diagram of a semiconductor cleaning nozzle;

[0011] The components in the attached diagram are labeled as follows:

[0012] 1. Semiconductor silicon wafer cleaning nozzle; 2. Base; 3. Support column; 4. Drill bit;

[0013] 101. Sprayer plate; 102. Threaded connection; 103. Splicing plug;

[0014] 201. Support column positioning slot, 202. Plug positioning slot, 203. Threaded connection slot, 204. Internal threaded connection surface. Detailed Implementation

[0015] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the scope of protection of the present invention.

[0016] Please see Figures 1 to 3 The embodiments of this utility model include:

[0017] A deburring fixture for a semiconductor silicon wafer cleaning nozzle is disclosed. The semiconductor silicon wafer cleaning nozzle 1 is made of PFA material. The nozzle 1 has a flow channel in the middle, a water spray plate 101 with multiple spray holes at the front end, and a threaded connection part 102 and a splicing plug 103 at the rear. The flow channel is 67.5 mm long and 6.35 mm in diameter. The threaded connection part 102 is 14.5 mm long, and the splicing plug 103 is 13 mm long. The fixture includes a base 2 and a support column 3, both injection molded from engineering plastics. The base 3 has a stepped positioning groove in the middle, which is divided into three steps. The first stage, located at the bottom, is a support column positioning slot 201 whose inner diameter matches the outer diameter of the support column 3. The second stage is a plug positioning groove 202 whose inner diameter matches the outer diameter of the splicing plug 103. The third stage is a threaded connection groove 203 whose inner diameter matches the outer diameter of the threaded connection part 102 and has a corresponding internal threaded connection surface 204. The diameter of the support column 3 is negatively tolerant to the diameter of the flow channel in the middle of the semiconductor silicon wafer cleaning nozzle 1. The length of the support column 3 is greater than the sum of the length of the flow channel and the depth of the support column positioning slot 201, and less than the sum of the length of the flow channel, the depth of the support column positioning slot 201, and half the depth of the plug positioning groove 202. This ensures that when the semiconductor silicon wafer cleaning nozzle 1 is installed into the fixture, the splicing plug 103 can be inserted at least into the middle of the plug positioning groove 202 without abutting the bottom of the plug positioning groove 202, thus ensuring clamping stability without affecting the product structure.

[0018] The sum of the depth of the plug positioning groove 202 and the depth of the threaded connection groove 203 is not less than the total length of the threaded connection portion 102 of the semiconductor silicon wafer cleaning nozzle 1 and the splicing plug 103. The depth of the plug positioning groove 202 is not greater than the length of the splicing plug 103. The depth of the threaded connection groove 203 is greater than the length of the threaded connection portion 102. In this way, combined with the aforementioned length limitation, it can be ensured that when the semiconductor silicon wafer cleaning nozzle 1 is installed into the tooling, the bottom of the threaded connection portion 102 will not touch the bottom of the threaded connection groove 203, ensuring clamping stability while preventing damage to the product's external structure.

[0019] In actual implementation, the support column 3 is generally made of engineering plastics such as ABS or PP with low hardness, while the base 2 is generally made of PEEK material with relatively high hardness. The dimensions of the support column 3 are generally 76mm in length and 6.35-0.015mm in diameter. The depth of the support column positioning slot 201 is 7.5mm, the depth of the threaded connection groove 203 is 18mm, and the depth of the plug positioning groove 202 is 10mm. Thus, when the semiconductor silicon wafer cleaning nozzle 1 is installed into the fixture, the threaded connection part 102 can be completely inserted into the threaded connection groove 203. At this time, most of the splicing plug 103 extends into the plug positioning groove 202, and the bottoms of the threaded connection part 102 and the splicing plug 103 do not abut against the bottom of the corresponding groove.

[0020] When performing deburring, first use a three-jaw chuck to hold the base 2, and then use a special drill bit 4 to clean the burrs on the spray holes of the water spray plate 101. During the cleaning process, the tip of the drill bit 4 will drill into the top of the support column 3 through the spray hole. At the same time, the scraped burrs will be guided into the support column 3 by the drill bit 4. When the action is finished and the drill bit 4 is withdrawn, the burrs will automatically remain on the top of the support column 3. After all the processing is completed, release the three-jaw chuck, unscrew the base 2, and pull out the support column 3. The burrs will be brought out of the water spray hole from the vertical direction, thereby achieving the purpose of fast and efficient burr removal. Moreover, the burrs will not fly around, reducing the impact of burrs on the surrounding environment.

[0021] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the description and drawings of this utility model, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A deburring fixture for a semiconductor silicon wafer cleaning nozzle, wherein the semiconductor silicon wafer cleaning nozzle is made of engineering plastic, the nozzle body has a flow channel in the middle, a water spray plate with multiple spray holes at the front end, and a threaded connection and a splicing plug at the rear end, characterized in that, The semiconductor silicon wafer cleaning nozzle deburring fixture includes a base and a support column. Both the base and the support column are injection molded from engineering plastics. The base has a stepped positioning groove in the middle. The stepped positioning groove is divided into three steps. The first step is located at the bottom and is a support column positioning slot with an inner diameter that matches the outer diameter of the support column. The second step is a plug positioning groove with an inner diameter that matches the outer diameter of the splicing plug. The third step is a threaded connection groove with an inner diameter that matches the outer diameter of the threaded connection part and has a corresponding internal threaded connection surface. The diameter of the support column is negatively tolerant to the diameter of the flow channel in the middle of the semiconductor silicon wafer cleaning nozzle, and the length of the support column is greater than the sum of the length of the flow channel and the depth of the support column positioning slot.

2. The semiconductor silicon wafer cleaning nozzle deburring fixture according to claim 1, characterized in that, The length of the support column is less than the sum of the length of the flow channel and half the depth of the support column positioning slot and the depth of the plug positioning slot.

3. The semiconductor silicon wafer cleaning nozzle deburring fixture according to claim 1, characterized in that, The sum of the depth of the plug positioning groove and the depth of the threaded connection groove is not less than the total length of the threaded connection portion of the semiconductor silicon wafer cleaning nozzle and the splicing plug.

4. The semiconductor silicon wafer cleaning nozzle deburring fixture according to claim 3, characterized in that, The depth of the plug positioning groove is not greater than the length of the splicing plug.

5. The semiconductor silicon wafer cleaning nozzle deburring fixture according to claim 3, characterized in that, The depth of the threaded connection groove is greater than the length of the threaded connection portion.

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