Radiation detector module, radiation detector device, and imaging system

Abstract

The utility model relates to a radiation detector module, a radiation detector device and an imaging system. The radiation detector module includes: a detector circuit board configured to detect rays incident on the detector circuit board and to convert the rays into an electrical signal; a frame, the detector circuit board disposed on a first side of the frame facing the radiation source and fixed to the frame, the frame including a plurality of through slots through the frame; a signal processing circuit board disposed on a second side of the frame opposite to the first side and fixed to the frame, the signal processing circuit board configured to communicate with the detector circuit board to receive the electrical signal; and the plurality of flexible circuits respectively penetrate through the plurality of through grooves of the frame and are connected with the detector circuit board and the signal processing circuit board.

Description

Technical Field

[0001] This disclosure relates to the field of detection, and more specifically, to a radiation detector module, a radiation detector device including the radiation detector module, and an imaging system including the radiation detector device. Background Technology

[0002] Detection systems (e.g., imaging systems) can be used to image objects and obtain corresponding detection results. For example, CT (Computed Tomography) systems are widely used in various medical institutions to create three-dimensional images of regions of interest, such as the lungs, to help clinicians make accurate medical diagnoses.

[0003] Some detection systems use radiation emitted from a radiation source to irradiate the object being examined, and then use a detector on the opposite side of the radiation source to detect the radiation and further analyze the data to obtain information about the object. For example, a CT system uses X-rays emitted from an X-ray source to scan the object being examined (e.g., the human body), receives the X-rays that have passed through the body through a detector, converts them into digital signals, and then processes and analyzes them by a computer to form an image, such as an image of one or more parts of the human body.

[0004] The radiation detector module is a crucial component of a CT imaging system. However, during installation, maintenance, and assembly, the flexible circuitry within the module is prone to rubbing against each other. This rubbing can damage the flexible circuitry and even affect its connectivity. Furthermore, current radiation detector modules use detector circuit boards formed as single flat planes. The detector elements near the sides of the circuit board gradually deviate from orthogonal to the radiation from the CT system's radiation source. This causes the detected values ​​of these elements to deviate from the actual values, thus affecting the accuracy of the detection results. Utility Model Content

[0005] To address the aforementioned technical problems, some embodiments of this disclosure provide a radiation detector module, including a detector circuit board, a frame, a signal processing circuit board, and multiple flexible circuits. The detector circuit board is configured to detect incident rays and convert them into electrical signals. The detector circuit board is disposed on a first side of the frame facing the radiation source and fixed to the frame, which includes multiple through slots passing through the frame. The signal processing circuit board is disposed on a second side of the frame opposite the first side and fixed to the frame, and is configured to communicate with the detector circuit board to receive the electrical signals. Each flexible circuit passes through one of the multiple through slots of the frame and connects the detector circuit board to the signal processing circuit board.

[0006] In the aforementioned radiation detector module, the detector circuit board and the signal processing circuit board are connected by flexible lines hidden in the frame, thereby avoiding the risk of the flexible lines being damaged by scratching each other during installation, maintenance and assembly.

[0007] Optionally, the detector circuit board may include at least two sub-detector circuit boards, which are angled so that the plane of each sub-detector circuit board faces the radiation source. Thus, each sub-detector circuit board receives the radiation from the radiation source substantially orthogonally, resulting in more accurate detection results.

[0008] Optionally, the frame may include a support portion that contacts the detector circuit board. The support portion includes support segments corresponding to the number of sub-detector circuit boards, adjacent support segments are arranged at an angle, and the surface of each support segment that contacts the sub-detector circuit board faces the radiation source.

[0009] Optionally, the sub-detector circuit board may include a radiating section for mounting a radiation detector and an end for mounting a signal processing unit, with the through slot provided near the end of the frame.

[0010] Optionally, the radiation detector module may further include collimator modules corresponding to the number of sub-detector circuit boards, with adjacent collimator modules arranged at an angle, and each ray channel of the collimator module facing the radiation source.

[0011] Optionally, the signal processing circuit board may have openings corresponding to multiple slot positions of the frame, through which the multiple flexible lines pass respectively.

[0012] Optionally, each of the plurality of flexible lines may include a plug with terminals at both ends, the plug including an arc-shaped retaining tab that mates with a mating slot in a corresponding socket on the detector circuit board to form a locking engagement.

[0013] Optionally, at least a portion of the surface of the first side of the frame may be covered with a radiation shielding layer, the at least a portion of which corresponds to the area where the signal processing unit is located in the signal processing circuit board.

[0014] Optionally, the radiation detector module may further include a housing that at least partially covers the signal processing circuit board and is connected to the frame.

[0015] Some embodiments of this disclosure also provide a radiation detector device, which may include one or more radiation detector modules as described above.

[0016] Optionally, there may be multiple radiation detector modules arranged on the same track.

[0017] Some embodiments of this disclosure also provide an imaging system that may include a radiation detector device and a radiation source as described above, the radiation source being configured to emit the rays toward the radiation detector device.

[0018] Other features and aspects of this disclosure will become clearer from the following detailed description taken in conjunction with the accompanying drawings. Attached Figure Description

[0019] To further illustrate the various embodiments of this utility model, reference will be made to the accompanying drawings. It should be understood that these drawings may only depict typical embodiments of this utility model and are therefore not intended to limit the scope of protection claimed by this utility model.

[0020] Furthermore, the accompanying drawings show the main connections or relative positions of the components, but not all of them, and the components and connections in the drawings are not necessarily drawn to scale in reality.

[0021] Figure 1 An exemplary CT imaging system is shown.

[0022] Figure 2 It shows something similar to Figure 1 A block diagram of an exemplary imaging system for CT imaging.

[0023] Figure 3 An exploded view of a radiation detector module according to some embodiments of the present disclosure is shown.

[0024] Figure 4 Some embodiments according to this disclosure are shown. Figure 3 A bottom view of the radiation detector module, excluding the collimator module.

[0025] Figure 5A and Figure 5B Schematic diagrams of sub-detector circuit boards in a radiation detector module according to some embodiments of the present disclosure are shown.

[0026] Figure 6 A top view of the end of the flexible circuit of a radiation detector module according to some embodiments of the present disclosure is shown.

[0027] Figure 7 Some embodiments according to this disclosure are shown. Figure 3 The bottom view assembly diagram of the radiation detector module, excluding the collimator module and the detector circuit board.

[0028] Figure 8 Some embodiments according to this disclosure are shown. Figure 3 A bottom view of the assembled radiation detector module.

[0029] Figure 9 Some embodiments according to this disclosure are shown. Figure 3 Assembly diagram of the radiation detector module. Detailed Implementation

[0030] The following detailed description is given with reference to the accompanying drawings. The drawings illustrate specific embodiments in which the claimed subject matter can be practiced by way of example. It should be understood that the following specific embodiments are intended to describe typical examples for illustrative purposes, but should not be construed as limiting the present invention; those skilled in the art can make appropriate modifications and adjustments to the disclosed embodiments without departing from the spirit and scope of the claimed subject matter, provided they fully understand the spirit and intent of the present invention.

[0031] Numerous specific details are set forth in the following detailed description in order to provide a thorough understanding of the various described embodiments. However, it will be apparent to those skilled in the art that the various described embodiments can be practiced without these specific details. In other instances, well-known structures have not been described in detail so as not to unnecessarily obscure aspects of the embodiments. Unless otherwise defined, the terminology used herein should have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs.

[0032] The terms “first,” “second,” etc., used in this disclosure and in the claims do not imply any order, quantity, or importance, but are merely used to distinguish different components or features.

[0033] The embodiments disclosed herein are exemplary implementations or examples. References to "embodiment," "one embodiment," "some embodiments," "alternative embodiments," or "other embodiments" in the specification mean that a specific feature or construction described in connection with an embodiment is included in at least some, but not necessarily all, embodiments of the present technology. Various appearances of "embodiment," "one embodiment," or "some embodiments" do not necessarily refer to the same embodiment. Elements or aspects from one embodiment may be combined with elements or aspects from another embodiment.

[0034] In the description of this disclosure, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0035] Unless otherwise defined, the technical or scientific terms used in the claims and description shall have the ordinary meaning as understood by one of ordinary skill in the art to which this utility model pertains. Words such as “comprising” or “including” mean that the elements or objects preceding “comprising” or “including” encompass the elements or objects listed following “comprising” or “including” and their equivalents, but do not exclude other elements or objects.

[0036] It should be understood that the descriptions of position and orientation in this specification are made in conjunction with the specific embodiments shown in the accompanying drawings, and are therefore relative descriptions of position. In other embodiments where the device or apparatus is placed in the opposite or different orientation than that shown in the drawings, these descriptions of position may vary accordingly.

[0037] The following description, in conjunction with the accompanying drawings, details a radiation detector module, a radiation detector device including the radiation detector module, and an imaging system including the radiation detector device that can be used to practice this utility model.

[0038] I. Overview of Imaging Systems

[0039] While this disclosure is primarily described in conjunction with CT imaging apparatuses, it should be understood that the techniques of this disclosure are also applicable to any other suitable type of imaging system, including but not limited to baggage X-ray machines, various medical imaging systems, etc. Various medical imaging systems may include other medical imaging modalities besides CT, such as C-arm imaging systems, positron emission tomography (PET) systems, single-photon emission computed tomography (SPECT) systems, interventional imaging systems (such as angiography, biopsy), x-ray radiographic imaging systems, x-ray fluorescence fluoroscopy imaging systems, etc., and combinations thereof (e.g., multimodal imaging systems, such as PET / CT or SPECT / CT imaging systems). Different types of imaging systems can be adapted to detect corresponding targets. The target can be any suitable type of target. As an example, a baggage X-ray machine can be adapted to detect specific items in baggage. For medical imaging systems, detectable targets include interventions (such as needles, endoscopes, implants, catheters, guidewires, dilators, ablation devices, contrast agents, etc.), lesions (such as tumors), bones, organ and tissue structures, vascular structures, etc. On the other hand, CT imaging systems, for example, can be used not only in the medical field but also in manufacturing, such as for parts inspection.

[0040] Figure 1An exemplary CT imaging system 100 is illustrated. Specifically, the CT imaging system (also referred to as a CT apparatus) 100 is configured to image an examination subject 112 (such as a patient, inanimate object, one or more manufactured parts, industrial parts, foreign objects, etc.). Throughout this disclosure, the terms "examination subject" and "patient" are used interchangeably, and it should be understood that, at least in some embodiments, a patient is a type of examination subject that can be imaged by the CT imaging system 100, and an examination subject may include a patient. In some embodiments, the CT imaging system 100 includes a gantry 102 that may include at least one x-ray radiation source 104 configured to project an x-ray beam (or x-rays) 106 for imaging the examination subject 112. Specifically, the x-ray radiation source 104 is configured to project x-rays 106 toward a detector array 108 positioned on opposite sides of the gantry 102. Although Figure 1 Only a single x-ray radiation source 104 is depicted. However, in some embodiments, multiple x-ray radiation sources 104 may be used to project multiple x-rays 106 toward multiple detectors to obtain projection data corresponding to the object 112 at different energy levels.

[0041] In some embodiments, the X-ray radiation source 104 projects a fan-shaped or conical X-ray beam 106, which is collimated to lie in the xy plane of a Cartesian coordinate system and is generally referred to as the "imaging plane" or "scanning plane." The X-ray beam 106 passes through the object under inspection 112. After attenuation on the object under inspection 112, the X-ray beam 106 is incident on the detector array 108. The intensity of the attenuated radiation beam received at the detector array 108 depends on the attenuation of the X-ray 106 by the object under inspection 112. Each detector element of the detector array 108 generates a separate electrical signal, which is a measure of the beam intensity at the detector location. Intensity measurements from all detectors are acquired individually to generate a transmission distribution.

[0042] In a third-generation CT imaging system, gantry 102 rotates the X-ray radiation source 104 and detector array 108 around the subject 112 in the imaging plane, causing the angle at which the X-ray beam 106 intersects the subject 112 to continuously change. A complete gantry rotation occurs when gantry 102 completes one full 360-degree rotation. A set of X-ray attenuation measurements (e.g., projection data) from detector array 108 at a given gantry angle is called a “view.” Therefore, a view is each incremental position of gantry 102. A “scan” of the subject 112 includes a set of views acquired at different gantry angles or viewing angles during one rotation of the X-ray radiation source 104 and detector array 108.

[0043] In axial scanning, the projection data is processed to construct an image corresponding to a two-dimensional slice taken through the object being examined 112. A method for reconstructing an image from a set of projection data is known in the art as filtered back-projection. This method converts attenuation measurements from the scan into an integer called a “CT number” or “Henry’s unit” (HU), which is used to control the brightness of the corresponding pixel on, for example, a cathode ray tube display.

[0044] In some examples, the CT imaging system 100 may include a depth camera 114, which is positioned on or outside the gantry 102. Figure 1 As shown, a depth camera 114 is mounted on a ceiling 116 positioned above an object 112 and oriented to image the object when it is at least partially outside the rack 102. The depth camera 114 may include one or more light sensors, including one or more visible light sensors and / or one or more infrared (IR) light sensors. In some embodiments, the one or more IR sensors may include one or more sensors within both near-IR and far-IR ranges to achieve thermal imaging. In some embodiments, the depth camera 114 may also include an IR light source. The light sensor may be any 3D depth sensor, such as a time-of-flight (ToF) sensor, a stereo sensor, or a structured light depth sensor, operable to generate a 3D depth image, while in other embodiments, the light sensor may be a two-dimensional (2D) sensor operable to generate a 2D image. In some such embodiments, the 2D light sensor may be used to infer depth based on an understanding of light reflection phenomena to estimate 3D depth. Regardless of whether the light sensor is a 3D depth sensor or a 2D sensor, the depth camera 114 can be configured to output a signal encoding an image to a suitable interface that can be configured to receive the signal encoding the image from the depth camera 114. In other examples, the depth camera 114 may also include other components, such as a microphone, to enable the reception and analysis of directional and / or non-directional sound from the observed object under inspection and / or other sources.

[0045] In some embodiments, the CT imaging system 100 also includes an image processing unit 110 configured to reconstruct an image of the patient target volume using a suitable reconstruction method, such as an iterative or analytical image reconstruction method. For example, the image processing unit 110 may use an analytical image reconstruction method, such as filtered backprojection (FBP), to reconstruct an image of the patient target volume. As another example, the image processing unit 110 may use an iterative image reconstruction method, such as adaptive statistical iterative reconstruction (ASIR), conjugate gradient (CG), maximum likelihood expectation maximization (MLEM), model-based iterative reconstruction (MBIR), etc., to reconstruct an image of the patient target volume.

[0046] As used herein, the phrase "reconstructed image" is not intended to exclude embodiments of this disclosure in which data representing an image is generated rather than a visual image. Therefore, as used herein, the term "image" broadly refers to both a visual image and the data representing a visual image. However, many embodiments generate (or are configured to generate) at least one visual image.

[0047] The CT imaging system 100 also includes a stage 115 on which the object 112 is positioned for imaging. The stage 115 may be electrically powered, allowing adjustment of its vertical and / or lateral positions. Therefore, the stage 115 may include a motor and a motor controller, as will be described below with respect to… Figure 2 To illustrate, the table motor controller moves the table 115 by adjusting the motor to properly position the object to be inspected within the frame 102 to obtain projection data corresponding to the target volume of the object. The table motor controller can adjust the height of the table 115 (e.g., its vertical position relative to the ground on which the table is located) and the lateral position of the table 115 (e.g., its horizontal position along an axis parallel to the axis of rotation of the frame 102).

[0048] Figure 2 It shows something similar to Figure 1 An exemplary imaging system 200 of a CT imaging system 100. In some embodiments, the imaging system 200 includes a detector array 108 (see...). Figure 1 The detector array 108 also includes a plurality of detector elements 202 that together collect the X-ray beam 106 passing through the object under examination 112 (see [link]). Figure 1 To acquire the corresponding projection data, the detector array 108 is fabricated in a multi-slice configuration comprising multiple rows of cells or detector elements 202 in some embodiments. In such a configuration, one or more additional rows of detector elements 202 are arranged in parallel for acquiring projection data. In some examples, individual detectors or detector elements 202 of the detector array 108 may include photon counting detectors that register the interaction of individual photons into one or more energy bins. It should be understood that the techniques described herein can also be implemented using energy integration detectors.

[0049] In some embodiments, the imaging system 200 is configured to traverse different angular positions around the object 112 to acquire the desired projection measurement data. Therefore, the gantry 102 and the components mounted thereon can be configured to rotate about a rotation center 206 to acquire projection measurement data, for example, at different energy levels. Alternatively, in embodiments where the projection angle relative to the object 112 varies over time, the mounted components can be configured to move along a generally arcuate path rather than along a circumference.

[0050] In some embodiments, the imaging system 200 includes a control mechanism 208 to control the movement of components, such as the rotation of the gantry 102 and the operation of the x-ray radiation source 104. In some embodiments, the control mechanism 208 further includes an x-ray controller 210 configured to provide power and timing signals to the x-ray radiation source 104. Additionally, the control mechanism 208 includes a gantry motor controller 212 configured to control the rotational speed and / or position of the gantry 102 based on imaging requirements.

[0051] In some embodiments, control unit 208 further includes a data acquisition system (DAS) 214 configured to sample analog data received from detector element 202 and convert the analog data into digital signals for subsequent processing. The data sampled and digitized by DAS 214 is transferred to a computer or computing device 216. In one example, computing device 216 stores the data in storage device 218. For example, storage device 218 may include a hard disk drive, floppy disk drive, optical disc read / write (CD-R / W) drive, digital versatile optical disc (DVD) drive, flash memory drive, and / or solid-state storage drive.

[0052] Additionally, computing device 216 provides commands and parameters to one or more of the DAS 214, x-ray controller 210, and rack motor controller 212 to control system operations, such as data acquisition and / or processing. In some embodiments, computing device 216 controls system operations based on operator input. Computing device 216 receives operator input, such as commands and / or scan parameters, via an operator console 220 operably coupled to computing device 216. Operator console 220 may include a keyboard (not shown) or a touchscreen to allow the operator to specify commands and / or scan parameters.

[0053] Although Figure 2Only one operator console 220 is shown, but more than one operator console may be coupled to the imaging system 200, for example, to input or output system parameters, request inspections, and / or view images. Furthermore, in some embodiments, the imaging system 200 may be coupled via one or more configurable wired and / or wireless networks (such as the Internet and / or VPNs) to multiple displays, printers, workstations, and / or similar devices, for example, located locally or remotely within an institution or hospital, or in completely different locations.

[0054] In some implementations, for example, the imaging system 200 includes or is coupled to a Picture Archiving and Communication System (PACS) 224. In one exemplary implementation, the PACS 224 is further coupled to a remote system (such as a radiology information system, a hospital information system) and / or coupled to an internal or external network (not shown) to allow operators in different locations to provide commands and parameters and / or obtain access to image data.

[0055] The computing device 216 uses operator-provided and / or system-defined commands and parameters to operate the table motor controller 226, which in turn controls the table motor, thereby adjusting... Figure 1 The position of the worktable 115 is shown. Specifically, the worktable motor controller 226 moves the worktable 115 via the worktable motor to properly position the inspection object 112 in the frame 102 to obtain projection data corresponding to the target volume of the inspection object 112. For example, the computing device 216 can send commands to the worktable motor controller 226 to instruct the worktable motor controller 226 to adjust the vertical and / or lateral position of the worktable 115 via the motor.

[0056] As described above, the DAS214 samples and digitizes the projection data acquired by detector element 202. Subsequently, the image reconstructor 230 uses the sampled and digitized X-ray data to perform high-speed reconstruction. Although Figure 2 Image reconstructor 230 is shown as a separate entity, but in some embodiments, image reconstructor 230 may be part of computing device 216. Alternatively, image reconstructor 230 may not be present in imaging system 200, and alternatively, computing device 216 may perform one or more functions of image reconstructor 230. Furthermore, image reconstructor 230 may be located locally or remotely and may be operatively connected to imaging system 200 using wired or wireless networks. Specifically, one exemplary embodiment may use computing resources in a "cloud" network cluster for image reconstructor 230.

[0057] In some embodiments, image reconstructor 230 stores the reconstructed image in storage device 218. Alternatively, image reconstructor 230 transmits the reconstructed image to computing device 216 to generate available examination subject information (also referred to as examination subject information) for diagnosis and evaluation. In some embodiments, computing device 216 transmits the reconstructed image and / or examination subject information to display 232, which is communicatively coupled to computing device 216 and / or image reconstructor 230. In some embodiments, display 232 allows an operator to evaluate the anatomical structures of the imaging. Display 232 may also allow an operator, for example via a graphical user interface (GUI), to select the volume of interest (VOI) and / or request examination subject information for subsequent scanning or processing.

[0058] As further described herein, computing device 216 may include computer-readable instructions executable to send commands and / or control parameters to one or more of the DAS 214, x-ray controller 210, gantry motor controller 212, and stage motor controller 226 according to an examination imaging protocol that includes a clinical task / intention, also referred to herein as a Clinical Intent Identifier (CID) for the examination. For example, the CID may inform the objective of the procedure based on clinical indications (e.g., general scan or lesion detection, anatomical structure of interest, quality parameters, or other objectives) and may further define the required position and orientation of the subject during the scan (e.g., posture) (e.g., supine and foot-first). The operator of system 200 can then position the subject on the stage according to the position and orientation specified by the imaging protocol. Furthermore, computing device 216 can set and / or adjust various scan parameters (e.g., dose, gantry rotation angle, kV, mA, attenuation filter) according to the imaging protocol. For example, the imaging scheme can be selected by the operator from multiple imaging schemes stored in the memory of the computing device 216 and / or a remote computing device, or the imaging scheme can be automatically selected by the computing device 216 based on the received inspection object information.

[0059] During the examination / scanning phase, it may be desirable to expose the subject to the lowest possible radiation dose while still maintaining the required image quality. Additionally, reproducible and consistent image quality may be required between examinations, between subjects, and between different imaging system operators. Therefore, the imaging system operator may manually adjust the stage position and / or subject position to, for example, center the desired patient anatomy within the gantry aperture. However, such manual adjustments can be error-prone. Therefore, the CID associated with the selected imaging protocol can be mapped to various subject positioning parameters, including subject posture and orientation, stage height, anatomical reference used for scanning, and start and / or end scan positions.

[0060] Therefore, the depth camera 114 can be operatively and / or communicatively coupled to the computing device 216 to provide image data for determining the structure of the subject being examined, including posture and orientation. Furthermore, the various techniques and processes described herein for determining patient structures based on image data generated by the depth camera 114 can be stored as executable instructions in the non-transitory memory of the computing device 216.

[0061] Additionally, in some examples, computing device 216 may include camera image data processor 215, which includes instructions for processing information received from depth camera 114. The information received from depth camera 114 (which may include depth information and / or visible light information) can be processed to determine various examination subject parameters, such as examination subject identity, examination subject physique (e.g., height, weight, patient thickness), and the current examination subject position relative to the worktable and depth camera 114. For example, prior to imaging, an image reconstructed from point cloud data generated by camera image data processor 215 based on images received from depth camera 114 can be used to estimate the body contour or structure of examination subject 112. Computing device 216 can use these examination subject parameters to perform, for example, patient-scanner contact prediction, scan range overlay, and scan keypoint calibration, as will be described in more detail herein. Furthermore, data from depth camera 114 may be displayed via display 232.

[0062] In some implementations, information from depth camera 114 can be used by camera image data processor 215 to perform tracking of one or more objects within the field of view of depth camera 114. In some examples, image information (e.g., depth information) can be used to perform skeletal tracking, where multiple joints of the object being inspected are identified and analyzed to determine the object's motion, pose, position, etc. During skeletal tracking, the joint positions can be used to determine the aforementioned object parameters. In other examples, image information can be used directly to determine the aforementioned object parameters without skeletal tracking.

[0063] Based on these subject positioning parameters, the computing device 216 can output one or more alerts to the operator related to patient posture / orientation and predicted examination (e.g., scan) results, thereby reducing the likelihood that the subject will be exposed to a higher-than-expected radiation dose and improving the quality and reproducibility of the images generated by the scan. As an example, estimated body structure can be used to determine whether the subject is in the imaging position prescribed by the radiologist, thereby reducing the incidence of repeated scans due to improper positioning. Furthermore, the time spent by the imaging system operator in positioning the subject can be reduced, allowing for more scans to be performed throughout the day and / or allowing for additional subject interactions.

[0064] Based on depth cameras (such as...) Figure 1 and Figure 2 The depth camera 114 shown receives data to determine multiple exemplary patient orientations. For example, a controller (e.g., Figure 2 The computing device 216 can extract patient structure and pose estimates based on images received from the depth camera 114, thereby enabling different patient orientations to be distinguished from each other.

[0065] The CT imaging system 100 can perform imaging examinations based on a scanning protocol. The scanning protocol is a description of the imaging examination. It may include descriptions of the body parts involved, such as medical or colloquial terms. The scanning protocol can provide various parameters and related information for scanning and post-processing, such as power values, radiation duration, movement speed, radiation energy, and time delay between image acquisition. Any configurable technical parameters that should be used on the imaging system 110 for the imaging examination can be defined in the scanning protocol.

[0066] The CT imaging system 100 may have an automatic patient positioning function, that is, it can automatically position the patient in the scan start position in the opening of the gantry 102 based on examination instructions or scanning protocols, and move along the z-axis to the scan end position during scanning imaging. Current automatic patient positioning functions can automatically determine the scan range in the horizontal direction based on the anatomical structure to be imaged (e.g., from examination instructions or scanning protocols) and the patient structure from the depth camera 114, but its automatic centering can only generally target the average body contour center of the head or body and all scout scans (hereinafter also referred to as reconnaissance scans), so the centering accuracy for specific anatomical structures and specific patients is not good enough.

[0067] II. Detector

[0068] Figure 3An exploded view of a radiation detector module 30 according to some embodiments of the present disclosure is shown. In some embodiments of the present disclosure, the radiation detector module 30 may be, for example, a combination of the above. Figure 2 The detector element 102 described, but Figure 3 The radiation detector module 30 integrates functions such as signal detection, analog-to-digital conversion, and signal processing. Figure 3 Arrows are used to indicate radiation rays, such as X-rays, incident from below the radiation detector module 30, so as to indicate direction in the description.

[0069] A radiation detector module 30 according to some embodiments of this disclosure may include a detector circuit board 302, a frame 304, a signal processing circuit board 306, and a plurality of flexible lines 307. The detector circuit board 302 may be configured to detect incident rays (as shown in the figure) onto the detector circuit board 302 and convert the rays into electrical signals. Figure 3 As shown, the detector circuit board 302 can be positioned in the frame 304 facing (i.e., towards or directly opposite) the radiation source (e.g., Figure 1 or Figure 2 The radiation source 104 shown is located on a first side 304a and fixed to the frame 304. The signal processing circuit board 306 can be disposed on a second side 304b of the frame 304 opposite to the first side 304a and fixed to the frame 304. In other words, the detector circuit board 302 and the signal processing circuit board 306 are located along the radiation direction ( Figure 3 The flexible circuits (in the directions indicated by the arrows below) are respectively positioned on both sides of the frame 304. The frame 304 may include multiple through slots 305 passing through it. The signal processing circuit board 306 may be configured to communicate with the detector circuit board 302 to receive the electrical signals. Each flexible circuit 307 passes through the multiple through slots 305 of the frame 304 and connects the detector circuit board 302 and the signal processing circuit board 306. Through the above design, the flexible circuits used to connect the detector circuit board and the signal processing circuit board are hidden in the frame, thereby preventing the flexible circuits from scratching each other and being damaged during the installation, maintenance and assembly of the radiation detector module, thereby greatly improving the safety and stability of the radiation detector module. The flexible circuits 307 include any circuit or cable with flexible or bendable characteristics, which can at least be used for signal transmission, including but not limited to flexible printed circuit boards (FPCs), flexible flat cables (FFCs), flexible cables and devices that can have similar characteristics and perform similar functions.

[0070] In some embodiments, the detector circuit board 302 and the signal processing circuit board 306 can be fixed to the frame 304 by one or more mechanical structures, including but not limited to screws.

[0071] In some embodiments of this disclosure, the detector circuit board 302 may include at least two sub-detector circuit boards, such as... Figure 4 As shown. This is understandable. Figure 4 The diagram shows three sub-detector circuit boards 3021, 3023, and 3025, but in practice, there can be two, three, or more sub-detector circuit boards. These sub-detector circuit boards 3021, 3023, and 3025 are angled so that the plane of each sub-detector circuit board faces (i.e., towards or directly opposite) the radiation source (e.g., [missing information]). Figure 1 or Figure 2 The radiation source 104 is shown in the diagram. The sub-detector circuit boards 3021, 3023, and 3025 each include a detector element that converts the received radiation into an electrical signal. Compared to existing detector circuit boards that are formed as flat planes, the detector elements in each of the aforementioned sub-detector circuit boards can receive radiation from the radiation source more orthogonally, thereby obtaining more accurate detection results.

[0072] In some embodiments, the radiation may include X-rays. In some embodiments, the detector element may include an element that first converts the X-rays into visible light (such as a scintillator) and further includes an element that can convert the light into an electrical signal (such as a photodiode); in some embodiments, the detector element may include a photon counting detector element or other types of elements that directly convert X-rays into electrical signals. The sub-detector circuit board may also include analog-to-digital conversion circuitry to convert analog signals into digital signals.

[0073] refer to Figure 5A and Figure 5B The diagram shows elevated views of the top and bottom sides of a single sub-detector circuit board. In some embodiments of this disclosure, each sub-detector circuit board, such as sub-detector circuit board 3021, may include a radiating portion 3032 and an end portion 3034, with a signal processing unit 3022 mounted on the end portion 3034 and a radiation detector 3024 mounted on the radiating portion 3032. In some embodiments, the sub-detector circuit board may include an array formed by a plurality of signal processing units 3022. In some embodiments, a through slot 305 may be provided in the frame 304 near the end portion 3034. In some embodiments of this disclosure, a signal processing circuit board 306 is provided at an opening 3066 corresponding to the location of the plurality of through slots 305 in the frame 304 (see [link to documentation]). Figure 3 Each flexible line 307 passes through opening 3066.

[0074] In some embodiments of this disclosure, the signal processing circuit board 306 may include processing circuitry 3068 for processing electrical signals received from the signal processing unit 3022 of the detector circuit board 302. Figure 3In the embodiment shown, the flexible line 307 is configured to connect the signal processing unit 3022 of the detector circuit board 302 with the corresponding processing circuit 3068 in the signal processing circuit board 306 to transmit signals.

[0075] like Figure 6 As shown, in some embodiments of this disclosure, each flexible line 307 may include a plug 3072 with terminals 3074 at both ends. The plug 3072 includes an arc-shaped retaining tab 3076, which matches a mating slot in a corresponding socket on the detector circuit board 302 to form a locking engagement.

[0076] In some embodiments of this disclosure, the frame 304 may include a support 3042 that contacts the detector circuit board 302, such as... Figure 7 As shown. The support portion 3042 includes support sections corresponding to the number of sub-detector circuit boards. It can be understood that, because... Figure 4 The diagram shows three sub-detector circuit boards 3021, 3023, and 3025. Therefore, the support portion 3042 also includes three support segments 3041, 3043, and 3045. The number of support segments can vary depending on the number of sub-detector circuit boards. Adjacent support segments are angled, and the surface of each support segment that contacts the corresponding sub-detector circuit board faces the radiation source (e.g., the radiation source). Figure 1 or Figure 2 The radiation source 104 shown is used to keep each sub-detector circuit board facing the radiation source respectively. In some embodiments of this disclosure, the frame 304 can also be configured for alignment of the detector circuit board 302 and the signal processing circuit board 306. For example, as shown... Figure 3 As shown, the frame 304 aligns the detector circuit board 302 and signal processing circuit board 306 on both sides of it at least partially to facilitate signal transmission and to reduce the overall size of the radiation detector module 30.

[0077] The detector circuit board 302 is a crucial component for the radiation detector module and the imaging system. It receives and detects incident rays and converts them into electrical signals. The detector in the detector circuit board 302 is highly sensitive to temperature during operation. This characteristic makes the thermal stability of the detector circuit board 302 extremely important for the image quality and accuracy ultimately obtained by the imaging system. In some embodiments of this disclosure, the frame 304 may also integrate a temperature regulation function to further stabilize the operating temperature of the radiation detector module 30. In some embodiments of this disclosure, the frame 304 integrates at least one of a heating or heat dissipation function.

[0078] Frame 304 can be fitted with a heater. For example, as Figure 3As shown, a heater 3044 is mounted on the surface (upper surface) of the second side 304b of the frame 304. In some embodiments, such as Figure 3 As shown, the upper surface of frame 304 includes a central region and an edge region outside the central region, and heater 3044 can be installed in the central region.

[0079] In some embodiments of this disclosure, the heater 3044 may be implemented as follows: Figure 3 The thin-walled surface heater shown is designed to fully utilize the lateral (perpendicular to the direction indicated by the arrow) space of the radiation detector module 30 while achieving effective heating, further reducing the size of the radiation detector module, particularly its dimensions along the ray direction (i.e., the height or thickness of the radiation detector module 30). In some embodiments, a switching circuit coupled to the heater 3044 and controlling its operating state may be included to activate the heater 3044 for heating when needed (e.g., when the ambient temperature of the radiation detector module 30 is below a preset value). In some embodiments of this disclosure, at least a portion of the surface of the heater 3044 may be covered with a heat insulation layer. The heat insulation layer can block heat conduction between the frame and the heater 3044. This heat insulation layer may be made of a heat-insulating material, or it may be a gap between the frame and the heater 3044, with the air in the gap also serving to block heat conduction.

[0080] Alternatively or additionally, frame 304 may be provided with a heat sink. For example, such as Figure 3 As shown, a heat sink 3046 is mounted on the surface (upper surface) of the second side 304b of the frame 304. The heat sink 3046 is a component independent of the frame 304. In some embodiments, the frame 304 is an integral structure manufactured using technologies such as 3D printing or additive manufacturing, and the frame 304 integrally incorporates several plate-shaped heat sinks. In some embodiments, such as... Figure 3 As shown, the upper surface of frame 304 includes a central region and an edge region outside the central region, and heat sink 3046 may be disposed on at least a portion of the edge region of the upper surface of frame 304. In some embodiments, such as Figure 3 As shown, the heat sink 3046 can be disposed near one edge of the upper surface of the frame 304. In other embodiments, heat sinks can be disposed near both sides of the upper surface of the frame 304.

[0081] In some embodiments of this disclosure, the heat sink 3046 can be implemented as follows: Figure 3The heat sink 3046 may include multiple sheet-like or fin-like structures to increase surface area and thus increase heat dissipation rate. The sheet-like structures of the heat sink 3046 may extend at least partially along the edges and along the ray direction (indicated by the arrow) to achieve good heat dissipation and make full use of the space of the radiation detector module 30.

[0082] In some embodiments, the frame 304 may be made of a thermally conductive material for heat conduction. The thermally conductive material allows heat generated by the heater 3044 to be conducted away quickly, for example, to the detector circuit board 302 thermally coupled to the frame. The thermally conductive material also allows heat conducted to the frame 304 to be conducted away quickly. Therefore, the frame 304 can be combined with the heater 3044 and / or the heat sink 3046 to further improve the thermal stability of the radiation detector module 30, thereby enabling the imaging system to obtain higher quality and more accurate data. In some embodiments, the thermally conductive material of the frame 304 may include a thermally conductive conductor, including but not limited to aluminum, copper, etc.

[0083] In some embodiments of this disclosure, the signal processing circuit board 306 and the frame 304 are isolated to avoid electrical short circuits or interference. For example, in Figure 3 In the illustrated embodiment, a certain distance can be maintained between the signal processing circuit board 306 and the frame 304 via the support pillar 3048, thereby achieving an isolated connection between the signal processing circuit board 306 and the frame 304. In other embodiments, isolation designs such as spacers or brackets can also be used to achieve an isolated connection between the signal processing circuit board 306 and the frame 304.

[0084] Since the signal processing circuit board 306 includes one or more components for signal processing, these components themselves generate heat during operation. To avoid or at least mitigate the direct conduction of heat generated by the signal processing circuit board 306 to the frame 304, thereby interfering with the temperature control of the frame 304 (and potentially affecting the temperature of the detector circuit board 302), in some embodiments of this disclosure, a spacing design as described above is used between the signal processing circuit board 306 and the frame 304. Furthermore, the signal processing circuit board 306 may also be thermally coupled to a heat sink 3062 to further avoid or reduce mutual thermal interference between the signal processing circuit board 306 and the frame 304. The heat sink 3062 may be arranged at or near components that generate high levels of heat to conduct the generated heat away more quickly, thereby reducing the temperature of the signal processing circuit board 306. In some embodiments of this disclosure, the heat sink 3062 may be configured to extend along the radiation direction (indicated by the arrow) to facilitate heat dissipation and make full use of longitudinal space, which is beneficial for reducing the size of the radiation detector module.

[0085] In some embodiments, the heat sink 3062 may also include one or more side-by-side sheet-like or fin-like structures to increase the heat dissipation area and accelerate heat dissipation. In some embodiments, thermally conductive adhesive 3064 may be included between the heat sink 3062 and the signal processing circuit board 306. The thermally conductive adhesive 3064 can be used to fix the heat sink 3062 to the signal processing circuit board 306. The thermally conductive adhesive 3064 can also accelerate the conduction of heat generated by the signal processing circuit board 306 to the heat sink 3062.

[0086] In some embodiments of this disclosure, at least a portion of the surface of the first side 304a of the frame 304 is covered with a radiation shielding layer (not shown), the at least a portion of which corresponds to the area where the signal processing unit is located in the signal processing circuit board 306. The radiation shielding layer is configured to prevent radiation rays from propagating upwards, i.e., to prevent radiation rays from propagating to the signal processing circuit board 306. In some embodiments, the radiation shielding layer may be made of a high-density material such as tungsten, molybdenum, or lead. In some embodiments, the radiation shielding layer may be attached to or coated onto the lower surface of the frame 304.

[0087] In some embodiments of this disclosure, the radiation detector module 30 may further include a collimator module corresponding to the number of sub-detector circuit boards, such as... Figure 8 As shown. This is understandable, because... Figure 4 The diagram shows three sub-detector circuit boards 3021, 3023, and 3025; therefore, there are also three collimator modules 3101, 3103, and 3105. However, as the number of sub-detector circuit boards increases or decreases, there can be more or fewer collimator modules accordingly. Adjacent collimator modules are arranged at an angle, and each ray channel of each collimator module faces the radiation source (e.g., ...). Figure 1 or Figure 2 Radiation source 104 shown.

[0088] like Figure 8As shown, collimator modules 3101, 3103, and 3105 are respectively disposed on the radiation source-facing side of sub-detector circuit boards 3021, 3023, and 3025. Collimator modules 3101, 3103, and 3105 can be fixed to sub-detector circuit boards 3021, 3023, and 3025, and further fixed to frame 304. Collimator modules 3101, 3103, and 3105 can be attached to the surfaces of sub-detector circuit boards 3021, 3023, and 3025, respectively. Collimator modules 3101, 3103, and 3105 may include collimator 3102 for collimating or homogenizing radiation and preventing or reducing radiation scattering. Collimator 3102 is fabricated as a single-piece structure using 3D printing or additive manufacturing technology to reduce manufacturing costs and improve performance. Collimator 3102 has a flat plate configuration, which can reduce the height or thickness of the radiation detector module. In other embodiments, the collimator module can also be assembled to, as needed by the design, such as... Figure 2 The detector array 108 is shown on a guide rail or track for mounting.

[0089] like Figure 3 As shown in the exploded view, in some embodiments of this disclosure, the radiation detector module 30 may further include a housing 308. Figure 9 Show Figure 3 An assembly diagram of the radiation detector module 30 is shown. The housing 308 at least partially covers the signal processing circuit board 306 and is connected (e.g., fixed) to the frame 304. The housing 308 may be made of a metallic material, thereby improving the electromagnetic interference immunity or electromagnetic compatibility (EMC) performance of the radiation detector module 30.

[0090] In some embodiments, such as Figure 3 Combination Figure 9 As shown, the housing 308 has an opening 3082 through which a heat sink 3062 on the signal processing circuit board 306 extends, allowing the heat sink 3062 to dissipate heat more effectively. Furthermore, the signal processing circuit board 306 may include a heat-conducting structure connected to the housing 308 to more quickly conduct heat generated by the signal processing circuit board 306 to the housing 308, where it is then conducted away, allowing the signal processing circuit board 306 to cool down more rapidly. Figure 9 As shown, the heat sink 3046 on the frame 304 can be disposed outside the housing 308 for better heat dissipation. In some embodiments, the housing 308 also includes a heat sink 3084 to aid in heat dissipation of the radiation detector module. In some embodiments, the heat sink 3084 may also include one or more side-by-side fin or sheet-like structures to increase the heat dissipation area and accelerate the heat dissipation rate.

[0091] Some embodiments of this disclosure may also include a radiation detector device. The radiation detector device includes one or more radiation detector modules 30 according to any embodiment of this disclosure. In some embodiments, the radiation detector device includes a plurality of radiation detector modules 30, which may be arranged on the same track, for example... Figure 2 The detector array 108 shown is mounted on an arc-shaped track.

[0092] Some embodiments of this disclosure may also include an imaging system. The imaging system may include a radiation detector device according to any embodiment of this disclosure. The imaging system may also include a radiation source configured to emit radiation rays toward the radiation detector device. The radiation source may be, for example... Figure 1 or Figure 2 The radiation source shown is 104.

[0093] Without departing from the spirit and intent of this utility model, those skilled in the art can make appropriate modifications and adjustments to the embodiments specifically described above. Therefore, it is intended that the claimed subject matter not be limited to the specific examples disclosed, but also include all implementations falling within the scope of the appended claims and their equivalents.

Claims

1. A radiation detector module, comprising: A detector circuit board configured to detect rays incident on the detector circuit board and convert the rays into electrical signals; A frame, wherein the detector circuit board is disposed on a first side of the frame facing the radiation source and fixed to the frame, the frame including a plurality of through slots passing through the frame; A signal processing circuit board is disposed on a second side of the frame opposite to the first side and fixed to the frame, and the signal processing circuit board is configured to communicate with the detector circuit board to receive the electrical signal. as well as Multiple flexible circuits pass through multiple slots in the frame and connect the detector circuit board to the signal processing circuit board.

2. The radiation detector module as described in claim 1, characterized in that: The detector circuit board includes at least two sub-detector circuit boards, which are angled so that the plane of each sub-detector circuit board faces the radiation source.

3. The radiation detector module as described in claim 2, characterized in that: The frame includes a support portion that contacts the detector circuit board. The support portion includes support segments corresponding to the number of sub-detector circuit boards. Adjacent support segments are arranged at an angle, and the surface of each support segment that contacts the sub-detector circuit board faces the radiation source.

4. The radiation detector module as described in claim 2, characterized in that: The sub-detector circuit board includes a radiating section for mounting a radiation detector and an end section for mounting a signal processing unit, and the frame has the through slot located near the end section.

5. The radiation detector module as described in claim 2, characterized in that: It also includes collimator modules corresponding to the number of the sub-detector circuit boards, with adjacent collimator modules set at an angle, and each ray channel of the collimator module facing the radiation source.

6. The radiation detector module as described in claim 1, characterized in that: The signal processing circuit board has openings corresponding to multiple slots in the frame, through which the multiple flexible lines pass.

7. The radiation detector module as described in claim 1, characterized in that: Each of the plurality of flexible lines includes a plug with terminals at both ends, the plug including an arc-shaped retaining tab that mates with a mating slot in a corresponding socket on the detector circuit board to form a locking engagement.

8. The radiation detector module as described in any one of claims 1-7, characterized in that: At least a portion of the surface of the first side of the frame is covered with a radiation shielding layer, the at least a portion of which corresponds to the area where the signal processing unit is located in the signal processing circuit board.

9. The radiation detector module as described in any one of claims 1-7, characterized in that, The radiation detector module further includes: A housing that at least partially covers the signal processing circuit board and is connected to the frame.

10. A radiation detector device comprising one or more radiation detector modules as claimed in any one of claims 1-8.

11. The radiation detector device as claimed in claim 10, characterized in that: The radiation detector modules are multiple and arranged on the same track.

12. An imaging system, comprising: The radiation detector device as described in any one of claims 10-11; as well as A radiation source configured to emit the rays toward the radiation detector device.

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