Ejector pin mechanism and wafer lifting device

Abstract

The utility model provides an ejector pin mechanism and a wafer lifting device. The ejector pin mechanism comprises an ejector pin, a heavy hammer and a horizontal bolt; the ejector pin is in threaded connection with the heavy hammer; the height of the ejector pin is adjusted through spiral movement between the ejector pin and the heavy hammer, and a first through hole is formed in the lower portion of the ejector pin in the horizontal direction. A second through hole in the horizontal direction is formed in the counter weight, and the second through hole and the first through hole are communicated to form a pin hole so as to contain the horizontal plug pin.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to the ejector pin mechanism of a wafer carrier device. Background Technology

[0002] In existing technology, the ejector pins and counterweights in semiconductor process equipment are in direct contact with the aluminum disc under the heating plate. The ejector pins passively lift the wafer by raising and lowering the heating plate; this method is called a fixed ejector pin method. Another type of fixed ejector pin involves the ejector pin and counterweight contacting a ejector pin support plate, and the height of the ejector pin can be adjusted by adjusting the height of the support plate.

[0003] However, these methods of adjusting the height of the ejector pin have many drawbacks:

[0004] Firstly, when the heights of the three ejector pins are inconsistent, the wafer will shift when it lands on the heating plate, causing a wafer transfer alarm or resulting in poor process performance.

[0005] Secondly, after the heating plate is leveled on the current machine, the height of the ejector pins will inevitably change, increasing the probability and magnitude of wafer misalignment.

[0006] Thirdly, for fixed ejector machines with large aluminum discs, the ejector height cannot be actively adjusted and can only change with the heating plate. For fixed ejector machines with ejector support plates, adjusting the ejector height is relatively complicated and inefficient. Utility Model Content

[0007] To achieve active height adjustment and safety of the ejector mechanism, this utility model provides an ejector mechanism and a wafer lifting device.

[0008] This utility model provides a ejector mechanism, which includes an ejector pin, a counterweight, and a horizontal pin.

[0009] The ejector pin is threadedly connected to the counterweight; the height of the ejector pin is adjusted by the spiral motion between the ejector pin and the counterweight; the lower part of the ejector pin has a first through hole in the horizontal direction; the counterweight has a second through hole in the horizontal direction inside, and the second through hole and the first through hole are connected to form a pin hole to accommodate the horizontal pin.

[0010] In one embodiment, the ejector pin includes an upper part and a lower part, and the outer surface of the lower part is provided with threads.

[0011] In one embodiment, the counterweight has a cavity inside, the cavity being in the same axial direction as the ejector pin, the cavity being used to accommodate the ejector pin, and the sidewall of the cavity being threaded.

[0012] In one embodiment, the pin hole extends through the cavity.

[0013] In one embodiment, the second through hole is perpendicular to the cavity.

[0014] In one embodiment, the horizontal pin includes a body and two ends, the body being horizontal and the two ends being perpendicular to the body.

[0015] In one embodiment, the height of the main body is less than the height of the second through hole or the first through hole.

[0016] In one embodiment, the height of the pin hole varies with the upward or downward spiral movement of the ejector pin, and the height of the pin hole is less than or equal to the height of the second through hole or the first through hole.

[0017] This utility model also provides a wafer lifting device, including: multiple sets of ejector pin mechanisms as described above.

[0018] This utility model also provides a method for adjusting the height of the ejector pin, the method including but not limited to the following steps:

[0019] Record the data measured by the Automatic Gap Measurement System (AGS) on the heating plate before removing it;

[0020] Remove the heating plate to allow for maintenance work.

[0021] Reinstall the heating plate and restore the data recorded before removal by the automatic gap measurement system;

[0022] The height of the ejector pin in the ejector pin mechanism described above is adjusted by means of a spiral motion between the ejector pin and the counterweight.

[0023] The ejector mechanism of this utility model has the following highly beneficial technical effects:

[0024] Firstly, by adjusting the way the ejector pin and the counterweight work together, the height of the ejector pin can be actively adjusted.

[0025] Secondly, after restoring AGS, the heating plate does not need to be leveled during re-running, ensuring that the pin height remains consistent and reducing the risk of wafer misalignment. Attached Figure Description

[0026] The above-described utility model and the following detailed embodiments will be better understood when read in conjunction with the accompanying drawings. It should be noted that the drawings are merely examples of the claimed utility model. In the drawings, the same reference numerals represent the same or similar elements.

[0027] Figure 1A wafer carrier device according to an embodiment of the present invention is shown;

[0028] Figure 2 A schematic diagram of a pin structure according to an embodiment of the present invention is shown;

[0029] Figure 3 This shows a front view of a counterweight according to an embodiment of the present invention;

[0030] Figure 4 A top view of a counterweight according to an embodiment of the present invention is shown;

[0031] Figure 5 A side view of a counterweight according to an embodiment of the present invention is shown;

[0032] Figure 6 A horizontal latch according to an embodiment of the present invention is shown;

[0033] Figure 7 This invention illustrates a method for adjusting the height of an ejector pin using an ejector pin mechanism according to an embodiment of the present invention. Detailed Implementation

[0034] The detailed features and advantages of this utility model are described below in specific embodiments. The content is sufficient for any person skilled in the art to understand the technical content of this utility model and implement it accordingly. Furthermore, based on the specification, claims, and drawings disclosed herein, those skilled in the art can easily understand the related objectives and advantages of this utility model. Although the description of this utility model is presented in conjunction with preferred embodiments, this does not mean that the features of this utility model are limited to this embodiment. On the contrary, the purpose of describing the utility model in conjunction with the embodiments is to cover other options or modifications that may be derived from the claims of this utility model. To provide a deep understanding of this utility model, many specific details will be included in the following description. This utility model may also be implemented without using these details. In addition, to avoid confusion or obscuring the focus of this utility model, some specific details will be omitted in the description.

[0035] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0036] Furthermore, the terms "upper," "lower," "left," "right," "top," "bottom," "horizontal," and "vertical" used in the following description should be understood as the orientations shown in the relevant paragraphs and accompanying drawings. These relative terms are for illustrative purposes only and do not imply that the described device must be manufactured or operated in a specific orientation; therefore, they should not be construed as limiting the scope of this invention.

[0037] It is understood that while terms such as "first," "second," and "third" may be used herein to describe various components, channels, assemblies, regions, layers, and / or parts, these components, channels, assemblies, regions, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, channels, assemblies, regions, layers, and / or parts. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0038] As indicated in this application and claims, unless the context clearly indicates otherwise, the words "a," "an," "an," and / or "the" are not specifically singular and may include plural forms. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of explicitly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements.

[0039] In some embodiments, numbers describing the quantity of components and attributes are used. It should be understood that such numbers used in the description of embodiments are modified in some examples with the terms "approximately," "approximately," or "generally." Unless otherwise stated, "approximately," "approximately," or "generally" indicates that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, which may be changed depending on the characteristics required by individual embodiments. In some embodiments, numerical parameters should take into account specified significant digits and employ a general method of digit reservation. Although the numerical ranges and parameters used to confirm their breadth of scope in some embodiments of this application are approximate values, in specific embodiments, such values ​​are set as precisely as feasible.

[0040] Furthermore, this application uses specific terms to describe embodiments of the application. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic related to at least one embodiment of the application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this specification do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the application can be appropriately combined.

[0041] In most semiconductor IC process reaction chambers, a wafer carrier is typically included. This carrier serves two purposes: firstly, it holds the wafer for specific processing within the reaction chamber; secondly, it allows for the loading and unloading of wafer components to minimize wafer damage during transfer between reaction chambers. Taking a semiconductor chemical vapor deposition (CVD) system as an example, the wafer carrier is located within the deposition chamber. This carrier includes a base, multiple ejector pins, ejector pin supports, and a lift driver. The base can be a heating plate, allowing the wafer placed on it to be heated through heat conduction for the deposition process. The base has multiple through-holes, and ejector pins are disposed within these through-holes, supporting the wafer and allowing it to move up and down. The ejector pin supports hold the bottom of the ejector pins and are driven by the lift driver to move up and down. The wafer can be transferred into the reaction chamber by a robotic arm. The lift driver then drives the ejector pin supports to rise and press against the ejector pins, causing the pins to rise through the through-holes to contact and lift the wafer, thus removing it from the robotic arm.

[0042] Figure 1 A wafer carrier device according to an embodiment of the present invention is shown. The wafer carrier device includes a base 102, multiple sets of ejector pin mechanisms, and an ejector pin mechanism support plate 105. The base 102 is used to support a wafer 101. The base 102 may include a heating plate so that the wafer 101 placed on the base 102 can be heated via heat conduction for deposition processes. Each set of ejector pin mechanisms includes an ejector pin 103, a counterweight 104, and a horizontal pin (not shown). The platform of the base 102 has multiple ejector pin holes, and the ejector pin 103 of each set of ejector pin mechanisms passes through one ejector pin hole. The multiple sets of ejector pin mechanisms are used to support the wafer placed thereon for lifting and lowering operations. Each ejector pin mechanism in the multiple sets of ejector pin mechanisms of the present invention can be actively adjusted in height. The ejector pin 103 is threadedly connected to the counterweight 104 and is protected by a double lock via a horizontal pin to prevent the ejector pin from rotating or falling off.

[0043] It should be pointed out that, Figure 1 This is just one application environment for the ejector mechanism of this utility model, and this utility model is not limited to this application environment.

[0044] Figure 2 A schematic diagram of a ejector pin structure according to an embodiment of the present invention is shown. The ejector pin includes an upper part 201 and a lower part 202. The outer surface of the lower part 202 is provided with threads 203, making the lower part a bolt. The lower part 202 also has a first through hole 204 in the horizontal direction for the insertion of a horizontal pin.

[0045] Figure 3 This image shows a front view of a counterweight according to an embodiment of the present invention. The ejector mechanism of the present invention includes an ejector pin (such as...). Figure 2 As shown), counterweight 301 and horizontal pin (as shown) Figure 6(As shown). The counterweight 301 has a cavity 303 inside, which is in the same axial direction as the ejector pin, and the cavity 303 is used to accommodate the ejector pin. The sidewall of the cavity has threads 302, so that the counterweight 301 can act as a nut. The thread on the outer surface of the lower part of the ejector pin is threadedly connected to the thread on the sidewall of the cavity of the counterweight 301 to form a fastening fit.

[0046] The thread 302 on the side wall of the cavity is threadedly connected to the thread 203 on the lower part of the ejector pin. The height of the ejector pin can be adjusted by a helical motion, that is, by rotating the ejector pin relative to the counterweight. For multiple ejector pin mechanisms, the height of each ejector pin can be adjusted independently.

[0047] The counterweight has a second through hole 304 in the horizontal direction (i.e., perpendicular to the circumferential direction of the ejector pin). This second through hole 304 communicates with the first through hole 204. The height of the second through hole 304 is the same as the height of the first through hole 204. The second through hole 304 and the first through hole 204 together form a pin hole that can accommodate a horizontal pin (such as...). Figure 6 (As shown).

[0048] It should be noted that the pin hole is at its largest when the uppermost edges of the first and second through holes are aligned. When there is a helical movement between the ejector pin and the counterweight, such as when the ejector pin is turned upwards to increase height, the uppermost edge of the first through hole will be higher than the uppermost edge of the second through hole, and the pin hole (in the height direction) will become smaller. Therefore, the height of the pin hole will change with the upward or downward helical movement of the ejector pin; that is, the height of the pin hole will be less than or equal to the height of the second or first through hole. However, within the reasonable stroke range of the ejector pin, the height of the pin hole should be able to accommodate the horizontal pin.

[0049] Figure 4 A top view of a counterweight according to an embodiment of the present invention is shown. Figure 4 As shown, the second through hole 304 penetrates the hammer horizontally and passes through the internal cavity 303 of the hammer.

[0050] Figure 5 A side view of a counterweight according to an embodiment of the present invention is shown. Figure 5 As shown, the second through hole 304 is perpendicular to the cavity 303.

[0051] Figure 6 A horizontal latch according to an embodiment of the present invention is shown. Figure 6As shown, the horizontal pin 601 is used to insert into the pin hole formed by the second through hole 304 and the first through hole 204. The horizontal pin 601 has a main body 602 and two ends 603 and 604. The main body 602 is horizontal, and the two ends 603 and 604 are perpendicular to the main body 602, forming a right angle to create gravity self-locking. The height of the main body 602 is less than the height of the second through hole 304 or the first through hole 204. This design allows the horizontal pin to have a certain amount of room to move, so that after the height of the ejector pin is adjusted, for example, after the ejector pin moves upward and the pin hole becomes smaller, the horizontal pin still has room to be inserted into the pin hole. That is, there is vertical movement space between the horizontal pin and the pin hole. In one embodiment, the length of the main body 602 is equal to the length of the pin hole.

[0052] After the ejector pins are screwed to the counterweight, and through a spiral motion, each ejector pin is actively adjusted to the required height, a horizontal pin is inserted into the pin hole formed by the first and second through holes to prevent the ejector pins from rotating and falling off if the screw connection fails. The two ends of the horizontal pin are designed at right angles to create a gravity-locked mechanism. The design of the pin hole and the horizontal pin in this invention provides a double lock, ensuring the safety of the process.

[0053] Figure 7 This illustration shows a method for adjusting the ejector pin height using an ejector pin mechanism according to an embodiment of the present invention. This method is generally applicable to processes that require the removal (e.g., for cleaning) and reinstallation of the heating plate.

[0054] This method includes, but is not limited to, the following steps:

[0055] Step 701: Record the AGS (Auto Gapping System) data of the heating plate before removing it. This data is used to ensure the spacing between the wafer and the spray plate.

[0056] Step 702: Remove the heating plate to allow for normal maintenance (e.g., cleaning).

[0057] Step 703: Reinstall the heating plate and restore the AGS reading to initially adjust the position of the heating plate to the previously recorded AGS state, maintaining the process performance consistent with that before the heating plate was removed.

[0058] Step 704: Adjust the height of the ejector pins in each ejector pin mechanism. This height adjustment is achieved through the spiral motion between the ejector pin and the counterweight.

[0059] Step 705: Adjust the transfer.

[0060] Those skilled in the art will understand that the various illustrative components, modules, blocks, units, circuits, systems, and steps described in conjunction with the embodiments disclosed herein can be implemented in hardware, software (including firmware, resident software, microcode, etc.), or a combination of both. To clearly illustrate this interchangeability between hardware and software, the various illustrative components, modules, blocks, units, circuits, systems, and steps described above are generalized in their functional form. Whether such functionality is implemented in hardware or software depends on the specific application and the design constraints imposed on the overall system. Those skilled in the art may implement the described functionality in different ways for each specific application, but such implementation decisions should not be construed as departing from the scope of this invention.

[0061] This application uses flowcharts to illustrate the operations or steps performed by a system according to embodiments of this application. It should be understood that the preceding or following operations or steps are not necessarily performed in exact order. Instead, various operations or steps can be processed in reverse order or simultaneously. Furthermore, other operations or steps may be added to these processes, or one or more operations or steps may be removed from these processes.

[0062] Unless expressly stated in the claims, the order of processing elements and sequences, the use of numbers and letters, or the use of other names described in this application are not intended to limit the order of the processes and methods of this application.

[0063] The terminology and expressions used above are for descriptive purposes only, and this utility model should not be limited to these terms and expressions. The use of these terms and expressions does not mean excluding any illustrative and descriptive equivalent features (or parts thereof), and it should be recognized that various possible modifications should also be included within the scope of the claims. Other modifications, variations, and substitutions may also exist. Accordingly, the claims should be considered to cover all such equivalents.

[0064] Similarly, it should be noted that, in order to simplify the description of this application and thus aid in the understanding of one or more embodiments of the utility model, the foregoing description of the embodiments of this application sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this disclosure method does not imply that the subject matter of this application requires more features than those mentioned in the claims.

[0065] Similarly, it should be noted that although the present invention has been described with reference to the specific embodiments described above, those skilled in the art should recognize that the above embodiments are only used to illustrate the present invention, and various equivalent changes or substitutions can be made without departing from the spirit of the present invention. Therefore, any changes or modifications to the above embodiments within the scope of the essential spirit of the present invention will fall within the scope of the claims of this application.

Claims

1. A pin mechanism, characterized in that, The ejector pin mechanism includes: Ejector pin, counterweight, and horizontal pin; The ejector pin is threadedly connected to the counterweight; the height of the ejector pin is adjusted by the spiral motion between the ejector pin and the counterweight; the lower part of the ejector pin has a first through hole in the horizontal direction; the counterweight has a second through hole in the horizontal direction inside, and the second through hole and the first through hole are connected to form a pin hole to accommodate the horizontal pin.

2. The ejector mechanism as described in claim 1, characterized in that, The ejector pin includes an upper part and a lower part, and the outer surface of the lower part is provided with threads.

3. The ejector mechanism as described in claim 1, characterized in that, The counterweight has a cavity inside, which is in the same axial direction as the ejector pin. The cavity is used to accommodate the ejector pin, and the sidewall of the cavity is threaded. The pin hole passes through the cavity.

4. The ejector mechanism as described in claim 3, characterized in that, The second through hole is perpendicular to the cavity.

5. The ejector mechanism as described in claim 1, characterized in that, There is vertical movement space between the horizontal pin and the pin hole.

6. The ejector mechanism as described in claim 1, characterized in that, The horizontal pin includes a main body and two ends, the main body being horizontal and the two ends being perpendicular to the main body.

7. The ejector mechanism as described in claim 6, characterized in that, The height of the main body is less than the height of the second through hole or the first through hole.

8. The ejector mechanism as described in claim 1, characterized in that, The height of the pin hole changes with the upward or downward spiral movement of the ejector pin, and the height of the pin hole is less than or equal to the height of the second through hole or the first through hole.

9. A wafer lifting device, characterized in that, include: Multiple sets of ejector mechanisms as described in any one of claims 1 to 8.

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