Variable frequency mutual inductor tester

Abstract

The utility model belongs to the field of testers, and particularly relates to a frequency conversion mutual inductor tester. According to the technology, a protection groove with an upward opening is included, a sealing plate used for sealing the protection groove is horizontally installed at a groove opening of the protection groove, a processor used for processing data and a battery used for supplying power are installed in the protection groove, a vertically-through through groove is formed in the sealing plate, and an interface module used for being externally connected with equipment is installed in the through groove; the interface module is in communication connection with the processor, the interface module is electrically connected with a HotSwap controller used for controlling a power supply of the interface module, the HotSwap controller is electrically connected with the battery, and the processor is in communication connection with the HotSwap controller. According to the utility model, different interfaces in the interface module are connected with different devices, so that function expansion is carried out, and the frequency conversion mutual inductor tester can temporarily have more functions.

Description

Technical Field

[0001] This utility model belongs to the field of testing instruments, and in particular relates to a frequency converter transformer tester. Background Technology

[0002] In the development of fields such as power and signal transmission, variable frequency transformers are used to convert transmitted current or signals. To ensure that variable frequency transformers can be used normally, a variable frequency transformer tester is needed to test them.

[0003] The processor and battery of the existing variable frequency transformer tester are installed in a protective slot. A sealing plate is detachably installed at the opening of the slot to seal the slot. The sealing plate is equipped with a display screen for displaying monitoring information, a connection port for connecting to the test line, and various control buttons. In actual use, the variable frequency transformer is connected to the connection port through the test line. After connection, it is operated through the control buttons, and the final test results are displayed on the screen.

[0004] The existing variable frequency transformer testers lack functional expansion capabilities. During use, the fixed connection ports prevent the connection of external adapters for testing older or non-standard variable frequency transformers. Furthermore, different transformer models require different winding numbers to be connected to the tester. Since existing testers cannot be equipped with additional interfaces to accommodate the required number of connections, operators must carry multiple testers, which is inconvenient. Additionally, when testing with sensors, the lack of direct sensor connection interfaces necessitates carrying a separate sensor-based testing instrument, further complicating the process. Utility Model Content

[0005] The purpose of this invention is to provide a variable frequency transformer tester that can be functionally expanded.

[0006] The aforementioned variable frequency transformer tester includes an upward-opening protective groove. A sealing plate is horizontally installed at the opening of the protective groove to seal it. A processor for data processing and a battery for power supply are installed inside the protective groove. A through slot is provided on the sealing plate, and an interface module for connecting external devices is installed in the through slot. The interface module is communicatively connected to the processor and electrically connected to a HotSwap controller for controlling the power supply of the interface module. The HotSwap controller is electrically connected to the battery, and the processor is communicatively connected to the HotSwap controller.

[0007] Furthermore, the interface module includes a D-Sub interface, a PCIe interface, and a Type-C interface. The D-Sub interface, PCIe interface, and Type-C interface are all communicatively connected to the processor, and the D-Sub interface, PCIe interface, and Type-C interface are all electrically connected to the HotSwap controller.

[0008] Furthermore, the D-Sub interface, PCIe interface, and Type-C interface are electrically connected to a π-type filter, which is electrically connected to the HotSwap controller.

[0009] Furthermore, the processor is connected to an isolator, and the D-Sub interface, PCIe interface, and Type-C interface are all connected to the isolator.

[0010] Furthermore, a partition is horizontally installed inside the protective tank, with the isolator, π-type filter, and HotSwap controller all installed on top of the partition, and the battery and processor installed at the bottom inside the protective tank.

[0011] Furthermore, it also includes a housing, the protective groove being located inside the housing, and a lid hinged to the top of the housing for sealing the housing.

[0012] Furthermore, a heat dissipation vent for internal heat dissipation is provided on the left side wall of the protective groove, and a dustproof net is installed inside the heat dissipation vent. An air outlet corresponding to the heat dissipation vent is provided on the left side wall of the box.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] This utility model allows for connection to different devices through different interfaces in the interface module, thereby expanding its functionality and enabling the frequency converter transformer tester to temporarily have more functions. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] Figure 2 for Figure 1 A top view of the box without the lid;

[0017] Figure 3 for Figure 1 A schematic diagram of the front structure;

[0018] Figure 4 This is a circuit module diagram of the present invention;

[0019] Figure 5 This is a flowchart of the present invention;

[0020] The components in the diagram are named as follows: 1. Cabinet; 2. Cabinet cover; 3. Isolator; 4. Interface module; 5. Sealing plate; 6. π-type filter; 7. Separator; 8. Battery; 9. Protective slot; 10. Processor; 11. HotSwap controller; 12. D-Sub interface; 13. PCIe interface; 14. Type-C interface. Detailed Implementation

[0021] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention. Example

[0022] The variable frequency transformer tester described in this embodiment includes an upward-opening protective groove 9, and a sealing plate 5 for sealing the protective groove 9 is horizontally installed at the opening of the groove 9. Figure 1 As shown, the sealing plate 5 is horizontally installed at the opening of the protective groove 9 to seal the protective groove 9. In actual application, the sealing plate 5 is detachably installed on the protective groove 9 by screws or bolts, so that when it is necessary to maintain or replace the internal components of the protective groove 9, only the sealing plate 5 needs to be removed.

[0023] The protective groove 9 houses a processor 10 for data processing and a battery 8 for power supply. Figure 1 As shown, both the processor 10 and the battery 8 are installed at the bottom of the protective groove 9. In actual applications, the processor 10 is the processor that comes with the existing frequency converter transformer tester, such as the automatic processor 10 in the 760E and 780E frequency converter transformer testers.

[0024] The sealing plate 5 has a through groove that connects the upper and lower parts. An interface module 4 for connecting external devices is installed in the through groove, such as... Figure 1 and Figure 2 As shown, interface module 4 is installed in the through slot, and the side wall of interface module 4 is in contact with the inner side wall of the through slot.

[0025] To further explain, such as Figure 1 , Figure 2 , Figure 4 and Figure 5 As shown, interface module 4 includes a D-Sub interface 12, a PCIe interface 13, and a Type-C interface 14. The D-Sub interface 12, PCIe interface 13, and Type-C interface 14 are all communicatively connected to the processor 10, and the D-Sub interface 12, PCIe interface 13, and Type-C interface 14 are all electrically connected to the HotSwap controller 11.

[0026] In practical applications, the D-Sub interface 12, PCIe interface 13, and Type-C interface 14 are connected to the processor 10 via communication lines.

[0027] In practical applications, D-Sub interface 12, PCIe interface 13 and Type-C interface 14 are existing technologies; D-Sub interface 12 has a robust structure and supports mixed transmission of multiple signals; PCIe interface 13 supports high-speed differential signals; Type-C interface 14 supports reversible insertion, high bandwidth and PD power supply.

[0028] Interface module 4 is connected to processor 10 via a communication line.

[0029] In practical applications, interface module 4 may also include interfaces such as M12 circular connection interface, HSD interface and MXM interface.

[0030] Interface module 4 is electrically connected to HotSwap controller 11, which controls the power supply of interface module 4. HotSwap controller 11 is electrically connected to battery 8. In practical applications, the power output terminal of HotSwap controller 11 is connected to the power input terminal of interface module 4 via a wire; the power input terminal of HotSwap controller 11 is connected to the power output terminal of battery 8 via a wire. In practical applications, HotSwap controller 11 can be models such as TPS2490 and MAX5976.

[0031] In practical applications, the positive terminal of battery 8 is connected to the VIN pin of HotSwap controller 11, and the negative terminal of battery 8 is connected to the GND pin of HotSwap controller 11; the VOUT pin of HotSwap controller 11 is connected to the power input pin of interface module 4.

[0032] The processor 10 is communicatively connected to the HotSwap controller 11. The signal input terminal of the processor 10 is connected to the signal output terminal of the HotSwap controller 11 via a communication line. The PRESENT pin of the HotSwap controller 11 is connected to the GPIO input of the processor 10, and the SDA / SCL (I2C) of the controller is connected to the I2C bus pin of the processor 10.

[0033] In this embodiment, during use, the frequency converter transformer is connected to the wiring port on the frequency converter transformer tester via a detection line, allowing the tester to test the transformer. When additional wiring ports are needed or sensors are required to test the transformer, the wiring device or sensor is inserted into the corresponding interface in interface module 4. Simultaneously, the HotSwap controller 11 controls the current in interface module 4 to prevent surge currents that could damage the power supply when the wiring device or sensor is inserted. Furthermore, if current or voltage issues arise, the HotSwap controller 11 will immediately cut off the power to prevent wiring burnout. After the wiring device or sensor is connected, it connects to the frequency converter transformer, enabling the tester to test different models of frequency converter transformers or perform tests using sensors. This allows for functional expansion through different interfaces in interface module 4, temporarily providing the frequency converter transformer tester with additional functions. Example

[0034] This embodiment further illustrates the technology. The D-Sub interface 12, PCIe interface 13, and Type-C interface 14 are electrically connected to a π-type filter 6. The π-type filter 6 is electrically connected to the HotSwap controller 11. Figure 1 and Figure 4 As shown; D-Sub interface 12, PCIe interface 13 and Type-C interface 14 are all connected to π-type filter 6 via wires, and π-type filter 6 is connected to HotSwap controller 11 via wires; in practical applications, π-type filter 6 performs power filtering to suppress power supply noise; in practical applications, a signal filter can also be installed on the communication line to suppress noise during signal transmission.

[0035] To further explain, such as Figure 1 and Figure 5 As shown, the processor 10 is communicatively connected to the isolator 3. The D-Sub interface 12, PCIe interface 13, and Type-C interface 14 are all communicatively connected to the isolator 3. The processor 10 is connected to the isolator 3 via a communication cable. In practical applications, the isolator 3 blocks ground loop noise to avoid distortion of transmitted information. Example

[0036] This embodiment further illustrates the technology. A partition 7 is horizontally installed inside the protective groove 9. The isolator 3, π-type filter 6, and HotSwap controller 11 are all installed on the top of the partition 7. The battery 8 and processor 10 are all installed at the bottom inside the protective groove 9. As shown in Figure 1, the left end of the partition 7 is installed on the left inner side wall of the protective groove 9, and the right end of the partition 7 is installed on the right inner side wall of the protective groove 9. In practical applications, the internal space of the protective groove 9 is divided into upper and lower spaces by the isolator 3, which facilitates the separate installation of the components inside the protective groove 9. Example

[0037] This embodiment further illustrates the technology, including a housing 1, with the protective groove 9 located inside the housing 1. A cover 2 for sealing the housing 1 is hinged to the top of the housing 1. Figure 1 , Figure 2 He Ru Figure 3 As shown, the outer wall of the protective groove 9 is in contact with the inner wall of the box 1; the box cover 2 is hinged to the top of the box 1 by a hinge or hinge; in actual application, the box cover 2 seals the box 1, thereby protecting the components installed on the sealing plate 5.

[0038] To further explain, a heat dissipation vent is provided on the left side wall of the protective groove 9 for internal heat dissipation. A dustproof net is installed inside the heat dissipation vent. An air outlet corresponding to the heat dissipation vent is provided on the left side wall of the housing 1, which is not shown in the figure. In actual application, the heat dissipation vent is located directly to the right of the air outlet, and the heat dissipation vent and the air outlet are the same size. In actual application, the heat dissipation vent and the air outlet work together to dissipate heat from the inside of the protective groove 9, preventing the temperature inside the protective groove 9 from becoming too high. At the same time, the dustproof net prevents dust from the outer wall from entering the inside of the protective groove 9 through the heat dissipation vent.

Claims

1. A variable frequency transformer tester, comprising an upward-opening protective groove (9), wherein a sealing plate (5) for sealing the protective groove (9) is horizontally installed at the opening of the groove (9), characterized in that: The protective groove (9) is equipped with a processor (10) for processing data and a battery (8) for power supply. The sealing plate (5) has a through groove that is open from top to bottom. An interface module (4) for connecting external devices is installed in the through groove. The interface module (4) is connected to the processor (10) for communication. The interface module (4) is electrically connected to the HotSwap controller (11) for controlling the power supply of the interface module (4). The HotSwap controller (11) is electrically connected to the battery (8). The processor (10) is connected to the HotSwap controller (11) for communication.

2. The frequency converter transformer tester according to claim 1, characterized in that: The interface module (4) includes a D-Sub interface (12), a PCIe interface (13) and a Type-C interface (14). The D-Sub interface (12), PCIe interface (13) and Type-C interface (14) are all connected to the processor (10) for communication. The D-Sub interface (12), PCIe interface (13) and Type-C interface (14) are all connected to the HotSwap controller (11) for electrical connection.

3. The variable frequency transformer tester according to claim 2, characterized in that: The D-Sub interface (12), PCIe interface (13) and Type-C interface (14) are electrically connected to a π-type filter (6), which is electrically connected to the HotSwap controller (11).

4. The frequency converter transformer tester according to claim 3, characterized in that: The processor (10) is communicatively connected to the isolator (3), and the D-Sub interface (12), PCIe interface (13) and Type-C interface (14) are all communicatively connected to the isolator (3).

5. The variable frequency transformer tester according to claim 4, characterized in that: A partition (7) is horizontally installed inside the protective groove (9). The isolator (3), π-type filter (6) and HotSwap controller (11) are all installed on the top of the partition (7), and the battery (8) and processor (10) are all installed at the bottom inside the protective groove (9).

6. The frequency converter transformer tester according to claim 1, characterized in that: It also includes a housing (1), the protective groove (9) is located inside the housing (1), and the top of the housing (1) is hinged with a cover (2) for sealing the housing (1).

7. The variable frequency transformer tester according to claim 2, characterized in that: The protective groove (9) has a heat dissipation vent on its left side wall for internal heat dissipation. A dustproof net is installed inside the heat dissipation vent. The box (1) has an air outlet on its left side wall corresponding to the heat dissipation vent.

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