Vapor chamber, shell of electronic equipment and electronic equipment

Abstract

The utility model relates to the technical field of electronic equipment, in particular to a vapor chamber, a shell of electronic equipment and the electronic equipment. The vapor chamber comprises a shell defining a closed cavity and a heat conduction piece arranged in the closed cavity. Wherein at least part of the area of the shell comprises a metal layer and a fiber reinforced resin composite material layer, the fiber reinforced resin composite material layer is arranged on the side, away from the closed cavity, of the metal layer in a stacked mode, and the density of the fiber reinforced resin composite material layer is smaller than that of the metal layer. The strength of the fiber reinforced resin composite material layer is high, and the density of the fiber reinforced resin composite material layer is smaller than that of the metal layer, so that the shell adopts the fiber reinforced resin composite material layer, and the weight of the shell can be reduced while the strength of the shell is ensured.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and more particularly to a heat spreader, a housing for an electronic device, and an electronic device. Background Technology

[0002] Vapor chambers (VCs) play a crucial role in thermal management of consumer electronics. However, with the increasing demand for thinner and lighter electronic products, the weight and thickness of vapor chambers are facing greater and greater challenges. Currently, the casings of mature vapor chambers are made of metals such as copper alloys, stainless steel, and titanium alloys. Due to the high density of these metals, the overall weight of the vapor chamber is excessive. Utility Model Content

[0003] This application provides a heat spreader, a housing, and an electronic device, which can reduce the overall density of the heat spreader, thereby reducing the weight of the heat spreader.

[0004] In a first aspect, embodiments of this application provide a heat spreader, including a shell surrounding a closed chamber and a heat-conducting element disposed in the closed chamber; wherein the heat-conducting element is attached to the inner wall of the shell for transferring heat from the shell to the closed chamber; at least a portion of the shell includes a metal layer and a fiber-reinforced resin composite material layer, the fiber-reinforced resin composite material layer being stacked on the side of the metal layer away from the closed chamber, and the density of the fiber-reinforced resin composite material layer being less than the density of the metal layer.

[0005] In this embodiment, a heat spreader is used to evenly heat the heating elements in electronic devices, preventing heat buildup around the heating elements and affecting their normal operation. The heat spreader may include a shell enclosing a sealed chamber, which may be a vacuum-sealed chamber. A heat-conducting element is disposed within the sealed chamber, adhering to the inner wall of the shell, to transfer heat from the shell to the sealed chamber, thereby achieving heat transfer within the sealed chamber. Partial or complete areas of the heat spreader shell comprise a metal layer and a fiber-reinforced resin composite material layer. Because the density of the fiber-reinforced resin composite material layer is lower than that of the metal layer, and the fiber-reinforced resin composite material layer has higher strength, the weight of the shell can be reduced while ensuring its strength.

[0006] In one possible implementation of the first aspect, the fiber-reinforced resin composite layer includes a resin matrix and reinforcing fibers disposed in the resin matrix.

[0007] It is understood that the fiber-reinforced resin composite layer includes a resin matrix and reinforcing fibers disposed in the resin matrix, which can improve the strength of the fiber-reinforced resin composite layer, thereby ensuring the structural strength of the shell.

[0008] In one possible implementation of the first aspect, the reinforcing fibers include carbon fibers, alumina fibers, silicon carbide fibers, silicon nitride fibers, basalt fibers, quartz fibers, glass fibers, polyimide fibers, poly(p-phenylenebenzodioxazole) fibers, ultra-high molecular weight polyethylene fibers, and aramid fibers.

[0009] It is understandable that high-strength fibers can be used as reinforcing fibers to ensure the structural strength of the shell.

[0010] In one possible implementation of the first aspect, the reinforcing fiber is a unidirectional fiber or a braided fiber.

[0011] It is understandable that when unidirectional fibers are selected as the reinforcing fibers in the fiber-reinforced resin composite layer, the lightweight and high-strength characteristics of the composite material allow for a reduction in shell weight without sacrificing strength and stiffness. Furthermore, the interlacing structure of the braided fibers significantly improves the tensile strength and modulus of the fiber-reinforced resin composite layer, thereby enhancing the shell's strength.

[0012] In one possible implementation of the first aspect, the heat resistance temperature of the resin is greater than or equal to 300°C.

[0013] It is understandable that a heat resistance temperature of 300°C or higher ensures that the resin in the fiber-reinforced resin composite layer will not soften during the processing of the heat exchange plate, thereby ensuring the structural integrity of the fiber-reinforced resin composite layer.

[0014] In one possible implementation of the first aspect, the heat spreader further includes a heat transfer element; the heat transfer element is disposed between the metal layer and the fiber-reinforced resin composite layer, or the heat transfer element is disposed on the surface of the fiber-reinforced resin composite layer away from the metal layer.

[0015] It is understandable that by setting heat transfer components between the metal layer and the fiber-reinforced resin composite layer, or on the outside of the fiber-reinforced resin composite layer, the heat transfer efficiency can be improved, thereby enhancing the heat distribution effect of the heat spreader.

[0016] In one possible implementation of the first aspect, the heat transfer element is a graphene sheet or a boron nitride sheet.

[0017] It is understandable that using graphene sheets or boron nitride sheets for heat transfer components can reduce the cost of the housing while ensuring its thermal conductivity, thereby reducing the cost of using the heat spreader.

[0018] In one possible implementation of the first aspect, the housing includes a first housing and a second housing connected together, the second housing including a bottom wall and a side wall, the bottom wall and the side wall forming a cavity with one end open, the first housing covering the opening to form a closed chamber with the second housing.

[0019] It is understood that the second shell can be a box-shaped structure with one open end, while the first shell can be a plate-shaped structure. The first shell covers the opening of the second shell, thus forming a closed chamber. By combining the first and second shells to form a closed chamber, the assembly complexity and difficulty of the heat spreader can be reduced, assembly costs can be lowered, and the first and second shells can be manufactured separately, allowing them to use different materials or structures, thus improving the design flexibility of the heat spreader.

[0020] In one possible implementation of the first aspect, the metal layer includes a first metal layer on a first housing and a second metal layer on a second housing; the first metal layer is connected to the second metal layer so that the first housing and the second housing are connected.

[0021] It is understood that by connecting the first metal layer and the second metal layer to connect the first housing and the second housing, the connection between the first housing and the second housing can be simplified and the reliability of the connection between the first housing and the second housing can be ensured.

[0022] In one possible implementation of the first aspect, the first metal layer and the second metal layer are connected by welding or bonding.

[0023] It is understandable that the first metal layer and the second metal layer are connected by welding or bonding, which can reduce the difficulty of the process and improve the processing efficiency of the heat spreader.

[0024] In one possible implementation of the first aspect, the fiber-reinforced resin composite layer includes a first fiber-reinforced resin composite layer located on a first housing, the first fiber-reinforced resin composite layer being stacked on at least a portion of the first metal layer; and / or, the fiber-reinforced resin composite layer includes a second fiber-reinforced resin composite layer located on a second housing, the second fiber-reinforced resin composite layer being stacked on at least a portion of the second metal layer.

[0025] It is understood that the housing may include a first housing and a second housing. The first housing may include a first fiber-reinforced resin composite material layer and a first metal layer laminated thereon, and the second housing may include a second fiber-reinforced resin composite material layer and a second metal layer laminated thereon. In practical applications, the structural combination of the first and second housings can be selected. For example, the first housing may be a double-layer composite structure including the first fiber-reinforced resin composite material layer and the first metal layer, and the second housing may be a single-layer structure including the second metal layer. Alternatively, the first housing may be a single-layer structure including the first metal layer, and the second housing may be a double-layer composite structure including the second fiber-reinforced resin composite material layer and the second metal layer. Furthermore, the first housing may be a double-layer composite structure including the first fiber-reinforced resin composite material layer and the first metal layer, and the second housing may be a double-layer composite structure including the second fiber-reinforced resin composite material layer and the second metal layer. These methods can improve the flexibility of housing structure design.

[0026] In one possible implementation of the first aspect, a first fiber-reinforced resin composite layer is laminated over the entire region of the first metal layer; and / or, a second fiber-reinforced resin composite layer is laminated over the entire region of the second metal layer.

[0027] It is understood that the first fiber-reinforced resin composite material layer is stacked over the entire area of ​​the first metal layer, thereby reducing the overall density and weight of the first shell. Based on the same design concept, the second fiber-reinforced resin composite material layer is stacked over the entire area of ​​the second metal layer, thereby reducing the overall density and weight of the second shell.

[0028] In one possible implementation of the first aspect, the thickness of the first housing is 0.05mm-0.2mm; and / or, the thickness of the second housing is 0.05mm-0.2mm.

[0029] It is understandable that by selecting an appropriate shell thickness, the overall weight of the heat spreader can be reduced while ensuring its functionality. In some embodiments, the shell can be made of copper sheet with a thickness of 0.05mm-0.2mm. When replacing the copper sheet shell with a shell composed of a fiber-reinforced resin composite layer and a metal layer, it should be ensured that the strength of the composite shell is close to (slightly less than or greater than or equal to) the strength of the previous copper sheet shell. That is, the appropriate shell thickness can be selected based on the material of the reinforcing fibers. Taking the first shell as an example, the first fiber-reinforced resin composite layer can be carbon fiber reinforced high-temperature resin unidirectional prepreg with a thickness of 0.05mm, and the first metal layer can be copper foil with a thickness of 0.05mm. The two can be molded together to form a 3D metal and carbon fiber composite composite shell. Compared to a copper metal shell, this shell achieves a density of 8.9g / cm³. 3 The overall density is 5.2 g / cm³. 3 This reduces the overall weight of the heat spreader. For example, the first fiber-reinforced resin composite layer can be a polyimide fiber-reinforced high-temperature resin unidirectional prepreg with a thickness of 0.1 mm, and the first metal layer can be copper foil with a thickness of 0.05 mm. The two can be molded together to form a 3D metal and polyimide fiber composite composite shell. Compared to a copper metal shell, this shell achieves a density lower than 8.9 g / cm³. 3 The overall density is 3.8 g / cm³. 3 This reduces the overall weight of the heat spreader.

[0030] In one possible implementation of the first aspect, the heat-conducting element includes a first end opposite to the thickness direction of the heat spreader, the first end being connected to the side surface of the second housing facing the enclosed chamber.

[0031] It is understood that the first end of the heat-conducting component can be connected to the surface (i.e., the inner surface) of the second housing facing the closed cavity, thereby allowing the heat generated by the heating element to be transferred from the second housing to the first end, and then from the first end to the second end, thus achieving heat transfer within the closed cavity. As an example, the heat-conducting component can be a liquid-absorbing core, which contains a capillary structure adsorbing a heat-transferring medium (i.e., a substance used to transfer heat), such as water, methanol, ethanol, or n-pentane. The first end of the liquid-absorbing core can be attached to the inner wall of the second housing, allowing heat to be transferred through the second housing to the first end of the liquid-absorbing core. The heat-transferring medium in the liquid-absorbing core absorbs heat and vaporizes, then releases heat at the second end and condenses back into liquid, thus repeatedly transferring heat from the second housing to the first housing. Through this method, the heat-transferring medium inside the heat spreader can distribute heat evenly within the cavity, avoiding localized overheating and improving overall heat dissipation efficiency.

[0032] In one possible implementation of the first aspect, the heat spreader further includes a support member disposed in a closed chamber, with one end of the support member connected to the first housing and the other end connected to the second housing.

[0033] It is understandable that the first and second shells enclose a closed cavity, and the support members are set in the closed cavity, which can improve the structural strength of the heat spreader.

[0034] In one possible implementation of the first aspect, the material of the metal layer includes at least one of aluminum, aluminum alloy, copper, copper alloy, stainless steel, and titanium alloy.

[0035] It is understandable that by selecting metals such as aluminum, aluminum alloy, copper, copper alloy, stainless steel, and titanium alloy as the metal layer material, the cost of the heat exchange plate can be reduced and the heat transfer efficiency of the heat exchange plate can be improved.

[0036] In one possible implementation of the first aspect, the reinforcing fiber is carbon fiber, and the ratio of the thickness of the metal layer to the thickness of the fiber-reinforced resin composite layer is 0.8:1 to 1.2:1; or, the reinforcing fiber is polyimide fiber, and the ratio of the thickness of the metal layer to the thickness of the fiber-reinforced resin composite layer is 0.4:1 to 0.6:1.

[0037] It is understandable that determining the ratio of metal layer thickness to fiber-reinforced resin composite layer thickness based on the different reinforcing fiber materials can ensure the reliable strength of the shell and reduce the overall density of the shell.

[0038] In one possible implementation of the first aspect, the reinforcing fiber is carbon fiber, the metal layer thickness is 0.05mm-0.1mm, and the fiber-reinforced resin composite layer thickness is 0.05mm-0.1mm; or, the reinforcing fiber is polyimide fiber, the metal layer thickness is 0.05mm-0.1mm, and the fiber-reinforced resin composite layer thickness is 0.1mm-0.2mm.

[0039] It is understandable that determining the thickness of the metal layer and the fiber-reinforced resin composite layer based on the different materials of the reinforcing fibers can ensure the reliable strength of the shell and reduce the overall density of the shell.

[0040] In one possible implementation of the first aspect, the thickness of the metal layer is greater than or equal to 0.05 mm, and the thickness of the fiber-reinforced resin composite layer is greater than or equal to 0.03 mm.

[0041] It is understandable that a metal layer thickness greater than or equal to 0.05 mm and a fiber-reinforced resin composite layer thickness greater than or equal to 0.03 mm can reduce the weight of the shell while ensuring its strength.

[0042] In one possible implementation of the first aspect, the thickness of the heat spreader is greater than or equal to 0.2 mm.

[0043] It is understandable that a heat spreader with a thickness greater than or equal to 0.2mm can ensure the heat spreader requirements of electronic devices and meet the requirements for thinner and lighter electronic devices.

[0044] Secondly, embodiments of this application provide a housing for an electronic device, including the heat spreader provided in the first aspect.

[0045] In one possible implementation of the second aspect, the housing further includes a protective layer, which is stacked with the heat spreader.

[0046] Thirdly, embodiments of this application provide an electronic device, including a heating element and a heat spreader provided in the first aspect, wherein the heating element is attached to the heat spreader, or the heating element and the heat spreader are connected through a thermally conductive medium, and the heat spreader is used to heat the heating element evenly.

[0047] In one possible implementation of the third aspect, the heat-generating element includes at least one of a system-on-a-chip, a memory, a camera, and a wireless charging coil.

[0048] Fourthly, embodiments of this application provide an electronic device, including a heating element and a housing provided in the second aspect, the housing being used to evenly heat the heating element.

[0049] In one possible implementation of the fourth aspect, the housing further includes a protective layer, which is stacked with the heat spreader; and the protective layer is located on the side of the heat spreader away from the heating element.

[0050] In one possible implementation of the fourth aspect, the electronic device is a mobile phone, tablet, or laptop.

[0051] The beneficial effects that can be achieved by the second to fourth aspects mentioned above can be referred to the beneficial effects corresponding to the first aspect and the various possible implementation methods of the first aspect, which will not be repeated here. Attached Figure Description

[0052] Figure 1A This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0053] Figure 1B This is an exploded structural diagram of an electronic device provided in an embodiment of this application;

[0054] Figure 1C A partial perspective structural diagram of an electronic device provided in an embodiment of this application;

[0055] Figure 2A This is a schematic diagram of the structure of another electronic device provided in an embodiment of this application;

[0056] Figure 2B This is a schematic diagram of the structure of a back cover provided in an embodiment of this application;

[0057] Figure 2C This is a top view of a back cover structure provided in an embodiment of this application;

[0058] Figure 2D A top view of another back cover structure provided in an embodiment of this application;

[0059] Figure 3 This is a schematic diagram of a heat spreader.

[0060] Figure 4A This is a schematic diagram of the structure of a heat spreader provided in an embodiment of this application;

[0061] Figure 4B This is a schematic diagram of the structure of a first housing provided in an embodiment of this application;

[0062] Figure 4C This is a schematic diagram of another first housing structure provided in an embodiment of this application;

[0063] Figure 4D This is a schematic diagram of another first housing structure provided in an embodiment of this application;

[0064] Figure 4E This is a schematic diagram of another first housing structure provided in an embodiment of this application;

[0065] Figure 5A This is a schematic diagram of the structure of a heat spreader provided in an embodiment of this application;

[0066] Figure 5B This is a schematic diagram of the structure of a second housing provided in an embodiment of this application;

[0067] Figure 5C This is a schematic diagram of another second housing structure provided in an embodiment of this application;

[0068] Figure 6 This is a schematic diagram of another heat spreader provided in an embodiment of this application;

[0069] Figure 7 This is a schematic diagram of another heat spreader provided in an embodiment of this application. Detailed Implementation

[0070] The specific embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0071] The embodiments of this application can be applied to electronic device 100. Electronic device 100 can be a mobile phone (including candybar phones and foldable phones), tablet computer, laptop computer, ultra-mobile personal computer (UMPC), handheld computer, touch screen TV, large-screen device, speaker, walkie-talkie, netbook, POS machine, personal digital assistant (PDA), wearable device, virtual reality device, intelligent vehicle, intelligent robot, industrial equipment, etc., and is not limited thereto in this application. In the following, a mobile phone will be used as an example of electronic device 100 to describe the technical solution of this application.

[0072] For ease of description, in the illustrations provided in this application, the X direction can be the width direction of the electronic device 100, the Y direction can be the length direction of the electronic device 100, and the Z direction can be the thickness direction of the electronic device 100. The X, Y, and Z directions can be perpendicular to each other. In addition, in this document, "above" refers to the direction in which the display screen 101 of the electronic device 100 faces (the positive direction of the Z direction), and "below" refers to the direction away from the display screen 101 of the electronic device 100 (the negative direction of the Z direction).

[0073] The following describes an exemplary application scenario of this application.

[0074] Figure 1A The structure of an electronic device 100 is shown, with reference to Figure 1A The electronic device 100 can be a candybar phone. It can include a display screen 101, a mid-frame 102, and a back cover 103. The display screen 101 and the back cover 103 are located on opposite sides of the mid-frame 102 along the Z-direction. The display screen 101, mid-frame 102, and back cover 103 together form the outer casing 110 of the electronic device 100. The mid-frame 102 and back cover 103 can be independent structures or an integrated structure.

[0075] In some embodiments, the electronic device 100 may also be a double-folding phone, that is, the electronic device 100 may include two displays 101, an inner screen and an outer screen, the two displays 101 may be respectively disposed on opposite sides of the middle frame 102 along the Z direction, and the back cover 103 may be disposed on one side of the middle frame 102, the middle frame 102, the back cover 103 and the two displays 101 together form the outer shell 110 of the electronic device 100.

[0076] The housing 110 of the electronic device 100 can form a receiving cavity 111, in which internal components of the electronic device 100 can be disposed. (Reference) Figure 1AThe internal components of the electronic device 100 may include a heat spreader 120, which may be disposed within the receiving cavity 111. The internal components of the electronic device 100 may also include a battery, a motherboard, a speaker, etc., which are also disposed within the receiving cavity 111.

[0077] The motherboard houses electronic components such as a System-on-Chip (SoC), memory (e.g., Read-Only Memory, ROM), and cameras (including a main camera, telephoto camera, and wide-angle camera). These electronic components 131 generate heat during operation; therefore, they are also referred to as "heat-generating components." When the heat generated by a heat-generating component is significant, it may accumulate inside or around the component, leading to a decrease in its reliability. A heat spreader 120 can distribute the heat evenly across the heat-generating components. Specifically, the heat-generating components are thermally connected to the heat spreader 120, allowing it to distribute the heat generated by the components to other locations (e.g., the mid-frame 102), ensuring the stable operation of the heat-generating components.

[0078] Figure 1B An exploded structure of an electronic device 100 is shown, with reference to Figure 1B The back cover 103 may be provided with a camera mounting hole 103a for mounting a camera. A camera (not shown in the figure) may be installed in the cavity 111 at a position corresponding to the camera mounting hole 103a. The electronic components 131 of the camera, SoC, and ROM may be installed on the motherboard. The motherboard may be powered by a battery 132, and the motherboard and battery 132 may be installed in the cavity 111. A heat spreader 120 may be installed between the motherboard (or battery 132) and the screen. The heat spreader 120 may distribute the heat generated by the operation of the electronic components 131 evenly, so that the heat is transferred to the middle frame 102, thereby dissipating the heat to the outside of the electronic device 100.

[0079] It is understood that the structure of a mobile phone is not limited to the above description. In some embodiments, the mobile phone can also be a tri-fold phone, a quad-fold phone, a penta-fold phone, etc. Since the function of the heat spreader 120 is to evenly distribute the heat generated by the heating element to other locations, for mobile phones with different structural forms, the heat spreader 120 can also be disposed within the receiving cavity 111 enclosed by the outer casing 110, and can be attached to the heating element. Alternatively, the heating element can be connected to the heat spreader 120 via a thermally conductive medium to achieve the heat even distribution effect. The thermally conductive medium is used to transfer the heat from the heating element to the heat spreader 120. Optionally, the thermally conductive medium can be thermally conductive adhesive, thermally conductive film, or a thin air layer (e.g., an air layer with a thickness of less than 0.5 mm) located between the heating element and the heat spreader 120.

[0080] As an example, Figure 1C A partial perspective view of an electronic device is shown, with reference to... Figure 1C A motherboard 104 is disposed within the receiving cavity 111. The motherboard 104 may include a circuit board 104a and a SoC chip 104b (an example of a heat-generating element) disposed on the circuit board 104a. The surface of the SoC chip 104b facing away from the circuit board 104a can be bonded to thermally conductive adhesive 105, which can be bonded to a heat spreader 120. The thermally conductive adhesive 105 serves as a thermally conductive medium between the SoC chip 104b and the heat spreader 120, transferring the heat generated by the SoC chip 104b during operation to the heat spreader 120. The heat spreader 120 can evenly distribute the heat, preventing heat accumulation near the SoC chip 104b and achieving rapid heat dissipation, thereby ensuring the operational stability of the SoC chip 104b.

[0081] In some embodiments, the heating element may also be directly attached to the heat spreader 120 to improve thermal conductivity.

[0082] The following describes another exemplary application scenario of this application.

[0083] Figure 2A The structure of another electronic device 100 is shown, with reference to Figure 2A The electronic device 100 can be a candybar phone, and... Figure 1A Unlike the electronic device 100 shown, in this electronic device 100, the heat spreader 120 is integrated with the back cover 103 of the electronic device 100 (example of housing 110), so that the back cover 103 can heat the heating element disposed in the housing cavity 111.

[0084] Specifically, Figure 2B A structure of a back cover 103 is shown, with reference to Figure 2B The back cover 103 may include a heat spreader 120 and a protective layer 103b. The heat spreader 120 may include a first housing 121 and a second housing 122, with a closed chamber formed between the first housing 121 and the second housing 122. The area corresponding to the closed chamber is the heat spreader region 120a, i.e., the region with heat spreader function. For the sake of continuity, the relevant content regarding the closed chamber will be discussed below. Figure 3 A detailed introduction will be provided in the following section.

[0085] refer to Figure 2B As shown, the size of the first housing 121 can be larger than the size of the second housing 122, so that the first housing 121, together with the mid-frame 102 and the display screen 101, can form the outer casing 110 of the electronic device 100. In some embodiments, the size of the second housing can also be the same as the size of the first housing.

[0086] The protective layer 103b can be stacked on the surface of the first housing 121 facing away from the second housing 122. The protective layer can be a decorative layer (an example of a protective layer) stacked on the surface of the first housing 121. The decorative layer can include multiple layers of paint films, such as a base coat, a polyurethane (PU) paint layer, an ultraviolet (UV) curing primer layer, a UV topcoat layer, etc. The decorative layer can serve as the exterior surface of the electronic device 100. That is, in this embodiment, the heat spreader 120 is used as part of the back cover 103 in the electronic device 100. It is understood that the heating element is located in the receiving cavity 111, and when the heat spreader 120 is used as the back cover 103 in the electronic device 100, the decorative layer is located on the side of the heat spreader 120 facing away from the heating element. In other embodiments, the surface of the heat spreader 120 may not have the protective layer 103b provided; in this embodiment, the surface of the heat spreader 120 can directly serve as the exterior surface of the electronic device 100.

[0087] Figure 2C A top view of the back cover 103 is shown, with reference to Figure 2C The back cover 103 may include a heat-spreading area 120a and a non-heat-spreading area, wherein the non-heat-spreading area refers to the area on the back cover 103 other than the heat-spreading area (i.e., heat-spreading area 120a). A camera mounting hole 103a for mounting a camera may be provided in the non-heat-spreading area, and a camera (not shown in the figure) may be installed at a position in the receiving cavity 111 corresponding to the camera mounting hole 103a. Components such as the motherboard, speaker 133, and wireless charging coil 134 are also disposed in the receiving cavity 111. The motherboard has electronic components 131, and the wireless charging coil 134 is used to charge the battery 132 in the receiving cavity 111. To ensure the proper arrangement of components such as the motherboard, speaker 133, and wireless charging coil 134 in the receiving cavity 111, the heat-spreading area 120a may avoid the placement positions of components such as the motherboard and speaker 133.

[0088] It is understandable that the heat dissipation zone 120a can be directly attached to components such as the motherboard and speaker 133, or it can be connected to components such as the motherboard and speaker 133 through a heat-conducting medium.

[0089] In some embodiments, since the wireless charging coil 134 is used to charge the battery 132 in the housing cavity 111, a lot of heat may be generated at the wireless charging coil 134 during the charging process. Therefore, the wireless charging coil 134 may also correspond to the heat equalization area 120a. Furthermore, the wireless charging coil 134 and the heat equalization area 120a are connected through a thermally conductive film 135 (an example of a thermally conductive medium), so that the back cover 103 can heat the wireless charging coil 134 evenly and improve the charging efficiency. Figure 2DAnother top view of the back cover 103 is shown, see reference. Figure 2D The heat dissipation area 120a can be hollowed out at the location of the wireless charging coil 134, so that the wireless charging coil 134 can be properly arranged. A heat-conducting film 135 can be set on the wireless charging coil 134. The heat-conducting film 135 can be attached to the wireless charging coil 134 and the heat dissipation area 120a respectively, so as to transfer the heat generated by the wireless charging coil 134 during operation to the heat dissipation area 120a.

[0090] The specific structure of the heat spreader 120 is described below.

[0091] The heat spreader 120 includes a shell that encloses a closed chamber 120b, in which a liquid wick 123 (an example of a heat-conducting element) and a support column 124 (an example of a support element) are disposed. Figure 3 A schematic diagram of a heat spreader 120 is shown. Referring to reference 3, the housing may include a first housing 121 and a second housing 122. The second housing 122 includes a bottom wall and side walls, which together form a cavity open at one end. The first housing 121 is connected to the opening of the cavity to form a closed chamber 120b. Optionally, the first housing 121 and the second housing 122 can be connected by welding, bonding, or other methods. In some embodiments, the first housing 121 can also be disposed at the opening of the cavity by an interference fit. The thickness of the first housing 121 can be 0.05mm-0.2mm, and the thickness of the second housing 122 is also 0.05mm-0.2mm. The thickness of the heat spreader 120 formed after the first housing 121 and the second housing 122 are connected is greater than or equal to 0.2 mm. For example, the thickness of the heat spreader 120 is 0.2 mm to 0.5 mm, and the thickness of the enclosed cavity 120b can be 0.05 mm to 0.3 mm. In this way, the ultra-thin thickness can be ensured to achieve the thinness of the electronic device 100, while also achieving a good heat spreader effect.

[0092] The support member is a support column 124. One end of the support column 124 is connected to the inner surface of the first housing 121 (the surface facing the second housing 122), and the other end is connected to the inner surface of the second housing 122 (the surface facing the first housing 121). In some embodiments, one end of the support column 124 may also be connected to both the inner surface of the first housing 121 and the upper surface of the liquid-absorbing core 123 (the surface facing away from the second housing 122).

[0093] The wick 123 includes a first end and a second end opposite to each other along the thickness direction of the heat spreader 120. The first end is connected to the side surface of the second shell 122 facing the closed chamber 120b (i.e., the inner wall of the closed chamber 120b). The wick 123 is used to transfer heat from the shell to the closed chamber 120b. Specifically, the wick 123 has a capillary structure in which liquid is adsorbed. Optionally, the liquid can be a liquid with a high specific heat capacity, such as water, methanol, ethanol, ethylene glycol, n-pentane, etc. Heat can be transferred through the second shell 122 to the first end of the wick 123. The heat transfer medium in the wick 123 absorbs heat and vaporizes, then releases heat at the second end and condenses back into liquid. This cycle repeats, transferring heat from the second shell 122 to the first shell 121. It can be understood that since the liquid vaporizes in the closed chamber 120b, the closed chamber 120b can also be called a "vapor chamber". In order to ensure that the liquid phase change process is not disturbed and to ensure the heat dissipation reliability of the heat spreader 120, the closed chamber 120b can be a vacuum-sealed chamber.

[0094] Currently, the first housing 121 and the second housing 122 are typically made of metals such as copper alloy, stainless steel, and titanium alloy. Due to the high density of these metals, the overall heat spreader 120 is too heavy, which is detrimental to the lightweight design of the electronic device 100.

[0095] In view of this, embodiments of this application provide a heat spreader 120, which includes a shell surrounding a closed chamber 120b and a heat-conducting element (e.g., a liquid-absorbing core 123) disposed within the closed chamber 120b. The heat-conducting element includes a first end and a second end opposite to each other along the thickness direction of the heat spreader. The first end is connected to the inner wall of the closed chamber, and the heat-conducting element is used to transfer heat generated by a heating element in an electronic device from the first end to the second end. At least a portion of the shell includes a metal layer and a fiber-reinforced resin composite material layer. The fiber-reinforced resin composite material layer is stacked on the side of the metal layer opposite to the closed chamber 120b, and the density of the fiber-reinforced resin composite material layer is less than the density of the metal layer, thereby reducing the weight of the heat spreader 120.

[0096] It is understandable that fiber-reinforced resin composite layers have high strength, and since the density of fiber-reinforced resin composite layers is lower than that of metal layers, by replacing a portion of the metal layers in the casing with fiber-reinforced resin composite layers, the weight of the casing can be reduced while ensuring its strength, thus achieving a lightweight vapor chamber 120. In consumer electronics products (such as mobile phones and tablets), this vapor chamber can disperse heat from the heat source, improving product performance and user experience.

[0097] The following is a detailed description of the heat spreader 120 provided in the embodiments of this application.

[0098] The heat spreader 120 provided in this embodiment includes a shell surrounding a closed chamber. The shell may include a first shell 121 and a second shell 122. At least a portion of the first shell 121 and / or the second shell 122 adopts a double-layer composite structure of a metal layer and a fiber-reinforced resin composite material layer. Support columns and liquid-absorbing cores may be disposed in the closed chamber.

[0099] Specifically, Figure 4A A structure of a heat spreader 120 is shown, with reference to Figure 4A ,and Figure 3 Compared to the heat spreader 120 shown, the first shell 121 in the heat spreader 120 is not a single metal layer structure, but a double-layer composite structure including a metal layer and a fiber-reinforced resin composite material layer. Since the density of the fiber-reinforced resin composite material layer is less than that of the metal layer, the weight of the heat spreader 120 can be reduced while keeping the shell thickness of the first shell 121 the same.

[0100] The material of the fiber-reinforced resin composite layer is fiber-reinforced resin composite material. Fiber-reinforced resin composite material refers to a composite material obtained by reinforcing resin with reinforcing fibers. Specifically, the fiber-reinforced resin composite layer may include a resin matrix and reinforcing fibers disposed within the resin matrix. The reinforcing fibers can be selected from high-strength fibers to ensure the strength of the fiber-reinforced resin composite layer. Optionally, the reinforcing fibers may be, but are not limited to, one or more of carbon fiber, alumina fiber, silicon carbide fiber, silicon nitride fiber, basalt fiber, quartz fiber, glass fiber, polyimide fiber, poly(p-phenylenebenzodioxazole) fiber, ultra-high molecular weight polyethylene fiber, and aramid fiber. In practical applications, the reinforcing fibers can be achieved by mixing or weaving different fibers together.

[0101] Reinforcing fibers can be long or short. In the field of fiber processing, long fibers typically refer to continuous filaments of organic or inorganic fibers, with a length greater than 1 kilometer, while short fibers typically refer to chopped organic or inorganic fibers, usually ranging in length from a few millimeters to tens of centimeters. Corresponding to the embodiments of this application, when the reinforcing fibers in the fiber-reinforced resin composite material layer are long fibers, the majority (e.g., more than 80%) of the reinforcing fibers in the fiber-reinforced resin composite material layer are continuous filaments; when the reinforcing fibers in the fiber-reinforced resin composite material layer are short fibers, there are more breaks in the reinforcing fibers in the fiber-reinforced resin composite material layer, that is, the number of continuous fibers is relatively small (e.g., less than 20%).

[0102] The reinforcing fibers in the fiber-reinforced resin composite material layer can be unidirectional fibers or woven fibers, such as unidirectional prepreg, unidirectional fiber tape, woven fiber cloth and woven fiber cloth prepreg, etc.

[0103] The resin in the fiber-reinforced resin composite layer can be a high-temperature resistant resin. Specifically, when the first housing 121 and the second housing 122 are connected by welding, in order to ensure the structural integrity of the fiber-reinforced resin composite layer, the heat resistance temperature of the resin in the fiber-reinforced resin composite layer must be higher than the welding temperature. As an example, when the first housing 121 and the second housing 122 are welded by contact welding, the contact welding temperature is usually less than 300°C. In this case, the heat resistance temperature of the resin must be greater than or equal to 300°C, that is, the resin needs to be able to withstand a temperature of 300°C for a long time to prevent the resin from melting during welding.

[0104] The connection between the first housing 121 and the second housing 122 can be achieved through a metal layer. The material of the metal layer can be, but is not limited to, one or more of aluminum, aluminum alloy, copper, copper alloy, stainless steel, and titanium alloy. In the heat spreader 120, the metal layer primarily serves to achieve a sealed connection between the first housing 121 and the second housing 122, and to provide waterproofing and moisture protection (i.e., preventing liquid or vapor leakage from the sealed chamber 120b). Furthermore, due to the excellent thermal conductivity of metal, the metal layer can also facilitate rapid heat transfer.

[0105] refer to Figure 4A The metal layer may include a first metal layer 121a located on the first housing 121 and a second metal layer located on the second housing 122. The second housing 122 may be a single-layer structure formed by the second metal layer. The first metal layer 121a and the second metal layer may be connected by welding or bonding to achieve a sealed connection between the first housing 121 and the second housing 122.

[0106] The fiber-reinforced resin composite layer may include a first fiber-reinforced resin composite layer 121b located on the first housing 121. Figure 4B The structure of a first housing 121 is shown, with reference to Figure 4B The first housing 121 may include a first metal layer 121a and a first fiber-reinforced resin composite material layer 121b laminated on the first metal layer 121a. The first metal layer 121a and the first fiber-reinforced resin composite material layer 121b may be joined together by compression molding (e.g., molding). As an example, a 3D metal and composite material composite housing (e.g., the first housing 121) can be formed by laminating fiber-reinforced high-temperature resin prepreg with metal sheets and then molding them. This housing is a laminated structure of fiber-reinforced resin composite material layers and metal layers.

[0107] The first fiber-reinforced resin composite material layer 121b is stacked on the entire area of ​​the first metal layer 121a, and the first fiber-reinforced resin composite material layer 121b is stacked on the side of the first metal layer 121a opposite to the closed cavity 120b. The thickness of the first metal layer 121a is greater than or equal to 0.05 mm, and the thickness of the first fiber-reinforced resin composite material layer 121b is greater than or equal to 0.03 mm.

[0108] Since fiber-reinforced resin composite material layers containing different reinforcing fibers often have different strengths, in order to meet the strength requirements, the thicknesses of the first metal layer 121a and the first fiber-reinforced resin composite material layer 121b can be selected according to the type of reinforcing fiber.

[0109] As an example, when the reinforcing fiber is carbon fiber, the ratio of the metal layer thickness to the fiber-reinforced resin composite layer thickness is 0.8:1 to 1.2:1. Specifically, the thickness of the first metal layer 121a can be 0.05mm-0.1mm, for example, the thickness of the first metal layer 121a can be 0.05mm. The thickness of the first fiber-reinforced resin composite layer 121b is 0.05mm-0.1mm, for example, the thickness of the first fiber-reinforced resin composite layer 121b can be 0.05mm. In practical applications, 0.05mm carbon fiber reinforced high-temperature resin unidirectional prepreg and 0.05mm copper foil can be laminated and molded into a 3D metal and carbon fiber composite composite shell to obtain the first shell 121. The first metal layer 121a in the first shell can be welded to the second metal layer to form a closed chamber 120b (also known as a "vapor chamber"). The first shell 121 and the second shell 122 can vacuum seal the support column and the wick (containing a heat transfer medium). This method can reduce the overall weight of the first housing 121 while ensuring its structural strength.

[0110] As another example, when the reinforcing fiber is polyimide fiber, the ratio of the metal layer thickness to the fiber-reinforced resin composite layer thickness is 0.4:1 to 0.6:1. Specifically, the thickness of the first metal layer 121a can be 0.05mm-0.1mm, for example, the thickness of the first metal layer 121a can be 0.05mm. The thickness of the first fiber-reinforced resin composite layer 121b is 0.1mm-0.2mm, for example, the thickness of the first fiber-reinforced resin composite layer 121b can be 0.1mm. In practical applications, a 0.1mm polyimide fiber-reinforced high-temperature resin unidirectional prepreg and a 0.05mm copper foil can be laminated and molded into a 3D metal and polyimide fiber composite composite shell to obtain the first shell 121. Compared to carbon fiber, polyimide fiber is a lighter fiber, which can achieve a lower density first shell 121.

[0111] In some embodiments, a first fiber-reinforced resin composite material layer 121b is laminated on a portion of the first metal layer 121a. Figure 4C Another structure of the first housing 121 is shown, see reference. Figure 4C The first metal layer 121a may include a first region 121c and a second region 121d, wherein the thickness of the first region 121c is greater than the thickness of the second region 121d. A first fiber-reinforced resin composite material layer 121b is laminated on the second region 121d, while the first fiber-reinforced resin composite material layer 121b is not laminated on the first region 121c. Optionally, the second region 121d may be an edge region near the first housing 121. The second region 121d can be obtained by thinning the first metal layer 121a.

[0112] In other embodiments, the heat spreader 120 further includes a heat transfer element 125 for accelerating heat transfer. Optionally, the heat transfer element 125 may be a graphene sheet or a boron nitride sheet.

[0113] The heat transfer element 125 may include a first heat transfer element located on the first housing 121. The first heat transfer element may be located between the first metal layer 121a and the fiber-reinforced resin composite layer, or it may be located on the side of the first fiber-reinforced resin composite layer 121b away from the metal layer.

[0114] Figure 4D and Figure 4E Two structures of the first housing 121 are shown, with reference to Figure 4D The first heat transfer element is disposed between the first metal layer 121a and the first fiber-reinforced resin composite material layer 121b. (Reference) Figure 4E The first heat transfer element is disposed on the surface of the first fiber-reinforced resin composite material layer 121b that is away from the first metal layer 121a.

[0115] By employing the above methods, the overall density of the first shell 121 can be significantly reduced. As an example, when the first metal layer 121a is made of copper and the reinforcing fibers in the first fiber-reinforced resin composite layer 121b are carbon fibers, before replacing a portion of the thickness of the first metal layer 121a with the first fiber-reinforced resin composite layer 121b (i.e., the first shell 121 is a single-layer copper structure), the density of the first shell 121 is 8.9 g / cm³. 3 After replacing a portion of the thickness of the first metal layer 121a with the first fiber-reinforced resin composite material layer 121b (i.e., the first housing 121 includes the first metal layer 121a and the first fiber-reinforced resin composite material layer 121b), the overall density of the first housing 121 is 5.2 g / cm³. 3As can be seen, the overall density of the first housing 121 is greatly reduced by the above methods, which reduces the weight of the heat spreader 120 and thus reduces the weight of the electronic device 100.

[0116] Figure 5A A structure of a heat spreader 120 is shown, with reference to Figure 5A ,and Figure 4A The difference between the heat spreader 120 shown is that the first shell 121 of the heat spreader 120 is a single-metal layer structure, while the second shell 122 is a double-layer composite structure consisting of a metal layer and a fiber-reinforced resin composite material layer. This method also reduces the weight of the heat spreader 120.

[0117] Figure 5B A structure of a second housing 122 is shown, with reference to Figure 5B The second housing 122 may include a second metal layer 122a and a second fiber-reinforced resin composite material layer 122b laminated on the second metal layer 122a. The second metal layer 122a and the second fiber-reinforced resin composite material layer 122b can be joined together by compression. The second fiber-reinforced resin composite material layer 122b is laminated over the entire area of ​​the second metal layer 122a, and is laminated on the side of the second metal layer 122a opposite to the closed cavity 120b. The thickness of the second metal layer 122a is greater than or equal to 0.05 mm, and the thickness of the second fiber-reinforced resin composite material layer 122b is greater than or equal to 0.03 mm.

[0118] Since fiber-reinforced resin composite layers containing different reinforcing fibers often have different strengths, the thicknesses of the second metal layer 122a and the second fiber-reinforced resin composite layer 122b can be selected according to the type of reinforcing fiber to meet strength requirements. As an example, when the reinforcing fiber is carbon fiber, the ratio of the metal layer thickness to the fiber-reinforced resin composite layer thickness is 0.8:1 to 1.2:1. Specifically, the thickness of the second metal layer 122a can be 0.05mm-0.1mm; for example, the thickness of the second metal layer 122a can be 0.05mm. The thickness of the second fiber-reinforced resin composite layer 122b is 0.05mm-0.1mm; for example, the thickness of the second fiber-reinforced resin composite layer 122b can be 0.05mm. As another example, when the reinforcing fiber is polyimide fiber, the ratio of the metal layer thickness to the fiber-reinforced resin composite layer thickness is 0.4:1 to 0.6:1. Specifically, the thickness of the second metal layer 122a can be 0.05mm-0.1mm, for example, the thickness of the second metal layer 122a can be 0.05mm. The thickness of the second fiber-reinforced resin composite material layer 122b is 0.1mm-0.2mm, for example, the thickness of the second fiber-reinforced resin composite material layer 122b can be 0.1mm.

[0119] In some embodiments, a second fiber-reinforced resin composite layer 122b is laminated on a portion of the second metal layer 122a. Figure 5C Another structure of the second housing 122 is shown, see reference. Figure 5C The second metal layer 122a may include a third region 122c and a fourth region 122d, wherein the thickness of the third region 122c is greater than the thickness of the fourth region 122d. A second fiber-reinforced resin composite layer 122b is laminated on the fourth region 122d, while the second fiber-reinforced resin composite layer 122b is not laminated on the third region 122c. Optionally, the third region 122c may be a region close to the edge of the second housing 122 to ensure reliable connection between the second housing 122 and the first housing 121. The fourth region 122d can be obtained by thinning the second metal layer 122a.

[0120] In some embodiments, the heat transfer element 125 may include a second heat transfer element located on the second housing 122. Specific implementation details of the second heat transfer element can be found in the implementation of the first heat transfer element, and will not be repeated here.

[0121] By employing the above methods, the overall density of the second shell 122 can be significantly reduced. As an example, when the second metal layer 122a is made of copper and the reinforcing fibers in the second fiber-reinforced resin composite layer 122b are polyimide fibers, before replacing a portion of the thickness of the second metal layer 122a with the second fiber-reinforced resin composite layer 122b (i.e., the second shell 122 is a single-layer copper structure), the density of the second shell 122 is 8.9 g / cm³. 3 After replacing a portion of the thickness of the second metal layer 122a with the second fiber-reinforced resin composite material layer 122b (i.e., the second housing 122 includes the second metal layer 122a and the second fiber-reinforced resin composite material layer 122b), the overall density of the second housing 122 is 3.8 g / cm³. 3 As can be seen, the overall density of the second housing 122 is greatly reduced by the above methods, which reduces the weight of the heat spreader 120 and thus reduces the weight of the electronic device 100.

[0122] Figure 6 Another structure of the heat spreader 120 is shown, see reference. Figure 6 ,and Figure 4A Unlike the heat spreader 120 shown, the first shell 121 and the second shell 122 in the heat spreader 120 are both double-layer composite structures consisting of a metal layer and a fiber-reinforced resin composite material layer. In this way, the weight of the heat spreader 120 can be significantly reduced.

[0123] As an example, a 0.1mm polyimide fiber-reinforced high-temperature resin unidirectional prepreg is laminated with a 0.05mm copper foil and molded into a 3D metal and polyimide fiber composite shell, thus obtaining a first shell 121 and a second shell 122. The first metal layer 121a in the first shell can be welded to the second metal layer 122a in the second shell 122 to form a closed chamber (also known as a "vapor chamber"). The first shell 121 and the second shell 122 can vacuum seal the support column and the wick (containing a heat transfer medium). This method can reduce the overall weight of the first shell 121 while ensuring the structural strength of the first shell 121 and the second shell 122.

[0124] For details regarding the implementation of the first housing 121, please refer to [link / reference]. Figures 4A to 4E Some corresponding descriptions will not be repeated here. Similarly, for details regarding the implementation of the second housing 122, please refer to [link / reference needed]. Figures 5A to 5C Some of the corresponding descriptions will not be repeated here.

[0125] Figure 7 Another structure of the heat spreader 120 is shown, see reference. Figure 7 ,and Figure 6Unlike the heat spreader 120 shown, in the second housing 122, the third region 122c is a heat source region. The heat source region refers to the region of the heat spreader 120 that is in contact with the heat-generating element when it is used in the electronic device 100.

[0126] refer to Figure 7 As shown, the second housing 122 includes a heat source region, in which the second fiber-reinforced resin composite material layer 122b is not disposed; that is, the heat source region is a single-layer structure of the second metal layer 122a. It is understood that metal has a higher thermal conductivity than resin. When the heat spreader 120 is used in the electronic device 100, the heat source region can contact the heating element, thereby improving the heat transfer efficiency of the heat spreader 120.

[0127] For details regarding the implementation of the first housing 121, please refer to [link / reference]. Figures 4A to 4E Some corresponding descriptions will not be repeated here. Similarly, for details regarding the implementation of the second housing 122, please refer to [link / reference needed]. Figures 5A to 5C Some of the corresponding descriptions will not be repeated here.

[0128] By using the above methods, the weight of the heat spreader 120 can be greatly reduced, thereby reducing the weight of the electronic device 100.

[0129] In the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0130] In the embodiments of this application, it should be understood that the directional terms mentioned, such as "up", "down", "left", "right", "inner", "outer", etc., are only for reference to the direction of the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0131] In the embodiments of this application, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first," "second," "third," and "fourth" may explicitly or implicitly include one or more of that feature.

[0132] In embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0133] In the embodiments of this application, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0134] In the embodiments of this application, it should be noted that the descriptions of "vertical" and "parallel" respectively indicate approximately vertical and approximately parallel within a certain error range. This error range can be a range with a deviation angle of less than or equal to 5°, 8° or 10° relative to absolute verticality and absolute parallelism, respectively, and is not specifically limited here.

[0135] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A heat spreader, characterized in that, It includes a shell that encloses a sealed chamber and a heat-conducting component disposed within the sealed chamber; wherein, The heat-conducting component is attached to the inner wall of the housing to transfer heat from the housing to the enclosed cavity. At least a portion of the housing includes a metal layer and a fiber-reinforced resin composite layer, the fiber-reinforced resin composite layer being stacked on the side of the metal layer away from the enclosed chamber, and the density of the fiber-reinforced resin composite layer being less than the density of the metal layer.

2. The heat spreader according to claim 1, characterized in that, The fiber-reinforced resin composite layer includes a resin matrix and reinforcing fibers disposed in the resin matrix.

3. The heat spreader according to claim 2, characterized in that, The reinforcing fibers include carbon fiber, alumina fiber, silicon carbide fiber, silicon nitride fiber, basalt fiber, quartz fiber, glass fiber, polyimide fiber, poly(p-phenylenebenzodioxazole) fiber, ultra-high molecular weight polyethylene fiber, and aramid fiber.

4. The heat spreader according to claim 2, characterized in that, The reinforcing fiber is a unidirectional fiber or a braided fiber.

5. The heat spreader according to claim 2, characterized in that, The heat resistance temperature of the resin is greater than or equal to 300°C.

6. The heat spreader according to claim 1, characterized in that, The heat spreader also includes heat transfer components; The heat transfer element is disposed between the metal layer and the fiber-reinforced resin composite material layer, or the heat transfer element is disposed on the surface of the fiber-reinforced resin composite material layer away from the metal layer.

7. The heat spreader according to claim 6, characterized in that, The heat transfer element is a graphene sheet or a boron nitride sheet.

8. The heat spreader according to claim 1, characterized in that, The housing includes a first housing and a second housing connected together. The second housing includes a bottom wall and a side wall. The bottom wall and the side wall form a cavity with one end open. The first housing covers the opening so as to enclose the closed cavity together with the second housing.

9. The heat spreader according to claim 8, characterized in that, The metal layer includes a first metal layer located on the first housing and a second metal layer located on the second housing; The first metal layer is connected to the second metal layer so that the first housing and the second housing are connected.

10. The heat spreader according to claim 9, characterized in that, The first metal layer and the second metal layer are connected by welding or bonding.

11. The heat spreader according to claim 10, characterized in that, The fiber-reinforced resin composite layer includes a first fiber-reinforced resin composite layer located on the first housing, the first fiber-reinforced resin composite layer being stacked on at least a portion of the first metal layer; and / or, The fiber-reinforced resin composite material layer includes a second fiber-reinforced resin composite material layer located on the second housing, and the second fiber-reinforced resin composite material layer is stacked on at least a portion of the second metal layer.

12. The heat spreader according to claim 11, characterized in that, The first fiber-reinforced resin composite layer is stacked over the entire area of ​​the first metal layer; and / or, The second fiber-reinforced resin composite material layer is stacked over the entire area of ​​the second metal layer.

13. The heat spreader according to claim 11 or 12, characterized in that, The thickness of the first housing is 0.05mm-0.2mm; and / or, The thickness of the second shell is 0.05mm-0.2mm.

14. The heat spreader according to claim 8, characterized in that, The heat-conducting component includes a first end opposite to the thickness direction of the heat spreader, and the first end is connected to the side surface of the second housing facing the enclosed cavity.

15. The heat spreader according to claim 14, characterized in that, The heat spreader also includes a support member, which is disposed in the enclosed chamber, with one end of the support member connected to the first housing and the other end connected to the second housing.

16. The heat spreader according to claim 1, characterized in that, The material of the metal layer includes one of aluminum, aluminum alloy, copper, copper alloy, stainless steel, or titanium alloy.

17. The heat spreader according to claim 2, characterized in that, The reinforcing fiber is carbon fiber, and the ratio of the thickness of the metal layer to the thickness of the fiber-reinforced resin composite layer is 0.8:1 to 1.2:1; or, The reinforcing fiber is a polyimide fiber, and the ratio of the thickness of the metal layer to the thickness of the fiber-reinforced resin composite layer is 0.4:1 to 0.6:

1.

18. The heat spreader according to claim 17, characterized in that, The reinforcing fiber is carbon fiber, the metal layer thickness is 0.05mm-0.1mm, and the fiber-reinforced resin composite layer thickness is 0.05mm-0.1mm; or, The reinforcing fiber is polyimide fiber, the metal layer has a thickness of 0.05mm-0.1mm, and the fiber-reinforced resin composite layer has a thickness of 0.1mm-0.2mm.

19. The heat spreader according to claim 1, characterized in that, The thickness of the metal layer is greater than or equal to 0.05 mm, and the thickness of the fiber-reinforced resin composite material layer is greater than or equal to 0.03 mm.

20. The heat spreader according to claim 1, characterized in that, The thickness of the heat spreader is greater than or equal to 0.2 mm.

21. A housing for an electronic device, characterized in that, Includes the heat spreader as described in any one of claims 1-20.

22. The housing of the electronic device according to claim 21, characterized in that, The casing of the electronic device also includes a protective layer, which is stacked with the heat spreader.

23. An electronic device, characterized in that, It includes a heating element and a heat spreader as described in any one of claims 1-20, wherein the heating element is attached to the heat spreader, or the heating element is connected to the heat spreader via a thermally conductive medium, and the heat spreader is used to heat the heating element evenly.

24. The electronic device according to claim 23, characterized in that, The heating element includes at least one of a system-on-a-chip, a memory, a camera, and a wireless charging coil.

25. An electronic device, characterized in that, It includes a heating element and a housing as described in claim 21 or 22, the housing being used to evenly heat the heating element.

26. The electronic device according to claim 25, characterized in that, The outer casing also includes a protective layer, which is stacked with the heat spreader plate. Furthermore, the protective layer is located on the side of the heat spreader away from the heating element.

27. The electronic device according to claim 25, characterized in that, The electronic device is a mobile phone, tablet, or laptop.

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