Wafer processing equipment

Abstract

The utility model discloses wafer processing equipment, which relates to the technical field of wafer processing equipment, aims to solve the problem of wafer positioning, and comprises a cavity, a transportation mechanism and a plurality of sample forks, the plurality of sample forks are arranged around the transportation mechanism through bolts, and the sample forks are arranged in the cavity. The conveying mechanism is installed in the cavity in a liftable and rotatable mode, a groove allowing the sample fork to be embedded therein is formed in the cavity, and the part, surrounded by the groove, in the cavity forms an approximately-circular boss used for heating wafers. By arranging the arc-shaped arm forks concentric with the protrusions and the slope steps, accurate positioning of the wafer is achieved, the problem that the wafer is damaged due to inaccurate positioning in the machining process is avoided, by arranging the cooperation of the limiting holes and the limiting columns, the positioning accuracy is further improved, the sample forks can be prevented from falling off when the positions of the sample forks deviate, and the machining accuracy of the wafer is improved. Therefore, the wafer is protected from being damaged.

Description

Technical Field

[0001] This utility model relates to the technical field of wafer processing equipment, specifically a wafer processing equipment. Background Technology

[0002] In semiconductor manufacturing, wafers undergo processing in equipment, such as heating, etching, and deposition. Traditional wafer processing equipment often uses mechanical positioning mechanisms, but under high-precision processing requirements, this positioning method may suffer from inaccurate positioning and wafer damage. Furthermore, wafers may be affected by changes in air pressure during processing, causing them to deviate from their falling position or fail to detach smoothly from the processing unit, thus impacting processing quality and efficiency. Utility Model Content

[0003] To solve the above problems, namely the problems mentioned in the background art, this utility model proposes a wafer processing equipment, including a cavity, a transport mechanism and multiple sample forks. The multiple sample forks are bolted around the transport mechanism. The transport mechanism is mounted in the cavity in a way that allows the sample forks to be inserted. The portion of the cavity surrounded by the groove forms an approximately circular boss for heating the wafer.

[0004] The forks on both sides of the sample fork are set as arcs concentric with the boss. The inner wall of the fork is provided with a step. The vertical surface of the step is set as a slope. The connection between the slope and the horizontal surface of the step is provided with a downwardly recessed arc groove.

[0005] A further feature of this invention is that the sample fork has a limiting hole on its upper surface, and a limiting post capable of being inserted into the limiting hole is provided in the groove.

[0006] A further feature of this invention is that an air passage capable of covering the entire boss is provided on the upper surface of the boss.

[0007] The beneficial technical effects of this invention are as follows: By setting an arc-shaped fork and a ramp step concentric with the protrusion, precise wafer positioning is achieved, avoiding wafer damage due to inaccurate positioning during processing. The combination of limiting holes and limiting posts further improves positioning accuracy and prevents the sample fork from falling if it shifts position, thus protecting the wafer from damage. The arc-shaped groove reduces the contact area between the sample fork and the wafer, lowering the probability of wafer contamination. The air passage covering the entire protrusion balances the air pressure around the wafer, preventing positional shifts or inability to detach from the protrusion due to pressure differences during placement or lifting, thus improving processing quality and efficiency. Attached Figure Description

[0008] Figure 1A schematic diagram of the overall structure of this solution is shown.

[0009] Figure 2 A schematic diagram of the overall structure of the transportation agency is shown.

[0010] Figure 3 A cross-sectional view of the sample fork is shown.

[0011] Figure 4 A schematic diagram of the sample fork structure is shown.

[0012] Figure 5 A schematic diagram of the cavity structure is shown.

[0013] The attached figures are labeled as follows: 1. cavity, 2. transport mechanism, 3. sample fork, 4. step, 5. arc groove, 6. groove, 7. air passage, 8. limiting post, 9. limiting hole. Detailed Implementation

[0014] Preferred embodiments of the present invention will now be described with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of the present invention and are not intended to limit the scope of protection of the present invention.

[0015] This invention proposes a wafer processing device, which consists of a transport mechanism 2 installed in a cavity 1 that can move vertically and rotate, and a sample fork 3 installed around the transport mechanism 2. The wafer is placed on the sample fork 3 and carried by the sample fork 3 to the heating unit in the cavity 1 for processing. A groove 6 with a profile slightly larger than that of the sample fork 3 is provided in the cavity 1. The approximately circular protrusion formed in the groove 6 is used as the heating unit for the wafer, so that after the sample fork falls into the groove 6, the wafer can fall onto the heating unit for processing.

[0016] The forks on both sides of the sample fork 3 are set as arcs concentric with the boss, and the inner wall of the arc is set as a step 4. The vertical surface of the step 4 is set as a slope, so that the edge of the wafer can fall into the horizontal surface along the slope for positioning. With the arc-shaped forks concentric with the boss, the wafer can be accurately placed on the boss.

[0017] The transition between the ramp and the horizontal plane is designed as a downward-recessed arc groove 5 to reduce the contact area between the sample fork 3 and the wafer and avoid contaminating the wafer.

[0018] A limiting hole 9 is provided on the sample fork 3, and a limiting post 8 is provided in the groove 6. If the sample fork 3 rotates to the top of the groove 6, the limiting post 8 can be inserted into the limiting hole 9 when it falls. If the position is offset, the sample fork 3 will be blocked by the limiting post 8 and will not fall, thus avoiding damage to the wafer.

[0019] A ventilation channel is provided on the boss that can cover the entire boss. The area covered by the ventilation channel is larger than the area covered by the wafer. This avoids local pressure differences when the wafer is placed on the boss, which could cause the wafer to fall off the platform. It also prevents the wafer from being unable to detach from the boss due to pressure differences when it is lifted off the boss, and thus avoids the wafer from generating opposing forces with the upward-moving sample fork, which could damage the wafer.

[0020] Although the present invention has been described with reference to preferred embodiments, various modifications can be made to it and components can be replaced with equivalents without departing from the scope of the present invention. In particular, the technical features mentioned in the various embodiments can be combined in any manner as long as there is no structural conflict. The present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0021] In the description of this utility model, terms such as "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," which indicate direction or positional relationships, are based on the direction or positional relationships shown in the accompanying drawings. These are used merely for ease of description and do not indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0022] Furthermore, it should be noted that, in the description of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0023] The term "comprising" or any other similar term is intended to cover non-exclusive inclusion, such that a process, article, or apparatus / device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to those processes, articles, or apparatus / devices.

[0024] The technical solution of this utility model has been described above with reference to the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the protection scope of this utility model is obviously not limited to these specific embodiments. Without departing from the principle of this utility model, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the protection scope of this utility model.

Claims

1. A wafer processing apparatus, comprising a cavity (1), a transport mechanism (2), and a plurality of sample forks (3), wherein the plurality of sample forks (3) are bolted around the transport mechanism (2), the transport mechanism (2) being vertically and rotatably mounted in the cavity (1), characterized in that: The cavity (1) is provided with a groove (6) that allows the sample fork (3) to be inserted, and the part of the cavity (1) surrounded by the groove (6) forms an approximately circular boss for heating the wafer. The forks on both sides of the sample fork (3) are set as arcs concentric with the boss. A step (4) is provided on the inner wall of the fork. The vertical surface of the step (4) is set as a slope. A downwardly recessed arc groove (5) is provided at the connection between the slope of the step (4) and the horizontal surface.

2. The wafer processing equipment according to claim 1, characterized in that: The sample fork (3) has a limiting hole (9) on its upper surface, and a limiting post (8) that can be inserted into the limiting hole (9) is provided in the groove (6).

3. A wafer processing equipment according to claim 1 or 2, characterized in that: The upper surface of the boss is provided with an air passage (7) that can cover the entire boss.

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