Chat robot mainboard

Abstract

The utility model relates to the technical field of main boards, in particular to a chat robot main board which comprises a main board body and further comprises a heat conduction substrate arranged at the bottom of the main board body, and a plurality of heat dissipation fins distributed at equal intervals are fixedly connected to the bottom of the heat conduction substrate. The shielding cover is arranged outside the mainboard body, positioning pressing plates are fixedly connected to the left side and the right side of the lower end of the inner wall of the shielding cover, and positioning rubber pressing sleeves which are of hollow structures and make contact with the top of the mainboard body are bonded to the bottoms of the positioning pressing plates. Under the action of the shielding cover, the heat conduction substrate and the shock insulation rubber block, the main board has the advantages of interference resistance and long service life, and the problems that the service life of the main board is shortened and communication fails due to the fact that an existing chat robot main board is prone to being interfered by external physical environments and electromagnetism in the using process are solved.

Description

Technical Field

[0001] This utility model relates to the field of motherboard technology, specifically a chatbot motherboard. Background Technology

[0002] A chatbot is a computer program that simulates human conversation through text or voice. Its design goal is to understand user intent and respond appropriately. Core functions include simulating dialogue, interacting through natural language processing (NLP) or keyword matching technologies, and some can pass the Turing test to verify their human-likeness. Practical applications include customer service, information retrieval, and entertainment interaction. Some are integrated into virtual assistants or instant messaging platforms.

[0003] Currently, chatbots cannot function without a motherboard. However, existing chatbot motherboards are susceptible to interference from the external physical environment and electromagnetic fields, which can lead to a decrease in the motherboard's lifespan and communication failures. To address this, we propose a new chatbot motherboard. Utility Model Content

[0004] The purpose of this invention is to provide a chatbot motherboard that has the advantages of anti-interference and long service life, and solves the problem that existing chatbot motherboards are easily affected by external physical environment and electromagnetic interference during use, which leads to a decrease in the service life of the motherboard and communication failure.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a chatbot motherboard, comprising a motherboard body, and further comprising:

[0006] A heat-conducting substrate is disposed at the bottom of the motherboard body, and a plurality of heat dissipation fins are fixedly connected to the bottom of the heat-conducting substrate.

[0007] A shielding cover is installed on the outside of the motherboard body. Positioning pressure plates are fixedly connected to the left and right sides of the lower end of the inner wall of the shielding cover. A positioning rubber pressure sleeve with a hollow structure inside and in contact with the top of the motherboard body is glued to the bottom of the positioning pressure plate.

[0008] Preferably, positioning posts are provided on the inner surface of each of the four corners of the thermal conductive substrate, and positioning bases are fixedly connected to the bottom of the positioning posts.

[0009] Preferably, mounting blocks are fixedly installed at both the left and right ends of the bottom of the positioning base, and a positioning groove adapted to the lower end of the shielding cover is provided at the upper end of the inner wall of the positioning base. Positioning slots are provided at both the front and rear ends of the left and right sides of the positioning groove.

[0010] Preferably, the bottom of the inner side of the positioning base is provided with a plurality of equally spaced recesses, and a vibration isolation rubber block is provided inside the recesses. A vibration isolation cavity is provided on the inner surface of the upper end of the vibration isolation rubber block.

[0011] Preferably, the shielding cover has adjustment slots at both the front and rear ends on both sides, and a positioning spring is fixedly connected to the bottom of the inner side of the adjustment slot. A positioning block is provided on one side of the positioning spring.

[0012] Preferably, the positioning spring is inclined outward, and a toggle bar is fixedly connected to the top of the positioning spring.

[0013] Preferably, an inverted V-shaped spring is fixedly connected between the inner wall of the adjustment groove and the positioning spring.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0015] 1. This utility model, through the setting of the shielding cover, can provide physical and electromagnetic shielding on the outside of the motherboard body, avoiding various adverse effects on the motherboard body, including external dust, moisture, impacts and electromagnetic interference.

[0016] 2. This utility model, with the help of a heat-conducting substrate placed at the bottom of the motherboard body and multiple equally spaced heat dissipation fins, can dissipate heat from the motherboard body in a shielded state. The vibration-damping rubber block set in the concave hole, and with the assistance of the vibration-damping cavity, can provide buffer protection when in contact with the bottom of the heat-conducting substrate, in conjunction with the positioning rubber sleeve in contact with the top of the motherboard body, thus avoiding the adverse effects of vibration and mechanical impact on the motherboard body and extending the service life of the motherboard body. Attached Figure Description

[0017] Figure 1 This is a first-view structural diagram of the present invention;

[0018] Figure 2 This is a schematic diagram of the cross-sectional structure of the present invention from a second perspective;

[0019] Figure 3 This is a schematic diagram of the third-view cross-sectional structure of this utility model;

[0020] Figure 4 This is a schematic diagram of the exploded structure of this utility model;

[0021] Figure 5 This is a schematic diagram of the unfolded structure of the heat-conducting base plate and positioning base of this utility model;

[0022] Figure 6 This is a schematic diagram of the principle framework of this utility model.

[0023] In the diagram: 1. Positioning base; 101. Mounting block; 102. Vibration isolation rubber block; 103. Vibration isolation cavity; 104. Positioning slot; 105. Positioning post; 106. Recessed hole; 107. Positioning groove; 2. Shielding cover; 201. Adjustment groove; 202. Positioning pressure plate; 203. Inverted V-shaped spring; 204. Toggle bar; 205. Positioning block; 206. Positioning spring; 3. Main board body; 4. Heat-conducting substrate; 401. Heat dissipation fins; 5. Positioning rubber pressure sleeve. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] In the description of this utility model, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In addition, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0026] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0027] The positioning base 1, mounting block 101, vibration isolation rubber block 102, vibration isolation cavity 103, positioning slot 104, positioning post 105, concave hole 106, positioning groove 107, shielding cover 2, adjustment groove 201, positioning pressure plate 202, inverted V-shaped spring 203, toggle bar 204, positioning block 205, positioning spring 206, main board body 3, heat-conducting substrate 4, heat dissipation fins 401, and positioning rubber pressure sleeve 5 of this application are all general standard parts or parts known to those skilled in the art. Their structure and principle can be learned by those skilled in the art through technical manuals or conventional experimental methods.

[0028] Example 1

[0029] Please see Figures 1-5 As shown, this utility model provides a technical solution: a chatbot motherboard, including a motherboard body 3, and further including:

[0030] A heat-conducting substrate 4 is disposed at the bottom of the motherboard body 3, and a plurality of heat dissipation fins 401 are fixedly connected to the bottom of the heat-conducting substrate 4.

[0031] The shielding cover 2 is located outside the motherboard body 3. Positioning pressure plates 202 are fixedly connected to the left and right sides of the lower end of the inner wall of the shielding cover 2. Positioning pressure plates 202 have a positioning rubber sleeve 5 with a hollow structure inside that contacts the top of the motherboard body 3.

[0032] Positioning posts 105 are provided on the inner surface of the four corners of the heat-conducting substrate 4. Positioning base 1 is fixedly connected to the bottom of the positioning posts 105. Mounting blocks 101 are fixedly installed on the left and right ends of the bottom of the positioning base 1. Positioning grooves 107 that are adapted to the lower end of the shielding cover 2 are opened at the upper end of the inner wall of the positioning base 1. Positioning slots 104 are opened at the front and rear ends of the left and right sides of the positioning grooves 107. Multiple equally spaced concave holes 106 are opened at the bottom of the inner side of the positioning base 1. Vibration isolation rubber blocks 102 are provided inside the concave holes 106. Vibration isolation cavities 103 are opened on the inner surface of the upper end of the vibration isolation rubber blocks 102.

[0033] This technical solution: By setting the mounting block 101, the positioning base 1 can be installed in the usage position. Then, by setting the shielding cover 2, it can provide physical and electromagnetic shielding on the outside of the motherboard body 3, avoiding various adverse effects on the motherboard body 3, including external dust, moisture, impact, and electromagnetic interference. With the cooperation of the heat-conducting substrate 4 placed at the bottom of the motherboard body 3 and the assistance of multiple equally spaced heat dissipation fins 401, the motherboard body 3 can dissipate heat under shielding conditions. With the vibration-damping rubber block 102 set in the concave hole 106 and the assistance of the vibration-damping cavity 103, when it contacts the bottom of the heat-conducting substrate 4, it can cooperate with the positioning rubber sleeve 5 that contacts the top of the motherboard body 3 to provide buffer protection during vibration, avoiding the adverse effects of vibration and mechanical impact on the motherboard body 3, thereby extending the service life of the motherboard body 3.

[0034] Example 2

[0035] Based on Embodiment 1, this utility model is as follows: Figures 1-5 As shown, the shielding cover 2 has adjustment grooves 201 at both the front and rear ends on both sides. A positioning spring 206 is fixedly connected to the bottom of the inner side of the adjustment groove 201. A positioning block 205 is provided on one side of the positioning spring 206. The positioning spring 206 is tilted outward. A toggle strip 204 is fixedly connected to the top of the positioning spring 206. An inverted V-shaped spring 203 is fixedly connected between the inner wall of the adjustment groove 201 and the positioning spring 206.

[0036] This technical solution involves a slight deformation of the positioning spring 206 caused by the actuating bar 204. This deformation causes the inverted V-shaped spring 203 to deform. After the positioning spring 206 retracts into the adjustment groove 201, the positioning block 205 on one side of the positioning spring 206 will exit the positioning slot 104, making it easier for staff to remove the shielding cover 2 from the positioning groove 107 to inspect or maintain the motherboard body 3. When the actuating bar 204 is released, the shielding cover 2 is moved into the positioning groove 107. At this time, with the assistance of the positioning spring 206 and the inverted V-shaped spring 203, the positioning block 205 will be moved back into the positioning slot 104, thereby achieving rapid positioning and installation of the shielding cover 2.

[0037] like Figure 6 As shown, the basic functions of motherboard body 3 are introduced as follows:

[0038] 1. Model R128S3WIFISOC is used;

[0039] 2. Supports two SPI interface LCD screens with a resolution of 240*240. The screens act as the robot's eyes, expressing its emotions. For example, the eyeballs will move when thinking; when angry, the eyes will show anger.

[0040] 3. Two microphones, supporting interruption and wake-up during voice interaction. Supports environmental noise reduction function, which can pick up clean human voices;

[0041] 4. One speaker, 2W power, for voice broadcasting;

[0042] 5. Supports 2.4G Wi-Fi connectivity for data exchange between devices and the cloud;

[0043] 6. It has a motor drive circuit that can drive the robot to rotate its neck, ears, and mouth. When speaking, its mouth will open and close, maximizing the simulation of human facial expressions during speech;

[0044] 7. Equipped with a gyroscope circuit, it will alert the robot if it falls over;

[0045] 8. USB-C charging port.

[0046] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit the scope of protection of this utility model. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this utility model without departing from the essence and scope of the technical solutions of this utility model.

Claims

1. A chatbot motherboard comprising a motherboard body (3), characterized in that, Also includes: A heat-conducting substrate (4) is disposed at the bottom of the motherboard body (3), and a plurality of heat dissipation fins (401) are fixedly connected to the bottom of the heat-conducting substrate (4). A shielding cover (2) is set outside the motherboard body (3). Positioning pressure plates (202) are fixedly connected to the left and right sides of the lower end of the inner wall of the shielding cover (2). A positioning rubber sleeve (5) with a hollow internal structure and in contact with the top of the motherboard body (3) is glued to the bottom of the positioning pressure plate (202).

2. The chatbot mainboard of claim 1, wherein: Positioning posts (105) are provided on the inner surfaces of the four corners of the heat-conducting substrate (4), and positioning bases (1) are fixedly connected to the bottom of the positioning posts (105).

3. The chatbot mainboard of claim 2, wherein: Mounting blocks (101) are fixedly installed at both the left and right ends of the bottom of the positioning base (1). A positioning groove (107) adapted to the lower end of the shield (2) is provided at the upper end of the inner wall of the positioning base (1). Positioning slots (104) are provided at both the front and rear ends of the left and right sides of the positioning groove (107).

4. The chatbot mainboard of claim 3, wherein: The bottom of the inner side of the positioning base (1) is provided with a plurality of equally spaced recesses (106), and a vibration isolation rubber block (102) is provided inside the recesses (106). A vibration isolation cavity (103) is provided on the inner surface of the upper end of the vibration isolation rubber block (102).

5. The chatbot mainboard of claim 1, wherein: The shield (2) has adjustment slots (201) at both the front and rear ends on both sides. A positioning spring (206) is fixedly connected to the bottom of the inner side of the adjustment slot (201). A positioning block (205) is provided on one side of the positioning spring (206).

6. The chatbot mainboard of claim 5, wherein: The positioning spring (206) is inclined outward, and a toggle bar (204) is fixedly connected to the top of the positioning spring (206).

7. The chatbot mainboard of claim 6, wherein: An inverted V-shaped spring (203) is fixedly connected between the inner wall of the adjustment groove (201) and the positioning spring (206).

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