Rapid heat dissipation ceramic circuit board

Abstract

The utility model relates to the technical field of circuit board heat dissipation, in particular to a quick heat dissipation ceramic circuit board, which comprises a circuit board, a processor arranged on the base surface of the circuit board, a controller mounted on the base surface of the circuit board, a heat dissipation assembly mounted on the side wall of the circuit board, a USB (universal serial bus) interface mounted on the base surface of the circuit board, and a heat dissipation module mounted on the side wall of the circuit board. According to the utility model, when the temperature sensor generates data according to the temperature of the processor, the temperature sensor generates an electric signal and transmits the electric signal to the controller through the wire, and when a set temperature value is reached, the controller controls the cooling fan to operate, so that the cooling fan blows air to cool the processor under the cooling fan; the heat conduction plate conducts the temperature of the back face of the circuit board, meanwhile, when airflow generated by the cooling fan passes through the circuit board, the airflow flows all around, when the airflow passes through the installation support, the airflow takes away the heat conduction plate on the inner wall of the installation support for cooling, and the cooling effect on the circuit board is better.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for circuit boards, specifically a fast heat dissipation ceramic circuit board. Background Technology

[0002] The electrical components on the surface of existing circuit boards generate a lot of heat when they operate. When the heat accumulates, the electrical components cannot operate stably, and prolonged high-temperature operation will also reduce their lifespan. However, the heat dissipation structure of existing circuit boards is mostly aimed at dissipating heat from the surface of the electrical components. There is no suitable cooling structure for the back of the circuit board, resulting in poor heat dissipation.

[0003] Therefore, a fast-heat dissipation ceramic circuit board is needed to improve the above problems. Utility Model Content

[0004] The purpose of this invention is to provide a fast heat dissipation ceramic circuit board to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A fast heat dissipation ceramic circuit board includes a circuit board, a processor disposed on the base surface of the circuit board, a controller mounted on the base surface of the circuit board, a heat dissipation component mounted on the side wall of the circuit board, a USB interface mounted on the base surface of the circuit board, and a power supply interface mounted on the base surface of the circuit board.

[0007] The heat dissipation assembly includes a mounting bracket and a temperature sensor. The mounting bracket is mounted on the side wall of the circuit board. A heat-conducting plate is mounted on the inner wall of the mounting bracket. One end of the heat-conducting plate is located on the bottom outer wall of the circuit board. A cooling fan is mounted on the outer wall of the mounting bracket. The temperature sensor is located on the base surface of the circuit board.

[0008] As a preferred embodiment of this utility model, the controller is electrically connected to a cooling fan and a temperature sensor via wires.

[0009] In a preferred embodiment of this invention, the processor is located on one side of the controller, and the USB interface is located on one side of the power supply interface.

[0010] As a preferred embodiment of this utility model, the mounting bracket is provided in two sets and is located on opposite side walls of the circuit board.

[0011] As a preferred embodiment of this utility model, the heat-conducting plates are provided in multiple sets and are respectively located on the outer wall of the mounting bracket, and the cross-section of the heat-conducting plates is L-shaped.

[0012] In a preferred embodiment of this invention, the cooling fan is located directly above the processor, and the temperature sensor is located on one side of the processor.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] 1. In this utility model, the heat dissipation component in the fast-heat dissipation ceramic circuit board, and the temperature sensor generating data based on the processor's temperature, will cause the temperature sensor to generate an electrical signal that is transmitted to the controller via wires. When the set temperature value is reached, the controller will control the cooling fan to operate, so that the cooling fan blows air to cool the processor directly below. The heat conduction plate conducts the temperature on the back of the circuit board. At the same time, when the airflow generated by the cooling fan passes through the circuit board, the airflow will flow in all directions. When the airflow passes through the mounting bracket, it will carry away the heat conduction plate on the inner wall of the mounting bracket for cooling. The cooling effect on the circuit board is better, which helps to solve the problem that the existing circuit board heat dissipation structure mostly targets the surface temperature of electrical components for heat dissipation, and there is no suitable cooling structure for the back of the circuit board, resulting in poor heat dissipation effect. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0016] Figure 2 This is a top view of the structure of this utility model;

[0017] Figure 3 This is a side view of the structure of this utility model.

[0018] In the diagram: 1. Circuit board; 2. Processor; 3. Controller; 4. Heat dissipation assembly; 401. Mounting bracket; 402. Temperature sensor; 403. Heat conduction plate; 404. Cooling fan; 5. USB interface; 6. Power supply interface. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0020] For examples, please refer to Figure 1-3 This utility model provides a technical solution:

[0021] A fast heat dissipation ceramic circuit board includes a circuit board 1, a processor 2 disposed on the base surface of the circuit board 1, a controller 3 mounted on the base surface of the circuit board 1, a heat dissipation component 4 mounted on the side wall of the circuit board 1, a USB interface 5 mounted on the base surface of the circuit board 1, and a power supply interface 6 mounted on the base surface of the circuit board 1.

[0022] In this embodiment, please refer to Figure 1 , Figure 2 and Figure 3 The heat dissipation assembly 4 includes a mounting bracket 401 and a temperature sensor 402. The mounting bracket 401 is mounted on the side wall of the circuit board 1. A heat-conducting plate 403 is mounted on the inner wall of the mounting bracket 401. One end of the heat-conducting plate 403 is located on the bottom outer wall of the circuit board 1. A cooling fan 404 is mounted on the outer wall of the mounting bracket 401. The temperature sensor 402 is located on the base surface of the circuit board 1.

[0023] Furthermore, the controller 3 is electrically connected to the cooling fan 404 and the temperature sensor 402 via wires, thereby powering the device and causing the controller 3 to control the cooling fan 404 and the temperature sensor 402 to operate. The processor 2 is located on one side of the controller 3, the USB interface 5 is located on one side of the power supply interface 6, two sets of mounting brackets 401 are provided and are located on opposite side walls of the circuit board 1, multiple sets of heat conduction plates 403 are provided and are located on the outer wall of the mounting brackets 401, and the heat conduction plates 403 have an L-shaped cross-section. The cooling fan 404 is located directly above the processor 2, and the temperature sensor 402 is located on one side of the processor 2.

[0024] The working process of this utility model is as follows: When the fast-heat dissipation ceramic circuit board designed in this scheme is in operation, the controller 3 is electrically connected to the cooling fan 404 and the temperature sensor 402 via wires, which in turn powers the device. This causes the controller 3 to control the cooling fan 404 and the temperature sensor 402 to operate. Simultaneously, with the temperature sensor 402 positioned on the base surface of the circuit board 1, when the temperature sensor 402 generates data based on the temperature of the processor 2, it generates an electrical signal that is transmitted to the controller 3 via wires. When the set temperature value is reached, the controller 3 controls the cooling fan 404 to operate, so that the cooling fan 404 blows heat onto the processor 2 directly below. The cooling system utilizes a heat-conducting plate 403 mounted on the inner wall of the circuit board 1 via a mounting bracket 401. One end of the heat-conducting plate 403 is positioned on the bottom outer wall of the circuit board 1. This heat-conducting plate 403 conducts heat to the back of the circuit board 1. Simultaneously, the airflow generated by the cooling fan 404 flows outwards as it passes over the circuit board 1. As the airflow passes over the mounting bracket 401, it carries away the heat-conducting plate 403 from the inner wall of the bracket, resulting in better cooling of the circuit board 1. This addresses the problem that existing circuit board cooling structures primarily target the surface temperature of electrical components, lacking suitable cooling structures for the back of the circuit board, leading to inadequate heat dissipation.

[0025] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A fast heat dissipation ceramic circuit board, comprising a circuit board (1), characterized in that: A processor (2) is provided on the base surface of the circuit board (1), a controller (3) is installed on the base surface of the circuit board (1), a heat dissipation component (4) is installed on the side wall of the circuit board (1), a USB interface (5) is installed on the base surface of the circuit board (1), and a power supply interface (6) is installed on the base surface of the circuit board (1). The heat dissipation assembly (4) includes a mounting bracket (401) and a temperature sensor (402). The mounting bracket (401) is mounted on the side wall of the circuit board (1). A heat-conducting plate (403) is mounted on the inner wall of the mounting bracket (401). One end of the heat-conducting plate (403) is located on the bottom outer wall of the circuit board (1). A cooling fan (404) is mounted on the outer wall of the mounting bracket (401). The temperature sensor (402) is located on the base surface of the circuit board (1).

2. The fast heat dissipation ceramic circuit board according to claim 1, characterized in that: The controller (3) is connected to a cooling fan (404) and a temperature sensor (402) via wires, and the connection is electrical.

3. The fast heat dissipation ceramic circuit board according to claim 1, characterized in that: The processor (2) is located on one side of the controller (3), and the USB interface (5) is located on one side of the power supply interface (6).

4. The fast heat dissipation ceramic circuit board according to claim 1, characterized in that: The mounting bracket (401) is provided in two sets and is located on the opposite side walls of the circuit board (1).

5. The fast heat dissipation ceramic circuit board according to claim 1, characterized in that: The heat-conducting plate (403) is provided in multiple sets and is located on the outer wall of the mounting bracket (401), and the cross-section of the heat-conducting plate (403) is L-shaped.

6. The fast heat dissipation ceramic circuit board according to claim 1, characterized in that: The cooling fan (404) is located directly above the processor (2), and the temperature sensor (402) is located on one side of the processor (2).

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