Surface laminating equipment for wafer production

Abstract

The utility model belongs to the technical field of wafer surface film coating, and particularly relates to wafer production surface film coating equipment which comprises a machine body, a supporting table is slidably connected in the machine body, two mounting grooves are formed in the upper surface of the supporting table, two electric sliding rails are fixedly mounted on the inner bottom wall of each mounting groove, and the electric sliding rails are fixedly connected with the supporting table. The outer surface of each electric sliding rail is slidably connected with a movable sliding block, the outer surface of each movable sliding block makes contact with the inner wall of the mounting groove, a fixing plate is fixedly mounted on the upper surfaces of every two movable sliding blocks, and rotating motors are fixedly mounted on the side faces, close to each other, of the two fixing plates. And the output end of each rotary motor is fixedly provided with a connecting shaft, and by arranging the supporting table, the mounting grooves, the electric sliding rails, the movable sliding blocks, the fixing plates, the rotary motors, the connecting shafts, clamping plates, protective pads, round holes, wafer trays, baffle discs, electric push rods and supports, the effect of clamping wafers can be achieved by utilizing movement of the clamping plates.

Description

Technical Field

[0001] This utility model belongs to the field of wafer surface coating technology, specifically relating to a wafer production surface coating equipment. Background Technology

[0002] Wafer surface coating is a crucial process step in semiconductor manufacturing, playing a key role in wafer protection, processing, and subsequent performance. Semi-automatic wafer thinning pre-coating machines are used in semiconductor manufacturing to apply protective films to the wafer surface before the wafer thinning process. Primarily used in the wafer thinning stage of semiconductor manufacturing, applying a protective film before wafer thinning protects the circuit patterns and surface quality on the front side of the wafer, preventing mechanical damage, chemical corrosion, and particulate contamination during the thinning process, thus ensuring the wafer's performance and yield in subsequent processing.

[0003] However, when using a semi-automatic wafer thinning pre-coating machine, it generally only coats one side of the wafer. When coating the other side, it is necessary to clean up the waste film, manually flip the wafer, and coat it again, which makes double-sided coating of the wafer inconvenient.

[0004] To address the aforementioned issues, this application proposes a wafer manufacturing surface coating equipment. Utility Model Content

[0005] To address the aforementioned problems in the existing technology, this utility model provides a wafer production surface coating equipment, which features convenient automatic wafer flipping, thereby improving the speed of double-sided wafer coating.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a wafer surface coating equipment, comprising a machine body, a support platform slidably connected inside the machine body, two mounting slots on the upper surface of the support platform, two electric slide rails fixedly mounted on the inner bottom wall of each mounting slot, a movable slider slidably connected to the outer surface of each electric slide rail, the outer surface of each movable slider contacting the inner wall of the mounting slot, a fixing plate fixedly mounted on the upper surface of every two movable sliders, a rotary motor fixedly mounted on the side of the two fixing plates that are close to each other, a connecting shaft fixedly mounted on the output end of each rotary motor, a clamping plate fixedly mounted on the end of the two connecting shafts that are close to each other, a protective pad fixedly mounted on the inner wall of each clamping plate, a circular hole on the upper surface of the support platform, a wafer tray disposed inside the circular hole, a baffle plate fixedly mounted on the bottom surface of the wafer tray, an electric push rod fixedly mounted on the bottom surface of the baffle plate, a bracket fixedly mounted on the bottom surface of the electric push rod, and the bottom surface of the bracket fixedly connected to the inner bottom wall of the support platform.

[0007] As a preferred technical solution of the wafer production surface coating equipment of this utility model, a control machine is fixedly installed on the left side of the machine body, and a closed shell is rotatably connected to the inner wall of the machine body.

[0008] As a preferred technical solution of the wafer production surface coating equipment of this utility model, a guide plate is fixedly installed on the inner side wall of the machine body, and a conveyor is fixedly installed on the bottom surface of the guide plate. The bottom surface of the conveyor is fixedly connected to the inner bottom wall of the support platform.

[0009] As a preferred technical solution of the wafer production surface coating equipment of this utility model, each of the rotary motors is fixedly installed with a coupling at its output end, and the inner wall of each coupling is fixedly connected to the outer surface of the connecting shaft.

[0010] As a preferred technical solution of the wafer production surface coating equipment of this utility model, a drive motor is fixedly installed on the inner wall of each fixed plate, a screw is fixedly installed at the output end of each drive motor, and the outer surface of each screw is rotatably connected to the inner wall of the fixed plate.

[0011] As a preferred technical solution of the wafer production surface coating equipment of this utility model, each screw has a nut threadedly connected to its outer surface, each nut has a displacement slider fixedly installed on its outer surface, and the outer surface of each displacement slider is in contact with the inner wall of the fixed plate.

[0012] As a preferred technical solution of the wafer production surface coating equipment of this utility model, each of the displacement sliders is fixedly mounted with a mounting plate on its upper surface, and each of the mounting plates is fixedly mounted with a telescopic rod on its upper surface.

[0013] As a preferred technical solution of the wafer production surface coating equipment of this utility model, each telescopic rod is fixedly equipped with a suction cup at its telescopic end, and a scraping knife is fixedly installed on the inner wall of the closed shell.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows: by providing a support platform, mounting groove, electric slide rail, moving slider, fixing plate, rotary motor, connecting shaft, clamping plate, protective pad, round hole, wafer tray, baffle, electric push rod and bracket, the movement of the clamping plate can be used to clamp the wafer, and the rotary motor and connecting shaft can be used to flip the wafer, so as to realize the purpose of automatic wafer flipping and facilitate the coating process. This is beneficial to replace manual wafer flipping and thus improve the coating speed. Attached Figure Description

[0015] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the conveyor structure in this utility model;

[0018] Figure 3 This is a cross-sectional view of the baffle plate in this utility model;

[0019] Figure 4 This is a schematic diagram of the support platform in this utility model;

[0020] Figure 5 This is a schematic diagram of the structure of the fixing plate in this utility model;

[0021] Figure 6 This is a schematic diagram of the screw structure in this utility model;

[0022] In the diagram: 1. Machine body; 2. Enclosed shell; 3. Scraping blade; 4. Control platform; 5. Displacement slider; 6. Guide plate; 7. Support platform; 8. Bracket; 9. Fixing plate; 10. Conveyor; 11. Electric push rod; 12. Baffle plate; 13. Wafer tray; 14. Drive motor; 15. Circular hole; 16. Mounting slot; 17. Moving slider; 18. Electric slide rail; 19. Mounting plate; 20. Telescopic rod; 21. Protective pad; 22. Clamping plate; 23. Connecting shaft; 24. Coupling; 25. Rotary motor; 26. Screw; 27. Nut; 28. Suction cup. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model. Example

[0024] Please see Figure 1-6This utility model provides the following technical solution: a wafer production surface coating equipment, including a body 1, a support platform 7 slidably connected inside the body 1, two mounting grooves 16 formed on the upper surface of the support platform 7, two electric slide rails 18 fixedly mounted on the inner bottom wall of each mounting groove 16, a movable slider 17 slidably connected to the outer surface of each electric slide rail 18, the outer surface of each movable slider 17 contacting the inner wall of the mounting groove 16, a fixing plate 9 fixedly mounted on the upper surface of every two movable sliders 17, a rotary motor 25 fixedly mounted on the side of the two fixing plates 9 that are close to each other, a connecting shaft 23 fixedly mounted on the output end of each rotary motor 25, and a fixed installation plate 9 fixedly mounted on the side of the two connecting shafts 23 that are close to each other. There are clamping plates 22, and a protective pad 21 is fixedly installed on the inner wall of each clamping plate 22. A circular hole 15 is opened on the upper surface of the support platform 7. A wafer tray 13 is arranged inside the circular hole 15. A baffle 12 is fixedly installed on the bottom surface of the wafer tray 13. An electric push rod 11 is fixedly installed on the bottom surface of the baffle 12. A bracket 8 is fixedly installed on the bottom surface of the electric push rod 11. The bottom surface of the bracket 8 is fixedly connected to the inner bottom wall of the support platform 7. In this embodiment, the protective pad 21 helps to reduce the damage to the wafer by the clamping plate 22. Through the electric push rod 11, the wafer tray 13, the baffle 12 and the bracket 8, the electric push rod 11 is used to lift the wafer tray 13 and the baffle 12, providing space for wafer flipping, so that the wafer can be flipped in the circular hole 15.

[0025] Specifically, a control unit 4 is fixedly installed on the left side of the machine body 1, and a closed shell 2 is rotatably connected to the inner wall of the machine body 1. In this embodiment, the control unit 4 is used to control the rotary motor 25 and the electric slide rail 18, which can be automated.

[0026] Specifically, a guide plate 6 is fixedly installed on the inner side wall of the machine body 1, and a conveyor 10 is fixedly installed on the bottom surface of the guide plate 6. The bottom surface of the conveyor 10 is fixedly connected to the inner bottom wall of the support platform 7. In this embodiment, the guide plate 6 guides the waste film through the guide plate 6 and the conveyor 10, so that the waste film moves to the conveyor 10 and is then discharged by the conveyor 10.

[0027] Specifically, each rotary motor 25 has a coupling 24 fixedly installed at its output end. The inner wall of each coupling 24 is fixedly connected to the outer surface of the connecting shaft 23. In this embodiment, the coupling 24 serves to connect the rotary motor 25 and the connecting shaft 23, so that the connecting shaft 23 rotates stably with the rotary motor 25.

[0028] Specifically, a drive motor 14 is fixedly installed on the inner wall of each fixed plate 9, and a screw 26 is fixedly installed on the output end of each drive motor 14. The outer surface of each screw 26 is rotatably connected to the inner wall of the fixed plate 9. In this embodiment, the drive motor 14 drives the screw 26 to rotate through the drive motor 14 and the screw 26.

[0029] Specifically, each screw 26 has a nut 27 threadedly connected to its outer surface, and each nut 27 has a displacement slider 5 fixedly installed on its outer surface. The outer surface of each displacement slider 5 is in contact with the inner wall of the fixed plate 9. In this embodiment, the screw 26, nut 27 and displacement slider 5 are screwed together, and the screw 26 and nut 27 are driven by a helical transmission, so that the nut 27 moves linearly, which in turn drives the displacement slider 5 to move.

[0030] Specifically, each displacement slider 5 has a mounting plate 19 fixedly installed on its upper surface, and each mounting plate 19 has a telescopic rod 20 fixedly installed on its upper surface. In this embodiment, the mounting plate 19 provides a certain length to position the waste film, while the telescopic rod 20 can be electric, and the height can be adjusted by extending and retracting the telescopic rod 20.

[0031] Specifically, each telescopic rod 20 is fixedly equipped with a suction cup 28 at its telescopic end, and a scraper 3 is fixedly installed on the inner wall of the closed shell 2. In this embodiment, the suction cup 28 is used to adsorb waste film, so that the waste film can move according to the suction cup 28, while the scraper 3 can cut the film according to the circumference of the wafer.

[0032] The working principle and usage process of this utility model are as follows: When coating a wafer, the wafer can be placed on the wafer tray 13, and the semi-automatic wafer thinning pre-coating machine 1 is used to coat the wafer. For specific coating procedures, please refer to the coating process of the semi-automatic wafer thinning pre-coating machine. After coating, the sealing shell 2 is closed, and the film is cut using a scraper 3. Since double-sided coating is required, before flipping the wafer for coating, the telescopic rod 20 is used to lower the suction cup 28, which then adsorbs the film. The drive motor 14 is then started, driving the screw 26 to rotate. The screw 26 and nut 27 undergo helical transmission, causing the nut 26 to rotate. 7 drives the displacement slider 5 to move to the left. When it moves to the maximum position, the suction cup 28 releases the film. The film moves to the conveyor 10 through the guide plate 6 to transport the waste film. After the waste film is processed, the electric slide rail 18 is started. The electric slide rail 18 drives the moving slider 17 to move, so that the clamping plate 22 clamps the wafer. After the wafer is clamped, the electric push rod 11 drives the wafer tray 13 and the baffle 12 to descend, providing space for the wafer to rotate. The rotary motor 25 is started. The rotary motor 25 rotates the clamping plate 22 through the connecting shaft 23. The clamping plate 22 drives the wafer to flip. After flipping, the wafer tray 13 and the baffle 12 return to their original positions and the wafer is placed on the wafer tray 13.

[0033] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A wafer fabrication surface coating equipment, characterized in that: Includes a body (1), the body (1) having a support platform (7) slidably connected inside, the support platform (7) having two mounting slots (16) on its upper surface, each mounting slot (16) having two electric slide rails (18) fixedly mounted on its inner bottom wall, each electric slide rail (18) having a sliding slider (17) slidably connected to its outer surface, each sliding slider (17) having its outer surface in contact with the inner wall of the mounting slot (16), each pair of sliding sliders (17) having a fixed plate (9) fixedly mounted on their upper surfaces, each pair of fixed plates (9) having a rotary motor (25) fixedly mounted on their side facing each other, each rotary motor (25) having a fixed plate (9) slidably connected to its upper surface. The output ends of the two connecting shafts (23) are fixedly installed with connecting shafts (23). The ends of the two connecting shafts (23) that are close to each other are fixedly installed with clamps (22). The inner wall of each clamp (22) is fixedly installed with a protective pad (21). The upper surface of the support platform (7) is provided with a round hole (15). The inside of the round hole (15) is provided with a wafer tray (13). The bottom surface of the wafer tray (13) is fixedly installed with a baffle (12). The bottom surface of the baffle (12) is fixedly installed with an electric push rod (11). The bottom surface of the electric push rod (11) is fixedly installed with a bracket (8). The bottom surface of the bracket (8) is fixedly connected to the inner bottom wall of the support platform (7).

2. The wafer fabrication surface coating equipment according to claim 1, characterized in that: A control unit (4) is fixedly installed on the left side of the body (1), and a closed shell (2) is rotatably connected to the inner wall of the body (1).

3. The wafer fabrication surface coating equipment according to claim 1, characterized in that: A guide plate (6) is fixedly installed on the inner side wall of the body (1), and a conveyor (10) is fixedly installed on the bottom surface of the guide plate (6). The bottom surface of the conveyor (10) is fixedly connected to the inner bottom wall of the support platform (7).

4. The wafer fabrication surface coating equipment according to claim 1, characterized in that: Each of the rotary motors (25) has a coupling (24) fixedly mounted at its output end, and the inner wall of each coupling (24) is fixedly connected to the outer surface of the connecting shaft (23).

5. The wafer fabrication surface coating equipment according to claim 2, characterized in that: Each of the fixed plates (9) has a drive motor (14) fixedly installed on its inner wall, and each of the drive motors (14) has a screw (26) fixedly installed at its output end. The outer surface of each screw (26) is rotatably connected to the inner wall of the fixed plate (9).

6. The wafer fabrication surface coating equipment according to claim 5, characterized in that: Each screw (26) has a nut (27) threaded onto its outer surface, and each nut (27) has a displacement slider (5) fixedly mounted on its outer surface. The outer surface of each displacement slider (5) is in contact with the inner wall of the fixing plate (9).

7. The wafer fabrication surface coating equipment according to claim 6, characterized in that: Each of the displacement sliders (5) has a mounting plate (19) fixedly installed on its upper surface, and each of the mounting plates (19) has a telescopic rod (20) fixedly installed on its upper surface.

8. The wafer fabrication surface coating equipment according to claim 7, characterized in that: Each telescopic rod (20) has a suction cup (28) fixedly installed at its telescopic end, and a scraper (3) is fixedly installed on the inner wall of the enclosed shell (2).

Images