Efficient circulating heat dissipation all-in-one machine

Abstract

The utility model relates to the technical field of all-in-one computer devices, in particular to an efficient circulating heat dissipation all-in-one machine which comprises a shell and a display screen arranged on the shell and further comprises a mainboard arranged on the shell, a processor module arranged on the mainboard and a heat dissipation module arranged on the shell. The heat dissipation module comprises a heat conduction base arranged on the processor module, one side of the heat conduction base is connected with a first heat dissipation assembly, and the other side of the heat conduction base is connected with a second heat dissipation assembly; the shell is provided with an air inlet hole set and an air outlet hole set which are communicated with the first heat dissipation assembly and the second heat dissipation assembly, and the air inlet hole set comprises supplementary air inlet holes which can be opened or closed. When the temperature of the processor is high, the first heat dissipation assembly continuously operates, the second heat dissipation assembly and the supplementary air inlet are started to increase the air inlet amount when the temperature of the processor is high so as to guarantee the heat dissipation effect on the processor, the heat dissipation effect on the processor is guaranteed on the basis that the noise reduction requirement is met, and therefore the processor with the higher specification can be installed to meet the performance requirement.

Description

Technical Field

[0001] This application relates to the field of all-in-one computer devices, and in particular to an all-in-one computer with high-efficiency circulating heat dissipation. Background Technology

[0002] An all-in-one PC is a computer that integrates the processor, motherboard, hard drive, screen, speakers, webcam, and monitor into a single unit. All the internal hardware is located directly behind the monitor, and the connection between these components saves or shortens the number of data cables, effectively reducing packaging and shipping costs.

[0003] All-in-one PCs are limited by heat dissipation and noise reduction requirements, and are usually equipped with relatively conventional processors. These processors can hardly meet the user's needs after a period of use. However, the components of all-in-one PCs are difficult to upgrade later, which makes it easy for existing all-in-one PCs to have performance bottlenecks and fail to meet the user's long-term use needs. Utility Model Content

[0004] The purpose of this application is to provide an all-in-one machine with high-efficiency circulating heat dissipation, which aims to improve the heat dissipation performance of the all-in-one machine and enable the all-in-one machine to be configured with higher-specification hardware.

[0005] A high-efficiency circulating heat dissipation integrated machine includes a housing and a display screen disposed on the housing, a motherboard disposed on the housing, a processor module disposed on the motherboard, and a heat dissipation module disposed on the housing; the heat dissipation module includes a heat-conducting base disposed on the processor module, a first heat dissipation component connected to one side of the heat-conducting base, and a second heat dissipation component connected to the other side of the heat-conducting base; the housing is provided with an air inlet group and an air outlet group communicating with the first heat dissipation component and the second heat dissipation component, the air inlet group including supplementary air inlets that can be opened or closed.

[0006] Furthermore, the first heat dissipation component includes a first heat dissipation shell disposed on the outer casing and a first heat dissipation fan disposed on the first heat dissipation shell. The first heat dissipation shell is connected to the air inlet group and the air outlet group, and the first heat dissipation shell surrounds to form a first air passage. The thermally conductive base is connected to a plurality of first thermally conductive copper pipes, and the plurality of first thermally conductive copper pipes are connected to the first heat dissipation shell.

[0007] Furthermore, the second heat dissipation component includes a second heat dissipation housing disposed on the outer casing and a second heat dissipation fan disposed on the second heat dissipation housing. The second heat dissipation housing is connected to the air inlet group and the air outlet group, and the second heat dissipation housing forms a second air passage. The thermally conductive base is connected to a plurality of second thermally conductive copper pipes, and the plurality of second thermally conductive copper pipes are connected to the second heat dissipation housing. The supplementary air inlet faces the second heat dissipation fan.

[0008] Furthermore, the second heat dissipation component also includes an air inlet cover fitted into the supplementary air inlet and an air inlet valve rotatably connected to the supplementary air inlet, the air inlet valve being located on the side of the air inlet cover closer to the second cooling fan.

[0009] Furthermore, the air inlet valve is provided with several guide sections along its length.

[0010] Furthermore, the air inlet group is located below the housing, and the air outlet group is located above the housing; the air inlet group includes a plurality of first air inlets and a plurality of second air inlets disposed on the housing, the plurality of first air inlets facing the first heat dissipation component; the plurality of second air inlets are located on one side of the supplementary air inlet.

[0011] The beneficial effects of this application are:

[0012] This application discloses a high-efficiency circulating cooling all-in-one machine. By setting a cooling module in the processor module, the cooling module is equipped with a first cooling component and a second cooling component connected to the processor for heat dissipation. When the processor is running, the first cooling component operates continuously, while the second cooling component and the supplementary air inlet are activated and opened when the processor temperature is high to increase the air intake and ensure the cooling effect on the processor. By setting the cooling module in this way, the cooling effect on the processor can be guaranteed while meeting the noise reduction requirements, so that the all-in-one machine can be adapted to install higher-specification processors to meet performance requirements.

[0013] 2. The high-efficiency circulating cooling integrated machine of this application is provided with an air inlet cover and a rotatable air inlet valve at the supplementary air inlet. When the integrated machine needs to perform high load tasks, the air inlet cover can be removed to allow the air inlet valve to rotate and start, thereby increasing the air intake for heat dissipation. When the integrated machine is running smoothly, installing the air inlet cover can effectively reduce the entry of external dust into the integrated machine, increase the dustproof capability of the integrated machine, and reduce the frequency of cleaning and maintenance. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of a high-efficiency circulating heat dissipation integrated machine provided in an embodiment of this application;

[0015] Figure 2 This is a schematic diagram of the internal structure of a high-efficiency circulating heat dissipation integrated machine provided in an embodiment of this application;

[0016] Figure 3 This is a schematic diagram of another internal structure of a high-efficiency circulating heat dissipation integrated machine provided in an embodiment of this application;

[0017] Figure 4 This is a schematic diagram of the installation structure of the air inlet cover and air inlet valve in the embodiments of this application;

[0018] Figure 5 This is a schematic diagram of the air inlet valve in an embodiment of this application.

[0019] Explanation of reference numerals in the attached figures:

[0020] 1. Outer casing; 11. Air inlet assembly; 111. First air inlet; 112. Second air inlet; 113. Supplementary air inlet; 12. Air outlet assembly; 2. Motherboard; 3. Processor module; 4. Heat dissipation module; 41. Thermal base; 411. First thermally conductive copper pipe; 412. Second thermally conductive copper pipe; 42. First heat dissipation component; 421. First heat dissipation shell; 422. First cooling fan; 43. Second heat dissipation component; 431. Second heat dissipation shell; 432. Second cooling fan; 433. Air inlet cover; 434. Air inlet valve; 4341. Airflow guide. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0022] It should be noted that although functional modules are divided in the device schematic diagram and a logical order is shown in the flowchart, in some cases, the steps shown or described may be performed in a different order than the module division in the device or the order in the flowchart. The terms "first," "second," etc., in the specification, claims, and the aforementioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing embodiments of this application only and is not intended to limit this application.

[0024] Reference Figure 1 as well as Figure 2 A high-efficiency circulating cooling all-in-one PC includes a casing and a display screen (not shown in the figure) mounted on the casing, a motherboard mounted on the casing, a processor module mounted on the motherboard, and a cooling module mounted on the casing. When the all-in-one PC is running, the display screen and the processor module operate, and the cooling module efficiently cools the processor module to ensure the normal operation of the all-in-one PC. It should be noted that the all-in-one PC also includes other modules to ensure normal operation, such as a graphics card module, a power supply module, and a hard drive module, which will not be described in detail here.

[0025] Reference Figure 1 , Figure 2 as well as Figure 3More specifically, the display screen is located on one side of the main body, and the motherboard 2 and the processor module 3 are located on the side of the housing 1 away from the display screen. The processor module 3 includes a processor located on the motherboard 2, and the processor is electrically connected to the motherboard 2.

[0026] The heat dissipation module 4 includes a heat-conducting base 41 disposed on the processor module 3. The heat-conducting base 41 is attached to the top of the processor. When the processor is running, the heat generated by the processor will be continuously conducted to the heat-conducting base 41. In order to achieve efficient heat dissipation, a first heat dissipation component 42 is connected to one side of the heat-conducting base 41, and a second heat dissipation component 43 is connected to the other side of the heat-conducting base 41. The first heat dissipation component 42 and the second heat dissipation component 43 can operate simultaneously for heat dissipation.

[0027] Correspondingly, the outer casing 1 is provided with an air inlet group 11 and an air outlet group 12 connecting the first heat dissipation component 42 and the second heat dissipation component 43. The air inlet group 11 is located at the bottom of the outer casing 1 and includes a plurality of first air inlets 111 and a plurality of second air inlets 112 disposed on the outer casing 1. The plurality of first air inlets 111 face the first heat dissipation component 42 and the plurality of second air inlets 112 face the second heat dissipation component 43. The air outlet group 12 includes a plurality of air outlets located at the top of the outer casing 1. The first air inlets 111, the second air inlets 112 and the air outlets are normally open. When the first heat dissipation component 42 or the second heat dissipation component 43 is running, gas is introduced through the air inlets, and after being cooled by the first heat dissipation component 42 and the second heat dissipation component 43, the gas is discharged from the air outlets.

[0028] In this embodiment, the first heat dissipation component 42 includes a first heat dissipation shell 421 disposed on the outer casing 1 and a first cooling fan 422 disposed on the first heat dissipation shell 421. The first heat dissipation shell 421 connects to the air inlet group 11 and the air outlet group 12, and the first heat dissipation shell 421 forms a first air passage. A thermally conductive base 41 is connected to a plurality of first thermally conductive copper pipes 411, which are connected to the first heat dissipation shell 421. Similarly, the second heat dissipation component 43 includes a second heat dissipation shell 431 disposed on the outer casing 1 and a second cooling fan 432 disposed on the second heat dissipation shell 431. The second heat dissipation shell 431 connects to the air inlet group 11 and the air outlet group 12, and the second heat dissipation shell 431 forms a second air passage. A thermally conductive base 41 is connected to a plurality of second thermally conductive copper pipes 412, which are connected to the second heat dissipation shell 431. With this arrangement, when the processor generates a large amount of heat, the first heat dissipation component 42 and the second heat dissipation component 43 can operate simultaneously to ensure the heat dissipation effect on the processor.

[0029] Reference Figure 4 as well as Figure 5Furthermore, noise reduction is also necessary to improve the user experience during operation of the all-in-one PC. If the two fans run continuously, it will result in significant noise and increase the amount of dust drawn into the all-in-one PC, leading to a higher frequency of maintenance and cleaning. Therefore, the air intake assembly 11 includes a supplementary air intake 113 that can be opened or closed, facing the second cooling fan 432. Several second air intakes 112 are located on one side of the supplementary air intake 113, and the number of second air intakes 112 is less than the number of first air intakes 111. Correspondingly, the second heat dissipation assembly 43 also includes an air intake cover 433 fitted into the supplementary air intake 113 and an air intake valve 434 rotatably connected to the supplementary air intake 113. The air intake valve 434 is located on the side of the air intake cover 433 closer to the second cooling fan 432. The air intake valve 434 has rotating shafts on both sides, and is rotatably connected to the outer casing 1 via these shafts. Several guide portions 4341 are provided along the length of the air intake valve 434.

[0030] This configuration ensures both effective heat dissipation and noise reduction / dust prevention, allowing the all-in-one PC to better accommodate higher-spec processors. When the all-in-one PC is running high-load tasks, its processor generates significant heat, triggering the second cooling component 43. Opening the air intake cover 433 initially increases airflow. As the processor temperature rises above a preset level, the air intake valve 434 flips, expanding the supplementary air intake vent 113. Air is then accelerated into the second cooling fan 432 and the second heat sink housing 431 by the air intake valve 434's guide section 4341 for cooling. When the all-in-one PC is running smoothly under low load conditions, the air intake valve 434 flips, reducing the size of the supplementary air intake vent 113. The air intake cover 433 can then be installed to close the supplementary air intake vent 113 for dust prevention, noise reduction, and improved user experience. It should be noted that the air intake cover 433 can also be opened or closed electrically by rotation or extension to further enhance the user experience.

[0031] Exemplary embodiments of this disclosure have been specifically shown and described above. It should be understood that this disclosure is not limited to the detailed structures, arrangements, or implementations described herein; rather, this disclosure is intended to cover various modifications and equivalent arrangements contained within the spirit and scope of the appended claims.

Claims

1. A high-efficiency circulating heat dissipation integrated machine, comprising a housing (1) and a display screen disposed on the housing (1), characterized in that, It also includes a motherboard (2) disposed on the housing (1), a processor module (3) disposed on the motherboard (2), and a heat dissipation module (4) disposed on the housing (1); the heat dissipation module (4) includes a heat-conducting base (41) disposed on the processor module (3), one side of the heat-conducting base (41) is connected to a first heat dissipation component (42), and the other side of the heat-conducting base (41) is connected to a second heat dissipation component (43); the housing (1) is provided with an air inlet group (11) and an air outlet group (12) communicating with the first heat dissipation component (42) and the second heat dissipation component (43), and the air inlet group (11) includes a supplementary air inlet (113) that can be opened or closed.

2. The high-efficiency circulating heat dissipation integrated machine according to claim 1, characterized in that, The first heat dissipation component (42) includes a first heat dissipation housing (421) disposed on the outer shell (1) and a first heat dissipation fan (422) disposed on the first heat dissipation housing (421). The first heat dissipation housing (421) is connected to the air inlet group (11) and the air outlet group (12). The first heat dissipation housing (421) forms a first air passage. The heat-conducting base (41) is connected to a plurality of first heat-conducting copper pipes (411). The plurality of first heat-conducting copper pipes (411) are connected to the first heat dissipation housing (421).

3. A high-efficiency circulating heat dissipation integrated machine according to claim 1 or 2, characterized in that, The second heat dissipation component (43) includes a second heat dissipation housing (431) disposed on the outer shell (1) and a second heat dissipation fan (432) disposed on the second heat dissipation housing (431). The second heat dissipation housing (431) is connected to the air inlet group (11) and the air outlet group (12). The second heat dissipation housing (431) forms a second air passage. The heat-conducting base (41) is connected to a plurality of second heat-conducting copper pipes (412). The plurality of second heat-conducting copper pipes (412) are connected to the second heat dissipation housing (431). The supplementary air inlet (113) faces the second heat dissipation fan (432).

4. The high-efficiency circulating heat dissipation integrated machine according to claim 3, characterized in that, The second heat dissipation component (43) further includes an air inlet cover (433) fitted into the supplementary air inlet (113) and an air inlet valve (434) rotatably connected to the supplementary air inlet (113), wherein the air inlet valve (434) is located on the side of the air inlet cover (433) near the second heat dissipation fan (432).

5. The high-efficiency circulating heat dissipation integrated machine according to claim 4, characterized in that, The air inlet valve (434) is provided with several guide sections (4341) along its length.

6. The high-efficiency circulating heat dissipation integrated machine according to claim 1, characterized in that, The air inlet group (11) is located below the outer casing (1), and the air outlet group (12) is located above the outer casing (1); the air inlet group (11) includes a plurality of first air inlets (111) and a plurality of second air inlets (112) disposed on the outer casing (1), the plurality of first air inlets (111) facing the first heat dissipation component (42); the plurality of second air inlets (112) are located on one side of the supplementary air inlet (113).

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