Semiconductor device mold convenient to demold

Abstract

The utility model belongs to the technical field of semiconductor device manufacturing, and particularly relates to a semiconductor device mold convenient to demold, which comprises a workbench, a lower mold is mounted on the surface of the workbench, a bearing plate is arranged in the lower mold, first ejection pieces and second ejection pieces are mounted on the surface of the bearing plate, the first ejection pieces are arranged at equal intervals, and the second ejection pieces are arranged at equal intervals. The first ejection pieces are located at the four corners of the bearing plate correspondingly, the second ejection pieces are located in the middle of the bearing plate and correspond to each other, the first ejection pieces and the second ejection pieces each comprise a sleeve fixed to the surface of the bearing plate, ejection rods are arranged in the sleeves, ejection plates are installed at the tops of the ejection rods, and silica gel blocks are installed at the tops of the ejection plates. And a groove is formed in the lower mold. According to the semiconductor device mold convenient to demold, through the arrangement of the first ejection piece and the second ejection piece, a uniform upward acting force can be applied to a semiconductor device, so that demolding operation is facilitated.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor device manufacturing technology, and in particular to a mold for semiconductor devices that is easy to demold. Background Technology

[0002] Semiconductor devices are various electronic components made using the special electrical properties of semiconductor materials. They play a vital role in modern electronic technology. Semiconductor devices typically have tiny and complex structures, requiring extremely high dimensional accuracy and shape consistency. Molds can provide precise cavities to ensure that semiconductor materials are accurately shaped according to design requirements during the manufacturing process, thereby achieving high performance and reliability of the devices. Therefore, molds are required in the processing of semiconductor devices.

[0003] Currently, when using molds for semiconductor devices, the semiconductor material is typically placed on a substrate, which is then placed in a lower mold. The upper mold then extrudes the material to achieve the desired shape. However, since the extrusion pressure is adjusted according to the area of ​​the semiconductor device, excessive extrusion pressure can facilitate the molding of large-area semiconductor devices. But excessive extrusion pressure will increase the bonding force between the substrate and the mold, resulting in greater resistance during demolding and increasing the difficulty of demolding. Therefore, there is an urgent need for a semiconductor device mold that facilitates demolding to solve the above problems. Utility Model Content

[0004] In order to overcome the defects of the prior art mentioned above, the inventors conducted in-depth research and, after a great deal of creative work, completed this utility model.

[0005] Specifically, the technical problem to be solved by this utility model is to provide a mold for semiconductor devices that is easy to demold, so as to solve the technical problem that the excessive extrusion force increases the bonding force between the substrate and the mold, which increases the difficulty of demolding.

[0006] To solve the above-mentioned technical problems, the present invention provides the following technical solution:

[0007] A semiconductor device mold for easy demolding includes a worktable. A lower mold and an upper mold are mounted on the surface of the worktable. The upper mold is located on top of the lower mold. A support plate is movably connected inside the lower mold. A first ejector and a second ejector are mounted on the surface of the support plate. The first ejector is equidistantly arranged and located at the four corners of the support plate. The second ejector is located in the middle of the support plate and consists of two sets that correspond to each other. Both the first and second ejectors include a sleeve fixed to the surface of the support plate. A push rod is provided inside the sleeve. A top plate is fixedly mounted on the top of the push rod. Silicone blocks are mounted on the top of the top plate. The silicone blocks are arranged in a circular array. The lower mold has multiple grooves that correspond one-to-one with the sleeves inside.

[0008] As an improved technical solution, a compression spring is fixedly connected inside the sleeve, and the top of the compression spring is fixedly connected to the push rod. The sleeve and the push rod are fixedly connected by the compression spring.

[0009] As an improved technical solution, a limiting groove is provided on the inner side of the sleeve, and limiting blocks are provided on both sides of the top rod. There are two sets of limiting grooves and limiting blocks, which correspond to each other. The two sets of limiting blocks are located inside the two sets of limiting grooves and are movably connected to them.

[0010] As an improved technical solution, an electric motor is fixedly connected inside the lower mold, and a lead screw is fixedly connected to the output end of the electric motor. One end of the lead screw passes through the support plate and extends to the top of the inner side of the lower mold. The lead screw is threadedly connected to the support plate and rotatably connected to the lower mold.

[0011] As an improved technical solution, the inner side of the lower mold is provided with a sliding groove, the sliding grooves are in pairs and correspond to each other, and the two sides of the bearing plate are fixedly connected with sliders that are adapted to the sliding grooves.

[0012] As an improved technical solution, a fixing block is fixedly connected to the surface of the workbench, and a bolt is threaded inside the fixing block. A retaining plate and a knob are respectively provided on both sides of the fixing block. The bolt passes through the fixing block, and its two ends are respectively connected to the retaining plate and the knob. The bolt is rotatably connected to the retaining plate, and the bolt is fixedly connected to the knob.

[0013] As an improved technical solution, the end of the card plate away from the fixing block is fixedly connected to a positioning plate and a positioning bolt. There are two sets of positioning bolts, which are located on both sides of the positioning plate. The lower mold has positioning grooves and holes on both sides that are compatible with the positioning plate and the positioning bolts.

[0014] As an improved technical solution, the surface of the workbench is provided with guide grooves, the guide grooves are in pairs and correspond to each other, and the bottom of the card plate is fixedly connected with a guide block that matches the guide grooves.

[0015] After adopting the above technical solution, the beneficial effects of this utility model are:

[0016] 1. This utility model, through the arrangement of the first ejector and the second ejector, enables the semiconductor device to be subjected to a uniform upward force during the demolding process, so as to facilitate the demolding operation and avoid deformation and damage of the device due to uneven force, thus ensuring the integrity and quality of the semiconductor device. In addition, during the ejection process, the compression spring can prevent damage to the semiconductor device due to excessive ejection speed or force, thus protecting the device and the mold.

[0017] 2. In this utility model, the traditional method requires a screwdriver to fix the lower mold and the worktable together with bolts. In actual operation, the bolts need to be aligned and tightened one by one, which is quite cumbersome. The knob can be used to drive the bolts, so that the positioning plate and positioning bolt move towards the positioning groove and the insertion hole until they are completely aligned. This can improve the efficiency of the lower mold installation. Moreover, this method does not require external equipment and makes the operation simpler. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them:

[0019] Figure 1 This is a schematic diagram of the overall structure of the mold for semiconductor devices that facilitates demolding, according to this utility model.

[0020] Figure 2 This is a schematic diagram of the lower mold and fixing block of the semiconductor device mold that is easy to demold according to this utility model.

[0021] Figure 3 This is a cross-sectional view of the worktable and lower mold of the semiconductor device mold that facilitates demolding according to this utility model.

[0022] Figure 4 This is a schematic diagram of the carrier plate, the first ejector, and the second ejector of the mold for semiconductor devices that is easy to demold according to this utility model.

[0023] Figure 5 This is a cross-sectional view of the sleeve and ejector pin of the mold for semiconductor devices that facilitates demolding, according to this utility model.

[0024] Figure 6 This is a schematic diagram of the positioning plate and clamping plate of the semiconductor device mold that facilitates demolding according to this utility model.

[0025] Explanation of reference numerals in the attached figures:

[0026] 1. Workbench; 2. Lower mold; 3. Upper mold; 4. Support plate; 5. Sleeve; 501. First ejector; 6. Ejector rod; 7. Top plate; 8. Silicone block; 9. Groove; 10. Compression spring; 11. Limiting groove; 12. Limiting block; 13. Motor; 14. Lead screw; 15. Slide groove; 16. Slider; 17. Fixing block; 18. Bolt; 19. Clamping plate; 20. Positioning plate; 21. Positioning bolt; 22. Positioning groove; 23. Insertion hole; 24. Knob; 25. Guide block; 26. Guide groove. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0029] Meanwhile, the meaning of "and / or" or "and / or" appearing throughout the text is that it includes three options. Taking "A and / or B" as an example, it includes option A, option B, or an option that satisfies both A and B.

[0030] Furthermore, in this utility model, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this utility model.

[0031] like Figures 1 to 6As shown in the figure, this embodiment provides a semiconductor device mold that is easy to demold. This semiconductor device mold that is easy to demold includes a worktable 1. A lower mold 2 and an upper mold 3 are mounted on the surface of the worktable 1. The upper mold 3 is located on top of the lower mold 2. The upper mold 3 is slidably connected to the worktable 1 and is driven by an electric push rod.

[0032] The lower mold 2 is internally connected to a support plate 4. A first ejector 501 and a second ejector are mounted on the surface of the support plate 4. The first ejector 501 is arranged at equal intervals and is located at the four corners of the support plate 4. The second ejector is located in the middle of the support plate 4 and there are two sets of them, which correspond to each other. They can eject different areas of the substrate, thereby making the substrate ejection more uniform. At the same time, the first ejector 501 and the second ejector have the same structure.

[0033] Both the first ejector 501 and the second ejector include a sleeve 5 fixed to the surface of the support plate 4. The sleeve 5 has an ejector rod 6 inside, and a top plate 7 is fixedly installed on the top of the ejector rod 6. Silicone blocks 8 are installed on the top of the top plate 7. The silicone blocks 8 are arranged in a ring array. The lower mold 2 has multiple sets of grooves 9 that correspond one-to-one with the sleeve 5. The grooves 9 facilitate the ejection operation of the first ejector 501 and the second ejector. The silicone blocks 8 can avoid damage to the substrate and can eject the substrate more gently, so as to facilitate the demolding operation of semiconductor devices.

[0034] A compression spring 10 is fixedly connected inside the sleeve 5. The top of the compression spring 10 is fixedly connected to the ejector rod 6. The sleeve 5 and the ejector rod 6 are fixedly connected through the compression spring 10. The ejector rod 6 and the sleeve 5 are slidably connected. By setting the compression spring 10, the impact force between the ejector rod 6 and the sleeve 5 can be absorbed, reducing mechanical wear and noise. At the same time, it can also prevent damage to semiconductor devices and substrates caused by excessive ejection speed or force, thus protecting the devices and molds.

[0035] The inner side of the sleeve 5 is provided with a limiting groove 11, and both sides of the push rod 6 are provided with limiting blocks 12. There are two sets of limiting grooves 11 and limiting blocks 12, which correspond to each other. The two sets of limiting blocks 12 are located inside the two sets of limiting grooves 11 and are movably connected to them. The limiting grooves 11 do not penetrate the sleeve 5, which can prevent the push rod 6 from separating from the sleeve 5, thereby ensuring the stability of the connection between the two. At the same time, it can facilitate the sliding operation of the push rod 6, thereby ensuring its stability when moving.

[0036] A motor 13 is fixedly connected inside the lower mold 2. A lead screw 14 is fixedly connected to the output end of the motor 13. One end of the lead screw 14 passes through the support plate 4 and extends to the top of the inner side of the lower mold 2. The lead screw 14 is threadedly connected to the support plate 4 and rotatably connected to the lower mold 2. This facilitates the lifting and lowering of the support plate 4 and allows the first ejector 501 and the second ejector to eject the substrate.

[0037] The inner side of the lower mold 2 is provided with a sliding groove 15. The sliding grooves 15 are in pairs and correspond to each other. Both sides of the support plate 4 are fixedly connected with sliders 16 that are compatible with the sliding grooves 15, which can make the lifting and lowering of the support plate 4 more stable.

[0038] A fixing block 17 is fixedly connected to the surface of the workbench 1. A bolt 18 is threaded inside the fixing block 17. A clamping plate 19 and a knob 24 are respectively provided on both sides of the fixing block 17. The bolt 18 passes through the fixing block 17, and its two ends are connected to the clamping plate 19 and the knob 24 respectively.

[0039] Bolt 18 is rotatably connected to clamping plate 19, and bolt 18 is fixedly connected to knob 24. Traditionally, the lower mold 2 and the worktable 1 require contact with a screwdriver to fix the two together with bolts. In actual operation, the bolts need to be aligned and tightened one by one, which is quite cumbersome. Knob 24 can facilitate the driving operation of bolt 18, thus improving the efficiency of installing the lower mold 2. Moreover, this method does not require external equipment, making the operation simpler. The above structure is provided in two sets, and they correspond to each other.

[0040] The end of the card plate 19 away from the fixing block 17 is fixedly connected to the positioning plate 20 and the positioning bolt 21. There are two sets of positioning bolts 21, which are located on both sides of the positioning plate 20 respectively.

[0041] Both sides of the lower mold 2 are provided with positioning grooves 22 and insertion holes 23 that are compatible with the positioning plate 20 and positioning bolt 21, which facilitates the positioning operation of the lower mold 2 and makes it easy to fix the lower mold 2 firmly on the worktable 1.

[0042] The surface of the workbench 1 is provided with guide grooves 26, which are in pairs and correspond to each other. The bottom of the clamping plate 19 is fixedly connected with guide blocks 25 that are adapted to the guide grooves 26, which can make the movement of the clamping plate 19 and the positioning plate 20 more stable, thereby preventing them from rotating with the rotation of the bolt 18.

[0043] In use, the substrate and the semiconductor device to be processed are placed inside the lower mold 2. Then, the upper mold 3 is driven to move towards the lower mold 2 by the electric push rod until the two are completely aligned, thus completing the semiconductor device processing operation. Then, the electric push rod is started again to make the upper mold 3 rise and move away from the lower mold 2.

[0044] Then, by starting the motor 13, it drives the lead screw 14 to rotate, causing the support plate 4 to rise with the rotation of the lead screw 14. During this process, the first ejector 501 and the second ejector rise with the support plate 4, causing the top plate 7 in the first ejector 501 and the second ejector to rise along the inside of the groove 9 and contact the four corners and the center of the substrate. As the support plate 4 continues to rise, the top plate 7 will slowly lift the support plate 4, causing the support plate 4 to slowly separate from the lower mold 2, thus achieving the purpose of easy demolding.

[0045] Meanwhile, when the top plate 7 contacts the substrate, if a certain area is stuck too tightly to the lower mold 2, the top plate 7 will move towards the ejector rod 6 and cause the compression spring 10 to compress and deform at the same time. This can avoid the phenomenon that excessive ejection force will damage the substrate.

[0046] When the lower mold 2 needs to be disassembled, the knob 24 can be rotated in the opposite direction to rotate the bolt 18, causing the bolt 18 to rotate along the inside of the fixing block 17, and causing the clamping plate 19 to move away from the lower mold 2. At the same time, the positioning plate 20 and the positioning bolt 21 will slowly separate from the positioning groove 22 and the insertion hole 23, thus canceling the fixation of the lower mold 2. During installation, the operation is reversed. This method is simple to operate and does not require the use of external tools.

[0047] It should be understood that these embodiments are for illustrative purposes only and are not intended to limit the scope of protection of this utility model. Furthermore, it should be understood that after reading the technical description of this utility model, those skilled in the art can make various alterations, modifications, and / or variations to this utility model, and all such equivalent forms also fall within the scope of protection defined by the appended claims.

Claims

1. A mold for semiconductor devices that facilitates demolding, characterized in that: Includes a workbench (1), on the surface of which a lower mold (2) and an upper mold (3) are mounted, the upper mold (3) being located on top of the lower mold (2); The lower mold (2) is internally connected to a support plate (4). The surface of the support plate (4) is equipped with a first ejector (501) and a second ejector. The first ejector (501) is arranged at equal intervals and is located at the four corners of the support plate (4). The second ejector is located in the middle of the support plate (4) and there are two sets of them, which correspond to each other. Both the first ejector (501) and the second ejector include a sleeve (5) fixed to the surface of the bearing plate (4). The sleeve (5) is provided with a push rod (6) inside. A top plate (7) is fixedly installed on the top of the push rod (6). A silicone block (8) is installed on the top of the top plate (7). The silicone blocks (8) are arranged in a ring array. The lower mold (2) has multiple sets of grooves (9) corresponding to the sleeve (5) one by one inside.

2. The semiconductor device mold for easy demolding according to claim 1, characterized in that: A compression spring (10) is fixedly connected inside the sleeve (5). The top of the compression spring (10) is fixedly connected to the top rod (6). The sleeve (5) and the top rod (6) are fixedly connected by the compression spring (10).

3. The mold for semiconductor devices that facilitates demolding according to claim 2, characterized in that: The sleeve (5) has a limiting groove (11) on its inner side, and the top rod (6) has limiting blocks (12) on both sides. The limiting groove (11) and the limiting blocks (12) are provided in two sets and correspond to each other. The two sets of limiting blocks (12) are located inside the two sets of limiting grooves (11) and are movably connected to them.

4. The semiconductor device mold for easy demolding according to claim 3, characterized in that: An electric motor (13) is fixedly connected inside the lower mold (2). A lead screw (14) is fixedly connected to the output end of the electric motor (13). One end of the lead screw (14) passes through the bearing plate (4) and extends to the top of the inner side of the lower mold (2). The lead screw (14) is threadedly connected to the bearing plate (4) and rotatably connected to the lower mold (2).

5. The mold for semiconductor devices that facilitates demolding according to claim 4, characterized in that: The lower mold (2) has a sliding groove (15) on its inner side. The sliding grooves (15) are in pairs and correspond to each other. The two sides of the bearing plate (4) are fixedly connected with sliders (16) that are compatible with the sliding grooves (15).

6. The semiconductor device mold for easy demolding according to claim 1, characterized in that: The surface of the workbench (1) is fixedly connected to a fixing block (17), and the fixing block (17) is internally threaded with a bolt (18). The fixing block (17) has a clamping plate (19) and a knob (24) on both sides respectively. The bolt (18) passes through the fixing block (17), and its two ends are connected to the clamping plate (19) and the knob (24) respectively. The bolt (18) is rotatably connected to the clamping plate (19), and the bolt (18) is fixedly connected to the knob (24).

7. The mold for semiconductor devices that facilitates demolding according to claim 6, characterized in that: The end of the card plate (19) away from the fixing block (17) is fixedly connected to a positioning plate (20) and a positioning bolt (21). The positioning bolt (21) is provided in two sets and is located on both sides of the positioning plate (20). The lower mold (2) has positioning grooves (22) and insertion holes (23) on both sides that are compatible with the positioning plate (20) and positioning bolt (21).

8. The mold for semiconductor devices that facilitates demolding according to claim 7, characterized in that: The surface of the workbench (1) is provided with guide grooves (26), the guide grooves (26) are in pairs and correspond to each other, and the bottom of the card plate (19) is fixedly connected with guide blocks (25) that are compatible with the guide grooves (26).

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