Uniform etching device for PCB (Printed Circuit Board)

Abstract

The utility model relates to the technical field of PCB (Printed Circuit Board) etching, in particular to a PCB uniform etching device, which comprises a rack, a fixed frame is arranged at a position close to the top in the rack, and a plurality of support beams I and support beams II which are crisscrossed are fixed in the fixed frame; a plurality of first liquid baffles and second liquid baffles are arranged below the second supporting beam and the first supporting beam at equal intervals correspondingly, nozzles are installed right above the etching disc and correspond to the positions between the first liquid baffles and the second liquid baffles adjacent to the first liquid baffles, and telescopic rods are installed in the middles of the tops of the first liquid baffles and the middles of the tops of the second liquid baffles correspondingly. The tops of the telescopic rods are fixed to the first supporting beam and the second supporting beam at the corresponding positions. According to the utility model, the liquid baffle plates are arranged around the spray heads, and each spray head is provided with the electromagnetic valve, so that the spray heads in an excessive etching area can be closed by utilizing the electromagnetic valves during etching, and the excessive etching area or an etching area is separated by utilizing the liquid baffle plates, thereby controlling the etching conditions of different areas and ensuring the uniformity of final etching.

Description

Technical Field

[0001] This utility model relates to the field of PCB etching technology, and specifically to a PCB uniform etching device. Background Technology

[0002] PCB etching is one of the important processes in the manufacturing of printed circuit boards (PCBs). Etching is a chemical process used to remove unwanted copper layers from the PCB to form the desired circuit pattern. The basic principle is that the etching solution reacts with the exposed copper layer in a redox reaction, etching away the unwanted copper layer while leaving the copper layer protected by the resist layer, thus forming the circuit.

[0003] Currently, during PCB etching, uneven etching occurs due to issues such as uneven copper base thickness, insufficient design compensation, excessive etching time, unreasonable line spacing, and poor exposure. In some areas, the etched lines are too fine, while in others, they are too coarse. Utility Model Content

[0004] To achieve the above objectives, this utility model specifically adopts the following technical solution:

[0005] A PCB board uniform etching device includes a frame, an etching disk installed in the middle of the frame, a fixing frame installed near the top of the frame, and multiple crisscrossing support beams 1 and 2 fixed in the fixing frame. Multiple equally spaced baffles 1 and 2 are respectively arranged below the support beams 1 and 2. A nozzle is installed directly above the etching disk between adjacent baffles 1 and 2. A telescopic rod is installed at the top center of each baffle 1 and 2, and the top of the telescopic rod is fixed to the corresponding support beams 1 and 2.

[0006] Furthermore, a fixing frame is installed between adjacent baffle plates 1 and 2 within the fixing frame. The nozzle is fixed to the fixing frame, and a support beam 3 is fixed to the top of the fixing frame. The two ends of the support beam 3 are fixed to the fixing frame at corresponding positions. The support beam 3 cooperates with the fixing frame to provide sufficient space for the nozzle to extend between adjacent baffle plates 1 and 2 for installation.

[0007] Furthermore, a liquid supply pipe is installed on the top right side of the frame, and multiple branch pipes are connected to the liquid supply pipe. Each branch pipe has an input pipe connected to a corresponding nozzle position. An extension pipe connected to the nozzle is installed on the mounting bracket. Each extension pipe is connected to a corresponding input pipe, and a solenoid valve is installed at the nozzle connection point. The solenoid valve can control the operation of each individual nozzle, thereby allowing for better control of the spraying and etching positions.

[0008] Furthermore, positioning holes are provided on both the first and second support beams corresponding to the two ends of the first and second baffles, respectively. Positioning rods are installed on the top of the first and second baffles, corresponding to the positioning holes. The positioning rods move through the positioning holes to form sliding supports. When the first and second baffles move up and down, they cause the positioning rods to slide within the positioning holes, thereby providing better support and stability for the first and second baffles.

[0009] Furthermore, a working window is provided on the front of the frame above the etching disk, and a splash guard is hinged to the frame at the working window position. The splash guard can be made transparent to facilitate visual observation of the internal etching process.

[0010] Furthermore, a waste liquid tank is installed within the frame below the etching plate. The waste liquid tank has an opening at the top, and the etching plate has multiple equally spaced protrusions. Through holes are formed on the etching plate between adjacent protrusions. The waste liquid tank centrally collects waste liquid, eliminating the need for external drainage pipelines and allowing the device to be flexibly repositioned according to production needs.

[0011] Furthermore, a concentrated liquid discharge pipe and a clear liquid discharge pipe are respectively installed on the rear side of the frame, corresponding to the bottom and top of the waste liquid tank. Both the concentrated liquid discharge pipe and the clear liquid discharge pipe are equipped with manual valves and are connected to the waste liquid tank. The clear liquid and concentrated liquid exit separately, allowing them to enter different waste liquid treatment stages according to their concentrations.

[0012] Furthermore, a ventilation duct is installed on the rear side of the frame below the fixed frame. The ventilation duct communicates with the interior of the frame and contains a filter element. The filter element is any one or a combination of several of the following: polyethersulfone filter element, PP cotton melt-blown filter element, wire-wound filter element, pleated filter element, and activated carbon filter element. The filter element can filter the odor of the etching solution and the odor generated during etching, thereby reducing the etching odor in the workspace.

[0013] The beneficial effects of this utility model are as follows:

[0014] 1. This utility model sets up baffles around the nozzle and equips each nozzle with a solenoid valve. During etching, the solenoid valve can be used to close the nozzle in the etched over-area, and the baffles can be used to separate the etched over-area or the area being etched, which greatly reduces the flow of etching liquid into the etched or over-etched area, thereby controlling the etching situation in different areas and ensuring the uniformity of the final etching.

[0015] 2. In this utility model, bumps are provided on the etching disk, which can form a protrusion after the PCB is placed, so as to ensure the flow of etching solution and prevent the PCB board from floating on the etching solution.

[0016] 3. In this utility model, a clear liquid discharge pipe and a concentrated liquid discharge pipe are installed on the waste liquid tank, which can separate the collected etching waste liquid into clear and concentrated liquids for separate discharge, and allow it to enter different waste liquid treatment stages according to its concentration.

[0017] 4. In this utility model, a ventilation pipe is installed on the frame, and a filter element is installed inside the ventilation pipe. On the one hand, this facilitates the discharge of etching odors inside the frame, and on the other hand, it filters foreign objects, reducing etching odors in the workspace. Attached Figure Description

[0018] Figure 1 This is a front view of the present invention;

[0019] Figure 2 This is a rear view of the present invention;

[0020] Figure 3 This is a cross-sectional view of the present invention;

[0021] Figure 4 This is a schematic diagram of the input tube configuration in this utility model;

[0022] Figure 5 This is a schematic diagram of the baffle plate in this utility model;

[0023] Figure 6 This is a schematic diagram of the nozzle configuration in this utility model.

[0024] Reference numerals: 1. Frame; 2. Etching plate; 3. Protrusion; 4. Through hole; 5. Nozzle; 6. Mounting bracket; 7. Solenoid valve; 8. Extension pipe; 9. Input pipe; 10. Diverter pipe; 11. Liquid supply pipe; 12. Waste liquid tank; 13. Clear liquid discharge pipe; 14. Concentrated liquid discharge pipe; 15. Manual valve; 16. Working window; 17. Splash guard; 18. Baffle plate one; 19. Baffle plate two; 20. Support beam one; 21. Support beam two; 22. Telescopic rod; 23. Support beam three; 24. Positioning rod; 25. Positioning hole; 26. Ventilation pipe; 27. Filter element; 28. Mounting frame. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings.

[0026] This application provides a PCB board uniform etching device, mainly to solve the problem of insufficient uniformity in PCB etching, and provides the following technical solution, which will be combined with the following... Figure 1 - Figure 6 Please provide a detailed explanation:

[0027] A PCB board uniform etching device includes a frame 1, an etching disk 2 installed in the middle of the frame 1, a fixing frame 28 installed near the top of the frame 1, a plurality of crisscrossing support beams 20 and 21 fixed in the fixing frame 28, a plurality of equally spaced liquid baffles 18 and 19 respectively arranged below the support beams 21 and 20, and a nozzle 5 installed directly above the etching disk 2 between adjacent liquid baffles 18 and 19.

[0028] Telescopic rods 22 are installed at the top middle position of both the first baffle plate 18 and the second baffle plate 19. The top of the telescopic rods 22 is fixed to the corresponding support beams 20 and 21. The telescopic rods 22 are pneumatic telescopic rods. A fixing frame 6 is installed between adjacent baffle plates 18 and 29. The nozzle 5 is fixed to the fixing frame 6. A third support beam 23 is fixed to the top of the fixing frame 6. The two ends of the third support beam 23 are fixed to the corresponding fixing frame 28.

[0029] A liquid supply pipe 11 is installed on the top right side of the frame 1. Multiple diversion pipes 10 are connected to the liquid supply pipe 11. An input pipe 9 is connected to each nozzle 5 on the diversion pipe 10. An extension pipe 8 connected to the nozzle 5 is installed on the mounting bracket 6. Each extension pipe 8 is connected to the corresponding input pipe 9. A solenoid valve 7 is installed at the connection position between the extension pipe 8 and the nozzle 5.

[0030] During etching, the PCB board to be etched is placed on the etching tray 2 with the etching surface facing upwards. Then, the etching solution is input through the supply pipe 11. The etching solution is input into each nozzle 5 through the supply pipe 11, the diversion pipe 10, the input pipe 9 and the extension pipe 8. Then, it is sprayed downwards from the nozzle 5, so that the etching solution is evenly sprayed onto the surface of the PCB board to perform etching.

[0031] When an area of ​​the PCB board is over-etched, the solenoid valve 7 on the etching nozzle 5 is closed to stop spraying etching solution in that area. At the same time, based on the edge position of the over-etched area, the telescopic rod 22 above the corresponding position is extended, causing the baffle plate 18 or baffle plate 29 fixed thereto to descend, so that the bottom of baffle plate 18 or baffle plate 29 is close to the PCB board, preventing the etching solution sprayed from adjacent nozzles 5 from falling into the over-etched area, thus protecting the over-etched area. When a local area is not etched and other areas are etched, the baffle plate 18 or baffle plate 29 at the edge position can also be lowered to separate the area being etched, allowing it to be etched separately, protecting the etched area, and preventing further etching that could lead to over-etching, thereby ensuring the uniformity of the final etching.

[0032] In some embodiments, positioning holes 25 are provided on the support beam 1 20 and the support beam 21 at both ends of the baffle plate 2 19 and the baffle plate 1 18, and positioning rods 24 are installed on the top of the baffle plate 2 19 and the baffle plate 1 18 at the positions corresponding to the positioning holes 25. The positioning rods 24 move through the positioning holes 25 at the corresponding positions to form sliding supports.

[0033] The positioning rod 24 cooperates with the positioning hole 25, and together with the telescopic rod 22, it can stably hoist and fix the second baffle plate 19 and the first baffle plate 18.

[0034] In some embodiments, a working window 16 is reserved on the front of the rack 1 above the etching disk 2, and a splash guard 17 is hinged on the rack 1 at the position of the working window 16.

[0035] The work window 16 and the splash guard 17 facilitate the placement of the PCB board and safe observation of the etching process, allowing for targeted adjustments.

[0036] In some embodiments, a waste liquid tank 12 is installed in the frame 1 below the etching disk 2. The waste liquid tank 12 has an opening at the top. A plurality of equally spaced protrusions 3 are pre-set on the etching disk 2, and through holes 4 are opened on the etching disk 2 between adjacent protrusions 3.

[0037] The waste liquid generated by etching can flow through the through hole 4 into the waste liquid tank 12 for centralized collection. At the same time, the setting of the bump 3 ensures that after the PCB board is placed, there is enough gap between the bottom surface and the etching plate 2 for the waste liquid to flow, and also prevents the PCB board from floating on the waste liquid and moving.

[0038] In some embodiments, a concentrated liquid discharge pipe 14 and a clear liquid discharge pipe 13 are respectively installed on the rear side of the frame 1 at the bottom and middle near the top of the waste liquid tank 12. Both the concentrated liquid discharge pipe 14 and the clear liquid discharge pipe 13 are equipped with manual valves 15 and are connected to the waste liquid tank 12.

[0039] After the etching waste liquid flows into the waste liquid tank 12, sedimentation will occur, resulting in a layered situation of a clearer liquid on top and a concentrated sediment at the bottom. When discharging the waste liquid, the clear liquid discharge pipe 13 can be opened first to discharge the clearer waste liquid and collect it separately. Then the concentrated liquid discharge pipe 14 can be opened to discharge the concentrated liquid and collect it separately as well. Discharging separately can be carried out according to the different treatments based on the concentration of the waste liquid, reducing the energy consumption of mixed treatment operations and achieving energy saving and emission reduction effects.

[0040] In some embodiments, a ventilation pipe 26 is installed on the rear side of the frame 1 below the fixed frame 28. The ventilation pipe 26 is connected to the inside of the frame 1. A filter element 27 is installed inside the ventilation pipe 26. The filter element 27 is any one or a combination of several of the following: polyethersulfone filter element, PP cotton meltblown filter element, wire-wound filter element, pleated filter element, and activated carbon filter element.

[0041] During etching, the etching solution itself has a strong odor, and odor will also be generated during etching. The ventilation pipe 26 is designed to allow the odor inside the rack 1 to be discharged through the ventilation pipe 26, reducing the leakage of odor through the gaps in the rack 1. When the odor is discharged through the ventilation pipe 26, it can also be filtered by the filter element 27.

[0042] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A PCB board uniform etching apparatus, comprising a frame (1), characterized in that, An etching disk (2) is installed in the middle of the frame (1). A fixed frame (28) is installed near the top of the frame (1). Multiple support beams 1 (20) and support beam 2 (21) are fixed in the fixed frame (28). Multiple baffles 1 (18) and baffles 2 (19) with equal spacing are respectively set below support beams 2 (21) and support beams 1 (20). A nozzle (5) is installed between adjacent baffles 1 (18) and baffles 2 (19) directly above the etching disk (2). A telescopic rod (22) is installed at the middle of the top of baffles 1 (18) and baffles 2 (19). The top of the telescopic rod (22) is fixed to the support beams 1 (20) and 2 (21) at the corresponding positions.

2. The PCB board uniform etching device according to claim 1, characterized in that, A fixing frame (6) is installed between adjacent baffles 1 (18) and baffle 2 (19) within the fixing frame (28). The nozzle (5) is fixed to the fixing frame (6). A support beam 3 (23) is fixed to the top of the fixing frame (6). Both ends of the support beam 3 (23) are fixed to the fixing frame (28) at the corresponding positions.

3. The PCB board uniform etching device according to claim 2, characterized in that, A liquid supply pipe (11) is installed on the top right side of the frame (1). Multiple diversion pipes (10) are connected to the liquid supply pipe (11). Input pipes (9) are connected to the diversion pipes (10) corresponding to the positions of each nozzle (5). An extension pipe (8) connected to the nozzle (5) is installed on the fixed frame (6). Each extension pipe (8) is connected to the input pipe (9) at the corresponding position. A solenoid valve (7) is installed at the connection position between the extension pipe (8) and the nozzle (5).

4. The PCB board uniform etching device according to claim 1, characterized in that, Positioning holes (25) are provided on both ends of the support beam 1 (20) and support beam 2 (21) corresponding to the positions of the two baffle plates 2 (19) and 1 (18). Positioning rods (24) are installed on the top of the baffle plates 2 (19) and 1 (18) corresponding to the positions of the positioning holes (25). The positioning rods (24) move through the positioning holes (25) at the corresponding positions to form sliding supports.

5. The PCB board uniform etching device according to claim 1, characterized in that, The frame (1) has a reserved working window (16) on the front of the etching disk (2) above it. A splash guard (17) is hinged on the frame (1) at the working window (16).

6. The PCB board uniform etching device according to claim 5, characterized in that, Waste liquid tank (12) is installed in the frame (1) below the etching disk (2). The top of the waste liquid tank (12) is open. Multiple protrusions (3) with equal spacing are preset on the etching disk (2). Through holes (4) are opened on the etching disk (2) between adjacent protrusions (3).

7. The PCB board uniform etching device according to claim 6, characterized in that, The frame (1) is equipped with a concentrated liquid discharge pipe (14) at the bottom of the waste liquid tank (12) and a clear liquid discharge pipe (13) at the top of the middle. Both the concentrated liquid discharge pipe (14) and the clear liquid discharge pipe (13) are equipped with manual valves (15). Both the concentrated liquid discharge pipe (14) and the clear liquid discharge pipe (13) are connected to the waste liquid tank (12).

8. A PCB board uniform etching apparatus according to any one of claims 1-7, characterized in that, A ventilation pipe (26) is installed on the rear side of the frame (1) below the fixed frame (28). The ventilation pipe (26) is connected to the inside of the frame (1). A filter element (27) is installed inside the ventilation pipe (26). The filter element (27) is any one or a combination of several of the following: polyethersulfone filter element, PP cotton meltblown filter element, wire-wound filter element, pleated filter element, and activated carbon filter element.

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