Photoelectric detection system

Abstract

The photoelectric detection system comprises a detector module, a PCB module, a refrigeration module, an optical fiber module, a microstrip line module, a vacuum cover, an optical channel integrated board and an electric channel integrated board, the detector module, the PCB module, the refrigeration module and the microstrip line module are arranged in the vacuum cover, and the optical channel integrated board and the electric channel integrated board are embedded in the surface of the vacuum cover. The optical fiber module penetrates through the optical channel integrated board to transmit optical signals to the photoelectric detection system, and the microstrip line module is connected to the electric channel integrated board to output electric signals outwards. By using the optical channel integrated board and the electric channel integrated board, the photoelectric conversion of the detector module can be completed in a vacuum low-temperature environment, and the number of optical channels and / or the number of electric channels can be greatly increased.

Description

Technical Field

[0001] This utility model relates to the field of photoelectric detection, and in particular to a photoelectric detection system. Background Technology

[0002] Superconducting nanowire single-photon detectors (SNSPDs) achieve wide-band, high-sensitivity detection based on the photon response characteristics of superconducting nanowires at extremely low temperatures (~2K). They possess excellent characteristics such as high detection efficiency (>98%), low dark count rate (<0.005cps), ultra-high temporal resolution (<20ps), high-speed response (>5GHz), and photon number resolution (>32). They have now been developed into a core technology in fields such as quantum communication, quantum computing, lidar, deep space exploration, and biofluorescence detection.

[0003] As the complexity of measurement tasks in various fields increases, higher demands are being placed on the number of detectors and the integration of detection systems. For example, in boson sampling applications, it is necessary to simultaneously detect photon states in multiple output paths; a larger number of detectors enables more complex computational tasks, thus demonstrating the superiority of quantum computing. In deep space communication applications, increasing the number of pixel arrays can exponentially increase the detector's counting rate and communication speed. In fluorescence lifetime imaging, more detectors can simultaneously capture single-photon fluorescence signals from multiple points, improving imaging resolution and acquisition speed. Early superconducting single-photon detection systems mainly had 6-16 channels; however, recent technological advancements have enabled superconducting single-photon detection systems to reach 64 channels.

[0004] However, as the number of channels in an SNSPD system increases, the size and complexity of the entire system rise sharply. In high-channel-count systems, how to efficiently integrate these interfaces into a compact module that can transmit signals to the outside directly affects the system's integration and space efficiency.

[0005] Therefore, how to design a superconducting single-photon detection system that can greatly increase the number of photoelectric channels within a limited area to improve the overall system performance has become one of the problems that urgently need to be solved by those skilled in the art.

[0006] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of this utility model and facilitating understanding by those skilled in the art. It should not be assumed that these technical solutions are known to those skilled in the art simply because they have been described in the background section of this utility model. Utility Model Content

[0007] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a photoelectric detection system to solve the problem of the limited number of photoelectric channels in the existing superconducting single-photon detection system.

[0008] To achieve the above and other related objectives, this utility model provides a photoelectric detection system, which includes at least: an optical fiber module, a detector module, a PCB module, a microstrip line module, a cooling module, a vacuum chamber, an optical channel integrated board, and an electrical channel integrated board; the detector module, the PCB module, the microstrip line module, and the cooling module are all disposed within the vacuum chamber; the optical channel integrated board includes an optical fiber cover plate, a first base plate, and a first base; the end face of the first base is embedded in the surface of the vacuum chamber, and a through hole communicates with the interior of the vacuum chamber; the optical fiber cover plate is fixed to the first base plate, and the first base plate is fixed to the first base, the optical fiber cover plate and the first base plate together forming a sealed space in the through hole of the first base; and / or, the electrical channel integrated board includes a PCB board, a second base plate, and a second base; the end face of the second base is embedded in the vacuum chamber. The surface of the cover has a through hole that communicates with the interior of the vacuum cover; the PCB board is fixed on the second base plate, and the second base plate is fixed on the second base. The PCB board and the second base plate together form a sealed space through the through hole of the second base; the PCB board is provided with a first multi-channel electrical interface board and a second multi-channel electrical interface board connected in sequence, and the first multi-channel electrical interface board and the second multi-channel electrical interface board together penetrate the PCB board; the optical fiber module passes through the optical channel integrated board into the interior of the vacuum cover and is connected to the first end of the detector module; the detector module is disposed on the PCB module, and the second end of the detector module is connected to the first end of the PCB module; the PCB module is disposed on the cooling module, and the second end of the PCB module is connected to the first end of the microstrip line module; the second end of the microstrip line module is connected to the electrical channel integrated board.

[0009] Optionally, a first fixing hole is provided on the end face of the first base, and a second fixing hole, a first mounting hole, and a first optical fiber hole are provided on the first base plate. The optical channel integrated board has a total of n optical fiber cover plates, where n is a natural number greater than or equal to 1. The optical fiber cover plates are provided with a second mounting hole and a second optical fiber hole. The first base plate is fixed to the first base through the first fixing hole and the second fixing hole. The optical fiber cover plates are fixed to the first base plate through the first mounting hole and the second mounting hole. The optical fiber module passes through the second optical fiber hole and the first optical fiber hole in sequence to enter the vacuum chamber.

[0010] Alternatively, the optical channel integrated board further includes a first sealing strip; a first groove is provided on the end face of the first base; the first sealing strip is correspondingly disposed between the first groove and the base plate.

[0011] Alternatively, the optical channel integrated board further includes n second sealing strips; n second grooves are provided on the side of the first base plate opposite to the optical fiber cover plate, and the n second grooves correspond one-to-one with the n optical fiber cover plates; the second sealing strips are disposed between the corresponding second grooves and the optical fiber cover plates; the second mounting holes are located outside the second grooves, and the second optical fiber holes are located inside the second grooves.

[0012] Alternatively, the second fiber optic hole is located within the area enclosed by the second mounting hole.

[0013] Optionally, a third fixing hole is provided on the end face of the second base, a fourth fixing hole, a third mounting hole and a first opening are provided on the second base plate, and a fourth mounting hole is also provided on the PCB board; the second base plate is fixed to the second base through the third fixing hole and the fourth fixing hole; the PCB board is fixed to the second base plate through the third mounting hole and the fourth mounting hole, and the microstrip line module passes through the first opening to connect to the first multi-channel electrical interface board.

[0014] Alternatively, the electrical channel integration board further includes a fixing plate, which is provided with a fifth mounting hole and a second opening. The fixing plate is fixed to the PCB board by the assembly of the fifth mounting hole and the fourth mounting hole, and the second multi-channel electrical interface board is located in the second opening.

[0015] Alternatively, the electrical channel integrated plate further includes a third sealing strip; a third groove is provided on the end face of the second base; the third sealing strip is correspondingly disposed between the third groove and the base plate.

[0016] Alternatively, the electrical channel integrated board further includes a fourth sealing strip; a fourth groove is provided on the side of the second base plate opposite to the PCB board; the fourth sealing strip is disposed between the fourth groove and the PCB board; the fourth mounting hole is located outside the fourth groove, and the first multi-channel electrical interface board is located inside the fourth groove.

[0017] Optionally, both the first multi-channel electrical interface board and the second multi-channel electrical interface board are multi-core electrical connectors, and the PCB module is a multi-core electrical connector.

[0018] As described above, the photoelectric detection system of this utility model has the following beneficial effects:

[0019] 1. The optical channel integrated board of this utility model seals the optical fiber cover plate, the base plate and the base plate in sequence, and sets optical fiber holes on the optical fiber cover plate and the base plate, so that the optical fiber can enter the sealed vacuum environment without the need for a coating layer. This reduces the area occupied by the optical fiber on the optical channel integrated board. Furthermore, since the optical fiber enters the vacuum environment through the optical fiber holes on the optical fiber cover plate, this utility model can greatly increase the number of optical fibers on the optical channel integrated board by widening the size of the optical fiber holes and the number of optical fiber cover plates.

[0020] 2. The electrical channel integrated board of this utility model seals the PCB board, base plate and base plate in sequence, and sets the first multi-channel electrical interface board and the second multi-channel electrical interface board for electrical connection on the PCB board. The first opening is set at the corresponding position of the base plate, so that the microstrip line module in the sealed vacuum environment can be connected to the first multi-channel electrical interface board. External electrical equipment can receive the electrical signals transmitted by the microstrip line module by connecting to the second multi-channel electrical interface board. By using the PCB with multi-channel electrical interface board installed and replacing the traditional electrical channel feedthrough board, this utility model can greatly increase the number of electrical channels on the electrical channel integrated board.

[0021] 3. The electrical channel integrated board of this utility model can also be provided with a fixing plate, and a second opening corresponding to the electrical interface board is provided on the fixing plate to enhance the stability and sealing of the PCB board. Attached Figure Description

[0022] Figure 1 The diagram shown is a structural schematic of an optical channel plate.

[0023] Figure 2 The diagram shown is a structural schematic of an electrical channel plate.

[0024] Figure 3 The diagram shown is a structural schematic of the photoelectric detection system of this utility model.

[0025] Figure 4 The diagram shown is a structural schematic of the optical channel integrated board of this utility model.

[0026] Figure 5 The diagram shown is a structural schematic of the first base of the optical channel integrated board of this utility model.

[0027] Figure 6 The diagram shown is a structural schematic of the second base plate of the optical channel integrated plate of this utility model.

[0028] Figure 7 The diagram shown is a structural schematic of the fiber optic cover plate of the optical channel integrated board of this utility model.

[0029] Figure 8 The diagram shown is a structural schematic of the electrical channel integrated board of this utility model.

[0030] Figure 9 The diagram shown is a structural schematic of the second base of the electrical channel integration board of this utility model.

[0031] Figure 10 The diagram shown is a structural schematic of the second base plate of the electrical channel integrated board of this utility model.

[0032] Figure 11 The diagram shows the inner side structure of the PCB board of the electrical channel integrated board of this utility model.

[0033] Figure 12 The diagram shows the outer side structure of the PCB board of the electrical channel integrated board of this utility model.

[0034] Figure 13 The diagram shown is a structural schematic of the fixing plate of the electrical channel integrated board of this utility model.

[0035] Component designation explanation

[0036] 1 Optical Channel Integrated Board

[0037] 2 Electrical Channel Integrated Board

[0038] 3 Fiber Optic Module

[0039] 4. Detector Module

[0040] 5 PCB modules

[0041] 6 Microstrip Modules

[0042] 7. Refrigeration Module

[0043] 8 Vacuum Shield

[0044] 11 Fiber Optic Cover Plate

[0045] 12 First base plate

[0046] 13 First base

[0047] 1a End face of the first base

[0048] 1b First fixing hole

[0049] 1c Through hole of the first base

[0050] 1d First mounting hole

[0051] 1e First fiber aperture

[0052] 1f Second fixing hole

[0053] 1h Second mounting hole

[0054] 1i Second fiber optic hole

[0055] 21 PCB board

[0056] 22 Second base plate

[0057] 23 Second base

[0058] 24 Fixing Plate

[0059] 2a End face of the second base

[0060] 2b Third fixing hole

[0061] 2c Through hole of the second base

[0062] 2d Third mounting hole

[0063] 2e First opening

[0064] 2f Fourth fixing hole

[0065] 2h First Multi-Channel Electrical Interface Board

[0066] 2m Second Multi-Channel Electrical Interface Board

[0067] 2i Fourth mounting hole

[0068] 2k Fifth mounting hole

[0069] 2j Second opening Detailed Implementation

[0070] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0071] Please see Figures 1-13 It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Therefore, the illustrations only show the components related to this utility model and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0072] like Figure 1As shown, an optical channel plate includes a base plate, ferrule connectors, and ferrules. The ferrules are used to compress the ferrules, ensuring a good vacuum state for the detection system. To avoid the risk of fiber breakage, the fiber passing through the ferrule must be coated for protection. This limits the ferrule aperture to a single fiber. Furthermore, the diameters of both the ferrules and the base plate are relatively small, and a certain gap needs to be left between each ferrule for installation. Therefore, this type of optical channel plate significantly restricts the number of optical fibers that can be used.

[0073] like Figure 2 As shown, there is an electrical channel board that includes an SMA electrical interface and a metal feedthrough plate. One side of the SMA electrical interface has a rubber ring. When the SMA interface is fixed to the metal feedthrough plate, the rubber ring is compressed and deformed to ensure the system's vacuum level. However, the number of SMA electrical interfaces that the base plate can accommodate is very limited. Each SMA electrical interface corresponds to an independent electrical channel. While achieving signal transmission through a limited number of electrical channels, this exposes a significant scalability bottleneck. That is, as the number of channels increases linearly, the installation complexity of the SMA electrical interfaces also increases continuously. Furthermore, the base plate size is limited by the vacuum chamber flange standard, and the problem of the limited number of electrical channels cannot be solved by simply increasing the diameter.

[0074] therefore, Figure 1 The optical channel integrated board shown and Figure 2 The existing integrated electrical channel boards all suffer from the following drawbacks: firstly, the exponentially increasing number of components increases the complexity of the installation process; secondly, the enormous physical space requirements lead to a sharp expansion in system size, severely restricting the integration of the equipment. In summary, this invention provides a photoelectric detection system that significantly increases the number of optical and / or electrical channels through integration. The specific technical solution is as follows:

[0075] Example 1

[0076] like Figure 3 As shown, this embodiment provides a photoelectric detection system, including: an optical fiber module 3, a detector module 4, a PCB module 5, a microstrip line module 6, a cooling module 7, a vacuum chamber 8, an optical channel integrated board 1, and an electrical channel integrated board 2.

[0077] like Figure 3 As shown, detector module 4, PCB module 5, microstrip line module 6 and cooling module 7 are all housed inside vacuum chamber 8.

[0078] Specifically, in this embodiment, the vacuum chamber 8 can be divided into two parts: the chamber body and the base. The detector module 4, PCB module 5, microstrip line module 6, and part of the cooling module 7 can be housed in the chamber body for easy placement. The other part of the cooling module 7 can be housed in the base for easy cooling. In practical applications, the specific structure of the vacuum chamber 8 can be designed according to needs, and is not limited to this embodiment.

[0079] like Figure 3 and Figure 4 As shown, the optical channel integrated board 1 includes an optical fiber cover plate 11, a first base plate 12, and a first base 13; the end face of the first base 13 is embedded in the surface of the vacuum chamber 8, and the through hole of the first base 13 communicates with the interior of the vacuum chamber 8; the optical fiber cover plate 11 is fixed on the first base plate 12, and the first base plate 12 is fixed on the first base 13, and the optical fiber cover plate 11 and the first base plate 12 together form a sealed space in the through hole of the first base 13.

[0080] Specifically, in this embodiment, the fiber optic cover plate 11 is sealed on the first base plate 12, and the first base plate 12 is sealed on the first base 13, so that a vacuum-sealed space can be formed in the through hole of the first base 13. The fiber optic module 3 passes through the fiber optic cover plate 11 and the first base plate 12 in sequence to enter the through hole of the first base 13 and connect to the detector module 4 inside the vacuum chamber 8. Further, as Figure 5 As shown, one end of the first base 13 shows the end face 1a and the through hole 1c. The end face of the first base 13 has i first fixing holes 1b, where i is a natural number greater than or equal to 2. For example, as shown... Figure 5 As shown, the value of i is 6. To ensure a better fixing effect, i first fixing holes 1b are arranged around the geometric center of the circular end face 1a. In practical applications, the specific number and location of the first fixing holes 1b can be set as needed, and are not limited to this embodiment. Furthermore, as... Figure 6 As shown, the first base plate 12 is provided with i second fixing holes 1f, n*p first mounting holes 1d, and n*q first fiber optic holes 1e, where n and q are natural numbers greater than or equal to 1, and p is a natural number greater than or equal to 2. The positions of the i first fixing holes 1b correspond one-to-one with the positions of the i second fixing holes 1f. Through the corresponding assembly of the first fixing holes 1b and the second fixing holes 1f, the first base plate 12 is fixed to the first base 13. Furthermore, as... Figure 7As shown, there are n fiber optic cover plates 11 on the first base plate 12 of the optical channel integration board 1. Each fiber optic cover plate 11 has p second mounting holes 1h and q second fiber optic holes 1i. Each fiber optic cover plate 11 is located within the vertical projection of the through hole of the first base 13 onto the first base plate 12. For any fiber optic cover plate 11, the first base plate 12 will have corresponding p first mounting holes 1d and q first fiber optic holes 1e. The positions of the p first mounting holes 1d correspond one-to-one with the positions of the p second mounting holes 1h on the fiber optic cover plate, and the positions of the q first fiber optic holes 1e correspond one-to-one with the positions of the p second mounting holes 1h on the fiber optic cover plate. The positions of the two fiber optic holes 1i correspond one-to-one; through the assembly of p first mounting holes 1d and corresponding second mounting holes 1h, the fiber optic cover plate 11 can be fixed on the first base plate 12, and all n fiber optic cover plates 11 are fixed on the first base plate 12 in the above manner. Through the penetration of q first fiber optic holes 1e and corresponding second fiber optic holes 1i, the optical fiber passes through the fiber optic cover plate 11 and the first base plate 12 in sequence and enters the through hole 1c of the first base 13 in the sealed vacuum, and all the optical fibers pass through the n fiber optic cover plates 11 and the first base plate 12 in the above manner and enter the through hole 1c of the first base 13 in the sealed vacuum.

[0081] Specifically, in this embodiment, the optical channel integrated board 1 further includes a first sealing strip. A first groove (not shown in the figure) is provided on the end face 1a of the first base 13. The first sealing strip is correspondingly disposed between the first groove and the first base plate 12, and can fill the gap of the first groove perfectly, so that the first base plate 12 is sealed and installed on the first base 13.

[0082] Specifically, in this embodiment, such as Figure 4 As shown, the optical channel integrated board 1 also includes n second sealing strips. The first base plate 12 has n second grooves on the side opposite to the fiber optic cover plate 11, with each of the n second grooves corresponding to one of the n fiber optic cover plates. The second sealing strips are correspondingly positioned between the second grooves and the fiber optic cover plates, and can completely fill the gaps in the second grooves, allowing the fiber optic cover plate 11 to be sealed and installed on the first base plate 12. Furthermore, the second mounting hole is located outside the third groove on the first base plate 12, and the second fiber optic hole 1i is located inside the third groove on the first base plate 12, reducing the number of openings in the third groove and improving the sealing performance of the optical channel integrated board 1.

[0083] It should be noted that, as Figure 4As shown, the first fixing hole and / or the second fixing hole are threaded holes. Using mounting accessories, the first fixing hole 1b on the first base 12 and the second fixing hole 1f on the first base plate 12 can be assembled, allowing the first base plate 12 to be tightly fixed to the first base 13. The first mounting hole and / or the second mounting hole are threaded holes. Using mounting accessories, the first mounting hole 1d on the first base plate 12 and the second mounting hole 1h on the fiber optic cover plate 11 can be assembled, allowing the fiber optic cover plate 11 to be tightly fixed to the first base plate 12. Further, the optical fiber enters the through hole 1c of the first base 13 through the second fiber optic hole 1i on the fiber optic cover plate 11 and the first fiber optic hole 1e on the first base plate 12. Multiple optical fibers can pass through the fiber optic hole, and then the second fiber optic hole 1i on the fiber optic cover plate 11 is sealed with sealant. Ultimately, the optical channel integrated board 1 of this embodiment allows optical fibers to enter the base through hole 1c in a sealed environment, and the through hole of the first base 13 can maintain a sealed vacuum environment. By using optical fiber holes that can accommodate multiple optical fibers and expanding the number of optical fiber cover plates 11, the number of optical fibers on the optical channel integrated board is greatly increased.

[0084] like Figure 3 and Figure 8 As shown, the electrical channel integrated board 2 includes a PCB board 21, a second base plate 22, and a second base 23; the end face 2a of the second base 23 is embedded in the surface of the vacuum chamber 8, and the through hole 2c of the second base 23 communicates with the interior of the vacuum chamber 8; the PCB board 21 is fixed on the second base plate 22, and the second base plate 22 is fixed on the second base 23. The PCB board 21 and the second base plate 22 together form a sealed space through the through hole 2c of the second base 23; a first multi-channel electrical interface board 2h and a second multi-channel electrical interface board 2m are arranged on the PCB board 21 in sequence, and the first multi-channel electrical interface board 2h and the second multi-channel electrical interface board 2m together penetrate the PCB board.

[0085] Specifically, in this embodiment, the PCB board 21 is sealed on the second base plate 22, and the second base plate 22 is sealed on the second base 23, so that the through hole 2c of the second base 23 can form a vacuum-sealed environment. The microstrip line module 6 inside the vacuum chamber 8 can sequentially connect to the first multi-channel electrical interface board 2h on the PCB board 21 through the through hole of the second base 23 and the second base plate 22. External electrical devices can connect to the second multi-channel electrical interface board 2m to receive the electrical signals transmitted by the microstrip line module 6. Further, as Figure 9As shown, one end of the second base 23 shows an end face 2a and a through hole 2c. The end face 2a of the second base has j third fixing holes 2b, where j is a natural number greater than or equal to 2; for example, j is 6. To enable the j third fixing holes 2b to function as fixing holes, the j third fixing holes 2b are arranged around the center of the circular end face 2a. In practical applications, the specific number and location of the third fixing holes 2b can be set as needed, and are not limited to this embodiment. Furthermore, as... Figure 10 As shown, the second base plate 22 is provided with a first opening 2e, j fourth fixing holes 2f, and k third mounting holes 2d, where k is a natural number greater than or equal to 2. The positions of the j third fixing holes 2b correspond one-to-one with the positions of the j fourth fixing holes 2f. Through the assembly of the third fixing holes 2b and the corresponding fourth fixing holes 2f, the second base plate 22 is fixed to the second base 23. Furthermore, as... Figure 11 and Figure 12 As shown, the PCB board 21 is provided with a first multi-channel electrical interface board 2h, a second multi-channel electrical interface board 2m, and k fourth mounting holes 2i. The positions of the k third mounting holes 2d correspond one-to-one with the positions of the k fourth mounting holes 2i. Through the assembly of the third mounting holes 2d and the corresponding fourth mounting holes 2i, the PCB board 21 is fixed on the second base plate 22. The k fourth mounting holes 2i are all within the vertical projection of the through hole 2c of the second base 23. The area enclosed by the k fourth mounting holes 2i is larger than the area of ​​the first opening 2e. The shape of the first opening 2e is similar to that of the first multi-channel electrical interface board 2h. The two circuit boards have the same shape, and the first multi-channel electrical interface board 2h is located on the inner side of the PCB board, while the second multi-channel electrical interface board 2m is located on the outer side of the PCB board. The first multi-channel electrical interface board and the second multi-channel electrical interface board 2m are electrically connected together and pass through the PCB board. The first multi-channel electrical interface board 2h is located in the first opening 2e. The microstrip module 6 in the vacuum chamber 8 can be connected to the first multi-channel electrical interface board 2h through the through hole 2c of the second base 23 and the first opening 2e. External electrical devices can be connected to the second multi-channel electrical interface board to receive the electrical signals transmitted by the microstrip module 6.

[0086] Specifically, in this embodiment, such as Figure 8 As shown, the electrical channel integration board 2 also includes a fixing plate 24, which is disposed on the PCB board 21. The fixing plate 24 has k fifth mounting holes 2k, and the positions of the k fourth mounting holes 2i correspond one-to-one with the positions of the k fifth mounting holes 2k, as shown. Figure 10 , Figure 11 , Figure 12 and Figure 13As shown, the fixing plate 24 can fix the PCB board 21 and set it on the second base plate 22 by sequentially assembling the third mounting hole 2d, the fourth mounting hole 2i, and the fifth mounting hole 2k. Furthermore, a second opening 2j is provided on the fixing plate 24 at a position opposite to the second multi-channel electrical interface board 2m. The shape of the second opening 2j is the same as the shape of the second multi-channel electrical interface board 2m, and the second multi-channel electrical interface board 2m should be slightly smaller than the second opening 2j, so that the second multi-channel electrical interface board 2m can be set within the second opening 2j. By setting the fixing plate 24, the PCB board 21 can be positioned more securely.

[0087] Specifically, in this embodiment, the electrical channel integrated board 2 further includes a third sealing strip. A third groove (not shown in the figure) is provided on the end face 2a of the second base 23. The third sealing strip is correspondingly disposed between the third groove and the second base plate, and the third sealing strip can fill the gap of the third groove so that the second base plate 22 can be sealed on the second base 23.

[0088] Specifically, in this embodiment, such as Figure 8 As shown, the electrical channel integrated board also includes a fourth sealing strip. A fourth groove is provided on the side of the second base plate 22 opposite to the PCB board 21. The fourth sealing strip is correspondingly disposed between the fourth groove and the PCB board, and the fourth sealing strip can completely fill the gap of the fourth groove, so that the PCB board 21 can be sealed on the second base plate 22. Furthermore, the fourth mounting hole 2i is located outside the fourth groove, and the first multi-channel electrical interface board 2h is located inside the fourth groove to enhance the sealing performance of the electrical channel integrated board 2.

[0089] It should be noted that, as Figure 8 As shown, the third and / or fourth fixing holes are threaded holes. Using mounting accessories, the third fixing hole 2b and the fourth fixing hole 2f are assembled together, allowing the second base plate 22 to be tightly fixed to the second base 23. The third and / or fourth mounting holes are threaded holes. Using mounting accessories, the third mounting hole 2d and the fourth mounting hole 2i are assembled together, allowing the PCB board 21 to be tightly fixed to the second base plate 22, and ensuring that the first multi-channel electrical interface board 2h fits snugly into the first opening 2e. Therefore, in this embodiment, the electrical channel integration board 2 connects the microstrip line module 6 in the vacuum chamber 8 to the first multi-channel electrical interface board 2h, and transmits electrical signals outward through the second multi-channel electrical interface board 2m. Simultaneously, the through hole of the second base 23 maintains a sealed vacuum environment, enabling the output of electrical signals from the sealed environment. Since the first multi-channel electrical interface board 2h and the second multi-channel electrical interface board 2m can effectively expand the number of electrical interfaces, the electrical channel integration board 2 in this embodiment significantly increases the number of electrical channels that can be accommodated.

[0090] It should be further explained that the optical channel integrated board 1 and the electrical channel integrated board 2 can be set in the photoelectric detection system at the same time, or one of them can be set in the photoelectric detection system to increase the number of optical channels and / or electrical channels of the photoelectric detection system, so as to improve the performance of the photoelectric detection system.

[0091] like Figure 3 As shown, the fiber optic module 3 passes through the optical channel integrated board 1 and enters the vacuum chamber 8, and is connected to the first end of the detector module 4; the detector module 4 is mounted on the PCB module 5, and the second end of the detector module 4 is connected to the first end of the PCB module 5; the PCB module 5 is mounted on the cooling module 7, and the second end of the PCB module 5 is connected to the first end of the microstrip line module 6; the second end of the microstrip line module 6 is connected to the electrical channel integrated board 2.

[0092] Specifically, in this embodiment, the optical channel integrated board 1, the optical fiber module 3, the detector module 4, the PCB module 5, the microstrip line module 6, and the electrical channel integrated board 2 are connected sequentially, enabling the photoelectric detection system to complete photoelectric conversion. The cooling module 7 provides a low-temperature environment for the photoelectric detection system. As an example, such as... Figure 3 As shown, the vacuum chamber 8 includes a chamber body and a base. The cooling module 7 includes a first cold stage, a second cold stage, and a cooling unit. The cooling unit is installed inside the base. The optical channel integrated board 1 and the electrical channel integrated board 2 are disposed on the outer surface of the base. The fiber optic module 3 can pass through the optical channel integrated board 1 into the vacuum chamber 8 and connect to the detector module 4. The detector module 4 is mounted and connected to the PCB module 5. The PCB module 5 passes through and is mounted on the second cold stage. The PCB module 5 includes a multi-channel electrical interface module, so the PCB module 5 can connect to a multi-core microstrip line. The multi-core microstrip line passes through the first cold stage and connects to the electrical channel integrated board 2. The PCB module 5 can use a multi-core connector. The first and second multi-channel electrical interface boards also use multi-core connectors to expand the electrical interface, and the multi-core connectors are relatively small in size. In practical applications, the specific settings of the photoelectric detection system can be configured as needed, and are not limited to this embodiment.

[0093] In summary, the photoelectric detection system of this invention includes: a detector module, a PCB module, a cooling module, an optical fiber module, a microstrip line module, a vacuum chamber, an optical channel integrated board, and an electrical channel integrated board. The detector module, PCB module, cooling module, and microstrip line module are disposed within the vacuum chamber. The optical channel integrated board and electrical channel integrated board are embedded on the surface of the vacuum chamber. The optical fiber module transmits optical signals to the photoelectric detection system through the optical channel integrated board, and the microstrip line module is connected to the electrical channel integrated board to output electrical signals. By using the optical channel integrated board and electrical channel integrated board, this invention enables the detector module to complete photoelectric conversion in a vacuum and low-temperature environment, and significantly increases the number of optical channels and / or electrical channels. Therefore, this invention effectively overcomes the various shortcomings of existing technologies and has high industrial application value.

[0094] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A photoelectric detection system, characterized in that, The photoelectric detection system includes at least: an optical fiber module, a detector module, a PCB module, a microstrip line module, a cooling module, a vacuum enclosure, an optical channel integrated board, and an electrical channel integrated board; The detector module, the PCB module, the microstrip line module, and the cooling module are all housed inside the vacuum chamber. The optical channel integrated board includes an optical fiber cover plate, a first base plate, and a first base; the end face of the first base plate is embedded in the surface of the vacuum hood, and the through hole communicates with the interior of the vacuum hood; the optical fiber cover plate is fixed on the first base plate, and the first base plate is fixed on the first base plate, and the optical fiber cover plate and the first base plate together form a sealed space in the through hole of the first base plate. And / or, the electrical channel integrated board includes a PCB board, a second base plate, and a second base; the end face of the second base plate is embedded in the surface of the vacuum hood, and the through hole communicates with the interior of the vacuum hood; the PCB board is fixed on the second base plate, the second base plate is fixed on the second base plate, and the PCB board and the second base plate together form a sealed space for the through hole of the second base plate; a first multi-channel electrical interface board and a second multi-channel electrical interface board are arranged on the PCB board in sequence, and the first multi-channel electrical interface board and the second multi-channel electrical interface board together penetrate the PCB board; The optical fiber module passes through the optical channel integrated plate into the vacuum chamber and connects to the first end of the detector module; The detector module is mounted on the PCB module, and the second end of the detector module is connected to the first end of the PCB module; The PCB module is mounted on the cooling module, and the second end of the PCB module is connected to the first end of the microstrip line module. The second end of the microstrip module is connected to the electrical channel integrated board.

2. The photoelectric detection system according to claim 1, characterized in that: The first base has a first fixing hole on its end face, and the first base plate has a second fixing hole, a first mounting hole and a first optical fiber hole. The optical channel integrated board has n optical fiber cover plates, where n is a natural number greater than or equal to 1. The optical fiber cover plates have a second mounting hole and a second optical fiber hole. The first base plate is fixed to the first base through the first fixing hole and the second fixing hole; The fiber optic cover is fixed to the first base plate through the first mounting hole and the second mounting hole, and the fiber optic module enters the vacuum chamber by passing through the second fiber optic hole and the first fiber optic hole in sequence.

3. The photoelectric detection system according to claim 2, characterized in that: The optical channel integrated board also includes a first sealing strip; A first groove is provided on the end face of the first base; the first sealing strip is correspondingly disposed between the first groove and the base plate.

4. The photoelectric detection system according to claim 2, characterized in that: The optical channel integrated board also includes n second sealing strips; The first base plate has n second grooves on the side opposite to the optical fiber cover plate, and the n second grooves correspond one-to-one with the n optical fiber cover plates; the second sealing strip is disposed between the corresponding second groove and the optical fiber cover plate; the second mounting hole is located outside the second groove, and the second optical fiber hole is located inside the second groove.

5. The photoelectric detection system according to claim 2, characterized in that: The second fiber optic hole is located within the area enclosed by the second mounting hole.

6. The photoelectric detection system according to claim 1, characterized in that: The second base has a third fixing hole on its end face, the second base plate has a fourth fixing hole, a third mounting hole and a first opening, and the PCB board also has a fourth mounting hole; The second base plate is fixed to the second base through the third fixing hole and the fourth fixing hole; The PCB board is fixed to the second base plate through the third mounting hole and the fourth mounting hole, and the microstrip module passes through the first opening to connect to the first multi-channel electrical interface board.

7. The photoelectric detection system according to claim 6, characterized in that: The electrical channel integrated board also includes a fixing plate, which is provided with a fifth mounting hole and a second opening. The fixing plate is fixed to the PCB board by the assembly of the fifth mounting hole and the fourth mounting hole, and the second multi-channel electrical interface board is located in the second opening.

8. The photoelectric detection system according to claim 6, characterized in that: The electrical channel integrated board also includes a third sealing strip; A third groove is provided on the end face of the second base; the third sealing strip is correspondingly disposed between the third groove and the base plate.

9. The photoelectric detection system according to claim 6, characterized in that: The electrical channel integrated board also includes a fourth sealing strip; A fourth groove is provided on the side of the second base plate opposite to the PCB board; the fourth sealing strip is disposed between the fourth groove and the PCB board; The fourth mounting hole is located outside the fourth groove, and the first multi-channel electrical interface board is located inside the fourth groove.

10. The photoelectric detection system according to claim 1, characterized in that: Both the first multi-channel electrical interface board and the second multi-channel electrical interface board are multi-core electrical connectors, and the PCB module is a multi-core electrical connector.

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