Die head cooling structure capable of rapidly cooling

Abstract

The utility model provides a die head cooling structure capable of achieving rapid cooling, and belongs to the technical field of die heads. The die head cooling structure capable of achieving rapid cooling comprises the filtering assembly and the heat dissipation assembly, water is conveyed into the connecting shell through the communicating pipe by means of the water pump in the water tank to cool the die head, the water in the water tank can be filtered through the filter, impurities are prevented from entering the connecting shell and the die head, and the cooling efficiency is improved. Water in the connecting shell is filtered again through the filter, impurities are prevented from entering the water tank through the spiral pipe again, the cold end of the semiconductor chilling plate faces the air inlet direction of the fan, the fan sucks air, the air is cooled through the semiconductor chilling plate and then blown out, active cold air conveying is formed, and the heat dissipation effect of the spiral pipe is improved; according to the cooling device, the rapid cooling effect can be achieved, then cold air is formed for heat dissipation, the heat dissipation effect is improved, meanwhile, circulating water is conveniently filtered, micro water channels in the die head are prevented from being blocked, and therefore practicability is improved.

Description

Technical Field

[0001] This application relates to the field of mold head technology, and more specifically, to a mold head cooling structure that can be cooled quickly. Background Technology

[0002] The forming component of an extruder. Also known as an extrusion die or extruder head. Its function is to ensure that the molten plastic from the extruder barrel is well distributed in the die head flow channel so that it can be extruded from the die orifice at a uniform speed and formed. The forming function of the extrusion die head is crucial in the entire extrusion process. Depending on the extruded product, the structure of the extrusion die head varies, and its classification is not standardized. Generally, extrusion dies are equipped with cooling devices for heat dissipation. For example, a water cooling mechanism for an extrusion die head according to Chinese patent application number CN202220203670.3 includes a housing and a mounting plate. The inner cavity of the housing has a heat dissipation chamber. Fixed brackets are fixedly installed on the upper and lower surfaces of one side of the housing. A cooling fan is fixedly installed inside the fixed bracket. A threaded pipe is fixedly installed on one side of the housing between the two sets of fixed brackets. A water pipe is fixedly installed on one side of the housing. A sliding groove is formed on the outer surface of the mounting plate. A water tank is slidably installed on the outer surface of the mounting plate. A limit block is movably installed on the upper surface of the mounting plate. A locking block is fixedly installed on one side of the limit block. This invention improves the cooling effect of the water cooling mechanism by adding a fan and a longer delivery pipe to enhance the cooling function. It also makes the water cooling mechanism easy to disassemble and maintain, allowing it to be removed and maintained in a simple way, thus making it practical.

[0003] However, the above solution still has certain drawbacks: First, if the cooling is only done by a cooling fan, the temperature of the air blown out by the cooling fan may be high when the ambient temperature is high, resulting in poor cooling effect. Second, the cooling water may carry particulate matter during circulation, which is not easy to filter. Over time, it may clog the micro-channels inside the mold head, thereby reducing its practicality. Utility Model Content

[0004] To overcome the above shortcomings, this application provides a mold head cooling structure that can cool quickly, aiming to improve the problem that the related technology only relies on a cooling fan for heat dissipation. When the ambient temperature is high, the temperature of the air blown out by the cooling fan may be high, resulting in poor heat dissipation. Secondly, the cooling water may carry particulate matter during circulation, which is not easy to filter. Over time, it is easy to clog the micro water channels inside the mold head, thereby reducing its practicality.

[0005] This application provides a rapidly cooling die head cooling structure including a filter assembly and a heat dissipation assembly.

[0006] The filtration assembly includes a connecting shell, a filter, a support frame, a water tank, a connecting pipe, and a spiral pipe. Both filters are connected through the connecting shell to one side. Both support frames are fixedly connected to the connecting shell. The water tank is fixedly connected to the support frames. One end of the connecting pipe is connected to the water tank, and the other end is connected to the filter via a flange. One end of the spiral pipe is connected to the filter via a flange, and the other end is connected to the water tank. The heat dissipation assembly includes a fan, a mounting bracket, and a thermoelectric cooler. The fan is fixedly connected to one side of the support frame, the mounting bracket is fixedly connected to the support frame, and the thermoelectric cooler is fixedly connected to one side of the mounting bracket.

[0007] In one specific implementation, the connecting shell is fixedly connected to both ends of a connecting pipe, and a sealing ring is pasted inside the connecting pipe.

[0008] In the above implementation process, the two ends of the connecting shell are fixedly connected with connecting pipes, and the connecting pipes and the internal sealing rings are used for fitting and fixing.

[0009] In one specific implementation, a heat dissipation cavity is provided inside the connecting shell.

[0010] In the above implementation process, a heat dissipation cavity is provided inside the connecting shell, which can achieve the effect of heat dissipation.

[0011] In one specific implementation, the filter includes a pipe, an arc-shaped plate, a first filter plate, and a second filter plate. The arc-shaped plate is slidably connected to the pipe, the first filter plate is fixedly connected to the arc-shaped plate and slidably connected to the pipe, the second filter plate is fixedly connected to the arc-shaped plate and slidably connected to the pipe.

[0012] In the above process, the circulating water can be filtered through the first filter plate and the second filter plate.

[0013] In one specific implementation, a fixing plate is fixedly connected to one side of the pipe, a bolt is connected through one side of the fixing plate, and a connecting block is fixedly connected to one side of the arc-shaped plate, with the bolt threadedly connected to the connecting block.

[0014] In the above implementation process, a fixing plate is fixedly connected to one side of the pipeline. The arc plate can be easily disassembled by bolt connection, so that the first filter plate and the second filter plate can be disassembled and cleaned.

[0015] In one specific implementation, the fixing frame includes a frame plate and four legs, all of which are fixedly connected to the frame plate.

[0016] In the above implementation process, the frame plate and the legs can play a supporting role.

[0017] In one specific implementation, a plurality of heat sinks are fixedly connected to one side of the semiconductor cooling chip.

[0018] In the above implementation process, several heat sinks are fixedly connected to one side of the thermoelectric cooler. These heat sinks work together to enhance the heat dissipation of the hot end of the thermoelectric cooler and prevent heat accumulation that could lead to a decrease in efficiency.

[0019] Compared with the prior art, the beneficial effects of this application are as follows: First, the connecting shell is installed on the mold head. Water is pumped from inside the water tank to the connecting shell through a connecting pipe to cool the mold head. The water inside the water tank is filtered to prevent impurities from entering the connecting shell and the mold head. Second, the water inside the connecting shell is filtered again to prevent impurities from entering the water tank through the spiral tube. The cold end of the semiconductor cooling chip faces the air intake direction of the fan. The air drawn in by the fan is cooled by the semiconductor cooling chip before being blown out, forming an active cold air delivery, which improves the heat dissipation effect of the spiral tube and achieves rapid cooling. This results in cold air heat dissipation, improves the heat dissipation effect, and facilitates the filtration of circulating water to prevent clogging of the micro water channels inside the mold head, thereby improving practicality. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of a rapidly cooling die head structure provided in an embodiment of this application;

[0021] Figure 2 A schematic diagram of the connecting shell structure provided for an embodiment of this application;

[0022] Figure 3 A schematic diagram of the filter structure provided for an embodiment of this application;

[0023] Figure 4 A schematic diagram of the fixing frame structure provided for an embodiment of this application.

[0024] In the diagram: 100-Filter assembly; 110-Connecting shell; 111-Connecting pipe; 112-Sealing ring; 113-Heat dissipation cavity; 120-Filter; 121-Pipe; 122-Arc plate; 123-First filter plate; 124-Second filter plate; 125-Fixing plate; 126-Bolt; 127-Connecting block; 130-Support frame; 140-Water tank; 150-Connecting pipe; 160-Spiral pipe; 200-Heat dissipation assembly; 210-Fan; 220-Fixing frame; 221-Frame plate; 222-Leg; 230-Semiconductor cooling chip; 231-Heat dissipation fin. Detailed Implementation

[0025] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.

[0026] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, not all of them. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0027] Please see Figure 1-4 This application provides a rapidly cooling die head cooling structure including a filter assembly 100 and a heat dissipation assembly 200.

[0028] Please see Figure 1-3 The filter assembly 100 includes a connecting shell 110, a filter 120, a support frame 130, a water tank 140, a connecting pipe 150, and a spiral pipe 160. Both filters 120 are connected through to one side of the connecting shell 110. Both support frames 130 are fixedly connected to the connecting shell 110. The water tank 140 is fixedly connected to the support frame 130. One end of the connecting pipe 150 is connected to the water tank 140, and the other end of the connecting pipe 150 is connected to the filter 120 through a flange. One end of the spiral pipe 160 is connected to the filter 120 through a flange, and the other end of the spiral pipe 160 is connected to the water tank 140. Both ends of the connecting shell 110 are fixedly connected to connecting pipes 111. A sealing ring 112 is pasted inside the connecting pipe 111. The connecting pipe 111 and the internal sealing ring 112 are used for fitting and fixing.

[0029] In some specific implementations, a heat dissipation cavity 113 is provided inside the connecting shell 110. The heat dissipation cavity 113 can achieve a heat dissipation effect. The filter 120 includes a pipe 121, an arc-shaped plate 122, a first filter plate 123, and a second filter plate 124. The arc-shaped plate 122 is slidably connected to the pipe 121, the first filter plate 123 is fixedly connected to the arc-shaped plate 122, and the second filter plate 124 is fixedly connected to the arc-shaped plate 122. 4 is slidably connected to pipe 121. The circulating water can be filtered through the first filter plate 123 and the second filter plate 124. A fixing plate 125 is fixedly connected to one side of pipe 121. A bolt 126 is connected through one side of fixing plate 125. A connecting block 127 is fixedly connected to one side of arc plate 122. The bolt 126 is threadedly connected to the connecting block 127. The arc plate 122 can be easily disassembled through the bolt 126 connection, so that the first filter plate 123 and the second filter plate 124 can be disassembled and cleaned.

[0030] Please see Figure 1 and Figure 4The heat dissipation assembly 200 includes a fan 210, a mounting bracket 220, and a thermoelectric cooler 230. The fan 210 is fixedly connected to one side of the support bracket 130, and the mounting bracket 220 is fixedly connected to the support bracket 130. The thermoelectric cooler 230 is fixedly connected to one side of the mounting bracket 220. The mounting bracket 220 includes a frame plate 221 and four legs 222. All four legs 222 are fixedly connected to the frame plate 221. The frame plate 221 and the legs 222 can provide support. Several heat sinks 231 are fixedly connected to one side of the thermoelectric cooler 230. The heat sinks 231 work together to enhance the heat dissipation of the hot end of the thermoelectric cooler 230 and prevent heat accumulation that would lead to a decrease in efficiency.

[0031] The working principle of this rapid-cooling die head cooling structure is as follows: In use, the connecting shell 110 is first installed on the die head. Water is pumped from inside the water tank 140 through the connecting pipe 150 to the connecting shell 110 to cool the die head. The circulating water is filtered by the first filter plate 123 and the second filter plate 124 inside the pipe 121, preventing impurities from entering the connecting shell 110 and the die head. The water inside the connecting shell 110 is then filtered again by the first filter plate 123 and the second filter plate 124 inside the pipe 121. To prevent impurities from entering the water tank 140 through the spiral tube 160, the cold end of the semiconductor cooling chip 230 is directed towards the air intake direction of the fan 210. The air drawn in by the fan 210 is first cooled by the semiconductor cooling chip 230 before being blown out, forming an active cold air delivery, which improves the heat dissipation effect of the spiral tube 160. In conjunction with several heat sinks 231, the heat dissipation of the hot end of the semiconductor cooling chip 230 is enhanced, avoiding heat accumulation that leads to a decrease in efficiency, and achieving rapid cooling. This forms cold air heat dissipation, improves the heat dissipation effect, and at the same time facilitates the filtration of circulating water, preventing blockage of the micro water channels inside the mold head, thereby improving practicality.

[0032] It should be noted that the specific models and specifications of the fan 210 and the thermoelectric cooler 230 need to be selected and determined according to the actual specifications of the device. The specific selection calculation method adopts the existing technology in this field, so it will not be described in detail.

[0033] The power supply and principle of the fan 210 and the thermoelectric cooler 230 are clear to those skilled in the art and will not be described in detail here.

[0034] The above description is merely an embodiment of this application and is not intended to limit the scope of protection of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application. It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0035] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A rapidly cooling die head cooling structure, characterized in that, include A filter assembly (100) includes a connecting shell (110), a filter (120), a support frame (130), a water tank (140), a connecting pipe (150), and a spiral pipe (160). Two filters (120) are connected through one side of the connecting shell (110), two support frames (130) are fixedly connected to the connecting shell (110), the water tank (140) is fixedly connected to the support frame (130), one end of the connecting pipe (150) is connected to the water tank (140), and the other end of the connecting pipe (150) is connected to the filter (120) through a flange. One end of the spiral pipe (160) is connected to the filter (120) through a flange, and the other end of the spiral pipe (160) is connected to the water tank (140). A heat dissipation assembly (200) includes a fan (210), a mounting bracket (220), and a thermoelectric cooler (230). The fan (210) is fixedly connected to one side of the support bracket (130), the mounting bracket (220) is fixedly connected to the support bracket (130), and the thermoelectric cooler (230) is fixedly connected to one side of the mounting bracket (220).

2. The rapidly cooling die head cooling structure according to claim 1, characterized in that, The connecting shell (110) is fixedly connected to both ends of the connecting tube (111), and a sealing ring (112) is pasted inside the connecting tube (111).

3. The rapidly cooling die head cooling structure according to claim 1, characterized in that, The connecting shell (110) has a heat dissipation cavity (113) inside.

4. The rapidly cooling die head cooling structure according to claim 1, characterized in that, The filter (120) includes a pipe (121), an arc-shaped plate (122), a first filter plate (123), and a second filter plate (124). The arc-shaped plate (122) is slidably connected to the pipe (121), the first filter plate (123) is fixedly connected to the arc-shaped plate (122), and the first filter plate (123) is slidably connected to the pipe (121). The second filter plate (124) is fixedly connected to the arc-shaped plate (122), and the second filter plate (124) is slidably connected to the pipe (121).

5. The rapidly cooling die head cooling structure according to claim 4, characterized in that, A fixing plate (125) is fixedly connected to one side of the pipe (121), and a bolt (126) is connected through one side of the fixing plate (125). A connecting block (127) is fixedly connected to one side of the arc plate (122), and the bolt (126) is threadedly connected to the connecting block (127).

6. The rapidly cooling die head cooling structure according to claim 1, characterized in that, The fixing frame (220) includes a frame plate (221) and support legs (222), and all four support legs (222) are fixedly connected to the frame plate (221).

7. The rapidly cooling die head cooling structure according to claim 1, characterized in that, A number of heat sinks (231) are fixedly connected to one side of the semiconductor cooling chip (230).

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