Injection mold for semiconductor carrier plate production
By adopting an integrated water pipe system and a dual guide pillar mechanism in the injection mold for semiconductor substrate production, the problems of uneven cooling and unstable mold closing were solved, resulting in more efficient cooling and a more stable injection process, thus improving product quality and mold life.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- WUHAN SHENGFENG PLASTIC MOLD CO LTD
- Filing Date
- 2025-05-29
- Publication Date
- 2026-04-24
AI Technical Summary
Existing injection molds in semiconductor substrate production suffer from problems such as uneven cooling efficiency, poor mold closing stability, product warping, and severe wear, resulting in low production efficiency and poor product quality.
An integrated water pipe system forms a closed-loop cooling channel, which, combined with a gradually narrowing diameter design and a nano-silicon carbide coating, enhances heat exchange efficiency. A dual-guide-pillar mechanism ensures mold closing accuracy and stability, and precise temperature control is achieved through an electromagnetically driven mold closing safety lock and a temperature sensor.
It improves cooling efficiency and temperature uniformity, extends mold life, enhances production efficiency and product quality, and reduces maintenance costs.
Smart Images
Figure CN224158776U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of injection mold technology, specifically relating to an injection mold for semiconductor substrate production. Background Technology
[0002] Injection molds are specialized tools used in plastic injection molding processes. They are used to inject heated and molten plastic into a mold cavity, which then cools and solidifies to obtain the finished product. They are widely used in the production of plastic parts and products, and are particularly suitable for mass production of products with complex geometries and high precision requirements. Semiconductor substrates, also known as chip substrates, are substrate materials used to support wafers in the semiconductor manufacturing process. They not only fix and protect the wafers and promote optical and electrical performance, but also improve production efficiency. There is a large demand for them in the semiconductor manufacturing process, and injection molds for semiconductor substrate production are special tools used to manufacture semiconductor substrates.
[0003] Semiconductor substrates, as the base material for precision electronic components, require extremely high dimensional accuracy and surface quality during injection molding. Existing injection molds employ distributed cooling channels, which leads to inconsistent cooling rates across the mold cavity, resulting in insufficient cooling efficiency. Temperature gradients cause uneven plastic shrinkage, ultimately causing substrate warping, dimensional deviations, and product deformation. This necessitates increased cooling time or secondary correction processes, extending the production cycle and reducing product quality and production efficiency. Furthermore, the single-guide-pillar structure of traditional injection molds is prone to displacement during high-pressure injection, resulting in poor mold closing stability, uneven parting line clearance, and molten plastic overflow forming flash. This reduces the surface finish of the product, potentially affecting subsequent packaging processes and production quality, and also accelerates mold wear, shortening the mold's lifespan. To address these issues, an improved injection mold for semiconductor substrate production is proposed. Utility Model Content
[0004] The purpose of this invention is to provide an injection mold for semiconductor substrate production, aiming to solve the aforementioned problems existing in the prior art.
[0005] To achieve the above objectives, the present invention adopts the following technical solution:
[0006] An injection mold for semiconductor substrate production includes a rear mold fixing plate fixed to the fixed mold side of an injection molding machine and a front mold fixing plate fixed to the moving mold side of the injection molding machine. A support column is installed on the rear mold fixing plate and a rear mold movable plate is connected through the support column. A rear mold core is embedded inside the rear mold movable plate, and a front mold core is embedded inside the front mold fixing plate. A mold cavity is formed between the front mold core and the rear mold core and a water supply pipe is provided. Grooves adapted to the water supply pipe are formed on the outer walls of the front mold core and the rear mold core for receiving the water supply pipe.
[0007] The rear mold movable plate and the front mold fixed plate are respectively provided with a main guide post and an auxiliary guide post. The front mold movable plate is provided at the end of the auxiliary guide post. The front mold fixed plate is closed and guided by the auxiliary guide post and the front mold movable plate.
[0008] The front mold core and the rear mold core are also provided with electromagnetically driven mold closing safety locks on both sides;
[0009] The front mold movable plate has a nozzle hole in the center and a positioning ring is arranged around the nozzle hole. The front mold movable plate has a cooling water inlet connected to the water pipeline to form a closed-loop cooling channel.
[0010] A pin base plate, a pin plate, and a mold foot are also provided between the rear mold fixed plate and the rear mold movable plate. A reset rod is provided through the rear mold fixed plate. A pin is mounted on the pin plate. A return pin guide sleeve is mounted on the pin base plate. A return pin and a spring are mounted on the pin plate. The reset rod and the return pin are embedded in the return pin guide sleeve. A waste nail is also fixedly installed on the rear mold movable plate.
[0011] In a preferred embodiment of this utility model, the cross-section of the water pipeline is a gradually narrowing structure with an inlet diameter of 12mm and an outlet diameter of 8mm, and the inner wall is coated with a nano-silicon carbide coating.
[0012] In a preferred embodiment of this utility model, the spring has an elastic coefficient of 60 N / mm and a pre-compression of 5 mm.
[0013] In a preferred embodiment of this utility model, the surfaces of the rear mold core and the front mold core are provided with microporous structures with a pore size of 10~20μm, and the surface roughness Ra≤0.1μm.
[0014] In a preferred embodiment of this utility model, a temperature sensor is embedded in the cooling water inlet of the front mold movable plate to monitor the cooling water temperature in real time and feed it back to the PLC system, with the temperature difference controlled to ≤±1℃.
[0015] In a preferred embodiment of this utility model, the inlet end of the nozzle hole is provided with a tapered guide surface with an angle of 30°, and the fitting gap with the injection molding machine nozzle is ≤0.03mm.
[0016] In a preferred embodiment of this utility model, the height of the mold foot is adjustable, with an adjustment range of ±5mm.
[0017] In a preferred embodiment of this utility model, the maximum flow rate of the water pipeline is 25L / min, the working pressure is 20~3.0MPa, and the suitable water temperature is 5℃~30℃.
[0018] In summary, the beneficial effects of the above-described technical solutions conceived by this utility model compared with the prior art include:
[0019] This invention relates to an injection mold for semiconductor substrate production. During the injection molding process, an integrated water supply system forms a closed-loop cooling channel within the mold cavity. The cross-section of the water supply system gradually decreases from the inlet to the outlet, creating a multi-section variable diameter design. Utilizing the Bernoulli effect, this design increases local flow velocity, enhances heat exchange efficiency, and integrates injection molding and cooling functions. This reduces mold volume, ensures temperature uniformity, and achieves higher cooling efficiency, more uniform temperature distribution, longer service life, and lower maintenance costs. Simultaneously, the main guide pillar and auxiliary guide pillar guide the front and rear mold movable plates to close, driving the front and rear mold cores to close and form a closed mold cavity. This double guide pillar mechanism improves mold closing accuracy and stability, preventing mold misalignment that could lead to flash on the product. This, in turn, improves the production efficiency and quality of semiconductor substrates, reduces mold wear during injection molding, and extends the service life of the injection mold. Attached Figure Description
[0020] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0021] Figure 2 This is a schematic diagram of the disassembled structure of this utility model.
[0022] In all the accompanying drawings, the same reference numerals denote the same technical features, specifically: 1. Reset rod; 2. Rear mold fixing plate; 3. Waste pin; 4. Support column; 5. Ejector pin base plate; 6. Return pin guide sleeve; 7. Ejector pin; 8. Return pin; 9. Spring; 10. Ejector plate; 11. Mold foot; 12. Main guide column; 13. Rear mold movable plate; 14. Water pipe; 15. Rear mold core; 16. Mold closing safety lock; 17. Front mold core; 18. Front mold fixing plate; 19. Auxiliary guide column; 20. Front mold movable plate; 21. Positioning ring; 22. Nozzle hole. Detailed Implementation
[0023] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the present utility model will be briefly introduced below in conjunction with the accompanying drawings and descriptions of the embodiments or the prior art. Obviously, the following description of the structure of the accompanying drawings is only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. It should be noted that the description of these embodiments is used to help understand this utility model, but does not constitute a limitation on this utility model.
[0024] Example:
[0025] like Figure 1-2As shown, this embodiment provides an injection mold for semiconductor substrate production, including a rear mold fixing plate 2 fixed to the fixed mold side of the injection molding machine and a front mold fixing plate 18 fixed to the moving mold side of the injection molding machine. A support column 4 is installed on the rear mold fixing plate 2 and a rear mold movable plate 13 is connected through the support column 4. A rear mold core 15 is embedded inside the rear mold movable plate 13, and a front mold core 17 is embedded inside the front mold fixing plate 18. A mold cavity is formed between the front mold core 17 and the rear mold core 15 and a water pipe 14 is provided. Grooves adapted to the water pipe 14 are formed on the outer walls of the front mold core 17 and the rear mold core 15 for receiving.
[0026] The rear mold movable plate 13 and the front mold fixed plate 18 are respectively provided with a main guide post 12 and an auxiliary guide post 19. The front mold movable plate 20 is provided at the end of the auxiliary guide post 19. The front mold fixed plate 18 is closed and guided by the auxiliary guide post 19 and the front mold movable plate 20.
[0027] Electromagnetically driven mold closing safety latches 16 are also provided on both sides of the front mold core 17 and the rear mold core 15;
[0028] The front mold movable plate 20 has a nozzle hole 22 in the center and a positioning ring 21 is arranged around the nozzle hole 22. The front mold movable plate 20 has a cooling water inlet connected to the water pipe 14 to form a closed-loop cooling channel.
[0029] Between the rear mold fixed plate 2 and the rear mold movable plate 13, there are also ejector base plate 5, ejector plate 10 and mold foot 11. The rear mold fixed plate 2 is provided with a reset rod 1 through it. The ejector plate 10 is equipped with ejector pin 7. The ejector base plate 5 is equipped with return needle guide sleeve 6. The ejector plate 10 is equipped with return needle 8 and spring 9. The reset rod 1 and return needle 8 are embedded in the return needle guide sleeve 6. The rear mold movable plate 13 is also fixedly installed with a garbage nail 3.
[0030] In a specific application scenario, an integrated water pipe 14 forms a closed-loop cooling channel within the mold cavity. The cross-section of the water pipe 14 gradually decreases from the inlet to the outlet, creating a multi-section variable diameter design. Utilizing the Bernoulli effect, this increases local flow velocity, enhances heat exchange efficiency, and integrates injection molding and cooling functions. This reduces mold volume, ensures temperature uniformity, and achieves higher cooling efficiency, more uniform temperature distribution, longer service life, and lower maintenance costs. Simultaneously, the main guide post 12 and auxiliary guide post 19 guide the front mold movable plate 20 and rear mold movable plate 13 to close, driving the front mold core 17 and rear mold core 15 to close and form a closed mold cavity. This double guide post mechanism improves mold closing accuracy and stability. The following description further illustrates the injection mold for semiconductor substrate production based on this application scenario.
[0031] Furthermore, referring to Figure 1-2The cross-section of the water pipeline 14 is a gradually narrowing structure with an inlet diameter of 12mm and an outlet diameter of 8mm. The inner wall is coated with a nano-silicon carbide coating.
[0032] In this embodiment, by setting a gradually narrowing diameter structure in the water pipe 14, the pipe diameter gradually decreases from the inlet to the outlet. According to Bernoulli's equation, when the pipe diameter decreases, the flow velocity increases and the pressure decreases. This may help increase the flow rate of the cooling water, thereby enhancing heat exchange efficiency and improving the cooling effect. Furthermore, coating the inner wall of the water pipe 14 with a nano-silicon carbide coating can improve the thermal conductivity of the inner wall, allowing heat to be transferred from the mold material to the cooling water more quickly. In addition, the wear resistance and corrosion resistance of silicon carbide may also extend the service life of the pipe and reduce maintenance requirements, thereby achieving higher cooling efficiency, more uniform temperature distribution, longer service life, and lower maintenance costs.
[0033] In more detail, refer to Figure 1-2 The spring constant of spring 9 is 60 N / mm, and the pre-compression is 5 mm.
[0034] In this embodiment, spring 9 in the ejection system of the injection mold is used to help ejector pin 7 return to its original position after ejecting the product, and to buffer the impact force during ejection. By setting the spring constant of spring 9 to 60 N / mm and the pre-compression amount to 5 mm, spring 9 is already compressed by 5 mm during installation. This allows spring 9 to provide a greater initial force during ejection, while also having sufficient stroke space to absorb impact. Therefore, the performance of the ejection system can be optimized by adjusting the parameters of spring 9. A higher spring constant may mean a stiffer spring, providing more stable support during ejection and reducing deviation during return. The pre-compression amount ensures that the spring has a certain preload in the initial state, preventing loosening or lag of the ejector pin during return, and improving the system's response speed and accuracy.
[0035] More preferably, refer to Figure 1-2 The surfaces of the rear mold core 15 and the front mold core 17 are provided with microporous structures with a pore size of 10~20μm and a surface roughness Ra≤0.1μm.
[0036] In this embodiment, in order to reduce demolding resistance and potentially improve the surface quality of the product during the demolding process of the injection mold, a microporous structure is set to facilitate the discharge of air, thereby reducing friction during the injection molding process. By setting the surface roughness Ra≤0.1μm to achieve a smooth surface, the adhesion between the plastic and the mold is further reduced, and the demolding force is lowered.
[0037] More preferably, refer to Figure 1-2 The cooling water inlet of the front mold movable plate is embedded with a temperature sensor, which monitors the cooling water temperature in real time and feeds it back to the PLC system. The temperature difference is controlled to be ≤±1℃.
[0038] In this embodiment, the temperature sensor, whose resistance changes with temperature, possesses high accuracy and stability. It can monitor the temperature changes of the cooling water in real time, ensuring that the temperature fluctuation does not exceed ±1℃ within the set range. The PLC system automatically adjusts the cooling water temperature, thereby maintaining the stability of the mold temperature, improving the accuracy of temperature control, and achieving automated control. This optimizes the cooling effect, improves product precision, production efficiency, energy saving, and the level of system automation.
[0039] Furthermore, referring to Figure 1-2 The inlet end of the nozzle hole 22 is provided with a tapered guide surface with an angle of 30°, and the clearance between it and the injection molding machine nozzle is ≤0.03mm.
[0040] In this embodiment, during the injection of molten material through the injection mold, the inlet end of the nozzle hole 22 is provided with a tapered guide surface with an angle of 30°, and the clearance between the guide surface and the nozzle of the injection molding machine is ≤0.03mm, which prevents molten material leakage, maintains injection stability, and improves injection accuracy.
[0041] Furthermore, referring to Figure 1-2 The height of mold foot 11 is adjustable, with an adjustment range of ±5mm.
[0042] In this embodiment, by setting the height of the mold foot 11 to be adjustable within a range of ±5mm, the versatility of the injection mold is enhanced, the equipment modification cost is reduced, and its applicability is expanded.
[0043] More specifically, refer to Figure 1-2 The maximum flow rate of water pipeline 14 is 25L / min, the working pressure is 2.0~3.0MPa, and the suitable water temperature is 5℃~30℃.
[0044] In this embodiment, during the injection molding process, the flow rate directly affects the circulation speed of the cooling water. The higher the flow rate, the more heat is removed per unit time, resulting in higher cooling efficiency. However, excessive flow rate may lead to increased pressure loss. Pressure determines the flow capacity of the cooling water in the pipeline. High pressure can ensure stable flow of cooling water in complex pipelines. Water temperature affects the cooling effect. Low-temperature water can remove heat faster, but excessively low water temperature may cause condensation on the mold surface or excessive material shrinkage, leading to product deformation. The maximum flow rate of the water supply pipeline 14 is set at 25L / min, the working pressure is 2.0~3.0MPa, and the suitable water temperature is 5℃~30℃. By limiting the flow rate, working pressure, and water temperature of the cooling water, the system stability and equipment lifespan are ensured while maintaining cooling efficiency.
[0045] Working principle:
[0046] In the semiconductor substrate production injection mold of this utility model, during the mold closing stage: the main guide post 12 and the auxiliary guide post 19 guide the front mold movable plate 20 and the rear mold movable plate 13 to close, and drive the front mold core 17 and the rear mold core 15 to close to form a closed mold cavity. Then, the mold closing safety lock 16 is used to lock the front mold core 17 and the rear mold core 15 to keep the mold cavity closed and stable.
[0047] Injection stage: Molten plastic is injected through nozzle hole 22 into the mold cavity formed by the closure of front mold core 17 and rear mold core 15 to form semiconductor carrier plate, and the support column 4 resists the injection pressure to prevent the semiconductor carrier plate from deforming.
[0048] Cooling stage: Cooling water is pumped into the water pipe 14 from the cooling water inlet on the front mold movable plate 20 to form a closed-loop cooling channel. The cooling water flows along the outer wall of the rear mold core 15 and the front mold core 17 to cool and lower the temperature inside the mold cavity, thereby accelerating the cooling and curing of the semiconductor substrate.
[0049] Ejection stage: The ejector base plate 5 drives the ejector pin 7 to eject the formed semiconductor carrier plate, and the ejection impact is absorbed by the spring 9. The reset rod 1 and the return pin 8 are precisely reset by the return pin guide sleeve 6 for reuse, and the stroke of the ejector base plate 5 is limited by the waste pin 3 to prevent over-ejection.
[0050] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the scope of protection of this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.
Claims
1. An injection mold for a semiconductor carrier production, comprising a back mold fixing plate (2) fixed to a fixed mold side of an injection molding machine and a front mold fixing plate (18) fixed to a movable mold side of the injection molding machine, characterized in that : The rear mold fixing plate (2) is equipped with a support column (4) and the rear mold movable plate (13) is connected through the support column (4). The rear mold movable plate (13) is embedded with a rear mold core (15). The front mold fixing plate (18) is embedded with a front mold core (17). A mold cavity is formed between the front mold core (17) and the rear mold core (15) and a water pipe (14) is provided. The outer walls of the front mold core (17) and the rear mold core (15) are formed with grooves that are adapted to the water pipe (14) for accommodating the water pipe. The rear mold movable plate (13) and the front mold fixed plate (18) are respectively provided with a main guide post (12) and an auxiliary guide post (19). The front mold movable plate (20) is provided at the end of the auxiliary guide post (19). The front mold fixed plate (18) is closed and guided by the auxiliary guide post (19) and the front mold movable plate (20). The front mold core (17) and the rear mold core (15) are also provided with electromagnetically driven mold closing safety locks (16) on both sides. The front mold movable plate (20) has a nozzle hole (22) in the center and a positioning ring (21) is provided around the nozzle hole (22). The front mold movable plate (20) has a cooling water inlet connected to the water pipe (14) to form a closed-loop cooling channel. Between the rear mold fixing plate (2) and the rear mold movable plate (13), there is also an ejector base plate (5), an ejector plate (10) and a mold foot (11). A reset rod (1) is provided through the rear mold fixing plate (2). An ejector pin (7) is mounted on the ejector plate (10). A return needle guide sleeve (6) is mounted on the ejector base plate (5). A return needle (8) and a spring (9) are mounted on the ejector plate (10). The reset rod (1) and the return needle (8) are embedded in the return needle guide sleeve (6). A garbage nail (3) is also fixedly installed on the rear mold movable plate (13).
2. The injection mold for semiconductor carrier production according to claim 1, characterized by, The water pipeline (14) has a gradually narrowing cross-section with an inlet diameter of 12 mm and an outlet diameter of 8 mm. The inner wall is coated with a nano-silicon carbide coating.
3. The injection mold for semiconductor carrier production according to claim 1, characterized by, The spring (9) has an elastic coefficient of 60 N / mm and a pre-compression of 5 mm.
4. The injection mold for semiconductor substrate production according to claim 1, characterized in that, The rear mold core (15) and the front mold core (17) have microporous structures with a pore size of 10~20μm on their surfaces, and the surface roughness Ra≤0.1μm.
5. The injection mold for semiconductor carrier production according to claim 1, characterized by, The front mold movable plate (20) has an embedded temperature sensor in the cooling water inlet that monitors the cooling water temperature in real time and feeds it back to the PLC system. The temperature difference is controlled to be ≤±1℃.
6. The injection mold for semiconductor substrate production according to claim 1, characterized in that, The inlet end of the nozzle hole (22) is provided with a tapered guide surface with an angle of 30°, and the clearance between it and the injection molding machine nozzle is ≤0.03mm.
7. The injection mold for semiconductor carrier production according to claim 1, characterized by The height of the mold foot (11) is adjustable, with an adjustment range of ±5mm.
8. The injection mold for semiconductor carrier production according to claim 1, characterized by, The maximum flow rate of the water pipeline (14) is 25L / min, the working pressure is 2.0~3.0MPa, and the suitable water temperature is 5℃~30℃.