Condensing device for vacuum coating equipment and vacuum coating equipment

Abstract

The utility model relates to the technical field of vacuum coating, in particular to a condensing device for vacuum coating equipment and the vacuum coating equipment. The condensing device for the vacuum coating equipment comprises a vacuum coating machine body, a sealable vacuum coating cavity is formed in the vacuum coating machine body, a heat insulation plate is arranged in the vacuum coating cavity, and the heat insulation plate divides the vacuum coating cavity into a condensing area and a coating area; wherein an evaporation source and a carrier assembly used for bearing a film coating base material are arranged in the film coating area, and the carrier assembly is installed on the surface of the side, facing the film coating area, of the heat insulation plate; and a cooling system is arranged in the condensation area. According to the condensing device, a vacuum coating cavity is divided into a condensing area and a coating area by a heat insulation plate, so that physical isolation is realized. Therefore, a cooling system can be protected, conditions can be created for a perovskite low-temperature process, the low temperature of a coating substrate can be kept, and the quality and consistency of a coating product are improved.

Description

Technical Field

[0001] This utility model relates to the field of vacuum coating technology, and in particular to a condensation device for vacuum coating equipment and a vacuum coating equipment. Background Technology

[0002] Perovskite solar cells (PSCs), as a typical representative of third-generation photovoltaic solar cells, have attracted much attention due to their unique characteristics such as light weight, high flexibility, low cost, low-temperature dissolution process, and high efficiency.

[0003] Currently, under laboratory conditions, perovskite thin films are mainly prepared using spin coating and slot coating processes. However, spin coating has significant drawbacks: its preparation area is small, making it difficult to meet the needs of large-scale production, and its long film formation time severely restricts production efficiency and hinders commercialization. Slot coating, on the other hand, has become a mainstream choice for large-area perovskite production due to its advantages in precision coating methods, such as highest throughput, good coating window adjustment, and stable and controllable product quality. However, during the scale-up of perovskite solar cell fabrication, this process has revealed problems such as high roughness of specific film layers and poor interlayer contact. These problems seriously affect the performance and stability of the cells, limiting the potential of slot coating equipment in the commercialization of perovskite solar cells.

[0004] Research indicates that low-temperature environments are beneficial for growing perovskite films with longer carrier lifetimes and higher quality. However, existing vacuum deposition equipment falls short in meeting the requirements of low-temperature perovskite processes. In conventional equipment, the large amount of heat generated by the evaporation source during deposition is easily conducted to the cooling system. This can lead to decreased performance and shortened lifespan of cooling system components, increasing maintenance costs. It also interferes with precise temperature control in the deposition area, making it difficult to create the stable low-temperature environment required for perovskite low-temperature processes. Furthermore, the evaporation source material can easily deposit onto the cooling system, resulting in cumbersome subsequent cleaning.

[0005] Based on this, the present invention develops a novel condensation device and vacuum coating equipment for vacuum coating equipment to solve the above problems. Utility Model Content

[0006] The first objective of this invention is to provide a condensation device for vacuum coating equipment. This condensation device uses a heat insulation plate to separate the vacuum coating chamber into a condensation zone and a coating zone, achieving physical isolation. This not only protects the cooling system but also creates conditions for the low-temperature perovskite process and maintains the low temperature of the coating substrate, thereby improving the quality and consistency of the coated product.

[0007] The present invention adopts the following technical solution:

[0008] A condensation device for a vacuum coating equipment includes a vacuum coating machine body, a sealable vacuum coating cavity is formed inside the vacuum coating machine body, and a heat insulation plate is provided inside the vacuum coating cavity, which divides the vacuum coating cavity into a condensation zone and a coating zone.

[0009] The coating area includes an evaporation source and a carrier assembly for supporting the coating substrate. The carrier assembly is installed on the surface of the heat insulation plate facing the coating area.

[0010] A cooling system is installed in the condensation zone.

[0011] Furthermore, the condensation device also includes a refrigeration system located outside the vacuum coating machine body, with the cold end of the refrigeration system thermally coupled to the cooling system.

[0012] Furthermore, the cooling system includes a closed-loop coolant circuit, a portion of which is located within the refrigeration system and thermally coupled to the cold end of the refrigeration system, while the other portion of the coolant circuit is located within the condensation zone.

[0013] Furthermore, the coolant circuit consists of condenser coils.

[0014] Furthermore, the condensation device for the vacuum coating equipment also includes a metal plate, which is fixedly installed in the condensation zone of the vacuum coating chamber, and the condensation coil is fixedly installed on the metal plate.

[0015] Furthermore, the condensation zone is located at the upper part of the vacuum coating chamber, the coating zone is located at the lower part of the vacuum coating chamber, the carrier assembly is suspended at the top of the coating zone, and the evaporation source is located at the bottom of the coating zone.

[0016] Furthermore, the top wall of the vacuum coating chamber is provided with a columnar connector, which extends toward the coating area and penetrates the heat insulation plate; the end of the columnar connector near the coating area is provided with a flange structure.

[0017] The vehicle assembly includes a vehicle body, on the side of which a hook structure is formed, and the hook structure is suspended from the flange structure of the columnar connector.

[0018] Furthermore, the top wall of the vacuum coating chamber is provided with multiple spaced connecting pillars, which penetrate the heat insulation plate, and a groove structure is provided at the end of the connecting pillar near the coating area, with a limiting clip inside the groove structure.

[0019] Furthermore, a heating component is provided at the evaporation source of the coating area to heat the evaporation source.

[0020] Furthermore, the heating element is a resistance heating element.

[0021] Compared with related technologies, the beneficial effects of this utility model are as follows:

[0022] This invention relates to a condensation device for vacuum coating equipment. It divides the vacuum coating chamber into a condensation zone and a coating zone, achieving physical isolation and effectively preventing the high temperature of the coating zone from being rapidly conducted to the cooling system in the condensation zone. During the coating process, the evaporation source generates a large amount of heat. Without a heat insulation plate, this high temperature could lead to a decrease in the performance and a shortened lifespan of the cooling system components. Simultaneously, the heat insulation plate prevents the evaporation source material from depositing onto the cooling system, avoiding the tedious cleaning work later, reducing maintenance costs, and ensuring the continuous and stable operation of the cooling system.

[0023] Secondly, perovskite materials are highly sensitive to temperature, requiring coating processes to be carried out in specific low-temperature environments. The heat insulation plate reduces heat conduction between the condensation zone and the coating zone, and the low temperature of the condensation zone can be transferred to the coating zone via heat radiation through the heat insulation plate. This creates suitable temperature conditions for low-temperature perovskite processes, broadens the range of processes applicable to vacuum coating equipment, and enhances the equipment's versatility and flexibility.

[0024] Furthermore, reducing heat conduction between the condensation zone and the coating zone where the evaporation source is located helps maintain the low temperature of the coating substrate, such as lowering the temperature during perovskite crystallization. During the coating process, the carrier assembly is directly fixed to the heat insulation plate located on the side surface of the coating zone, shortening the heat conduction path. When the cooling system is working, the coating substrate can quickly respond to temperature changes and rapidly reach the appropriate low temperature range, preventing the coating quality from being affected by excessively high temperatures, thereby improving the quality and consistency of the coated products.

[0025] The second objective of this invention is to provide a vacuum coating equipment, which includes the aforementioned condensation device for vacuum coating equipment. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of an embodiment of the condensation device for vacuum coating equipment according to the present invention;

[0028] Figure 2 for Figure 1 Internal structure diagram;

[0029] Figure 3 for Figure 2 A sectional view;

[0030] Figure 4 for Figure 3 Enlarged view of a portion of point A in the middle;

[0031] Figure 5 for Figure 1 Schematic diagram of the vehicle component structure;

[0032] Figure 6 This is a diagram showing the temperature inside the vacuum coating cavity in Example 1;

[0033] Figure 7 This is a schematic diagram of the second embodiment of the condensation device for vacuum coating equipment according to the present invention;

[0034] Figure 8 This is a schematic diagram of the working principle of the vapor compression refrigeration system in a specific embodiment of the condensation device for vacuum coating equipment of this utility model;

[0035] Figure 9 for Figure 5 Schematic diagram of the structure of the vehicle assembly after adding a mask plate;

[0036] In the diagram: 1. Vacuum coating machine body; 10. Condensation zone; 11. Coating zone; 12. Connecting support column; 121. Groove structure; 122. Shoulder structure; 13. Columnar connector; 13. Flange structure; 14. Vacuum coating chamber; 2. Heat insulation plate; 3. Evaporation source; 4. Carrier assembly; 40. Carrier body; 40. Hook structure; 41. Coating substrate; 42. Mask plate; 5. Refrigeration system; 50. Compressor; 51. Condenser; 52. Expansion valve; 53. Evaporator; 6. Cooling system; 60. Coolant circuit; 7. Metal plate; 8. Limiting clip. Detailed Implementation

[0037] The technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0038] The following is in conjunction with the appendix Figure 1 To be continued Figure 9 The present invention will be described in detail with specific embodiments:

[0039] like Figures 1 to 9As shown, this utility model provides a condensation device for vacuum coating equipment, mainly used in the low-temperature process of perovskite coating. The condensation device includes a vacuum coating machine body 1, within which a sealable vacuum coating cavity 14 is formed. A heat insulation plate 2 is provided inside the vacuum coating cavity 14, dividing the vacuum coating cavity 14 into a condensation zone 10 and a coating zone 11. The condensation zone 10 is a low-temperature zone, and the coating zone 11 is a high-temperature zone.

[0040] The coating area 11 is provided with an evaporation source 3 and a carrier assembly 4 for supporting the coating substrate 41. The carrier assembly 4 is installed on the surface of the heat insulation plate 2 facing the coating area 11.

[0041] A cooling system 6 is provided in the condensation zone 10. The cooling system 6 is used to cool the condensation zone 10 and the coating substrate 41 in the carrier assembly 4, and to create a temperature difference between the condensation zone 10 and the side of the coating zone 11 away from the heat insulation plate 2. Figure 6 As shown, blue represents the low-temperature zone and red represents the high-temperature zone.

[0042] It should be noted that the sealable vacuum coating cavity 14 mentioned in this utility model refers to the vacuum coating machine body 1 being provided with a door that can be opened and closed. After the door is closed, a closed vacuum coating cavity 14 can be formed inside the vacuum coating machine body 1.

[0043] The condensation device for vacuum coating equipment in this invention divides the vacuum coating chamber into a condensation zone 10 and a coating zone 11, achieving physical isolation and effectively preventing the high temperature of the coating zone 11 from being rapidly conducted to the cooling system 6 of the condensation zone 10. During the coating process, the evaporation source 3 generates a large amount of heat. Without the heat insulation plate 2, the high temperature may cause the components of the cooling system 6 to degrade in performance and shorten their lifespan. At the same time, the heat insulation plate 2 prevents the evaporation source material from being deposited onto the cooling system 6, avoiding the tedious work of subsequent cleaning, reducing maintenance costs, and ensuring the continuous and stable operation of the cooling system 6.

[0044] Secondly, perovskite materials are highly sensitive to temperature, requiring coating processes to be carried out in specific low-temperature environments. The heat insulation plate 2 reduces heat conduction between the condensation zone 10 and the coating zone 11, and the low temperature of the condensation zone 10 can be transferred to the coating zone 11 via heat radiation through the heat insulation plate 2. This creates suitable temperature conditions for low-temperature perovskite processes, broadens the range of processes applicable to the vacuum coating equipment, and enhances the equipment's versatility and flexibility.

[0045] Furthermore, reducing heat conduction between the condensation zone 10 and the coating zone 11 where the evaporation source 3 is located helps maintain the low temperature of the coating substrate 41, such as lowering the temperature during perovskite crystallization. During the coating process, the carrier assembly 4 is directly fixed to the heat insulation plate 2 located on the side surface of the coating zone 11, shortening the heat conduction path. When the cooling system 6 is working, the coating substrate can quickly respond to temperature changes and rapidly reach a suitable low temperature range, preventing the coating substrate 41 from being affected by excessively high temperatures, thereby improving the quality and consistency of the coated products.

[0046] Furthermore, in some specific embodiments, such as Figure 1 , 8 As shown, the condensation device also includes a refrigeration system 5 placed outside the vacuum coating machine body 1. The cold end of the refrigeration system 5 is thermally coupled to the cooling system 6, so that the low temperature of the cold end of the refrigeration system 5 is exchanged with the cooling system 6 to reduce the temperature of the cooling system 6 and further enhance the cooling effect. This allows the cooling system 6 to provide a low temperature environment for the coating area 11 in the vacuum coating cavity more efficiently, thereby improving the quality and consistency of the coated products.

[0047] It should be noted that there are multiple ways to implement the cooling system 6. For example, a cooling plate can be used. Specifically, the cooling plate is placed in the condensation zone 10 to cool the condensation zone 10 and the coating substrate 41 in the carrier assembly 4.

[0048] Preferably, the cooling system 6 includes a closed-loop coolant circuit 60. A portion of the coolant circuit 60 is placed within the refrigeration system 5 and thermally coupled to the cold end of the refrigeration system 5. The other portion of the coolant circuit 60 is placed within the condensation zone 10 to cool the condensation zone 10 and the coating substrate 41 in the carrier assembly 4. During operation, the low temperature at the cold end of the refrigeration system 5 further exchanges heat with the coolant in the coolant circuit 60. The coolant absorbs the low temperature at the cold end of the refrigeration system 5, lowering its own temperature and enhancing the cooling effect. This allows the cooling system 6 to more efficiently provide a low-temperature environment for the coating zone 11 within the vacuum coating chamber 14, thereby improving the quality and consistency of the coated products. Furthermore, the coolant circuit 60 of the cooling system 6 uses coolant circulation for heat exchange, without relying on gas flow for heat conduction, making it more suitable for vacuum chambers.

[0049] It should be further explained that the refrigeration system 5 can be implemented in various ways, such as vapor compression refrigeration, absorption refrigeration, magnetic refrigeration, etc. The present invention does not impose specific limitations on the structural design of the refrigeration system 5, and those skilled in the art can design and select according to the actual situation.

[0050] In this embodiment, the refrigeration system 5 includes a compressor 50, a condenser 51, an expansion valve 52, and an evaporator 53. The compressor 50, condenser 51, expansion valve 52, and evaporator 53 are connected sequentially to form a closed-loop refrigerant circulation circuit. Heat transfer and exchange are achieved through the circulation of refrigerant among these four components, thus achieving cooling. Simultaneously, the cold end of the evaporator 53 is thermally coupled to the coolant circuit 60 of the cooling system 6, forming a heat exchange.

[0051] The general working principle of the refrigeration system 5 in this embodiment is as follows:

[0052] First, the compressor 50, as the power core of the entire refrigeration system 5, draws in the low-temperature, low-pressure gaseous refrigerant from the outlet of the evaporator 53 and compresses it forcefully. During this process, the compressor 50 performs work on the refrigerant, causing its pressure and temperature to rise rapidly, thus transforming it into a high-temperature, high-pressure gaseous refrigerant. Subsequently, the high-temperature, high-pressure gaseous refrigerant is transported to the inlet of the condenser 51 through a high-pressure gas pipeline.

[0053] Next, the high-temperature, high-pressure gaseous refrigerant enters the condenser 51. Since the condenser 51 typically uses air cooling or water cooling for heat dissipation, the refrigerant releases a large amount of heat it carries into the surrounding environment. As the heat is continuously dissipated, the gaseous refrigerant gradually cools and liquefies, eventually becoming a high-temperature, high-pressure liquid refrigerant, which flows out from the outlet of the condenser 51.

[0054] Then, the high-temperature, high-pressure liquid refrigerant flowing from the outlet of condenser 51 enters expansion valve 52. Expansion valve 52 is a component with a throttling function, which reduces the pressure of the liquid refrigerant through a narrow throttling orifice. During this process, the pressure of the refrigerant drops instantaneously, and its boiling point also decreases accordingly due to the pressure reduction. The liquid refrigerant partially vaporizes, forming a gas-liquid two-phase mixture, that is, becoming a low-temperature, low-pressure gas-liquid two-phase refrigerant, which is then transported to the inlet of evaporator 53 through the two-phase flow pipeline.

[0055] Secondly, after the low-temperature, low-pressure gas-liquid two-phase refrigerant enters the evaporator 53, due to the low internal pressure of the evaporator 53 and the large temperature difference between it and the surrounding medium that needs to be cooled, the refrigerant begins to rapidly vaporize and evaporate. During the evaporation process, the refrigerant absorbs heat from the surrounding medium, thereby lowering the temperature of the surrounding medium and achieving a cooling effect. The evaporated low-temperature, low-pressure gaseous refrigerant then returns to the suction port of the compressor 50 through the low-pressure return gas pipeline, completing one complete refrigeration cycle. This cycle repeats continuously, achieving heat transfer and exchange, and thus achieving the purpose of cooling.

[0056] In some more specific embodiments, such as Figure 3 , 6As shown in Figure 7, the coolant circuit 60 is composed of a condenser coil. The condenser coil is generally arranged in a meandering manner, which can increase the contact area between the coolant and the coating substrate 41, thereby improving the heat exchange efficiency.

[0057] There are various methods for installing and fixing the condenser coil in this application, such as direct welding to the inner wall of the condensation zone 10 of the vacuum coating chamber 14, or snap-fit ​​connection. No specific limitation is made in this utility model; those skilled in the art can choose according to the actual situation. In this embodiment, the condenser coil is welded and fixed to the metal plate 7, which is then fixedly installed in the condensation zone 10 of the vacuum coating chamber 14. This facilitates the installation, maintenance, and replacement of the condenser coil. Simultaneously, the metal plate 7 has a large surface area, increasing the heat exchange area between the condenser coil and the surrounding environment. When the coolant in the condenser coil absorbs heat, the heat can be dissipated more quickly into the surrounding space through the metal plate 7, improving heat dissipation efficiency and enhancing the condensation effect. This allows the condensation zone 10 of the vacuum coating chamber 14 to cool down more quickly, meeting the low-temperature environment requirements of the coating process.

[0058] Furthermore, the positional relationship between the condensation zone 10 and the coating zone 11 in this invention can be varied.

[0059] Option 1: As Figure 7 As shown, in this utility model, the condensation zone 10 is located at the lower part of the vacuum coating chamber 14, and the coating zone 11 is located at the upper part of the vacuum coating chamber 14. Correspondingly, the carrier assembly 4 is set at the bottom of the coating zone 11, and the evaporation source 3 is set at the top of the coating zone 11.

[0060] During operation, the evaporation source 3, located at the top of the coating zone 11, converts the coating raw materials into gaseous atoms or molecules through heating and other methods. Because the evaporation source 3 is at the top, the generated gaseous coating material begins to diffuse downwards due to its own thermal motion and gravity. The carrier assembly 4 is installed at the bottom of the coating zone 11, on which the coating substrate is placed. As the gaseous coating material diffuses downwards, it gradually deposits on the surface of the coating substrate below, forming a uniform thin film on the surface of the coating substrate, thus completing the vapor deposition coating operation. Meanwhile, the condensation zone 10 located below the vacuum coating chamber 14 cools the coating substrate.

[0061] Option 2: Figure 3 , 6 As shown, the condensation zone 10 is located at the upper part of the vacuum coating chamber 14, the coating zone 11 is located at the lower part of the vacuum coating chamber 14, the carrier assembly 4 is disposed at the top of the coating zone 11, and the evaporation source 3 is disposed at the bottom of the coating zone 11. In this embodiment, the evaporation source 3 is disposed at the middle position of the bottom of the vacuum coating chamber 14.

[0062] During operation, the evaporation source 3, located at the bottom of the coating zone 11, converts solid or liquid coating raw materials into a gaseous state through resistance heating, electron beam heating, or other methods. Because the evaporation source 3 is positioned below, the gaseous coating material gains sufficient kinetic energy and diffuses upwards, randomly spreading into the surrounding space. In this structure, the space above the coating zone 11 becomes its primary diffusion direction. Simultaneously, the carrier assembly 4 is positioned at the top of the coating zone 11, supporting the coating substrate. As the gaseous coating material diffuses upwards, it contacts the surface of the coating substrate, where gaseous molecules are adsorbed and deposited, gradually forming a thin film. Because the carrier assembly 4 is suspended and unobstructed, the gaseous coating material can approach the coating substrate relatively uniformly from all directions, which is beneficial for forming a uniform coating layer on the surface of the coating substrate.

[0063] The preferred design is the one in Scheme 2. On the one hand, the evaporation source 3 is at the bottom, and the gaseous material diffuses upward, which enhances natural convection and makes the diffusion path more uniform. Moreover, there is no deposition loss at the bottom of the cavity when the gaseous material diffuses upward, resulting in high target material utilization. On the other hand, the carrier assembly 4 is located at the top of the coating area 11, with no obstruction on all sides, allowing the gaseous material to be incident from multiple angles, resulting in good coating uniformity for complex structure substrates.

[0064] Furthermore, based on Scheme 2, multiple spaced connecting pillars 12 can be provided on the top wall of the vacuum coating chamber 14. The connecting pillars 12 penetrate the heat insulation plate 2, and a groove structure 121 is provided at the end of the connecting pillar 12 near the coating area 11. A limiting clip 8 is provided in the groove structure 121 to prevent the heat insulation plate 2 from falling off, thus achieving double insurance for the safe limiting of the heat insulation plate 2. In this embodiment, the limiting clip 8 can be a limiting ring, a spring structure, etc.

[0065] It should be noted that there are various ways to install and fix the heat insulation plate 2 and the metal plate 7 in the vacuum coating cavity 14, such as welding, snap-fit, and buckle connection. This utility model does not make a specific limitation. In this embodiment, the metal plate 7 and the heat insulation plate 2 are arranged in parallel, and the condenser coil is placed between the metal plate 7 and the heat insulation plate 2. One side surface of the condenser coil abuts against the metal plate 7, and the other side surface abuts against the heat insulation plate 2. Correspondingly, the connecting support column 12 passes through the metal plate 7 and the heat insulation plate 2 in sequence and extends into the coating area 11. A shoulder structure 122 is formed at the contact part of the surface of the connecting support column 12 and the metal plate 7 away from the heat insulation plate 2. The shoulder structure 122 limits the upward displacement of the metal plate 7 along the vacuum coating cavity 14, and cooperates with the limiting clip 8 in the groove structure 121 of the connecting support column 12 to limit the downward displacement of the heat insulation plate 2 along the vacuum coating cavity 14, thereby realizing the fixed installation of the metal plate 7, the condenser coil, and the heat insulation plate 2 in the vacuum coating cavity 14.

[0066] Furthermore, in some specific embodiments, a heating component is provided at the evaporation source 3 of the coating area 11, which is used to heat the evaporation source 3. There are various heating components that can heat the evaporation source 3, such as resistance heating, electron beam heating, etc. Preferably, the heating component is a resistance heating element, which has a simple structure, low cost, and is easy to control the temperature. The heating power and temperature can be precisely controlled by adjusting the current.

[0067] Furthermore, in some specific embodiments, such as Figure 3 , 4 As shown in Figure 6, the top wall of the vacuum coating chamber 14 is provided with a columnar connector 13, which extends towards the coating area 11 and penetrates the heat insulation plate 2, thereby transferring a portion of the low temperature of the condensation area 10 to the coating area 11. A flange structure 131 is provided at one end of the columnar connector 13 near the coating area 11.

[0068] like Figure 5 As shown, the carrier assembly 4 includes a carrier body 40, which is used to support the coating substrate 41; the edge of the top of the carrier body 40 is bent inward to form a hook structure 401, which is suspended at the flange structure 131 of the columnar connector 13.

[0069] In this embodiment, the columnar connector 13 is a cylindrical connector; the flange structure 131 is an annular flange provided at one end of the columnar connector 13; and hook structures 401 are formed on both sides of the top end of the carrier body 40 to increase the stability of the suspension setup. Meanwhile, the coating substrate 41 can be a silicon wafer, glass sheet, etc. For example, when the evaporation source 3 is a perovskite material, the evaporated perovskite molecules form a film on the lower surface of the silicon wafer or glass sheet, forming a perovskite film layer. Additionally, the carrier assembly 4 may also include a mask plate, such as... Figure 9 As shown, the mask 42 is generally placed between the coating substrate 41 and the evaporation source 3. During the coating process, the gaseous coating material evaporated from the evaporation source 3 passes through a specific pattern or cutout area on the mask 42 and is then deposited on the surface of the coating substrate 41. In this way, the deposition position and shape of the coating material on the coating substrate 41 can be precisely controlled by the mask 42, thereby forming a thin film pattern on the coating substrate 41 corresponding to the pattern on the mask 42.

[0070] In use, the columnar connector 13 allows the carrier assembly 4 to be adjusted at any installation angle to meet the coating requirements at different angles.

[0071] The specific steps of the process for preparing perovskite by vacuum evaporation using the condensation device described above for vacuum coating equipment are as follows:

[0072] 1) Add a perovskite target to the evaporation crucible of the evaporation source. Then, install the coating substrate 41, such as a silicon wafer or glass plate, onto the carrier body 40 of the carrier assembly 4. If there is a mask 42, install it at a suitable position between the coating substrate 41 and the evaporation source 3. According to Scheme 2, the carrier assembly 4 is suspended by a hook structure 401 at the flange structure 131 of the columnar connector 13. The installation angle of the carrier assembly 4 can be adjusted according to the coating requirements. Then, close the door of the vacuum coating machine body 1.

[0073] 2) Start the vacuum pump and evacuate the vacuum coating chamber 14 to a vacuum level of 5×10⁻⁶. -4 Below Pa, i.e., evacuated to a low vacuum state, a low-pressure environment is created for subsequent coating processes, reducing the interference of air molecules on the coating process.

[0074] 3) Turn on the cooling system 6 and the refrigeration system 5 until the condenser coil stabilizes at a suitable temperature.

[0075] 4) Begin the vapor deposition process.

[0076] 5) After the evaporation coating is completed, the condenser coil stops working, that is, the cooling system 6 and the refrigeration system 5 are turned off to stop the equipment from cooling down.

[0077] 6) Perform a vacuum breaking operation on the vacuum coating chamber 14, that is, slowly introduce air to restore the gas pressure inside the chamber to normal pressure. Then open the door of the vacuum coating machine body 1, take out the sample coated with perovskite film, and complete the entire perovskite low-temperature coating process.

[0078] It should be noted that in this process, the vacuum coating chamber 14 must first be evacuated to a low vacuum state, and then the cooling system 6 and the refrigeration system 5 must be started to cool it down. Then the evaporation process begins. After the evaporation process is completed, the cooling system 6 and the refrigeration system 5 must be cooled down first, and then the vacuum in the vacuum coating chamber 14 must be broken to prevent water vapor in the air from condensing near the condensation coil during cooling, which would affect the performance of the perovskite.

[0079] Based on the aforementioned condensation device for vacuum coating equipment, this utility model further provides a vacuum coating equipment that includes the aforementioned condensation device for vacuum coating equipment. The vacuum coating equipment provided by this utility model encompasses all the technical solutions of all embodiments of the aforementioned condensation device for vacuum coating equipment, and therefore possesses at least all the beneficial effects brought about by the technical solutions of the aforementioned condensation device embodiments for vacuum coating equipment, which will not be elaborated upon here.

[0080] The present invention has been further described above with reference to specific embodiments. However, it should be understood that the specific description herein should not be construed as limiting the substance and scope of the present invention. Various modifications made by those skilled in the art to the above embodiments after reading this specification are all within the scope of protection of the present invention.

Claims

1. A condensation device for a vacuum coating equipment, characterized in that: The condensation device includes a vacuum coating machine body, a sealable vacuum coating cavity is formed inside the vacuum coating machine body, and a heat insulation plate is provided inside the vacuum coating cavity, which divides the vacuum coating cavity into a condensation zone and a coating zone. The coating area is provided with an evaporation source and a carrier assembly for supporting the coating substrate. The carrier assembly is installed on the surface of the heat insulation plate facing the coating area. The condensation zone is equipped with a cooling system.

2. The condensation device for vacuum coating equipment according to claim 1, characterized in that: The condensation device also includes a refrigeration system located outside the vacuum coating machine body, and the cold end of the refrigeration system is thermally coupled to the cooling system.

3. The condensation device for vacuum coating equipment according to claim 2, characterized in that: The cooling system includes a closed-loop coolant circuit, a portion of which is located within the refrigeration system and thermally coupled to the cold end of the refrigeration system, while the other portion of the coolant circuit is located within the condensation zone.

4. The condensation device for vacuum coating equipment according to claim 3, characterized in that: The coolant circuit consists of a condenser coil.

5. The condensation device for vacuum coating equipment according to claim 4, characterized in that: The condensation device for the vacuum coating equipment also includes a metal plate, which is fixedly installed in the condensation zone of the vacuum coating cavity, and the condensation coil is fixedly installed on the metal plate.

6. The condensation device for vacuum coating equipment according to claim 1, characterized in that: The condensation zone is located at the upper part of the vacuum coating chamber, the coating zone is located at the lower part of the vacuum coating chamber, the carrier assembly is located at the top of the coating zone, and the evaporation source is located at the bottom of the coating zone.

7. The condensation device for vacuum coating equipment according to claim 6, characterized in that: The top wall of the vacuum coating chamber is provided with a columnar connector, which extends toward the coating area and penetrates the heat insulation plate; the end of the columnar connector near the coating area is provided with a flange structure. The vehicle assembly includes a vehicle body, and a hook structure is formed on the side of the vehicle body. The hook structure is suspended from the flange structure of the columnar connector.

8. The condensation device for vacuum coating equipment according to claim 6, characterized in that: The top wall of the vacuum coating chamber is provided with a plurality of spaced connecting pillars, which penetrate the heat insulation plate and have a groove structure at the end of the connecting pillar near the coating area, and a limiting clip is provided in the groove structure.

9. The condensation device for vacuum coating equipment according to claim 1, characterized in that: A heating component is provided at the evaporation source of the coating area, and the heating component is used to heat the evaporation source.

10. A vacuum coating apparatus, characterized in that: The condensation device for vacuum coating equipment as described in any one of claims 1 to 9 is included.

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