Chip test fixture

Abstract

The utility model relates to a chip test fixture, including bottom plate, outer cover, press fit mechanism, clamping mechanism, temperature control subassembly and test subassembly, press fit mechanism is installed the lower end of bottom plate, the output end of press fit mechanism passes upwards through bottom plate and is connected with outer cover, outer cover and bottom plate can form cavity, test subassembly and clamping mechanism are respectively installed the upper end of bottom plate, and the temperature control subassembly is connected with the temperature control subassembly. The temperature control assembly is installed at the upper end of the testing assembly, a shifting plate is arranged at the output end of the clamping mechanism, the output end of the shifting plate is of an elastic structure, a notch is formed in the temperature control assembly, and the elastic structure can stretch into the position above the notch. The chip test fixture realizes rapid clamping, loosening and replacement of the chip, shortens the installation time of the chip, greatly improves the test efficiency, can adapt to chips with different sizes and different packaging forms, improves the compatibility of the fixture in diversified chip test scenes, ensures the stable clamping and pressing of the chip, thereby ensuring the reliable electrical connection, and greatly improving the test efficiency. And the accuracy of a test result is ensured.

Description

Technical Field

[0001] This utility model relates to the field of fixture technology, specifically to a chip testing fixture. Background Technology

[0002] In semiconductor manufacturing, chip testing is a critical step in ensuring product quality and performance. Each chip needs to be tested to ensure it meets design and performance specifications. Batch testing of chips relies on fixtures, but currently available chip testing fixtures have certain limitations in their structural design, such as complex clamping mechanisms, inconvenient operation, and low testing efficiency. Most testing fixtures require considerable time to adjust the clamping force and position when clamping and fixing chips, and are prone to issues like chips not being securely fixed or being damaged by over-clamping. Furthermore, some traditional fixtures have poor compatibility with chips of different sizes. When testing chips of various specifications, different fixtures are often required, which not only increases testing costs but also extends the testing cycle. Utility Model Content

[0003] To address the aforementioned technical problems, this utility model provides a chip testing fixture that not only improves testing efficiency but also solves issues related to compatibility and reliability.

[0004] The technical solution of this utility model is as follows: a chip testing fixture, including a base plate, an outer cover, a pressing mechanism, a clamping mechanism, a temperature control component, and a testing component. The pressing mechanism is installed at the lower end of the base plate, and the output end of the pressing mechanism passes upward through the base plate and is connected to the outer cover. The outer cover can form a cavity with the base plate. The testing component and the clamping mechanism are respectively installed at the upper end of the base plate. The temperature control component is installed at the upper end of the testing component. The output end of the clamping mechanism is provided with a toggle plate. The output end of the toggle plate is an elastic structure. The temperature control component is provided with a notch, and the elastic structure can extend into the notch.

[0005] Furthermore, the base plate is provided with guide posts, and the lower end of the outer cover is provided with guide holes, with the guide posts and guide holes being slidably connected.

[0006] Furthermore, the temperature control component is provided with a limiting plate at its upper end, and the limiting plate is provided with a limiting groove that runs vertically through it. The limiting groove corresponds to the position of the notch, and the elastic structure is located between the limiting groove and the notch.

[0007] Furthermore, the base plate is provided with a dew point monitoring component, and the monitoring end of the dew point monitoring component is located in the cavity.

[0008] Furthermore, a drying gas diffuser is provided on the base plate, and the drying gas diffuser is located in the cavity.

[0009] Furthermore, the temperature control component includes a heating element and a heat exchange plate. The heating element is installed on the upper end of the test component, the heat exchange plate is installed on the upper end of the heating element, and the limiting plate is installed on the upper end of the heat exchange plate. The heat exchange plate has a gas flow channel inside, with the inlet of the gas flow channel located on the bottom plate and the outlet located in the cavity.

[0010] Furthermore, it also includes a temperature sensor, which is mounted on the heat exchange plate.

[0011] Furthermore, the pressing mechanism includes a motor, a lead screw, and a pressing frame. The motor is mounted on the base plate, the lead screw is rotatably connected to the base plate, the motor and the lead screw are connected by gear and chain transmission, the lead screw is connected to the pressing frame, and the outer cover is mounted on the pressing frame.

[0012] Furthermore, a pressure head is provided at the lower end of the pressure frame.

[0013] Furthermore, a position sensor is provided on the base plate, and the position sensor is located on the side of the pressure frame.

[0014] Compared with existing technologies, the advantages of this invention are as follows: This chip testing fixture enables rapid clamping, loosening, and replacement of chips, shortening chip installation time and significantly improving testing efficiency during large-scale chip production testing. Simultaneously, the limiting groove and elastic structure can adapt to chips of different sizes and packaging forms, improving the fixture's compatibility with diverse chip testing scenarios. Furthermore, the elastic structure and pressure head ensure stable chip clamping and pressing, thereby ensuring reliable electrical connections and the accuracy of test results, further enhancing the reliability of this fixture. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a top-view structural diagram of the present invention;

[0017] Figure 2 This is a structural schematic diagram of the present invention viewed from below.

[0018] Figure 3 This is a schematic diagram of the pressing mechanism of this utility model from a top view.

[0019] Figure 4 This is a schematic diagram of the pressing mechanism of this utility model from a bottom view angle;

[0020] Figure 5 for Figure 4 Enlarged view of point A in the middle;

[0021] Figure 6 This is a schematic diagram of the structure of the outer cover of this utility model;

[0022] Figure 7 This is a schematic diagram of the assembly of the test component and clamping mechanism of this utility model;

[0023] Figure 8 for Figure 7 Enlarged view of point B in the middle;

[0024] Figure 9 This is a schematic diagram of the structure of the toggle plate of this utility model;

[0025] Figure 10 for Figure 9 Enlarged view of point C in the middle.

[0026] The components include: 1. Base plate; 101. Guide post; 2. Outer cover; 201. Guide hole; 3. Motor; 4. Gear; 5. Chain; 6. Lead screw; 7. Pressure frame; 8. Pressure head; 9. Test assembly; 901. Notch; 10. Heating element; 11. Heat exchange plate; 1101. Gas flow channel; 12. Limiting plate; 1201. Limiting groove; 13. Clamping mechanism; 14. Actuating plate; 15. Elastic structure; 16. Chip; 17. Dew point monitoring assembly; 18. Drying gas diffuser. Detailed Implementation

[0027] To further illustrate the technical means and effects of this utility model in achieving its intended purpose, the following detailed description of the specific implementation methods, structure, features and effects of this utility model, in conjunction with the accompanying drawings and preferred embodiments, is provided below.

[0028] like Figure 1-10As shown, a chip testing fixture includes a base plate 1, an outer cover 2, a pressing mechanism, a clamping mechanism 13, a temperature control component, and a testing component 9. The pressing mechanism is mounted on the lower end of the base plate 1, and its output end passes upward through the base plate 1 and connects to the outer cover 2. The outer cover 2 can move downward under the drive of the pressing mechanism to form a cavity with the base plate 1. The testing component 9 and the clamping mechanism 13 are respectively mounted on the upper end of the base plate 1. The testing component 9 is used to test a chip 16, and the temperature control component is mounted on the upper end of the testing component 9 to provide a high and low temperature environment for the chip 16. The output end of the clamping mechanism 13 is equipped with a toggle plate 14, and the output end of the toggle plate 14 is an elastic structure 15. The temperature control component has a notch 901 for inserting the chip 16. Driven by the clamping mechanism 13, the toggle plate 14 drives the elastic structure 15 to extend above the notch 901 and hold the chip 16 in place, ensuring that the pins of the chip 16 are connected to the probes of the test component 9, thereby successfully testing the chip 16. The elastic structure 15 is bow-shaped and made of an insulating material with a certain deformation capability, which can be used repeatedly without causing a short circuit in the chip 16. The test component 9 includes an MCU board for IO signal conversion and a connector for signal conversion, both located in a cavity on the base plate 1.

[0029] In the above embodiment, the temperature control component is provided with a limiting plate 12 at its upper end. The limiting plate 12 has a limiting groove 1201 that runs vertically through it. The limiting groove 1201 corresponds to the notch 901. An elastic structure 15 is located between the limiting groove 1201 and the notch 901. The limiting groove 1201 provides positioning for the chip 16. After the chip 16 is placed in, the elastic structure 15 holds the chip 16 against the limiting groove 1201 from the side, ensuring that the pins of the chip 16 are aligned with the probes of the test component 9. The base plate 1 is provided with a dew point monitoring component 17. The monitoring end of the dew point monitoring component 17 is located in the cavity and is used to monitor the dew point in the cavity. The base plate 1 is provided with a dry gas diffuser 18, which is located in the cavity. The dry gas diffuser 18 is filled with dry gas, which is released into the cavity during the low-temperature test of the chip 16 to prevent frost from forming inside the cavity.

[0030] The temperature control assembly includes a heating element 10 and a heat exchange plate 11. The heating element 10 is mounted on the upper end of the test assembly 9, and the heat exchange plate 11 is mounted on the upper end of the heating element 10. A limiting plate 12 is mounted on the upper end of the heat exchange plate 11. The heat exchange plate 11 has a gas flow channel 1101 inside, with the inlet of the gas flow channel 1101 located on the base plate 1 and the outlet located in the cavity. The heating element 10 provides heat to the heat exchange plate 11 and the cavity, providing a high-temperature environment for testing the chip 16. Cold air is introduced into the gas flow channel 1101 and exchanges heat with the cavity through the heat exchange plate 11, providing a low-temperature environment for testing the chip 16. Through the above means, a testing environment of -55℃ to 150℃ can be provided for the chip 16. The temperature control assembly also includes a temperature sensor, which is mounted on the heat exchange plate 11. The temperature sensor can be electrically connected to the test assembly 9 or an external controller for automated temperature control.

[0031] The pressing mechanism includes a motor 3, a lead screw 6, and a pressing frame 7. The motor 3 is mounted on the base plate 1, and the lead screw 6 is rotatably connected to the base plate 1. The motor 3 and the lead screw 6 are connected by a gear 4 and a chain 5. The lead screw 6 is also connected to the pressing frame 7. The outer cover 2 is mounted on the pressing frame 7. Driven by the motor 3, multiple lead screws 6 on the base plate 1 rotate synchronously through the gear 4 and chain 5, thereby pressing or releasing the chip 16 by the pressing frame 7, and simultaneously opening and closing the outer cover 2. The lower end of the pressing frame 7 is provided with a pressing head 8, which protrudes downward on both sides to hold the two ends of the chip 16, making the connection between the chip 16 pins and the probe more stable and ensuring normal testing. The base plate 1 is provided with a guide post 101, and the lower end of the outer cover 2 is provided with a guide hole 201. The guide post 101 is slidably connected to the guide hole 201 to guide the opening and closing of the pressing frame 7. The base plate 1 is provided with a position sensor located on the side of the pressing frame 7 to monitor whether the pressing frame 7 is in position.

[0032] Description of the working principle of this utility model:

[0033] In the automated production line, multiple sets of chips 16 are transported side by side. A robotic arm picks up and places a matrix of chips 16 into the limiting groove 1201 of the fixture. Then, the cylinder of the clamping mechanism 13 pushes them out. Through the linkage mechanism, the actuating plate 14 is driven to move, so that the elastic structure 15 abuts against the chip 16 from the side and presses the chip 16 against the side of the limiting groove 1201. Next, the pressing mechanism drives the outer cover 2 to move downward and form the cavity. At the same time, the pressing head 8 presses the chip 16. At this time, the pins of the chip 16 are connected to the probes at the upper end of the test component 9, and the test component 9 obtains the initial test data of the chip 16. The temperature control component makes the inside of the cavity reach a certain temperature condition, and tests the output data of the chip 16 under high and low temperature changes and extreme temperatures, thereby determining whether the chip 16 is qualified.

[0034] This chip 16 test fixture enables rapid clamping, loosening, and replacement of the chip 16, shortening the chip 16 installation time and significantly improving testing efficiency during large-scale chip 16 production testing. Simultaneously, the limiting groove 1201 and the elastic structure 15 can adapt to chips 16 of different sizes and packaging forms, improving the fixture's compatibility with diverse chip 16 testing scenarios. Furthermore, the elastic structure 15 and the pressure head 8 ensure stable clamping and pressing of the chip 16, thereby ensuring reliable electrical connections and the accuracy of test results, further enhancing the reliability of this fixture.

[0035] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A chip testing fixture, comprising a base plate, an outer cover, a pressing mechanism, a clamping mechanism, a temperature control component, and a testing component, characterized in that: The pressing mechanism is installed at the lower end of the base plate. The output end of the pressing mechanism passes upward through the base plate and is connected to the outer cover. The outer cover can form a cavity with the base plate. The test component and the clamping mechanism are respectively installed at the upper end of the base plate. The temperature control component is installed at the upper end of the test component. The output end of the clamping mechanism is provided with a toggle plate. The output end of the toggle plate is an elastic structure. The temperature control component is provided with a notch. The elastic structure can extend into the notch.

2. The chip testing fixture according to claim 1, characterized in that: The base plate is provided with guide posts, and the lower end of the outer cover is provided with guide holes. The guide posts and guide holes are slidably connected.

3. The chip testing fixture according to claim 1, characterized in that: The temperature control component is provided with a limiting plate at the upper end, and the limiting plate has a limiting groove that runs through it from top to bottom. The limiting groove corresponds to the position of the notch, and the elastic structure is located between the limiting groove and the notch.

4. The chip testing fixture according to claim 1, characterized in that: The base plate is equipped with a dew point monitoring component, and the monitoring end of the dew point monitoring component is located in the cavity.

5. The chip testing fixture according to claim 1, characterized in that: A dry gas diffuser is provided on the base plate, and the dry gas diffuser is located in the cavity.

6. The chip testing fixture according to claim 1, characterized in that: The temperature control component includes a heating element and a heat exchange plate. The heating element is installed on the upper end of the test component, the heat exchange plate is installed on the upper end of the heating element, and the limiting plate is installed on the upper end of the heat exchange plate. The heat exchange plate has a gas flow channel inside, with the inlet of the gas flow channel located on the bottom plate and the outlet located in the cavity.

7. The chip testing fixture according to claim 6, characterized in that: It also includes a temperature sensor, which is mounted on the heat exchange plate.

8. The chip testing fixture according to claim 1, characterized in that: The pressing mechanism includes a motor, a lead screw, and a pressing frame. The motor is mounted on the base plate, the lead screw is rotatably connected to the base plate, the motor and the lead screw are connected by gear and chain transmission, the lead screw is connected to the pressing frame, and the outer cover is mounted on the pressing frame.

9. The chip testing fixture according to claim 8, characterized in that: The lower end of the pressure frame is provided with a pressure head.

10. The chip testing fixture according to claim 8, characterized in that: A position sensor is provided on the base plate, and the position sensor is located on the side of the pressure frame.

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